The present invention is related to the fabrication and manufacture of thin-film solid-state batteries and, in particular, for example, the formation of a dense, single phase sputter target of lithium orthophosphate, Li3PO4, for reactive sputter deposition of a film or layer of lithium phosphorus oxynitride, known in the literature as LIPON, that may be utilized as an electrolyte, separator, or dielectric layer inside a thin-film battery or any other charge storage device structure, such as capacitors.
Solid-state thin-film batteries are typically formed by stacking thin films on a substrate in such a way that the films cooperate to generate a voltage. The thin films typically include current collectors, a positive cathode, a negative anode, and an electrolyte film. The cathode and the electrolyte can be deposited utilizing a number of vacuum deposition processes, including physical vapor deposition, which includes evaporation and sputtering. Other methods of deposition include chemical vapor deposition and electroplating.
In a thin-film battery configuration, the cathode layer is separated from the anode layer by the insulating layer of solid electrolyte material. This electrolyte layer provides two functions. The first function is to conduct the electrochemically active ions between the cathode and the anode. The second function is to prevent the direct exchange of electrons between the cathode and the anode so that the electronic current becomes available only in the external circuit. In the case of a lithium based battery which comprises, for example, lithium (metal anode) batteries, lithium ion (anode) batteries, and lithium-free (anode) batteries, the electrochemically active ion that is exchanged is the Lithium+1 ion or the Li+ ion. In U.S. Pat. No. 5,597,660 to John B. Bates, Jan. 28, 1997, it is reported, “Most critical to battery performance is the choice of electrolyte. It is known that the principal limitation on recharge ability of prior batteries is failure of the electrolyte. Battery failure after a number of charge-discharge cycles and the loss of charge on standing is caused by reaction between the anode and the electrolyte, e.g. attack of the lithium anode on the lithium electrolyte in lithium batteries.” (Bates, column 2, lines 10-16).
The use of lithium phosphorus oxynitride is well known in the literature as LIPON and suitable for the formation of the solid thin film electrolyte layer in such devices. See, for instance, U.S. Pat. No. 5,569,520, Apr. 30, 1996 and U.S. Pat. No. 5,597,660, Jan. 28, 1997, issued to John B. Bates and N. J. Dudney. The resulting LIPON film was found to be stable in contact with the lithium anode. Perhaps as important, Bates et al. reported that incorporation of nitrogen into lithium orthophosphate films increased their Li+ ion conductivity up to 2.5 orders of magnitude.
Both U.S. Pat. Nos. 5,569,520 and 5,597,660 disclose the formation of amorphous lithium phosphorus oxynitride electrolyte films deposited over the cathode by sputtering Li3PO4, lithium orthophosphate, in a nitrogen atmosphere. Both patents teach that the targets were prepared by cold pressing of lithium orthophosphate powder followed by sintering of the pressed disc in air at 900° C. In each patent, deposition of a 1 micron thick film was carried out over a period of 16-21 hours at an average rate of 8-10 Angstroms per minute. The resulting film composition was LixPOyNz where x has approximate value 2.8, while 2y+3z equals about 7.8, and z has an approximate value of 0.16 to 0.46.
There were two shortcomings with regard to the sputter target disclosed by Bates, et al. One was the low rate of deposition. In part, the low deposition rate is a result of an inherent low sputter rate of a low density target material. In addition, high sputter rates also require high sputter power, which was not, or could not be applied. The other shortcoming is the presence of impurity phases in the lithium orthophosphate target material. These impurity phases can cause plasma instability, as reported by other workers for other sputter target materials. Also, the impurity phases that were likely present in the method taught by Bates could have weakened the sputter target and caused target cracking at higher sputter powers. Hence, high power and high rate deposition were not often possible with sputter targets having these impurities in the target material.
High density ceramic bodies or tiles of the lithium orthophosphate material suitable as sputtering target have been demonstrated by at least two methods: sintering and hot pressing. However, due to the large number of known oxides of phosphorus, targets that are commercially available have been shown by the present research and investigation to be rich in at least one or more impurity phases, such as Li4P2O7, which is deficient in lithium oxide (Li2O) as informally described by L4P2O7=Li3PO4●LiPO3 where LiPO3=Li3PO4−Li2O. Such compound and concentration variations of the impurity phases inside the parent material Li3PO4 due to presently available commercial manufacturing methods cause undesirable variations in the properties of the sputter target. These impurities cause plasma instability and target damage. For instance, they weaken the mechanical integrity of the sputter target, which is then prone to flaking and cracks. A weakened target can lead to particle generation, which, in turn, is built into the deposited film as defects. Impurities also weaken the sputter target through the formation of separated or agglomerated regions of higher or lower physical properties, such as density, elastic modulus, or color. At a given sputter power level these regions exhibit different sputter rates and sputtered composition compared with the surrounding sputter target areas. This scenario results in off-stoichiometric and non-uniform films. In particular, the impurity Li4P2O7 is deficient in lithium (oxide), which causes the deposited lithium phosphorus oxynitride film to be deficient in lithium. In that case, the Bates patent describes x of LixPOyNz equal to 2.8, and this patent is not specific regarding the actual ratio of lithium to phosphorus. Due to these process variations and defects caused by multi phase sputter targets, the deposited films display particle defects that typically result in electrical shorting of the thin-film battery. The same holds true if LIPON was used as the dielectric in a capacitor. The deposited films also show variation in chemical composition and poor uniformity. As a result, solid state batteries containing the subject LIPON electrolyte sputtered from multi phase lithium orthophosphate targets have poor yields and very low manufacturing rates. Furthermore, such films have not been practically manufacturable and therefore have remained only a scientific and engineering curiosity. Hence, mass produced batteries, typical of other vacuum thin film manufactured products such as semiconductor chips or LCD display panels, have not been made available for use with solid state batteries that first require generally defect free, uniform LIPON electrolyte films.
Lithium phosphorus oxynitride films must be chemically inert to the other layers present in thin film solid state batteries, capacitors and memory devices. Thin film batteries equipped with such an electrolyte are known to offer many benefits of high recharge cycle life, low impedance for fast charging and discharging, and high temperature operation such as 150° C. or even higher. Thin film batteries using lithium phosphorus oxynitride electrolytes can be made very small and thin, while providing high energy storage density when configured with thin film lithium cobalt oxide cathode layers.
Although, experimental batteries fabricated with lithium phosphorus oxynitride electrolyte layer have been reported, no commercial devices are generally available today due to the difficulty in sputtering from a lithium orthophosphate ceramic sputter target material formed by prior art methods. The industry has difficulty producing commercial thin film batteries with a lithium phosphorus oxynitride thin-film electrolyte for two major reasons. The first reason is that efficient sputtering of pure materials to form films or layers on a substrate cannot be accomplished economically from low density targets. The second reason is that sputter targets including more than one phase possess physical properties such as strength, elastic modulus, hardness, chemical composition, thermal conductivity, dielectric strength and even color that vary widely over the target surface. At a given power level the different phases of the target material will sputter at different rates, leading to non uniform erosion of the sputter target and non-uniform properties of the sputtered film. Moreover, commercial lithium orthophosphate targets evaluated were found to contain one or more impurity phases as discussed further below.
U.S. Pat. No. 5,435,826 by M. Sakakibara and H. Kikuchi discloses a method of forming a dense, single phase sputtering target of indium-tin oxide for sputtering an indium tin oxide layer or film by a particular method of sintering under particular high temperature and time conditions. In the '826 patent, a single phase sputter target having a density of 93% or more while containing a second impurity phase with a concentration of less than 10% is discussed. Sakakibara et. al. discloses the plasma instabilities that arise with multiphase targets as well as the high quality oxide film that can be made from the sputter target having both high density and high single phase composition.
Accordingly, there remains is a need for uniform high density commercial lithium orthophosphate targets. Therefore, there is also a need for a method of forming a dense, single phase sputter target of lithium orthophosphate that allows for deposition of a high quality LIPON layer at high rates of deposition.
Various aspects and embodiments of the present invention, as described in more detail and by example below, address certain of the shortfalls of the background technology and emerging needs in the relevant industries. Accordingly, the present invention is directed, for example, to a sputter target and a method of forming a sputter target that substantially obviate one or more of the shortcomings or problems due to the limitations and disadvantages of the related art.
In one aspect of an embodiment of the invention, a sputter target may be formed from single phase lithium orthophosphate material into a high density, uniform ceramic body comprised of pure lithium orthophosphate without the formation of impurity phases. The sputter target fabricated from such body is suitable for the deposition of LIPON films. Some exemplary embodiments of the invention address the need for a sputter target to deposit LIPON films utilized as the electrolyte layer in a solid state rechargeable lithium based battery or other charge storage or charge transfer device.
In another aspect of an embodiment of the invention, a method of forming a high density, single phase sputter target of Li3PO4 includes a first step of refining a powder of pure Li3PO4, a second step of densifying the powder by cold isostatic pressing (CIP) to form the powder into an initial consolidated lithium orthophosphate material body (green body), degassing the consolidated material, and hot isostatic pressing (HIP) the degassed ceramic body into an initial lithium orthophosphate material body to form a dense ceramic body or material of single phase lithium orthophosphate.
In yet another aspect of an embodiment of the invention, an HIP process is performed for about 2 hours above 10 kpsi at a temperature less than about less than about 850° C. to form a 95% to 99% dense ceramic body or material of single phase lithium orthophosphate.
