The present invention generally relates to test sockets and contactors for testing and burning-in integrated circuit (IC) devices, and more particularly to spring contact pins, sometimes referred to as pogo pins, used in test sockets and contactors to make circuit connections between an IC device and a test or burn-in circuit board.
As their capabilities increase, the input/output (I/O) densities of IC chips have increased, leading to a shift from chips with physical leads to leadless devices. For example, surface mounted IC chips with ball grid array (BGA) packages and micro-BGA packages are now in widespread use because BGA's allow for more densely packed contacts—small solder balls—having relatively small contact dimensions. The small contact dimensions create challenges in the test and burn-in of leadless devices. To facilitate testing and burn-in, test sockets and contactors have been designed for holding the BGA chip packages and connecting and disconnecting chip's I/O contacts to a printed circuit (PC) test board, such as used in an automated chip tester. Such socket devices commonly use tiny double-ended pogo pins, whose length is measured in millimeters, for achieving this electrical interconnection. Double-ended pogo-pins, which have a conductive plunger at both ends of a conductive spring barrel and which are provided in densely packed arrays in a thin contact wall that is interposed between the device under test and the test circuit, are intended to provide an efficient electrical path between chip and test circuit. Because the electrical path passes through the plungers and the conductive sidewalls of the pogo pin's spring barrel, the internal resistance of the pins tends to be dominated by the contact resistance created at the junction of the plungers and the barrel sidewalls. This contact resistance is relatively high and occurs at two points in the conductive path through the pins, namely, at the plunger-to-barrel contact for each plunger. The resulting increase in the internal resistance of the pogo pins is detrimental to the pogo pins' overall electrical performance, and the performance of the test socket or contactor in which the pogo pins are used.
In an effort to reduce the undesirable contact resistance in double-ended pogo pins, a single-ended pogo pin has been devised, which has a barrel housing that tapers to a point at one end and a spring-loaded plunger at the other end. While this design eliminates the relatively high contact resistance associated with one of the plungers, it has significant disadvantages. First, it is relatively difficult to manufacture. Also, it is often desirable to make pogo pins having contact tips fabricated of a different material than the material used for the spring barrel casing. For example, it may be desirable to make both tips of a harder conductive material than the housing material. Where one of the contact tips of the pogo pin is the end of the barrel casing itself, this will not be feasible.
Therefore, a need exists for a spring contact pin that has reduced internal resistance as compared to conventional double-ended pogo pins, but that do not have the disadvantages of single-ended pogo pins of the type described above. The need also exists for an improved spring contact pin that can be readily manufactured, and that minimizes the risk that foreign particles will find their way into the spring cavity of the pin during manufacture.
Briefly, the present invention is an improved spring contact pin for an IC test device, such as a test socket or contactor, which has a lower internal resistance compared to conventional double-ended pogo pins, but which provide advantages over the single-ended pogo pin design mentioned above. The invention is also directed to a method of manufacturing a spring contact pin, which reduces the internal resistance of the contact.
The spring contact pin of the invention is comprised of a conductive spring barrel casing having a conductive longitudinal barrel sidewall, a compression spring and two conductive plungers. The plungers are contained in the spring cavity at the ends of the spring barrel with the compression spring being disposed in the spring cavity between plungers. At least one inwardly indented portion in the sidewall of the barrel casing is provided at one of the barrel ends, wherein the indented portion firmly grips the plunger so as to reduce the contact resistance between the one plunger and the barrel casing. Preferably, the indented portion in the sidewall of the barrel casing is produced by crimping the barrel casing.
The spring contact pin of the invention can be manufactured from a standard double-ended pogo pin by crimping one end of the pin's barrel casing so that it crimps into one of the plungers of the double-ended pin. Such crimping would fix the one plunger in a non-depressible position, while allowing the other plunger to be depressed in the conventional manner. As a result of the crimping, the contact resistance between the plunger and casing at the crimped end can be reduced, thereby reducing the overall internal resistance of the pogo pin. This is achieved by a relatively simple manufacturing process that will allow the plungers and the barrel casing to be made of different materials, if desired. Also, the crimping process can be achieved without exposing the internal spring cavity of the spring contact pin to the introduction of foreign materials which would be detrimental to the performance of the spring.
