Patent Application
20200288589
The present disclosure relates to the field of standardized hot-pluggable transceiving units. More specifically, the present disclosure relates to a standardized hot-pluggable transceiving unit having heat dissipation capabilities.
Small Form-factor Pluggable (SFP) units represent one example of standardized hot-pluggable transceiving units. SFP units are standardized units adapted to be inserted within a chassis of a hosting unit. A suite of specifications, produced by the SFF (Small Form Factor) Committee, describe the size of the SFP unit, so as to ensure that all SFP compliant units may be inserted smoothly within one same chassis, i.e. inside cages, ganged cages, superposed cages and belly-to-belly cages. Specifications for SFP units are available at the SFF Committee website.
SFP units may be used with various types of exterior connectors, such as coaxial connectors, optical connectors, RJ45 connectors and various other types of electrical connectors. In general, an SFP unit allows connection between an external apparatus, via a front connector of one of the aforementioned types, and internal components of a hosting unit, for example a motherboard, a card or a backplane leading to further components, via a back interface of the SFP unit. Specification no INF-8074i Rev 1.0, entitled “SFP (Small Form-factor Pluggable) Transceiver, dated May 12, 2001, generally describes sizes, mechanical interfaces, electrical interfaces and identification of SFP units.
The SFF Committee also produced specification no SFF-8431 Rev. 4.1, “Enhanced Small Form-factor Pluggable Module SFP+”, dated Jul. 6, 2010. This document, which reflects an evolution of the INF-8074i specification, defines, inter alia, high speed electrical interface specifications for 10 Gigabit per second SFP+ modules and hosts, and testing procedures. The term “SFP+” designates an evolution of SFP specifications.
INF-8074i and SFF-8431 do not generally address internal features and functions of SFP devices. In terms of internal features, they simply define identification information to describe SFP devices' capabilities, supported interfaces, manufacturer, and the like. As a result, conventional SFP devices merely provide connection means between external apparatuses and components of a hosting unit, the hosting unit in turn exchanging signals with external apparatuses via SFP devices.
Recently, SFP units with internal features and functions providing signal processing capabilities have appeared. For instance, some SFP units now include signal re-clocking, signal reshaping or reconditioning, signals combination or separation, signal monitoring, etc. Furthermore, some SFP units now include content processing capabilities, for processing the content transported by the signals received by the SFP units.
The integration of a larger number of electronic component within the housing of an SFP unit increases the global power consumption of the SFP unit, and accordingly the heat generated by the SFP unit. Therefore, it becomes practical and sometimes even mandatory to use heat dissipation means for extracting at least some of the generated heat from the SFP unit. A failure to perform heat dissipation may result in damaging some of the electronic component within the housing of the SFP unit, harming a person manipulating the SFP unit, etc.
Therefore, there is a need for a new standardized hot-pluggable transceiving unit having heat dissipation capabilities.
According to a first aspect, the present disclosure provides a transceiving unit. The transceiving unit comprises a housing adapted to being inserted into a port of a hosting unit, the housing defining a top surface. The transceiving unit comprises at least one electronic component located inside the housing. The transceiving unit comprises an insert disposed along the top surface of the housing, the insert passively extracting heat generated by the at least one electronic component located inside the housing. The transceiving unit comprises a rear connector located on a back panel of the housing.
According to a second aspect, the present disclosure provides transceiving unit. The transceiving unit comprises a housing adapted to being inserted into a port of a hosting unit, the housing comprising a front panel. The transceiving unit comprises a heat sink integrated to the front panel for passively extracting heat generated by the at least one electronic component located inside the housing. The transceiving unit comprises a rear connector located on a back panel of the housing.
In a particular aspect, the insert is made of copper, silver, graphite, gold, platinum, or an alloy of a combination thereof.
In another particular aspect, the transceiving unit is a standardized hot-pluggable transceiving unit and the housing has standardized dimensions.
Embodiments of the disclosure will be described by way of example only with reference to the accompanying drawings, in which:
The foregoing and other features will become more apparent upon reading of the following non-restrictive description of illustrative embodiments thereof, given by way of example only with reference to the accompanying drawings.
