concerning contact pieces or mechanical details

Industry

CPC
G01R1/0466

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00

Current Industry

G01R1/0466concerning contact pieces or mechanical details

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Module substrate for semiconductor module, semiconductor module and...
- Patent number 12,130,306
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Kwangkyu Bang
- G01 - MEASURING TESTING
Information Patent Grant
Test socket
- Patent number 12,105,138
- Issue date Oct 1, 2024
- Leeno Industrial Inc.
- Young taek Shin
- G01 - MEASURING TESTING
Information Patent Grant
Socket
- Patent number 12,099,077
- Issue date Sep 24, 2024
- Enplas Corporation
- Yuki Ueyama
- G01 - MEASURING TESTING
Information Patent Grant
Testing devices and method for testing semiconductor devices
- Patent number 12,092,655
- Issue date Sep 17, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket for electrical component
- Patent number 12,066,482
- Issue date Aug 20, 2024
- Enplas Corporation
- Yoshinobu Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing device and method for testing a device under test
- Patent number 12,032,001
- Issue date Jul 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Jia Jin Lin
- G01 - MEASURING TESTING
Information Patent Grant
Test socket having an automated lid
- Patent number 12,007,411
- Issue date Jun 11, 2024
- Teradyne, Inc.
- John P. Toscano
- G01 - MEASURING TESTING
Information Patent Grant
Resonant-coupled transmission line
- Patent number 12,004,288
- Issue date Jun 4, 2024
- Teradyne, Inc.
- Andrew Westwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing device for integrated circuit package
- Patent number 11,994,534
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Chun Chiu
- G01 - MEASURING TESTING
Information Patent Grant
Spring contact and test socket with same
- Patent number 11,982,688
- Issue date May 14, 2024
- Hicon Co., Ltd.
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Chip socket, testing fixture and chip testing method thereof
- Patent number 11,959,939
- Issue date Apr 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Shih-Ting Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip test socket
- Patent number 11,953,520
- Issue date Apr 9, 2024
- MICRO CONTACT SOLUTION CO., LTD.
- Kyung Hoon Yoo
- G01 - MEASURING TESTING
Information Patent Grant
Testing module and testing method using the same
- Patent number 11,906,573
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Automated test system
- Patent number 11,899,042
- Issue date Feb 13, 2024
- Teradyne, Inc.
- Philip Luke Campbell
- G01 - MEASURING TESTING
Information Patent Grant
Socket for inspection
- Patent number 11,821,915
- Issue date Nov 21, 2023
- Yamaichi Electronics Co., Ltd.
- Kouki Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pin and socket
- Patent number 11,821,917
- Issue date Nov 21, 2023
- Enplas Corporation
- Yuki Ueyama
- G01 - MEASURING TESTING
Information Patent Grant
Ground connector in an integrated circuit testing apparatus
- Patent number 11,821,916
- Issue date Nov 21, 2023
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision, high bandwidth, switching attenuator
- Patent number 11,808,786
- Issue date Nov 7, 2023
- Tektronix, Inc.
- Julie A. Campbell
- G01 - MEASURING TESTING
Information Patent Grant
Test site configuration in an automated test system
- Patent number 11,754,596
- Issue date Sep 12, 2023
- Teradyne, Inc.
- Michael O. McKenna
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for conducting burn-in testing of semiconducto...
- Patent number 11,719,743
- Issue date Aug 8, 2023
- Kes Systems, Inc.
- Ballson Gopal
- G01 - MEASURING TESTING
Information Patent Grant
Socket and inspection socket
- Patent number 11,714,105
- Issue date Aug 1, 2023
- Enplas Corporation
- Leo Azumi
- G01 - MEASURING TESTING
Information Patent Grant
Testing module and testing method using the same
- Patent number 11,693,045
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Conductive particle and testing socket comprising the same
- Patent number 11,693,027
- Issue date Jul 4, 2023
- SNOW CO., LTD.
- Gyu Sun Kim
- G01 - MEASURING TESTING
Information Patent Grant
Short interconnect assembly with strip elastomer
- Patent number 11,674,977
- Issue date Jun 13, 2023
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Grant
Force deflection and resistance testing system and method of use
- Patent number 11,668,731
- Issue date Jun 6, 2023
- MODUS TEST, LLC
- Lynwood Adams
- G01 - MEASURING TESTING
Information Patent Grant
Test socket assembly with antenna and related methods
- Patent number 11,662,363
- Issue date May 30, 2023
- Xcerra Corporation
- Jason Mroczkowski
- G01 - MEASURING TESTING
Information Patent Grant
Contact probe and probe unit
- Patent number 11,656,246
- Issue date May 23, 2023
- NHK Spring Co., Ltd.
- Kohei Hironaka
- G01 - MEASURING TESTING
Information Patent Grant
Micro-coaxial wire interconnect architecture
- Patent number 11,656,247
- Issue date May 23, 2023
- Intel Corporation
- Ronald Michael Kirby
- G01 - MEASURING TESTING
Information Patent Grant
Low-thermal resistance pressing device for a socket
- Patent number 11,630,147
- Issue date Apr 18, 2023
- CHROMA ATE INC.
- Ming Cheng Huang
- G01 - MEASURING TESTING
Information Patent Grant
Test kit for testing a device under test
- Patent number 11,624,758
- Issue date Apr 11, 2023
- Mediatek Inc.
- Sheng-Wei Lei
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR COAXIAL TEST SOCKET AND PRINTED CIRCUIT BOA...
- Publication number 20240402217
- Publication date Dec 5, 2024
- Smiths Interconnect Americas, Inc.