In another aspect of an embodiment of the invention, a dense ceramic body or material of single phase lithium orthophosphate is formed into a sputter target used to deposit a layer of LIPON onto a substrate.
Another aspect of an embodiment of the invention involves fabricating single phase lithium orthophosphate sputter targets by adding appropriate small amounts of pure Li2O powder to powder of pure Li3PO4 to thermodynamically prevent the formation of the predominant impurity phase Li4P2O7 during a heating step. This approach is to be understood from the point that Li4P2O7 is a lithium orthophosphate derivative, which is deficient in lithium oxide (Li2O), as informally described by Li4P2O7=Li3PO4●LiPO3 wherein LiPO3=Li3PO4−Li2O. The appropriate small amounts of Li2O powder will further counteract the loss of any Li2O during the sputter target fabrication process described above through pushing the thermodynamic equilibrium of the following chemical reaction to the side of the pure Li3PO4:Li4P2O7+Li2O=2 Li3PO4.
Another aspect of an embodiment of the invention, a battery structure may be formed inside a vacuum deposition system using the lithium orthophosphate sputter target to form the thin-film electrolyte layer of said battery structure.
Another aspect of an embodiment of the invention is a method of producing a battery inside a vacuum deposition system. It includes: 1) loading a substrate into the vacuum deposition system; 2) depositing an optional barrier layer onto the substrate in one vacuum chamber; 3) depositing an optional conducting layer over the substrate or over the optional barrier layer inside the vacuum chamber or inside a different vacuum chamber of the vacuum deposition system; 4) depositing a LiCoO2 layer over the optional barrier layer or the optional conducting layer inside the vacuum chamber or inside a different vacuum chamber of the vacuum deposition system; 5) depositing a LIPON electrolyte layer over the LiCoO2 layer inside the vacuum chamber or inside a different vacuum chamber of the vacuum deposition system; 6) depositing an anode layer over the LIPON electrolyte layer inside the vacuum chamber or inside a different vacuum chamber of the vacuum deposition system; and 7) depositing an optional, second conducting layer over the anode layer inside vacuum chamber or inside a different vacuum chamber of the vacuum deposition system.
In another aspect of an embodiment of the invention, a step of refining a powder of pure Li3PO4 refines the powder to a mesh size of 250 mesh.
In still another aspect of an embodiment of the invention, densification of the pure lithium orthophosphate powder may be carried out in a CIP process resulting in a consolidated material body (green body) that exhibits approximately 50% of the theoretical density of lithium orthophosphate.
In yet another aspect of an embodiment of the invention, degasification of the consolidated material may be carried out at a temperature between 400° C. to 550° C. in a suitable steel vessel.
Another aspect of an embodiment of the invention includes performing an HIP process in a lined and scaled steel vessel at pressures of well above 10 kpsi and at a temperature less than about 850° C. for about 2 hours to form a 95% to 99% dense ceramic body or material of single phase lithium orthophosphate.
These and further embodiments are further discussed below with respect to the following figures.
Some features and advantages of the invention are described with reference to the drawings of certain preferred embodiments, which are intended to illustrate and not to limit the invention.
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention that together with the description serve to explain the principles of the invention. In the drawings:
These and other aspects of the invention will now be described in greater detail in connection with exemplary embodiments that are illustrated in the accompanying drawings.
It is to be understood that the present invention is not limited to the particular methodology, compounds, materials, manufacturing techniques, uses, and applications described herein, as these may vary. It is also to be understood that the terminology used herein is used for the purpose of describing particular embodiments only, and is not intended to limit the scope of the present invention. It must be noted that as used herein and in the appended claims, the singular forms “a,” “an,” and “the” include the plural reference unless the context clearly dictates otherwise. Thus, for example, a reference to “an element” is a reference to one or more elements and includes equivalents thereof known to those skilled in the art. Similarly, for another example, a reference to “a step” or “a means” is a reference to one or more steps or means and may include sub-steps and subservient means. All conjunctions used are to be understood in the most inclusive sense possible. Thus, the word “or” should be understood as having the definition of a logical “or” rather than that of a logical “exclusive or” unless the context clearly necessitates otherwise. Structures described herein are to be understood also to refer to functional equivalents of such structures. Language that may be construed to express approximation should be so understood unless the context clearly dictates otherwise.
Unless defined otherwise, all technical and scientific terms used herein have the same meanings as commonly understood by one of ordinary skill in the art to which this invention belongs. Preferred methods, techniques, devices, and materials are described, although any methods, techniques, devices, or materials similar or equivalent to those described herein may be used in the practice or testing of the present invention. Structures described herein are to be understood also to refer to functional equivalents of such structures. Unless the context of the disclosure or claims dictate otherwise, for example, the terms “target” and “target title” maybe used interchangeably.
All patents and other publications identified are incorporated herein by reference for the purpose of describing and disclosing, for example, the methodologies described in such publications that might be used in connection with the present invention. These publications are provided solely for their disclosure prior to the filing date of the present application. Nothing in this regard should be construed as an admission that the inventors are not entitled to antedate such disclosure by virtue of prior invention or for any other reason.
According to embodiments of the present invention, it can be seen that process conditions similar to those described by Sakakibara et al. (U.S. Pat. No. 5,435,826, discussed above) and other methods currently researched and disclosed for formation of the predominantly single phase indium tin oxide target are not useful and do not lead to acceptable single phase, high density targets of lithium orthophosphate. Indeed, it is not clear, for a given material, that even a pure powder of a pure composition can be densified suitably for the purpose of sputtering without forming secondary or impurity phases. In some cases, pressure causes the formation of new chemical phases or the loss of a portion of the starting material as it transforms into another compound or chemical phase. In some other cases, temperature will result in similar transformations or degeneration of phase purity. Additionally, phase diagrams for ternary compounds of lithium, oxygen and phosphorus are known for only a few conditions of constant temperature or pressure. In addition to the under-oxidized phosphite anion (PO3)3−, wherein the phosphorus adopts the +3 oxidation state, there are more anionic species known in which the phosphorus assumes other well known states such as +5 (phosphates; (PO4)3−) and +1 (hypo-phosphites; (PO2)3−) or −3 (phosphonium compounds; (PH4)+).
In accordance with some embodiments of the present invention, a sputter target of Li3PO4 having a density very close to the theoretical density of 2.48 g/cm3 can be formed. Sputter targets that are currently available, particularly those of a densified ceramic or vitreous material, are often of low density because of the incorporation of voids and porosity during the fabrication process from power feedstock or other low density starting material. As a dense target is sputtered, the surface of the target may remain continuous and display a surface of constant roughness or even become smoother under the influence of the sputter process, which is a process for the direct atomization or vaporization of the sputter target directly from the solid state. In this process, the material of the target is deposited on a substrate by the condensation of the vapor on the substrate to be coated. Less dense targets may become rougher as the porosity is exposed by continuous removal of the surface during the sputtering process, which in turn can increase the porosity thereby fueling the surface roughening. This situation can create a vicious cycle of a runaway degradation of the target surface. Plasma instability may result at the asperities of the rough surface. Roughening leads to flaking-off of particulate material from the rough target surface. These particles produced from the rough surface may contribute to defects or particle occlusions in the deposited film. For example, electrolyte films infected with a particle occlusion may exhibit a film discontinuity or pinhole defect under, above or around the occlusion. This occlusion can lead to undesirable results, such as short-circuiting a battery through reaction of the cathode material with the anode material, which may come into contact with each other at the discontinuity or pinhole defect in the electrolyte film. Analogous effects also may occur in other device films, such as capacitor dielectrics.
Some embodiments of the present invention may result in lithium orthophosphate sputter targets with a single phase purity achieved simultaneously with high density. In order to evaluate the phase composition of available commercial lithium orthophosphate target materials, two samples were obtained. One sample was hot pressed and had a density of 95%, the other was sintered and had a density of 81%. The X-ray diffraction (XRD) analyses of these two samples, shown in
According to some embodiments of process 100, a pure powder 101 of lithium orthophosphate of mesh size 80 may be prepared. A powder 103 of refined size having a mesh of 250 (average 250 mesh screen grain size is about 75 microns while average 80 mesh screen is about 180 microns) can be formed by means such as jet milling or other powder size reduction process. After de-agglomeration of the mesh 250 powder, a mean grain size of about 25 microns can be obtained. The powder can be refined to a fine grain size condition so that it will undergo high density densification in the subsequent steps 105 and 111 at temperatures lower than is used by conventional sintering, hot pressing, or HIP processes so as to avoid the formation of the impurity phase shown in
In step 105, the refined powder is packaged in a rubber mold of an appropriate size and pressed at room temperature at a pressure sufficient to densify the material to about 50-60% of the theoretical density of 2.48 g/cm3 to form a green billet. In some embodiments a pressure of about 12 kpsi can be applied to form a green billet of ˜50% density. The green billet can be considered a ceramic body.
According to some embodiments of the present invention, in step 107 the ceramic body formed in step 105 is packaged in a closed steel container that has a liner of, for example, molybdenum, graphite paper or graphite foil with a thickness of about 80/1000 of an inch. The container may be equipped with a means for gas evacuation.
Process 100 may further include the step 109 of degassing the 50% dense ceramic body by evacuation of the atmosphere down to 10−6 Torr of the container formed in step 107 while heating the container at a constant rate to a temperature between 400-550° C. for a period of time to reach the appropriate vacuum level. For example, small billets can be degassed successfully at only 400° C. within a few hours but larger billets of ˜10 kg may require higher temperatures of up to 550° C. to ensure degassing within 2 days.