The present disclosure describes standardized hot-pluggable transceiving units, such as Small Form-factor Pluggable (SFP)/SFP+ units, having internal features that far exceed those of conventional units. Conventional units merely provide connection capabilities between a hosting unit in which they are inserted and external apparatuses. The standardized hot-pluggable transceiving unit disclosed herein provides heat dissipation capabilities, in order to adapt to the heat generated by the power consumption of electronic component located within the housing of the transceiving unit.
The following terminology is used throughout the present disclosure:
In the rest of the disclosure, an SFP unit is used to illustrate an example of a standardized hot-pluggable transceiving unit. However, the teachings of the present disclosure are not limited to an SFP unit; but can be applied to any type of standardized hot-pluggable transceiving unit.
An SFP unit comprises a housing having a front panel, a back panel, a top, a bottom and two sides. Generally, the front panel includes at least one connector for connecting a cable, a fiber, twisted pairs, etc. The back panel includes at least one rear connector for connecting to a hosting unit. However, some SFP units may have no front connector, or alternatively no rear connector. The SFP unit may be fully-compliant or partially compliant with various SFP standards, such as SFP, SFP+, XFP (SFP with 10 Gigabit/s data rate), Xenpak, QSFP (Quad (4-channel) SFP with 4×1 Gigabit/s data rate), QSFP+ (Quad (4-channel) SFP with 4×10 Gigabit/s data rate), CFP (C form-factor pluggable with 100 Gigabit/s data rate), CPAK, SFP28 (SFP with 25 Gigabit/s data rate), SFP56 (SFP with 50 Gigabit/s data rate), SFP112 (SFP with 112 Gigabit/s data rate), QSFP28 (Quad (4-channel) SFP with 4×28 Gigabit/s data rate), QSFP56 (Quad (4-channel) SFP with 4×56 Gigabit/s data rate), QSFP112 (Quad (4-channel) SFP with 4×112 Gigabit/s data rate), or any other standardized Small Form-factor Pluggable unit.
In the rest of the description, when the terminology SFP unit is used, it may encompass any of the aforementioned standards when applicable.
Reference is now made concurrently to
The SFP unit 10 further comprises a back panel 16 affixed to the housing 12. The back panel 16 comprises a rear connector 17, for instance an electrical or an optical connector. In an example, the back panel 16 comprises the rear connector 17 (also named a host connector) suitable to connect the SFP unit 10 to a backplane of a chassis (not shown for clarity purposes) of a hosting unit, as known to those skilled in the art. More specifically, the connection is performed via a port of the hosting unit adapted for insertion of the SFP unit 10 and connection of the rear connector 17 to the backplane of the hosting unit.
The SFP unit 10 further comprises a front panel 18 affixed to the housing 12. The front panel 18 comprises zero, one or more connector(s). For example,
Transceiving Unit with a Top Insert for Extracting Heat
Referring now concurrently to
The insert 100 is disposed along the top surface 14 of the housing 12. The insert 100 is made of a material having the property of being an excellent heat conductor. For example, the insert 100 is made of copper, silver, graphite, gold, platinum, an alloy of at least two of these, etc. The role of the insert 100 is to extract heat generated by one or more electronic component located inside the housing 12.
In a first exemplary implementation, the insert 100 is integral to the top surface 14 of the housing 12. The housing 12 is made of a material different from the material of the insert 100. For example, the housing 12 is made of steel or aluminum. A portion of material having the shape of the insert 100 is extruded from the top surface 14 of the housing 12, and the insert 100 is positioned within the extruded portion of the top surface 14 of the housing 12. The thickness of the insert 100 may be lower than, equal to or greater than the thickness of the top surface 14 of the housing 12. The insert 100 is affixed to the top surface 14 of the housing 12 by means well known in the art (e.g. the insert 100 is welded to the top surface 14 of the housing 12, the insert 100 is held together with the top surface 14 of the housing 12 by fasteners or bonding, etc.). In a particular configuration, the original top surface 14 of the housing 12 is entirely replaced with the insert 100, so that the heat extraction capabilities are deployed on the entire top surface 14.
