Number | Date | Country | Kind |
---|---|---|---|
3642723 | Dec 1986 | DEX |
This application is a continuation of application Ser. No. 131,803, filed 12/11/87, now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
1694151 | Waite | Dec 1928 | |
2951165 | Arutunoff | Aug 1960 | |
3369166 | Lake | Feb 1968 | |
3600636 | Peterson | Aug 1971 | |
3626252 | Cath | Dec 1971 | |
3805140 | Takahashi et al. | Apr 1974 | |
3909678 | Rifkin et al. | Sep 1975 | |
3999105 | Archey et al. | Dec 1976 | |
4053942 | Dougherty et al. | Oct 1977 | |
4262224 | Kofink et al. | Apr 1981 |
Number | Date | Country |
---|---|---|
A1114000 | Jul 1984 | EPX |
A1183850 | Jun 1986 | EPX |
2015518 | Oct 1970 | DEX |
2836710 | Feb 1980 | DEX |
2364773 | Jul 1984 | DEX |
1039601 | Aug 1966 | GBX |
1137266 | Dec 1968 | GBX |
1144121 | Mar 1969 | GBX |
Entry |
---|
IBM Technical Disclosure Bulletin 18, "Cooling Cap for Powder or Liquid Filled Modules", No. 5, 1387-1388, 10/75. |
IBM Technical Disclosure Bulletin 14, "Substrate Mounted Heat Pipe for Chip Cooling", No. 9, 2690, 2/72. |
IBM Technical Disclosure Bulletin 13, "Self-Cooling Heat Exchanger-Condenser", No. 5, 1048, 10/70. |
IBM Technical Disclosure Bulletin 21, "Metal Wood and Idium Heat Sink", No. 3, 1143-1144, 8/78. |
Number | Date | Country | |
---|---|---|---|
Parent | 131803 | Dec 1987 |