The DSC data shown in
In step 109, the powder can be degassed and water removed.
The formation of the impurity phase Li4P2O7 occurs at a temperature of approximately 880° C., which is shown to have an enthalpy of formation of 21.8 Joules per gram.
In order to further improve the phase purity of a lithium orthophosphate sputter target described by an embodiment of the present invention, one may add appropriate small amounts of pure Li2O powder to the powder of pure Li3PO4 prior to the powder refinement process using a mesh screen of 250. These small amounts of Li2O thermodynamically prevent the formation of the predominant impurity phase Li4P2O7 during any of the heating steps described in the previous paragraphs. This approach is to be understood from the point that Li4P2O7 is a lithium orthophosphate derivative, which is deficient in lithium oxide (Li2O), as informally described by Li4P2O7=Li3PO4●LiPO3, wherein LiPO3=Li3PO4−Li2O. It has been found that appropriate small amounts of Li2O powder will thermodynamically counteract the loss of any Li2O during the sputter target fabrication process described above, thereby favoring the formation of more, pure Li3PO4 at the expense of the impurity phase Li4P2O7.
According to some embodiments of the present invention and consistent with the conditions discovered for the degas step 109, the pre-densified ceramic body formed in step 107 is sealed in the steel container package 107. In step 111, the pre-densified ceramic body is subjected to a hot isostatic pressure (HIP) process at a heating rate of about ½° C. per minute to a temperature of below 850° C. and maintained for about 2 hours. It is thereafter cooled at a rate of ½° C. per minute. Process 111 takes about 2 days. Although the HIP process 111 can be carried out at 850° C. without the formation of an impurity phase, it was determined that stress related brittle cracking during step 113 could be reduced or eliminated by reducing the maximum temperature of step 109 to 800° C. The resulting ceramic body of pure lithium orthophosphate in step 111 may be polycrystalline, single crystalline, or glassy.
According to embodiments of process 100, the HIP can and ceramic body provided in process step 111 is removed of the steel can by surface grinding to reveal the ceramic body in step 113. The body of densified, single phase lithium orthophosphate material is then sliced, for example, by means of a diamond saw or wheel and surface ground or lapped under dry conditions to form “tiles” or plate parts suitable for sputter target fabrication, either for single tile arrangement or for multi-tile assembly, which is part of step 113.
The embodiments described above are exemplary only. One skilled in the art may recognize variations from the embodiments specifically described here, which are intended to be within the scope of this disclosure. As such, the invention is limited only by the following claims. Thus, it is intended that the present invention cover the modifications of this invention provided they come within the scope of the appended claims and their equivalents. Further, specific explanations or theories regarding the formation or performance of lithium orthophosphate target material or films formed from such target material according to embodiments of the present invention are presented for explanation only and are not to be considered limiting with respect to the scope of the present disclosure or the claims.
This application is related to and claims the benefit under 35 U.S.C. §119 of U.S. provisional application Ser. No. 60/864,755, entitled “SPUTTERING TARGET OF Li3PO4 AND METHOD FOR PRODUCING SAME,” filed on Nov. 7, 2006, which is incorporated herein by reference in its entirety.
Number | Name | Date | Kind |
---|---|---|---|
712316 | Loppe et al. | Oct 1902 | A |
2970180 | Urry | Jan 1961 | A |
3309302 | Heil | Mar 1967 | A |
3616403 | Collins et al. | Oct 1971 | A |
3790432 | Fletcher et al. | Feb 1974 | A |
3797091 | Gavin | Mar 1974 | A |
3850604 | Klein | Nov 1974 | A |
3939008 | Longo et al. | Feb 1976 | A |
4082569 | Evans, Jr. | Apr 1978 | A |
4111523 | Kaminow et al. | Sep 1978 | A |
4127424 | Ullery, Jr. | Nov 1978 | A |
4226924 | Kimura et al. | Oct 1980 | A |
4283216 | Brereton | Aug 1981 | A |
4318938 | Barnett et al. | Mar 1982 | A |
4328297 | Bilhorn | May 1982 | A |
4437966 | Hope et al. | Mar 1984 | A |
4442144 | Pipkin | Apr 1984 | A |
4467236 | Kolm et al. | Aug 1984 | A |
4481265 | Ezawa et al. | Nov 1984 | A |
4518661 | Rippere | May 1985 | A |
4555456 | Kanehori et al. | Nov 1985 | A |
4572873 | Kanehori et al. | Feb 1986 | A |
4587225 | Tsukuma et al. | May 1986 | A |
4619680 | Nourshargh et al. | Oct 1986 | A |
4645726 | Hiratani et al. | Feb 1987 | A |
4664993 | Sturgis et al. | May 1987 | A |
4668593 | Sammells | May 1987 | A |
RE32449 | Claussen | Jun 1987 | E |
4672586 | Shimohigashi et al. | Jun 1987 | A |
4710940 | Sipes, Jr. | Dec 1987 | A |
4728588 | Noding et al. | Mar 1988 | A |
4740431 | Little | Apr 1988 | A |
4756717 | Sturgis et al. | Jul 1988 | A |
4785459 | Baer | Nov 1988 | A |
4826743 | Nazri | May 1989 | A |
4865428 | Corrigan | Sep 1989 | A |
4878094 | Balkanski | Oct 1989 | A |
4903326 | Zakman et al. | Feb 1990 | A |
4915810 | Kestigian et al. | Apr 1990 | A |
4964877 | Keister et al. | Oct 1990 | A |
4977007 | Kondo et al. | Dec 1990 | A |
4978437 | Wirz | Dec 1990 | A |
5006737 | Fay | Apr 1991 | A |
5019467 | Fujiwara | May 1991 | A |
5030331 | Sato | Jul 1991 | A |
5035965 | Sangyoji et al. | Jul 1991 | A |
5055704 | Link et al. | Oct 1991 | A |
5057385 | Hope et al. | Oct 1991 | A |
5085904 | Deak et al. | Feb 1992 | A |
5096852 | Hobson | Mar 1992 | A |
5100821 | Fay | Mar 1992 | A |
5107538 | Benton et al. | Apr 1992 | A |
5110694 | Nagasubramanian et al. | May 1992 | A |
5110696 | Shokoohi et al. | May 1992 | A |
5119269 | Nakayama | Jun 1992 | A |
5119460 | Bruce et al. | Jun 1992 | A |
5124782 | Hundt et al. | Jun 1992 | A |
5147985 | DuBrucq | Sep 1992 | A |
5153710 | McCain | Oct 1992 | A |
5169408 | Biggerstaff et al. | Dec 1992 | A |
5171413 | Arntz et al. | Dec 1992 | A |
5173271 | Chen et al. | Dec 1992 | A |
5174876 | Buchal et al. | Dec 1992 | A |
5180645 | Moré | Jan 1993 | A |
5187564 | McCain | Feb 1993 | A |
5196041 | Tumminelli et al. | Mar 1993 | A |
5196374 | Hundt et al. | Mar 1993 | A |
5200029 | Bruce et al. | Apr 1993 | A |
5202201 | Meunier et al. | Apr 1993 | A |
5206925 | Nakazawa et al. | Apr 1993 | A |
5208121 | Yahnke et al. | May 1993 | A |
5217828 | Sangyoji et al. | Jun 1993 | A |
