STRIP TEST METHOD

Abstract

A strip test method includes the following steps. First, an assembly strip is provided, wherein the assembly strip includes a plurality of semiconductor devices, each having a plurality of leads. A test socket and a base are provided, wherein the test socket has a plurality of probe sets. The assembly strip is loaded to the base. The probe sets electrically contacts the leads of the semiconductor devices simultaneously and respectively so as to process an electrical test. When one of the semiconductor devices is failed in the electrical test, one of the base and the test socket are relatively moved in such a manner that the failed one of the semiconductor devices is corresponding to one of the probe sets which is successful in the electrical test and is the nearest to the failed one of semiconductor device. Finally, the successful and nearest one of probe sets simultaneously and electrically contacts the leads of the failed one of the semiconductor devices so as to process another electrical test again.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional schematic view of an assembly strip in the prior art, showing an electrical test.

FIG. 2 is a flow chart of a strip test method in the prior art.

FIG. 3 is a flow chart of a strip test method of the present invention.

FIG. 4 is a perspective schematic view of a strip test method according to an embodiment of the present invention, showing that the probe set (the location number 18) is corresponding to the semiconductor device (the location number 18).

FIG. 5 is a perspective schematic view of a strip test method according to the embodiment of the present invention, showing that the probe set (the location number 23) is corresponding to the semiconductor device (the location number 18).

Claims

1. A strip test method, comprising the steps of: providing a assembly strip, wherein the assembly strip includes a plurality of semiconductor devices each having a plurality of leads;providing a test socket and a base, wherein the test socket has a plurality of probe sets;loading the assembly strip to the base;electrically contacting the leads of the semiconductor devices with the probe sets simultaneously and respectively so as to process a first electrical test;relatively moving one of the base and the test socket when one of the semiconductor devices is failed in the first electrical test in such a manner that the failed one of semiconductor devices is corresponding to one of the probe sets which is successful in the first electrical test and is the nearest to the failed one of semiconductor devices; andelectrically contacting the leads of the failed one of the semiconductor devices with the successful and the nearest one of the probe sets simultaneously so as to process a second electrical test.

2. The strip test method as claimed in claim 1, further comprising the steps of: relatively moving the one of the base and the test socket when the one of semiconductor devices is still failed in the second electrical test in such a manner that the failed one of semiconductor devices is corresponding to another one of the probe sets which is successful in the second electrical test and is the nearest to the failed one of semiconductor devices; andelectrically contacting the leads of the failed one of the semiconductor devices with the another successful and the nearest one of the probe sets simultaneously so as to process a N-th electrical test, wherein N is an integer more than 2.

3. The strip test method as claimed in claim 2, further comprising the step of: unloading the assembly strip from the base when the one of semiconductor devices which is failed in the (N−1)-th electrical test is successful in the N-th electrical test.

4. The strip test method as claimed in claim 2, further comprising the step of: unloading the assembly strip from the base when the whole test time of the strip test method exceeds a predetermined time limit.

5. The strip test method as claimed in claim 1, further comprising the step of: unloading the assembly strip from the base when the one of semiconductor devices which is failed in the first electrical test is successful in the second electrical test.

6. The strip test method as claimed in claim 1, wherein the semiconductor devices are assembled on matrix-type lead frame structures in which the semiconductor devices are arranged in multiple rows and columns.

7. The strip test method as claimed in claim 1, wherein the test socket and the base are deposed in a functional test device.