- Khaled Elmadbouly
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR TEST SOCKETS HAVING SCRUBBING CONTACTS
- Publication number 20240393364
- Publication date Nov 28, 2024
- Smiths Interconnect Americas, Inc.
- Jiachun Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEST SOCKET
- Publication number 20240385214
- Publication date Nov 21, 2024
- TSE CO., LTD.
- Hae Guk Cho
- G01 - MEASURING TESTING
Information Patent Application
CONTACTOR FOR MULTI DEVICE SOCKETS AND RELATED
- Publication number 20240377454
- Publication date Nov 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Raffy CELIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST SOCKET
- Publication number 20240369597
- Publication date Nov 7, 2024
- TSE CO., LTD.
- Yee Sun Kang
- G01 - MEASURING TESTING
Information Patent Application
TEST SOCKET AND ASSEMBLY DEVICE THEREOF
- Publication number 20240361352
- Publication date Oct 31, 2024
- okins electronics Co.,Ltd
- Jin Kook JUN
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD AND SEMICONDUCTOR DEVICE INSPECTION SYSTEM INCLUDING THE...
- Publication number 20240353442
- Publication date Oct 24, 2024
- Korea University Research and Business Foundation
- Moonil Kim
- G01 - MEASURING TESTING
Information Patent Application
PROBE AND INSPECTION SOCKET
- Publication number 20240353444
- Publication date Oct 24, 2024
- Yamaichi Electronics Co., Ltd.
- Seiya YAMAMOTO
- G01 - MEASURING TESTING
Information Patent Application
TEST SOCKET
- Publication number 20240319227
- Publication date Sep 26, 2024
- WINWAY TECHNOLOGY CO., LTD.
- Po-Han YEH
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR TESTING SOCKET
- Publication number 20240302408
- Publication date Sep 12, 2024
- Antares Advanced Test Technologies (Suzhou) Limited
- Long Zhang
- G01 - MEASURING TESTING
Information Patent Application
SOCKET
- Publication number 20240295584
- Publication date Sep 5, 2024
- YOKOWO CO., LTD.
- Daisuke HOSOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PIN AND SPRING CONTACT INCLUDING THE SAME
- Publication number 20240280608
- Publication date Aug 22, 2024
- HICON CO., LTD.
- Dong Weon HWANG
- G01 - MEASURING TESTING
Information Patent Application
SOCKET, JIG, SOCKET MAINTENANCE SET, AND DISASSEMBLY METHOD
- Publication number 20240241172
- Publication date Jul 18, 2024
- YOKOWO CO., LTD.
- Kohei AMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET DEVICE FOR TESTING ICs
- Publication number 20240230716
- Publication date Jul 11, 2024
- HICON CO., LTD.
- Dong Weon HWANG
- G01 - MEASURING TESTING
Information Patent Application
TEMPERATURE RESISTANT CONTACT UNIT HOLDER RECEPTACLE ASSEMBLY AND R...
- Publication number 20240201224
- Publication date Jun 20, 2024
- Semiconductor Components Industries, LLC
- Novellie Pangilinan VICTORIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF
- Publication number 20240192252
- Publication date Jun 13, 2024
- NANYA TECHNOLOGY CORPORATION
- SHIH-TING LIN
- G01 - MEASURING TESTING
Information Patent Application
SOCKET DEVICE FOR TESTING ICs
- Publication number 20240183879
- Publication date Jun 6, 2024
- HICON CO., LTD.
- Dong Weon HWANG
- G01 - MEASURING TESTING
Information Patent Application
TEST SOCKET FOR AND A METHOD OF TESTING ELECTRONIC COMPONENTS, IN P...
- Publication number 20240168055
- Publication date May 23, 2024
- Cohu GmbH
- Stefan ENGELBRECHT
- G01 - MEASURING TESTING
Information Patent Application
Test socket
- Publication number 20240159794
- Publication date May 16, 2024
- OKINS ELECTRONICS CO.,LTD
- Jin Kook JUN
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICALLY CONDUCTIVE CONTACT PIN
- Publication number 20240159795
- Publication date May 16, 2024
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- G01 - MEASURING TESTING
Information Patent Application
TEST APPARATUS FOR IMAGE SENSOR PACKAGE
- Publication number 20240151769
- Publication date May 9, 2024
- TSE CO., LTD
- Min Cheol KIM
- G01 - MEASURING TESTING
Information Patent Application
SOCKET FOR TESTING SEMICONDUCTOR DEVICE
- Publication number 20240142493
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POGO PIN COOLING SYSTEM AND METHOD AND ELECTRONIC DEVICE TESTING AP...
- Publication number 20240142492
- Publication date May 2, 2024
- CHROMA ATE INC.
- I-Shih TSENG
- G01 - MEASURING TESTING
Information Patent Application
TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20240133942
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
RUBBER SOCKET WITH BUILT-IN COMPONENT
- Publication number 20240125845
- Publication date Apr 18, 2024
- TSE CO., LTD
- Seon A. KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE
- Publication number 20240094244
- Publication date Mar 21, 2024
- KIOXIA Corporation
- Tsunehiro KITA
- G01 - MEASURING TESTING
Information Patent Application
TEST SOCKET WITH CONDUCTIVE COMPRESSION CONTACTS FOR INTEGRATED CIR...
- Publication number 20240094245
- Publication date Mar 21, 2024
- Ironwood Electronics, Inc.
- Ilavarasan M. Palaniappa
- G01 - MEASURING TESTING
Information Patent Application
PRECISION, HIGH BANDWIDTH, SWITCHING ATTENUATOR
- Publication number 20240069065
- Publication date Feb 29, 2024
- Tektronix, Inc.
- JULIE A. CAMPBELL
- G01 - MEASURING TESTING
Information Patent Application
TEST SOCKET AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240069066
- Publication date Feb 29, 2024
- LEENO INDUSTRIAL INC.
- Woesuk YANG
- G01 - MEASURING TESTING
Information Patent Application
LOW PROFILE ELECTRONIC TESTING SYSTEM WITH FLEXIBLE TEST PCB FORMAT
- Publication number 20240061015
- Publication date Feb 22, 2024
- Modus Test, LLC
- Lynwood Adams
- G01 - MEASURING TESTING