5221891 | Janda et al. | Jun 1993 | A |
5225288 | Beeson et al. | Jul 1993 | A |
5227264 | Duval et al. | Jul 1993 | A |
5237439 | Misono et al. | Aug 1993 | A |
5252194 | Demaray et al. | Oct 1993 | A |
5262254 | Koksbang et al. | Nov 1993 | A |
5273608 | Nath | Dec 1993 | A |
5287427 | Atkins et al. | Feb 1994 | A |
5296089 | Chen et al. | Mar 1994 | A |
5300461 | Ting | Apr 1994 | A |
5303319 | Ford et al. | Apr 1994 | A |
5306569 | Hiraki | Apr 1994 | A |
5307240 | McMahon | Apr 1994 | A |
5309302 | Vollmann | May 1994 | A |
5314765 | Bates | May 1994 | A |
5326652 | Lake | Jul 1994 | A |
5326653 | Chang | Jul 1994 | A |
5338624 | Gruenstern et al. | Aug 1994 | A |
5338625 | Bates et al. | Aug 1994 | A |
5342709 | Yahnke et al. | Aug 1994 | A |
5355089 | Treger | Oct 1994 | A |
5360686 | Peled et al. | Nov 1994 | A |
5362579 | Rossoll et al. | Nov 1994 | A |
5381262 | Arima et al. | Jan 1995 | A |
5387482 | Anani | Feb 1995 | A |
5401595 | Kagawa et al. | Mar 1995 | A |
5403680 | Otagawa et al. | Apr 1995 | A |
5411537 | Munshi et al. | May 1995 | A |
5411592 | Ovshinsky et al. | May 1995 | A |
5419982 | Tura et al. | May 1995 | A |
5427669 | Drummond | Jun 1995 | A |
5435826 | Sakakibara et al. | Jul 1995 | A |
5437692 | Dasgupta et al. | Aug 1995 | A |
5445856 | Chaloner-Gill | Aug 1995 | A |
5445906 | Hobson et al. | Aug 1995 | A |
5448110 | Tuttle et al. | Sep 1995 | A |
5449576 | Anani | Sep 1995 | A |
5455126 | Bates et al. | Oct 1995 | A |
5457569 | Liou et al. | Oct 1995 | A |
5458995 | Behl et al. | Oct 1995 | A |
5464692 | Huber | Nov 1995 | A |
5464706 | Dasgupta et al. | Nov 1995 | A |
5470396 | Mongon et al. | Nov 1995 | A |
5472795 | Atita | Dec 1995 | A |
5475528 | LaBorde | Dec 1995 | A |
5478456 | Humpal et al. | Dec 1995 | A |
5483613 | Bruce et al. | Jan 1996 | A |
5493177 | Muller et al. | Feb 1996 | A |
5498489 | Dasgupta et al. | Mar 1996 | A |
5499207 | Miki et al. | Mar 1996 | A |
5501918 | Gruenstern et al. | Mar 1996 | A |
5504041 | Summerfelt | Apr 1996 | A |
5512147 | Bates et al. | Apr 1996 | A |
5512387 | Ovshinsky | Apr 1996 | A |
5512389 | Dasgupta et al. | Apr 1996 | A |
5538796 | Schaffer et al. | Jul 1996 | A |
5540742 | Sangyoji et al. | Jul 1996 | A |
5547780 | Kagawa et al. | Aug 1996 | A |
5547782 | Dasgupta et al. | Aug 1996 | A |
5552242 | Ovshinsky et al. | Sep 1996 | A |
5555127 | Abdelkader et al. | Sep 1996 | A |
5561004 | Bates et al. | Oct 1996 | A |
5563979 | Bruce et al. | Oct 1996 | A |
5565071 | Demaray et al. | Oct 1996 | A |
5567210 | Bates et al. | Oct 1996 | A |
5569520 | Bates | Oct 1996 | A |
5582935 | Dasgupta et al. | Dec 1996 | A |
5591520 | Migliorini et al. | Jan 1997 | A |
5597660 | Bates et al. | Jan 1997 | A |
5597661 | Takeuchi et al. | Jan 1997 | A |
5599355 | Nagasubramanian et al. | Feb 1997 | A |
5601952 | Dasgupta et al. | Feb 1997 | A |
5603816 | Demaray et al. | Feb 1997 | A |
5607560 | Hirabayashi et al. | Mar 1997 | A |
5607789 | Treger et al. | Mar 1997 | A |
5612152 | Bates | Mar 1997 | A |
5612153 | Moulton et al. | Mar 1997 | A |
5613995 | Bhandarkar et al. | Mar 1997 | A |
5616933 | Li | Apr 1997 | A |
5618382 | Mintz et al. | Apr 1997 | A |
5625202 | Chai | Apr 1997 | A |
5637418 | Brown et al. | Jun 1997 | A |
5643480 | Gustavsson et al. | Jul 1997 | A |
5644207 | Lew et al. | Jul 1997 | A |
5645626 | Edlund et al. | Jul 1997 | A |
5645960 | Scrosati et al. | Jul 1997 | A |
5654054 | Tropsha et al. | Aug 1997 | A |
5654984 | Hershbarger et al. | Aug 1997 | A |
5658652 | Sellergren | Aug 1997 | A |
5660700 | Shimizu et al. | Aug 1997 | A |
5665490 | Takeuchi et al. | Sep 1997 | A |
5667538 | Bailey | Sep 1997 | A |
5677784 | Harris | Oct 1997 | A |
5679980 | Summerfelt | Oct 1997 | A |
5681666 | Treger et al. | Oct 1997 | A |
5686360 | Harvey, III et al. | Nov 1997 | A |
5689522 | Beach | Nov 1997 | A |
5693956 | Shi et al. | Dec 1997 | A |
5702829 | Paidassi et al. | Dec 1997 | A |
5705293 | Hobson | Jan 1998 | A |
5718813 | Drummond | Feb 1998 | A |
5719976 | Henry et al. | Feb 1998 | A |
5721067 | Jacobs et al. | Feb 1998 | A |
RE35746 | Lake | Mar 1998 | E |
5731661 | So et al. | Mar 1998 | A |
5738731 | Shindo et al. | Apr 1998 | A |
5742094 | Ting | Apr 1998 | A |
5755938 | Fukui et al. | May 1998 | A |
5755940 | Shindo | May 1998 | A |
5757126 | Harvey, III et al. | May 1998 | A |
5762768 | Goy et al. | Jun 1998 | A |
5763058 | Isen et al. | Jun 1998 | A |
5771562 | Harvey, III et al. | Jun 1998 | A |
5776278 | Tuttle et al. | Jul 1998 | A |
5779839 | Tuttle et al. | Jul 1998 | A |
5790489 | O'Connor | Aug 1998 | A |
5792550 | Phillips et al. | Aug 1998 | A |
5805223 | Shikakura et al. | Sep 1998 | A |
5811177 | Shi et al. | Sep 1998 | A |
5814195 | Lehan et al. | Sep 1998 | A |
5830330 | Lantsman | Nov 1998 | A |
5831262 | Greywall et al. | Nov 1998 | A |
5834137 | Zhang et al. | Nov 1998 | A |
5841931 | Foresi et al. | Nov 1998 | A |
5842118 | Wood, Jr. | Nov 1998 | A |
5845990 | Hymer | Dec 1998 | A |
5847865 | Gopinath et al. | Dec 1998 | A |
5849163 | Ichikawa et al. | Dec 1998 | A |
5851896 | Summerfelt | Dec 1998 | A |
5853830 | McCaulley et al. | Dec 1998 | A |
5855744 | Halsey et al. | Jan 1999 | A |
5856705 | Ting | Jan 1999 | A |
5864182 | Matsuzaki | Jan 1999 | A |
5865860 | Delnick | Feb 1999 | A |
5870273 | Sogabe et al. | Feb 1999 | A |
5874184 | Takeuchi et al. | Feb 1999 | A |
5882721 | Delnick | Mar 1999 | A |
5882946 | Otani | Mar 1999 | A |
5889383 | Teich | Mar 1999 | A |
5895731 | Clingempeel | Apr 1999 | A |
5897522 | Nitzan | Apr 1999 | A |
5900057 | Buchal et al. | May 1999 | A |
5909346 | Malhotra et al. | Jun 1999 | A |
5916704 | Lewin et al. | Jun 1999 | A |
5923964 | Li | Jul 1999 | A |
5930046 | Solberg et al. | Jul 1999 | A |
5930584 | Sun et al. | Jul 1999 | A |
5942089 | Sproul et al. | Aug 1999 | A |
5948215 | Lantsman | Sep 1999 | A |
5948464 | Delnick | Sep 1999 | A |
5948562 | Fulcher et al. | Sep 1999 | A |
5952778 | Haskal et al. | Sep 1999 | A |
5955217 | Lerberghe | Sep 1999 | A |
5961672 | Skotheim et al. | Oct 1999 | A |
5961682 | Lee et al. | Oct 1999 | A |
5966491 | DiGiovanni | Oct 1999 | A |
5970393 | Khorrami et al. | Oct 1999 | A |
5973913 | McEwen et al. | Oct 1999 | A |
5977582 | Fleming et al. | Nov 1999 | A |
5982144 | Johnson et al. | Nov 1999 | A |
5985484 | Young et al. | Nov 1999 | A |
5985485 | Ovshinsky et al. | Nov 1999 | A |
6000603 | Koskenmaki et al. | Dec 1999 | A |
6001224 | Drummond et al. | Dec 1999 | A |
6004660 | Topolski et al. | Dec 1999 | A |
6007945 | Jacobs et al. | Dec 1999 | A |