In a second exemplary implementation, the insert 100 is affixed above the top surface 14 of the housing 12. The insert 100 is positioned above a portion of the top surface 14 of the housing 12. The insert 100 is affixed to the top surface 14 of the housing 12 by means well known in the art (e.g. the insert 100 is welded above the top surface 14 of the housing 12, the insert 100 is held together with the top surface 14 of the housing 12 by fasteners or bonding, etc.). In a particular configuration, the top surface 14 of the housing 12 is entirely covered by the insert 100, so that the heat extraction capabilities are deployed on the entire top surface 14.
As mentioned previously, the SFP unit 10 includes one or more electronic component located inside the housing 12. The one or more electronic component generates heat within the housing 12, and at least part of the generated heat is passively extracted from the housing 12 by the insert 100. The extracted heat is released by the insert 100 outside the housing 12. Examples of electronic component include an optical to electrical signal converter, an electrical to optical signal converter, a signal re-clocking unit, a signal processing unit, a data processing unit adapted for processing data transported by a signal, etc. The signal or data processing unit may consist of processor(s), Field-Programmable Gate Arrays (FPGA), Application-Specific Integrated Circuit (ASIC), etc.
In the configuration (
The present disclosure is not limited to SFP units, but also applies to other types of standardized hot-pluggable transceiving units including the insert 100. Furthermore, the present disclosure is not limited to SFP units or other types of standardized hot-pluggable transceiving units comprising a housing with standardized dimensions. The present disclosure also applies to any transceiving unit including the insert 100 and adapted to being inserted into a chassis/a corresponding port of a hosting unit.
Transceiving Unit with a Heat Sink for Extracting Heat
Referring now concurrently to
The heat sink 200 is integrated to the front panel 18 of the housing 12. The role of the heat sink 200 is to extract heat generated by one or more electronic component located inside the housing 12. Heat sinks are well known in the art and can be designed to operate in the context of an SFP unit.
The one or more electronic component generates heat within the housing 12, and at least part of the generated heat is passively extracted from the housing 12 by the heat sink 200. The extracted heat is released by the heat sink 200 outside the housing 12. Examples of electronic component include an optical to electrical signal converter, an electrical to optical signal converter, a signal re-clocking unit, a signal processing unit, a data processing unit adapted for processing data transported by a signal, etc. The signal or data processing unit may consist of processor(s), Field-Programmable Gate Arrays (FPGA), Application-Specific Integrated Circuit (ASIC), etc.
In a first exemplary implementation, the heat sink 200 is at least partially located inside the front panel 18 of the housing 12. A first end of the heat sink 200 extends within the housing 12, for collecting the heat generated by the one or more electronic component located inside the housing 12. A second end of the heat sink 200 extends outside the housing 12 through an opening in the front panel 18 of the housing 12, for evacuating the heat (generated by the one or more electronic component located inside the housing 12) in the environment outside the housing 12. Alternatively, the second end of the heat sink 200 does not extend outside the housing 12, but is in contact with the environment outside the housing 12 through an opening in the front panel 18 of the housing 12. The heat sink 200 is affixed to the front panel 18 and/or the rest of the housing 12 by means well known in the art (e.g. the heat sink 200 is welded to the front panel 18 and/or the rest of the housing 12, the heat sink 200 is held together with the front panel 18 and/or the rest of the housing 12 by fasteners or bonding, etc.).
In a second exemplary implementation, the heat sink 200 is affixed to a surface of the front panel 18 external to the housing 12. The heat sink 200 is positioned along a portion of the external surface of the front panel 18 of the housing 12 and is located outside of the housing 12. The heat sink 200 is affixed to the front panel 18 of the housing 12 by means well known in the art (e.g. the heat sink 200 is welded to the front panel 18 of the housing 12, the heat sink 200 is held together with the front panel 18 of the housing 12 by fasteners or bonding, etc.). Heat generated by the one or more electronic component located inside the housing 12 is transmitted to the front panel 18 of the housing 12, extracted by the heat sink 200 and released in the environment outside the housing 12 through thermal contact between the heat sink 200 and the external surface of the front panel 18 of the housing 12.
