BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a plan view of memory modules and cooling fans as used in existing architectures.
FIG. 2 is a plan view of a printed circuit board utilizing memory modules and cooling fans in accordance with an embodiment of the present invention.
FIG. 3 is a plan view of memory modules arranged in accordance with the present invention.
FIG. 4 is a perspective view of memory modules arranged in accordance with the present invention.
DETAILED DESCRIPTION
Directing attention to FIG. 3, there is shown generally a computer server having a plurality of components. In an embodiment, computer 100 is a low-profile, rack-mounted server. Computer 100 includes cooling fans 102, which serve to draw heat from a pair of redundant power supply units 104. Power supply units 104 power the various components located on main logic board (MLB) 106 and elsewhere on computer 100. Power is distributed to the components by power distribution board 108. Chipset 110 includes Southbridge 112 and Northbridge 114, shown in an embodiment oriented proximate to central processing units (CPUs) 116. In the preferred embodiment CPUs 116 in the preferred embodiment are Pentiumâ„¢ processors available from Intel Corporation. Communication is handled by input/output connectors 118 located on the back panel of computer 100, as well as peripheral connect interface (PCI) cards (not shown), and graphics processing unit (GPU) 122. In the preferred embodiment, the PCI cards are nine inches and 6.5 inches long. Storage on computer 100 includes three hard disk drives 124 connected to hard disk drive backplane board 125. Storage also includes CD/DVD Superdrive 126. LED board 128 is located near the front panel of computer 100 to provide information to a user, and chassis stiffener 129 is located above hard disk drives 124.
Also proximate to CPUs 116 are memory modules 130. Memory modules 130, in an embodiment, utilize dual inline memory modules (DIMMs) that are similar to SIMMs but have a 64-bit path to the memory chips contained within each individual DIMM. As this 64-path is compatible with the Pentiumâ„¢ family of processors, DIMMs can be installed one DIMM at a time, rather than in pairs as SIMMs require. DIMMs also can be placed closer together than SIMMs can, making them easier to configure with respect to cooling fans. Normally, DIMMs are spaced at a pitch of 10-12 mm, limited primarily by socket dimensions. A staggered layout has a significant advantage of increased airflow, since the channel for air is widened to 27 mm. FB-DIMMs have extremely high power (15 W) and need an air velocity of greater than 2.5 meter per second to perform in 40 degrees Celsius ambient temperature. This is important for a 1 U server enclosure having a minimal height. As shown in FIGS. 2 and 3, memory modules 130 are organized into two groups. Group 132 includes memory modules 130a-130d, and group 134 includes memory modules 130e-130h. Each row of memory modules 130 within groups 132, 134 defines, with its neighboring row, channel 136 through which air from fans 138 passes, removing heat from memory modules 130.
As shown in FIG. 3, memory modules 130 are disposed such that memory module groups 132, 134 are interleaved with respect to each other. This decreases the area of the circuit board required to accommodate memory modules 130, and frees it for other uses or components. As shown, overlapping area 136 allows memory modules to be concentrated in a smaller area than required for memory modules 10, 12 in FIG. 1. The amount of overlap can be varied, depending on power budgets. Also, it is to be understood that groups 132, 134 do not necessarily require memory modules to be perfectly aligned within groups 132, 134.
As shown in FIG. 4, memory modules 130 in the preferred embodiment utilize advanced memory buffer 140. As memory buffer 140 radiates heat, in the preferred embodiment, heat sink 142 is bonded or secured to the surface of memory buffer 140 to absorb heat. Heat spreaders may also be used with memory modules 130.
A staggered memory layout for improved cooling in reduced height enclosure has been described and illustrated in detail, it is to be understood that numerous changes and modifications can be made to various embodiments of the present invention without departing from the spirit thereof.