6013949 | Tuttle | Jan 2000 | A |
6019284 | Freeman et al. | Feb 2000 | A |
6023610 | Wood, Jr. | Feb 2000 | A |
6024844 | Drummond et al. | Feb 2000 | A |
6025094 | Visco et al. | Feb 2000 | A |
6028990 | Shahani et al. | Feb 2000 | A |
6030421 | Gauthier et al. | Feb 2000 | A |
6033768 | Muenz et al. | Mar 2000 | A |
6042965 | Nestler et al. | Mar 2000 | A |
6045626 | Yano et al. | Apr 2000 | A |
6045652 | Tuttle et al. | Apr 2000 | A |
6045942 | Miekka et al. | Apr 2000 | A |
6046081 | Kuo | Apr 2000 | A |
6048372 | Mangahara et al. | Apr 2000 | A |
6051114 | Yao et al. | Apr 2000 | A |
6051296 | McCaulley et al. | Apr 2000 | A |
6052397 | Jeon et al. | Apr 2000 | A |
6057557 | Ichikawa | May 2000 | A |
6058233 | Dragone | May 2000 | A |
6071323 | Kawaguchi | Jun 2000 | A |
6075973 | Greeff et al. | Jun 2000 | A |
6077106 | Mish | Jun 2000 | A |
6077642 | Ogata et al. | Jun 2000 | A |
6078791 | Tuttle et al. | Jun 2000 | A |
6080508 | Dasgupta et al. | Jun 2000 | A |
6080643 | Noguchi et al. | Jun 2000 | A |
6093944 | VanDover | Jul 2000 | A |
6094292 | Goldner et al. | Jul 2000 | A |
6096569 | Matsuno et al. | Aug 2000 | A |
6100108 | Mizuno et al. | Aug 2000 | A |
6106933 | Nagai et al. | Aug 2000 | A |
6110531 | Paz De Araujo | Aug 2000 | A |
6115616 | Halperin et al. | Sep 2000 | A |
6117279 | Smolanoff et al. | Sep 2000 | A |
6118426 | Albert et al. | Sep 2000 | A |
6120890 | Chen et al. | Sep 2000 | A |
6129277 | Grant et al. | Oct 2000 | A |
6133670 | Rodgers et al. | Oct 2000 | A |
6137671 | Staffiere | Oct 2000 | A |
6144916 | Wood, Jr. et al. | Nov 2000 | A |
6146225 | Sheats et al. | Nov 2000 | A |
6148503 | Delnick et al. | Nov 2000 | A |
6156452 | Kozuki et al. | Dec 2000 | A |
6157765 | Bruce et al. | Dec 2000 | A |
6159635 | Dasgupta et al. | Dec 2000 | A |
6160373 | Dunn et al. | Dec 2000 | A |
6162709 | Raoux et al. | Dec 2000 | A |
6165566 | Tropsha | Dec 2000 | A |
6168884 | Neudecker et al. | Jan 2001 | B1 |
6169474 | Greeff et al. | Jan 2001 | B1 |
6175075 | Shiotsuka et al. | Jan 2001 | B1 |
6176986 | Watanabe et al. | Jan 2001 | B1 |
6181283 | Johnson et al. | Jan 2001 | B1 |
6192222 | Greeff et al. | Feb 2001 | B1 |
6197167 | Tanaka | Mar 2001 | B1 |
6198217 | Suzuki et al. | Mar 2001 | B1 |
6204111 | Uemoto et al. | Mar 2001 | B1 |
6210544 | Sasaki | Apr 2001 | B1 |
6210832 | Visco et al. | Apr 2001 | B1 |
6214061 | Visco et al. | Apr 2001 | B1 |
6214660 | Uemoto et al. | Apr 2001 | B1 |
6218049 | Bates et al. | Apr 2001 | B1 |
6220516 | Tuttle et al. | Apr 2001 | B1 |
6223317 | Pax et al. | Apr 2001 | B1 |
6228532 | Tsuji et al. | May 2001 | B1 |
6229987 | Greeff et al. | May 2001 | B1 |
6232242 | Hata et al. | May 2001 | B1 |
6235432 | Kono et al. | May 2001 | B1 |
6236793 | Lawrence et al. | May 2001 | B1 |
6242128 | Tura et al. | Jun 2001 | B1 |
6242129 | Johnson | Jun 2001 | B1 |
6242132 | Neudecker et al. | Jun 2001 | B1 |
6248291 | Nakagama et al. | Jun 2001 | B1 |
6248481 | Visco et al. | Jun 2001 | B1 |
6248640 | Nam | Jun 2001 | B1 |
6249222 | Gehlot | Jun 2001 | B1 |
6252564 | Albert et al. | Jun 2001 | B1 |
6258252 | Miyasaka et al. | Jul 2001 | B1 |
6261917 | Quek et al. | Jul 2001 | B1 |
6264709 | Yoon et al. | Jul 2001 | B1 |
6265652 | Kurata et al. | Jul 2001 | B1 |
6268695 | Affinito | Jul 2001 | B1 |
6271053 | Kondo | Aug 2001 | B1 |
6271793 | Brady et al. | Aug 2001 | B1 |
6271801 | Tuttle et al. | Aug 2001 | B2 |
6280585 | Obinata et al. | Aug 2001 | B1 |
6280875 | Kwak et al. | Aug 2001 | B1 |
6281142 | Basceri et al. | Aug 2001 | B1 |
6284406 | Xing et al. | Sep 2001 | B1 |
6287986 | Mihara | Sep 2001 | B1 |
6289209 | Wood, Jr. | Sep 2001 | B1 |
6290821 | McLeod | Sep 2001 | B1 |
6290822 | Fleming et al. | Sep 2001 | B1 |
6291098 | Shibuya et al. | Sep 2001 | B1 |
6294722 | Kondo et al. | Sep 2001 | B1 |
6296949 | Bergstresser et al. | Oct 2001 | B1 |
6296967 | Jacobs et al. | Oct 2001 | B1 |
6296971 | Hara | Oct 2001 | B1 |
6300215 | Shin | Oct 2001 | B1 |
6302939 | Rabin et al. | Oct 2001 | B1 |
6306265 | Fu et al. | Oct 2001 | B1 |
6316563 | Naijo et al. | Nov 2001 | B2 |
6323416 | Komori et al. | Nov 2001 | B1 |
6324211 | Ovard et al. | Nov 2001 | B1 |
6325294 | Tuttle et al. | Dec 2001 | B2 |
6329213 | Tuttle et al. | Dec 2001 | B1 |
6339236 | Tomii et al. | Jan 2002 | B1 |
6344366 | Bates | Feb 2002 | B1 |
6344419 | Forster et al. | Feb 2002 | B1 |
6344795 | Gehlot | Feb 2002 | B1 |
6350353 | Gopalraja et al. | Feb 2002 | B2 |
6351630 | Wood, Jr. | Feb 2002 | B2 |
6356230 | Greef et al. | Mar 2002 | B1 |
6356694 | Weber | Mar 2002 | B1 |
6356764 | Ovard et al. | Mar 2002 | B1 |
6358810 | Dornfest et al. | Mar 2002 | B1 |
6360954 | Barnardo | Mar 2002 | B1 |
6361662 | Chiba et al. | Mar 2002 | B1 |
6365300 | Ota et al. | Apr 2002 | B1 |
6365319 | Heath et al. | Apr 2002 | B1 |
6368275 | Sliwa et al. | Apr 2002 | B1 |
6369316 | Plessing et al. | Apr 2002 | B1 |
6372383 | Lee et al. | Apr 2002 | B1 |
6372386 | Cho et al. | Apr 2002 | B1 |
6373224 | Goto et al. | Apr 2002 | B1 |
6375780 | Tuttle et al. | Apr 2002 | B1 |
6376027 | Lee et al. | Apr 2002 | B1 |
6379835 | Kucherovsky et al. | Apr 2002 | B1 |
6379842 | Mayer | Apr 2002 | B1 |
6379846 | Terahara et al. | Apr 2002 | B1 |
6380477 | Curtin | Apr 2002 | B1 |
6384573 | Dunn | May 2002 | B1 |
6387563 | Bates | May 2002 | B1 |
6391166 | Wang | May 2002 | B1 |
6392565 | Brown | May 2002 | B1 |
6394598 | Kaiser | May 2002 | B1 |
6395430 | Cho et al. | May 2002 | B1 |
6396001 | Nakamura | May 2002 | B1 |
6398824 | Johnson | Jun 2002 | B1 |
6399241 | Hara et al. | Jun 2002 | B1 |
6402039 | Freeman et al. | Jun 2002 | B1 |
6402795 | Chu et al. | Jun 2002 | B1 |
6402796 | Johnson | Jun 2002 | B1 |
6409965 | Nagata et al. | Jun 2002 | B1 |
6413284 | Chu et al. | Jul 2002 | B1 |
6413285 | Chu et al. | Jul 2002 | B1 |
6413382 | Wang et al. | Jul 2002 | B1 |
6413645 | Graff et al. | Jul 2002 | B1 |
6413676 | Munshi | Jul 2002 | B1 |
6414626 | Greef et al. | Jul 2002 | B1 |
6416598 | Sircar | Jul 2002 | B1 |
6420961 | Bates et al. | Jul 2002 | B1 |
6422698 | Kaiser | Jul 2002 | B2 |
6423106 | Bates | Jul 2002 | B1 |
6423776 | Akkapeddi et al. | Jul 2002 | B1 |
6426163 | Pasquier et al. | Jul 2002 | B1 |
6432577 | Shul et al. | Aug 2002 | B1 |
6432584 | Visco et al. | Aug 2002 | B1 |
6433380 | Shin | Aug 2002 | B2 |
6433465 | McKnight et al. | Aug 2002 | B1 |
6436156 | Wandeloski et al. | Aug 2002 | B1 |
6437231 | Kurata et al. | Aug 2002 | B2 |
6444336 | Jia et al. | Sep 2002 | B1 |
6444355 | Murai et al. | Sep 2002 | B1 |
6444368 | Hikmet et al. | Sep 2002 | B1 |