In a third exemplary implementation, the heat sink 200 is a plug and play heat sink adapted for being inserted into a front connector (e.g. 20) located on the front panel 18 of the housing 12. When plugged into the front connector, the heat sink 200 is in thermal contact with the external surface of the front panel 18 of the housing 12. Heat generated by the one or more electronic component located inside the housing 12 is transmitted to the front panel 18 of the housing 12, extracted by the heat sink 200 and released in the environment outside the housing 12 through thermal contact between the heat sink 200 and the external surface of the front panel 18 of the housing 12. This implementation has not been represented in the Figures.
The representation of the heat sink 200 in the Figures is schematic for simplification purposes. The heat sink 200 may have various form factors (as is well known in the art) as long as the heat sink 200 is designed for being integrated to the front panel 18 of the housing 12.
In the configuration where the SFP unit 10 has no front connector located on the front panel 18, the front panel 18 may include components (in addition to the heatsink 200) such as one or more led, a screen, etc. Alternatively, the heat sink 200 occupies substantially the entire surface of the front panel 18.
In an alternative configurations, the heat sink 200 may be integrated to one of the back panel 16, the top 14, the bottom 24, or one of the sides 21. Several heat sinks 200 may also be integrated to a combination of at least some of the front panel 18, the back panel 16, the top 14, the bottom 24, and at least one of the sides 21.
The SFP unit 10 may comprise more than one heat sink 200 integrated to the front panel 18 of the housing 12. For example,
Optionally, the SFP unit 10 further comprises an active cooling device 300 located inside the housing 12. The active cooling device 300 aims at improving the efficiency of the heat sink 200 for extracting heat generated by the one or more electronic component located inside the housing 12.
Various types of active cooling devices may be used in the context of the present disclosure, such as for example a fan, a blower, a thermoelectric cooler, a heat pipe, etc. In a particular configuration, the active cooling device 300 is located in the vicinity of a surface of the front panel 18 internal to the housing 12.
Optionally, the SFP unit 10 further comprises the previously described insert 100.
Thus, the following implementations of the SFP unit 10 are considered by the current disclosure: the SFP unit 10 comprising the heat sink 200 only, the SFP unit 10 comprising the heat sink 200 and the cooling device 300, the SFP unit 10 comprising the heat sink 200 and the insert 100, the SFP unit 10 comprising the heat sink 200 and a combination of the cooling device 300 and the insert 100
The present disclosure is not limited to SFP units, but also applies to other types of standardized hot-pluggable transceiving units including the heat sink 200. Furthermore, the present disclosure is not limited to SFP units or other types of standardized hot-pluggable transceiving units comprising a housing with standardized dimensions. The present disclosure also applies to any transceiving unit including the heat sink 200 and adapted to being inserted into a chassis/a corresponding port of a hosting unit.
As mentioned previously, the SFP unit 10 comprises at least one connector (e.g. the rear connector 17 and optionally front connector(s) 20) for receiving and transmitting signals, each signal transporting one or more flow of data. For example, the flow of data consists of an IP flow transporting a data content (e.g. a video content). The signals and optionally the transported flows of data are processed by the electronic component located inside the housing 12 of the SFP unit 10, as is well known in the art.
In a particular implementation, at least one of the front connectors is not adapted for receiving signals transporting IP flows. For example, one or more front connector (e.g. 20) is a Serial Digital Interface (SDI) connector adapted for receiving SDI signals transporting SDI video payloads. Other types of front connectors, such as a High-Definition Multimedia Interface (HDMI) video connector for receiving a HDMI signals transporting HDMI video payloads, may be used as well.
Although the present disclosure has been described hereinabove by way of non-restrictive, illustrative embodiments thereof, these embodiments may be modified at will within the scope of the appended claims without departing from the spirit and nature of the present disclosure.