concerning contact pieces or mechanical details

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Module substrate for semiconductor module, semiconductor module and...

Test socket

Socket

Testing devices and method for testing semiconductor devices

Socket for electrical component

Testing device and method for testing a device under test

Test socket having an automated lid

Resonant-coupled transmission line

Testing device for integrated circuit package

Spring contact and test socket with same

Chip socket, testing fixture and chip testing method thereof

Semiconductor chip test socket

Testing module and testing method using the same

Automated test system

Socket for inspection

Contact pin and socket

Ground connector in an integrated circuit testing apparatus

Precision, high bandwidth, switching attenuator

Test site configuration in an automated test system

Method and apparatus for conducting burn-in testing of semiconducto...

Socket and inspection socket

Testing module and testing method using the same

Conductive particle and testing socket comprising the same

Short interconnect assembly with strip elastomer

Force deflection and resistance testing system and method of use

Test socket assembly with antenna and related methods

Contact probe and probe unit

Micro-coaxial wire interconnect architecture

Low-thermal resistance pressing device for a socket

Test kit for testing a device under test

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR COAXIAL TEST SOCKET AND PRINTED CIRCUIT BOA...

SYSTEMS AND METHODS FOR TEST SOCKETS HAVING SCRUBBING CONTACTS

TEST SOCKET

CONTACTOR FOR MULTI DEVICE SOCKETS AND RELATED

TEST SOCKET

TEST SOCKET AND ASSEMBLY DEVICE THEREOF

PROBE CARD AND SEMICONDUCTOR DEVICE INSPECTION SYSTEM INCLUDING THE...

PROBE AND INSPECTION SOCKET

TEST SOCKET

SEMICONDUCTOR TESTING SOCKET

SOCKET

CONTACT PIN AND SPRING CONTACT INCLUDING THE SAME

SOCKET, JIG, SOCKET MAINTENANCE SET, AND DISASSEMBLY METHOD

SOCKET DEVICE FOR TESTING ICs

TEMPERATURE RESISTANT CONTACT UNIT HOLDER RECEPTACLE ASSEMBLY AND R...

CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF

SOCKET DEVICE FOR TESTING ICs

TEST SOCKET FOR AND A METHOD OF TESTING ELECTRONIC COMPONENTS, IN P...

Test socket

ELECTRICALLY CONDUCTIVE CONTACT PIN

TEST APPARATUS FOR IMAGE SENSOR PACKAGE

SOCKET FOR TESTING SEMICONDUCTOR DEVICE

POGO PIN COOLING SYSTEM AND METHOD AND ELECTRONIC DEVICE TESTING AP...

TESTING MODULE AND TESTING METHOD USING THE SAME

RUBBER SOCKET WITH BUILT-IN COMPONENT

SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE

TEST SOCKET WITH CONDUCTIVE COMPRESSION CONTACTS FOR INTEGRATED CIR...

PRECISION, HIGH BANDWIDTH, SWITCHING ATTENUATOR

TEST SOCKET AND METHOD OF MANUFACTURING THE SAME

LOW PROFILE ELECTRONIC TESTING SYSTEM WITH FLEXIBLE TEST PCB FORMAT