6444750 | Touhsaent | Sep 2002 | B1 |
6459418 | Comiskey et al. | Oct 2002 | B1 |
6459726 | Ovard et al. | Oct 2002 | B1 |
6466771 | Wood, Jr. | Oct 2002 | B2 |
6475668 | Hosokawa et al. | Nov 2002 | B1 |
6481623 | Grant et al. | Nov 2002 | B1 |
6488822 | Moslehi | Dec 2002 | B1 |
6494999 | Herrera et al. | Dec 2002 | B1 |
6495283 | Yoon et al. | Dec 2002 | B1 |
6497598 | Affinito | Dec 2002 | B2 |
6500287 | Azens et al. | Dec 2002 | B1 |
6503661 | Park et al. | Jan 2003 | B1 |
6503831 | Speakman | Jan 2003 | B2 |
6506289 | Demaray et al. | Jan 2003 | B2 |
6511516 | Johnson et al. | Jan 2003 | B1 |
6511615 | Dawes et al. | Jan 2003 | B1 |
6517968 | Johnson et al. | Feb 2003 | B2 |
6522067 | Graff et al. | Feb 2003 | B1 |
6524466 | Bonaventura et al. | Feb 2003 | B1 |
6524750 | Mansuetto | Feb 2003 | B1 |
6525976 | Johnson | Feb 2003 | B1 |
6528212 | Kusumoto et al. | Mar 2003 | B1 |
6533907 | Demaray et al. | Mar 2003 | B2 |
6537428 | Xiong et al. | Mar 2003 | B1 |
6538211 | St. Lawrence et al. | Mar 2003 | B2 |
6541147 | McLean et al. | Apr 2003 | B1 |
6548912 | Graff et al. | Apr 2003 | B1 |
6551745 | Moutsios et al. | Apr 2003 | B2 |
6558836 | Whitacre et al. | May 2003 | B1 |
6562513 | Takeuchi et al. | May 2003 | B1 |
6563998 | Farah et al. | May 2003 | B1 |
6569564 | Lane | May 2003 | B1 |
6569570 | Sonobe et al. | May 2003 | B2 |
6570325 | Graff et al. | May 2003 | B2 |
6572173 | Muller | Jun 2003 | B2 |
6573652 | Graff et al. | Jun 2003 | B1 |
6576546 | Gilbert et al. | Jun 2003 | B2 |
6579728 | Grant et al. | Jun 2003 | B2 |
6582480 | Pasquier et al. | Jun 2003 | B2 |
6582481 | Erbil | Jun 2003 | B1 |
6582852 | Gao et al. | Jun 2003 | B1 |
6589299 | Missling et al. | Jul 2003 | B2 |
6593150 | Ramberg et al. | Jul 2003 | B2 |
6599662 | Chiang et al. | Jul 2003 | B1 |
6600905 | Greeff et al. | Jul 2003 | B2 |
6602338 | Chen et al. | Aug 2003 | B2 |
6603139 | Tessler et al. | Aug 2003 | B1 |
6603391 | Greeff et al. | Aug 2003 | B1 |
6605228 | Kawaguchi et al. | Aug 2003 | B1 |
6608464 | Lew et al. | Aug 2003 | B1 |
6610440 | LaFollette et al. | Aug 2003 | B1 |
6615614 | Makikawa et al. | Sep 2003 | B1 |
6616035 | Ehrensvard et al. | Sep 2003 | B2 |
6618829 | Pax et al. | Sep 2003 | B2 |
6620545 | Goenka et al. | Sep 2003 | B2 |
6622049 | Penner et al. | Sep 2003 | B2 |
6632563 | Krasnov et al. | Oct 2003 | B1 |
6637906 | Knoerzer et al. | Oct 2003 | B2 |
6637916 | Mullner | Oct 2003 | B2 |
6639578 | Comiskey et al. | Oct 2003 | B1 |
6645675 | Munshi | Nov 2003 | B1 |
6650000 | Ballantine et al. | Nov 2003 | B2 |
6650942 | Howard et al. | Nov 2003 | B2 |
6662430 | Brady et al. | Dec 2003 | B2 |
6664006 | Munshi | Dec 2003 | B1 |
6673484 | Matsuura | Jan 2004 | B2 |
6673716 | D'Couto et al. | Jan 2004 | B1 |
6674159 | Peterson et al. | Jan 2004 | B1 |
6677070 | Kearl | Jan 2004 | B2 |
6683244 | Fujimori et al. | Jan 2004 | B2 |
6683749 | Daby et al. | Jan 2004 | B2 |
6686096 | Chung | Feb 2004 | B1 |
6693840 | Shimada et al. | Feb 2004 | B2 |
6700491 | Shafer | Mar 2004 | B2 |
6706449 | Mikhaylik et al. | Mar 2004 | B2 |
6709778 | Johnson | Mar 2004 | B2 |
6713216 | Kugai et al. | Mar 2004 | B2 |
6713389 | Speakman | Mar 2004 | B2 |
6713987 | Krasnov et al. | Mar 2004 | B2 |
6723140 | Chu et al. | Apr 2004 | B2 |
6730423 | Einhart et al. | May 2004 | B2 |
6733924 | Skotheim et al. | May 2004 | B1 |
6737197 | Chu et al. | May 2004 | B2 |
6737789 | Radziemski et al. | May 2004 | B2 |
6741178 | Tuttle | May 2004 | B1 |
6750156 | Le et al. | Jun 2004 | B2 |
6752842 | Luski et al. | Jun 2004 | B2 |
6753108 | Hampden-Smith et al. | Jun 2004 | B1 |
6753114 | Jacobs et al. | Jun 2004 | B2 |
6760520 | Medin et al. | Jul 2004 | B1 |
6764525 | Whitacre et al. | Jul 2004 | B1 |
6768246 | Pelrine et al. | Jul 2004 | B2 |
6768855 | Bakke et al. | Jul 2004 | B1 |
6770176 | Benson et al. | Aug 2004 | B2 |
6773848 | Nortoft et al. | Aug 2004 | B1 |
6780208 | Hopkins et al. | Aug 2004 | B2 |
6797428 | Skotheim et al. | Sep 2004 | B1 |
6797429 | Komatsu | Sep 2004 | B1 |
6805998 | Jenson et al. | Oct 2004 | B2 |
6805999 | Lee et al. | Oct 2004 | B2 |
6818356 | Bates | Nov 2004 | B1 |
6822157 | Fujioka | Nov 2004 | B2 |
6824922 | Park et al. | Nov 2004 | B2 |
6827826 | Demaray et al. | Dec 2004 | B2 |
6828063 | Park et al. | Dec 2004 | B2 |
6828065 | Munshi | Dec 2004 | B2 |
6830846 | Kramlich et al. | Dec 2004 | B2 |
6835493 | Zhang et al. | Dec 2004 | B2 |
6838209 | Langan et al. | Jan 2005 | B2 |
6846765 | Imamura et al. | Jan 2005 | B2 |
6852139 | Zhang et al. | Feb 2005 | B2 |
6855441 | Levanon | Feb 2005 | B1 |
6861821 | Masumoto et al. | Mar 2005 | B2 |
6863699 | Krasnov et al. | Mar 2005 | B1 |
6866901 | Burrows et al. | Mar 2005 | B2 |
6866963 | Seung et al. | Mar 2005 | B2 |
6869722 | Kearl | Mar 2005 | B2 |
6884327 | Pan et al. | Apr 2005 | B2 |
6886240 | Zhang et al. | May 2005 | B2 |
6890385 | Tsuchiya et al. | May 2005 | B2 |
6896992 | Kearl | May 2005 | B2 |
6899975 | Watanabe et al. | May 2005 | B2 |
6902660 | Lee et al. | Jun 2005 | B2 |
6905578 | Moslehi et al. | Jun 2005 | B1 |
6906436 | Jenson et al. | Jun 2005 | B2 |
6911667 | Pichler et al. | Jun 2005 | B2 |
6916679 | Snyder et al. | Jul 2005 | B2 |
6921464 | Krasnov et al. | Jul 2005 | B2 |
6923702 | Graff et al. | Aug 2005 | B2 |
6924164 | Jensen | Aug 2005 | B2 |
6929879 | Yamazaki | Aug 2005 | B2 |
6936377 | Wensley et al. | Aug 2005 | B2 |
6936381 | Skotheim et al. | Aug 2005 | B2 |
6936407 | Pichler | Aug 2005 | B2 |
6949389 | Pichler et al. | Sep 2005 | B2 |
6955986 | Li | Oct 2005 | B2 |
6962613 | Jenson | Nov 2005 | B2 |
6962671 | Martin et al. | Nov 2005 | B2 |
6964829 | Utsugi et al. | Nov 2005 | B2 |
6982132 | Goldner et al. | Jan 2006 | B1 |
6986965 | Jenson et al. | Jan 2006 | B2 |
6994933 | Bates | Feb 2006 | B1 |
7022431 | Shchori et al. | Apr 2006 | B2 |
7033406 | Weir et al. | Apr 2006 | B2 |
7045246 | Simburger et al. | May 2006 | B2 |
7045372 | Ballantine et al. | May 2006 | B2 |
7056620 | Krasnov et al. | Jun 2006 | B2 |
7073723 | Fürst et al. | Jul 2006 | B2 |
7095372 | Soler Castany et al. | Aug 2006 | B2 |
7129166 | Speakman | Oct 2006 | B2 |
7131189 | Jenson | Nov 2006 | B2 |
7144654 | LaFollette et al. | Dec 2006 | B2 |
7144655 | Jenson et al. | Dec 2006 | B2 |
7157187 | Jenson | Jan 2007 | B2 |
7158031 | Tuttle | Jan 2007 | B2 |
7162392 | Vock et al. | Jan 2007 | B2 |
7183693 | Brantner et al. | Feb 2007 | B2 |
7186479 | Krasnov et al. | Mar 2007 | B2 |
7194801 | Jenson et al. | Mar 2007 | B2 |
7198832 | Burrows et al. | Apr 2007 | B2 |
7202825 | Leizerovich et al. | Apr 2007 | B2 |