It is contemplated that the plungers of the spring contact pin of the invention would be made of a relatively hard conductive material such as beryllium copper. The barrel casing of the spring contact pin, on the other hand, could be made of beryllium copper or another conductive material such as brass.
While the invention contemplates crimping of the end of the barrel casing of the spring contact pin, it will be understood that it is not intended that the invention be limited to crimping as a method of producing an inward indentation in the barrel casing sidewall that grips or pushes into one of the spring contact pin's plungers for reducing contact resistance. However, crimping provides a facility for easily manufacturing the spring contact pin of the invention.
While it is also contemplated that one end of the spring contact pin of the invention will be crimped around its entire circumference to produce a uniform indentation around the circumference, other forms of crimps in the barrel casing sidewall are considered within the scope of the invention. This might include partial crimps and crimps that are non-uniform.
Therefore, it can be seen that it is a primary object of the invention to provide an improved spring contact pin for an IC test socket, contactor or the like, which has improved performance characteristics and which particularly exhibits lower internal resistance than conventional pogo pins having doubled depressible ends. It is a further object of the invention to provide an improved spring contact pin which can be produced economically. It is still a further object of the invention to provide a spring contact pin wherein the spring casing and contacting tip ends of the spring contact pin can be fabricated of different materials, if desired. Other objects of the invention will be apparent from the following specification and claims and the accompanying drawings.
Referring now to the drawings,
The barrel casing and plungers of the spring contact pin shown in
The improved spring contact pin of the invention illustrated in
In the spring contact pin of the invention, only the first conductive plunger 51 can depress against the compression spring 56 in the manner of a conventional contact spring. To reduce the contact resistance between the second plunger 53 and the barrel casing 43, the barrel's second end 49 is provided with an inward indentation which forces at least a portion of the sidewall into the base end of the second plunger. This indentation is preferably formed by crimping the second end of the barrel casing by a suitable crimping tool (not shown). In the illustrated embodiment, the crimp formed in the sidewalls of the barrel casing extends around the entire perimeter of the barrel casing, forcing the sidewall at the crimp into the plunger base end over 360 degrees of the base end. The electrical path through the barrel casing and second plunger now passes through a junction “J” where the metal of the casing's sidewall is pressed into the sidewall 54 of the plunger base 49. Testing has shown that the overall internal resistance of the contact pin crimped in this fashion is substantially reduced over a contact pin where the sidewall is not crimped.
Referring to
As above-mentioned, the barrel casing and plungers of spring contact pin 41 are made of conductive materials. One of the benefits of the invention is that the plungers and the barrel casing can be made of different materials. The plungers are suitably made of hardened connective materials, such as hardened beryllium copper, steel, bronze, gold or a silver alloy. The barrel casing is suitably fabricated of brass (which can be readily crimped), but could be made of other materials, including the same material as the plungers, for example, beryllium copper.
Spring contact pin 41 has the further benefit that it can be made from a conventional double-ended pogo-pin, with the only additional manufacturing step being the crimping of the second end of the barrel casing to force the sidewall of the barrel casing into the second plunger. While it is contemplated that the crimping would occur when the second plunger 53 is in its full extended position as shown in
A comparison between the electrical performance of a conventional spring contact pin of the type illustrated in
Therefore, it can be seen that the present invention provides a new spring contact pin and method of manufacturing a spring contact pin for IC chip test sockets and contactors that improve the performance of the pin without any significant increase in the cost or complexity of manufacture of the contact. While the present invention has been described in considerable detail in the foregoing specification, it shall be understood that it is not intended that the invention be limited to such detail, except as necessitated by the following claims.
This application claims the benefit of U.S. Provisional Application Ser. No. 60/702,009 filed Jul. 22, 2005.
Number | Date | Country | |
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60702009 | Jul 2005 | US |