7220517 | Park et al. | May 2007 | B2 |
7230321 | McCain | Jun 2007 | B2 |
7247408 | Skotheim et al. | Jul 2007 | B2 |
7253494 | Mino et al. | Aug 2007 | B2 |
7265674 | Tuttle | Sep 2007 | B2 |
7267904 | Komatsu et al. | Sep 2007 | B2 |
7267906 | Mizuta et al. | Sep 2007 | B2 |
7273682 | Park et al. | Sep 2007 | B2 |
7274118 | Jenson et al. | Sep 2007 | B2 |
7288340 | Iwamoto | Oct 2007 | B2 |
7316867 | Park et al. | Jan 2008 | B2 |
7323634 | Speakman | Jan 2008 | B2 |
7332363 | Edwards | Feb 2008 | B2 |
7335441 | Luski et al. | Feb 2008 | B2 |
RE40137 | Tuttle et al. | Mar 2008 | E |
7345647 | Rodenbeck | Mar 2008 | B1 |
7348099 | Mukai et al. | Mar 2008 | B2 |
7389580 | Jenson et al. | Jun 2008 | B2 |
7400253 | Cohen | Jul 2008 | B2 |
7410730 | Bates | Aug 2008 | B2 |
RE40531 | Graff et al. | Oct 2008 | E |
7468221 | LaFollette et al. | Dec 2008 | B2 |
7494742 | Tarnowski et al. | Feb 2009 | B2 |
7670724 | Chan et al. | Mar 2010 | B1 |
20010005561 | Yamada et al. | Jun 2001 | A1 |
20010027159 | Kaneyoshi | Oct 2001 | A1 |
20010031122 | Lackritz et al. | Oct 2001 | A1 |
20010032666 | Jenson et al. | Oct 2001 | A1 |
20010033952 | Jenson et al. | Oct 2001 | A1 |
20010034106 | Moise et al. | Oct 2001 | A1 |
20010041294 | Chu et al. | Nov 2001 | A1 |
20010041460 | Wiggins | Nov 2001 | A1 |
20010052752 | Ghosh et al. | Dec 2001 | A1 |
20010054437 | Komori et al. | Dec 2001 | A1 |
20010055719 | Akashi et al. | Dec 2001 | A1 |
20020000034 | Jenson | Jan 2002 | A1 |
20020001746 | Jenson | Jan 2002 | A1 |
20020001747 | Jenson | Jan 2002 | A1 |
20020004167 | Jenson et al. | Jan 2002 | A1 |
20020009630 | Gao et al. | Jan 2002 | A1 |
20020019296 | Freeman et al. | Feb 2002 | A1 |
20020028377 | Gross | Mar 2002 | A1 |
20020033330 | Demaray et al. | Mar 2002 | A1 |
20020037756 | Jacobs et al. | Mar 2002 | A1 |
20020066539 | Muller | Jun 2002 | A1 |
20020067615 | Muller | Jun 2002 | A1 |
20020071989 | Verma et al. | Jun 2002 | A1 |
20020076133 | Li et al. | Jun 2002 | A1 |
20020091929 | Ehrensvard | Jul 2002 | A1 |
20020093029 | Ballantine et al. | Jul 2002 | A1 |
20020106297 | Ueno et al. | Aug 2002 | A1 |
20020110733 | Johnson | Aug 2002 | A1 |
20020115252 | Haukka et al. | Aug 2002 | A1 |
20020134671 | Demaray et al. | Sep 2002 | A1 |
20020139662 | Lee | Oct 2002 | A1 |
20020140103 | Kloster et al. | Oct 2002 | A1 |
20020159245 | Murasko et al. | Oct 2002 | A1 |
20020161404 | Schmidt | Oct 2002 | A1 |
20020164441 | Amine et al. | Nov 2002 | A1 |
20020170821 | Sandlin et al. | Nov 2002 | A1 |
20020170960 | Ehrensvard et al. | Nov 2002 | A1 |
20030019326 | Han et al. | Jan 2003 | A1 |
20030022487 | Yoon et al. | Jan 2003 | A1 |
20030024994 | Ladyansky | Feb 2003 | A1 |
20030029493 | Plessing | Feb 2003 | A1 |
20030035906 | Memarian et al. | Feb 2003 | A1 |
20030036003 | Shchori et al. | Feb 2003 | A1 |
20030042131 | Johnson | Mar 2003 | A1 |
20030044665 | Rastegar et al. | Mar 2003 | A1 |
20030048635 | Knoerzer et al. | Mar 2003 | A1 |
20030063883 | Demaray et al. | Apr 2003 | A1 |
20030064292 | Neudecker et al. | Apr 2003 | A1 |
20030068559 | Armstrong et al. | Apr 2003 | A1 |
20030077914 | Le et al. | Apr 2003 | A1 |
20030079838 | Brcka | May 2003 | A1 |
20030091904 | Munshi | May 2003 | A1 |
20030095463 | Shimada et al. | May 2003 | A1 |
20030097858 | Strohhofer et al. | May 2003 | A1 |
20030109903 | Berrang et al. | Jun 2003 | A1 |
20030127319 | Demaray et al. | Jul 2003 | A1 |
20030134054 | Demaray et al. | Jul 2003 | A1 |
20030141186 | Wang et al. | Jul 2003 | A1 |
20030143853 | Celii et al. | Jul 2003 | A1 |
20030146877 | Mueller | Aug 2003 | A1 |
20030152829 | Zhang et al. | Aug 2003 | A1 |
20030162094 | Lee et al. | Aug 2003 | A1 |
20030173207 | Zhang et al. | Sep 2003 | A1 |
20030173208 | Pan et al. | Sep 2003 | A1 |
20030174391 | Pan et al. | Sep 2003 | A1 |
20030175142 | Milonopoulou et al. | Sep 2003 | A1 |
20030178623 | Nishiki et al. | Sep 2003 | A1 |
20030178637 | Chen et al. | Sep 2003 | A1 |
20030180610 | Felde et al. | Sep 2003 | A1 |
20030185266 | Henrichs | Oct 2003 | A1 |
20030231106 | Shafer | Dec 2003 | A1 |
20030232248 | Iwamoto et al. | Dec 2003 | A1 |
20040008587 | Siebott et al. | Jan 2004 | A1 |
20040015735 | Norman | Jan 2004 | A1 |
20040023106 | Benson et al. | Feb 2004 | A1 |
20040028875 | Van Rijn et al. | Feb 2004 | A1 |
20040029311 | Snyder et al. | Feb 2004 | A1 |
20040038050 | Saijo et al. | Feb 2004 | A1 |
20040043557 | Haukka et al. | Mar 2004 | A1 |
20040048157 | Neudecker et al. | Mar 2004 | A1 |
20040058237 | Higuchi et al. | Mar 2004 | A1 |
20040077161 | Chen et al. | Apr 2004 | A1 |
20040078662 | Hamel et al. | Apr 2004 | A1 |
20040081415 | Demaray et al. | Apr 2004 | A1 |
20040081860 | Hundt et al. | Apr 2004 | A1 |
20040085002 | Pearce | May 2004 | A1 |
20040101761 | Park et al. | May 2004 | A1 |
20040105644 | Dawes | Jun 2004 | A1 |
20040106038 | Shimamura et al. | Jun 2004 | A1 |
20040106045 | Ugaji et al. | Jun 2004 | A1 |
20040106046 | Inda | Jun 2004 | A1 |
20040118700 | Schierle-Arndt et al. | Jun 2004 | A1 |
20040126305 | Chen et al. | Jul 2004 | A1 |
20040151986 | Park et al. | Aug 2004 | A1 |
20040161640 | Salot | Aug 2004 | A1 |
20040175624 | Luski et al. | Sep 2004 | A1 |
20040188239 | Robison et al. | Sep 2004 | A1 |
20040209159 | Lee et al. | Oct 2004 | A1 |
20040214079 | Simburger et al. | Oct 2004 | A1 |
20040219434 | Benson et al. | Nov 2004 | A1 |
20040245561 | Sakashita et al. | Dec 2004 | A1 |
20040258984 | Ariel et al. | Dec 2004 | A1 |
20040259305 | Demaray et al. | Dec 2004 | A1 |
20050000794 | Demaray et al. | Jan 2005 | A1 |
20050006768 | Narasimhan et al. | Jan 2005 | A1 |
20050048802 | Zhang et al. | Mar 2005 | A1 |
20050070097 | Barmak et al. | Mar 2005 | A1 |
20050072458 | Goldstein | Apr 2005 | A1 |
20050079418 | Kelley et al. | Apr 2005 | A1 |
20050095506 | Klaassen | May 2005 | A1 |
20050105231 | Hamel et al. | May 2005 | A1 |
20050110457 | LaFollette et al. | May 2005 | A1 |
20050112461 | Amine et al. | May 2005 | A1 |
20050118464 | Levanon | Jun 2005 | A1 |
20050130032 | Krasnov et al. | Jun 2005 | A1 |
20050133361 | Ding et al. | Jun 2005 | A1 |
20050141170 | Honda et al. | Jun 2005 | A1 |
20050142447 | Nakai et al. | Jun 2005 | A1 |
20050147877 | Tarnowski et al. | Jul 2005 | A1 |
20050158622 | Mizuta et al. | Jul 2005 | A1 |
20050170736 | Cok | Aug 2005 | A1 |
20050175891 | Kameyama et al. | Aug 2005 | A1 |
20050176181 | Burrows et al. | Aug 2005 | A1 |
20050181280 | Ceder et al. | Aug 2005 | A1 |
20050183946 | Pan et al. | Aug 2005 | A1 |
20050189139 | Stole | Sep 2005 | A1 |
20050208371 | Kim et al. | Sep 2005 | A1 |
20050239917 | Nelson et al. | Oct 2005 | A1 |
20050266161 | Medeiros et al. | Dec 2005 | A1 |
20060019504 | Taussig | Jan 2006 | A1 |
20060021214 | Jenson et al. | Feb 2006 | A1 |
20060040177 | Onodera et al. | Feb 2006 | A1 |
20060046907 | Rastegar et al. | Mar 2006 | A1 |
20060054496 | Zhang et al. | Mar 2006 | A1 |
20060057283 | Zhang et al. | Mar 2006 | A1 |
20060057304 | Zhang et al. | Mar 2006 | A1 |
20060063074 | Jenson et al. | Mar 2006 | A1 |
20060071592 | Narasimhan et al. | Apr 2006 | A1 |
20060155545 | Jayne | Jul 2006 | A1 |
20060201583 | Michaluk et al. | Sep 2006 | A1 |
20060210779 | Weir et al. | Sep 2006 | A1 |
20060222954 | Skotheim et al. | Oct 2006 | A1 |
20060234130 | Inda | Oct 2006 | A1 |
20060237543 | Goto et al. | Oct 2006 | A1 |
20060255435 | Fuergut et al. | Nov 2006 | A1 |
20060286448 | Snyder et al. | Dec 2006 | A1 |
20070009802 | Lee et al. | Jan 2007 | A1 |
20070023275 | Tanase et al. | Feb 2007 | A1 |
20070037058 | Visco et al. | Feb 2007 | A1 |
20070053139 | Zhang et al. | Mar 2007 | A1 |
20070087230 | Jenson et al. | Apr 2007 | A1 |
20070091543 | Gasse et al. | Apr 2007 | A1 |
20070125638 | Zhang et al. | Jun 2007 | A1 |
20070141468 | Barker | Jun 2007 | A1 |
20070148065 | Weir et al. | Jun 2007 | A1 |
20070148553 | Weppner | Jun 2007 | A1 |
20070151661 | Mao et al. | Jul 2007 | A1 |
20070164376 | Burrows et al. | Jul 2007 | A1 |
20070166612 | Krasnov et al. | Jul 2007 | A1 |
20070184345 | Neudecker et al. | Aug 2007 | A1 |
20070196682 | Visser et al. | Aug 2007 | A1 |
20070202395 | Snyder et al. | Aug 2007 | A1 |
20070205513 | Brunnbauer et al. | Sep 2007 | A1 |
20070210459 | Burrows et al. | Sep 2007 | A1 |
20070222681 | Greene et al. | Sep 2007 | A1 |
20070224951 | Gilb et al. | Sep 2007 | A1 |
20070235320 | White et al. | Oct 2007 | A1 |
20070264564 | Johnson et al. | Nov 2007 | A1 |
20070278653 | Brunnbauer et al. | Dec 2007 | A1 |
20070298326 | Angell et al. | Dec 2007 | A1 |
20080003496 | Neudecker et al. | Jan 2008 | A1 |
20080008936 | Mizuta et al. | Jan 2008 | A1 |
20080014501 | Skotheim et al. | Jan 2008 | A1 |
20080057397 | Skotheim et al. | Mar 2008 | A1 |
20080213672 | Skotheim et al. | Sep 2008 | A1 |
20080233708 | Hisamatsu | Sep 2008 | A1 |
20080254575 | Fuergut et al. | Oct 2008 | A1 |
20080261107 | Snyder et al. | Oct 2008 | A1 |
20080263855 | Li et al. | Oct 2008 | A1 |
20080286651 | Neudecker et al. | Nov 2008 | A1 |
20090181303 | Neudecker et al. | Jul 2009 | A1 |
20090302226 | Schieber et al. | Dec 2009 | A1 |
20100032001 | Brantner | Feb 2010 | A1 |
20100086853 | Venkatachalam et al. | Apr 2010 | A1 |
Number | Date | Country |
---|---|---|
1415124 | Apr 2003 | CN |
1532984 | Sep 2004 | CN |
19824145 | Dec 1999 | DE |
10 2005 014 427 | Sep 2006 | DE |
10 2006 054 309 | Nov 2006 | DE |
10 2008 016 665 | Oct 2008 | DE |
102007030604 | Jan 2009 | DE |
0 510 883 | Oct 1992 | EP |
0 639 655 | Feb 1995 | EP |
0 652 308 | May 1995 | EP |
0 820 088 | Jan 1998 | EP |
1 068 899 | Jan 2001 | EP |
0 0867 985 | Feb 2001 | EP |
1 092 689 | Apr 2001 | EP |
1 189 080 | Mar 2002 | EP |
1 713 024 | Oct 2006 | EP |
2806198 | Sep 2001 | FR |
2 861 218 | Apr 2005 | FR |
55-009305 | Jan 1980 | JP |
56-076060 | Jun 1981 | JP |
56-156675 | Dec 1981 | JP |
60-068558 | Apr 1985 | JP |
61-269072 | Nov 1986 | JP |
62-267944 | Nov 1987 | JP |
63-290922 | Nov 1988 | JP |
2000-162234 | Nov 1988 | JP |
2-054764 | Feb 1990 | JP |
2-230662 | Sep 1990 | JP |
03-036962 | Feb 1991 | JP |
4-058456 | Feb 1992 | JP |
4-072049 | Mar 1992 | JP |
6-010127 | Jan 1994 | JP |
6-100333 | Apr 1994 | JP |
7-233469 | May 1995 | JP |
7-224379 | Aug 1995 | JP |
08-114408 | May 1996 | JP |
10-026571 | Jan 1998 | JP |
10-239187 | Sep 1998 | JP |
11-204088 | Jul 1999 | JP |
2000-144435 | May 2000 | JP |
2000-188099 | Jul 2000 | JP |
2000-268867 | Sep 2000 | JP |
2001-171812 | Jun 2001 | JP |
2001-259494 | Sep 2001 | JP |
2001-297764 | Oct 2001 | JP |
2001-328198 | Nov 2001 | JP |
2002-140776 | May 2002 | JP |
2002-344115 | Nov 2002 | JP |
2003-17040 | Jan 2003 | JP |
2003-347045 | Dec 2003 | JP |
2004-071305 | Mar 2004 | JP |
2004-149849 | May 2004 | JP |
2004-158268 | Jun 2004 | JP |
2004-273436 | Sep 2004 | JP |
2005-256101 | Sep 2005 | JP |
2002-026412 | Feb 2007 | JP |
7-107752 | Apr 2007 | JP |
20020007881 | Jan 2002 | KR |
20020017790 | Mar 2002 | KR |
20020029813 | Apr 2002 | KR |
20020038917 | May 2002 | KR |
20030033913 | May 2003 | KR |
20030042288 | May 2003 | KR |
20030085252 | Nov 2003 | KR |
2241281 | Nov 2004 | RU |
WO 9513629 | May 1995 | WO |
WO 9623085 | Aug 1996 | WO |
WO 9623217 | Aug 1996 | WO |
WO 9727344 | Jul 1997 | WO |
WO 9735044 | Sep 1997 | WO |
WO 9847196 | Oct 1998 | WO |
WO 9943034 | Aug 1999 | WO |
WO 9957770 | Nov 1999 | WO |
WO 0021898 | Apr 2000 | WO |
WO 0022742 | Apr 2000 | WO |
WO 0028607 | May 2000 | WO |
WO 0036665 | Jun 2000 | WO |
WO 0060682 | Oct 2000 | WO |
WO 0060689 | Oct 2000 | WO |
WO 0062365 | Oct 2000 | WO |
WO 0101507 | Jan 2001 | WO |
WO 0117052 | Mar 2001 | WO |
WO 0124303 | Apr 2001 | WO |
WO 0133651 | May 2001 | WO |
WO 0139305 | May 2001 | WO |
WO 0173864 | Oct 2001 | WO |
WO 0173865 | Oct 2001 | WO |
WO 0173866 | Oct 2001 | WO |
WO 0173868 | Oct 2001 | WO |
WO 0173870 | Oct 2001 | WO |
WO 0173883 | Oct 2001 | WO |
WO 0173957 | Oct 2001 | WO |
WO 0182390 | Nov 2001 | WO |
WO 0212932 | Feb 2002 | WO |
WO 0242516 | May 2002 | WO |
WO 0247187 | Jun 2002 | WO |
WO 02071506 | Sep 2002 | WO |
WO 02101857 | Dec 2002 | WO |
WO 03003485 | Jan 2003 | WO |
WO 03005477 | Jan 2003 | WO |
WO 03026039 | Mar 2003 | WO |
WO 03036670 | May 2003 | WO |
WO 03069714 | Aug 2003 | WO |
WO 03080325 | Oct 2003 | WO |
WO 03083166 | Oct 2003 | WO |
WO 2004012283 | Feb 2004 | WO |
WO 2004021532 | Mar 2004 | WO |
WO 2004061887 | Jul 2004 | WO |
WO 2004077519 | Sep 2004 | WO |
WO 2004086550 | Oct 2004 | WO |
WO 2004093223 | Oct 2004 | WO |
WO 2004106581 | Dec 2004 | WO |
WO 2004106582 | Dec 2004 | WO |
WO 2005008828 | Jan 2005 | WO |
WO 2005013394 | Feb 2005 | WO |
WO 2005038957 | Apr 2005 | WO |
WO 2005067645 | Jul 2005 | WO |
WO 2005085138 | Sep 2005 | WO |
WO 2005091405 | Sep 2005 | WO |
WO 2006063308 | Jun 2006 | WO |
2006085307 | Aug 2006 | WO |
WO 2006085307 | Aug 2006 | WO |
WO 2007016781 | Feb 2007 | WO |
WO 2007019855 | Feb 2007 | WO |
WO 2007027535 | Mar 2007 | WO |
WO 2009027535 | Mar 2007 | WO |
WO 2007095604 | Aug 2007 | WO |
WO 2008036731 | Mar 2008 | WO |
Number | Date | Country | |
---|---|---|---|
20080173542 A1 | Jul 2008 | US |
Number | Date | Country | |
---|---|---|---|
60864755 | Nov 2006 | US |