Patent Application
20160273564
Corresponding reference characters indicate corresponding parts throughout the drawings.
With the increased demand for portable computing devices, such as laptops, smartphones, tablets, and/or phablets, at least some computing devices have become thinner to increase a portability of the computing device. Known methods and systems for manufacturing and/or producing thinner computing devices are somewhat restricted by current infrastructure (e.g., hardware requirements). In addition to printed circuit boards and/or other electronic devices, computing devices are designed to accommodate fastening mechanisms (e.g., screws, rivets) that couple electronic devices to a chassis and/or frame.
At least some known computing devices include a printed circuit board having an opening, and a coupling mechanism including a shaft portion extending through the opening and a head portion positioned above an upper surface of the printed circuit board, which may increase a height of at least a part of the computing device. To accommodate the head portion of the coupling mechanism and/or decrease the height of at least the part of the computing device, at least some known computing devices include a printed circuit board having an opening sized to receive the head portion using a countersink configuration. However, such printed circuit boards may not allow for much thermal expansion of the coupling mechanism and/or allocation for lateral tolerances. Additionally or alternatively, such printed circuit boards are subjected to lateral stress induced from the head portion of the coupling mechanism, which may distort at least a part of the printed circuit board over time and/or with continued use.
Examples of the disclosure enable a printed circuit board to be coupled to a chassis. Some examples include a coupling mechanism including an insert and/or housing mechanism at least partially positionable within an opening defined by a printed circuit board, and a mounting screw and/or fastening mechanism at least partially positionable within a channel defined by the insert shaft portion such that the printed circuit board is coupled to the chassis.
Aspects of the disclosure enable a printed circuit board to be coupled to a chassis, such that a coupling mechanism that couples the printed circuit board to the chassis lies flush or below (“sub-flush”) an upper surface of the printed circuit board. By incorporating the coupling mechanism in the manner described in this disclosure, some examples enable miniaturization, e.g., require less space for functionality, improved usability, and/or enhanced reliability of a device.
The PCB 102 has a thickness or height 106 extending between an upper surface 108 and a lower surface 110. The height 106 is sized to receive at least a part of the coupling mechanism 104. The PCB 102 has an inner surface 112 that defines an opening 114 extending through the PCB 102 between the upper surface 108 and the lower surface 110. The inner surface 112 has an inner diameter 116 sized to receive at least a part of the coupling mechanism 104. In one example, the inner diameter 116 is between approximately 2.62 mm and approximately 2.78 mm. Alternatively, the inner surface 112 may have any diameter that enables the PCB 102 to function as described herein.
The coupling mechanism 104 includes an insert or housing mechanism 118 (e.g., a first body) including a head portion 120 (e.g., washer) and a shaft portion 122 (e.g., collar) extending from the head portion 120.
The shaft portion 122 has an upper surface 128, an outer surface 130 having an outer diameter 132 (e.g., a first diameter) sized to fit within the opening 114 (e.g., the outer diameter 132 is less than or equal to the inner diameter 116 of the PCB 102), and a first inner surface 134 (not shown in
The first inner surface 134 at least partially defines a channel 138 (not shown in
In some examples, the housing mechanism 118 is coupleable to the lower surface 110 of the PCB 102 such that the shaft portion 122 is positioned and/or extends at least partially through the opening 114. In at least some examples, the head portion 120 is sized such that the housing mechanism 118 does not fully traverse and/or pass through the PCB 102. For example, the upper surface 124 of the head portion 120 may engage the lower surface 110 of the PCB 102 when inserting the housing mechanism 118 into the opening 114.
In at least some examples, the upper surface 124 of the head portion 120 faces and/or extends substantially parallel to the lower surface 110 of the PCB 102 when the housing mechanism 118 is coupled to the PCB 102. Additionally or alternatively, the outer surface 130 of the shaft portion 122 faces and/or extends substantially parallel to the inner surface 112 of the PCB 102 when the housing mechanism 118 is coupled to the PCB 102.
In at least some examples, a soldering material 146 (shown in
In some examples, the housing mechanism 118 includes a shoulder portion 148 (not shown in
Referring again to
In one example, the fastening mechanism 156 is a rivet. In this example, the fastening mechanism 156, being a rivet, couples the PCB 102 to the chassis 107 when the rivet is driven through the housing mechanism 118 and is forced and implanted in to the chassis 107. The advantage of this system is that the housing mechanism 118 mechanically stabilizes and supports the force of the fastening mechanism 156 on the PCB 102 while permitting the fastening mechanism to be sub-flush with the PCB 102. In another example, the fastening mechanism 156 is a screw that includes threading on the shaft portion 160. The chassis 107 may include a threaded hole that accepts the threading on the shaft portion 160 of fastening mechanism 156. In this manner, the fastening mechanism 156 screws into the chassis 107, thereby providing the advantage that the PCB 102 may be unscrewed and removed from the chassis 107 to permit maintenance or repair of the PCB 102, the chassis 107, or another component of the device.
The head portion 158 has an outer surface 168 having an outer diameter 170 (e.g., a second diameter) sized to fit within the opening 114 while providing at least some vertical support to the fastening mechanism 156 (e.g., the outer diameter 170 is less than or equal to the inner diameter 116 of the PCB 102 and greater than the first inner diameter 136 of the housing mechanism 118). In at least some examples, the outer diameter 170 is less than or equal to the outer diameter 132 of the housing mechanism shaft portion 122.
The shaft portion 160 has a lower surface 172, and a first outer surface 174 having an outer diameter 176 sized to fit within the channel 138 (e.g., the outer diameter 176 is less than or equal to the inner diameters 136 and/or 154 of the housing mechanism 118). The shaft portion 160 has a first end section 178 (shown in
In some examples, the fastening mechanism 156 is configured to engage the housing mechanism 118 such that at least a part of the shaft portion 160 is positioned and/or extends through the channel 138. In at least some examples, the head portion 158 is sized such that the fastening mechanism 156 does not directly interface with the PCB 102 and such that the fastening mechanism 156 does not fully traverse and/or pass through the housing mechanism 118. For example, the lower surface 166 of the head portion 158 may engage the upper surface 128 of the housing mechanism shaft portion 122 when inserting the fastening mechanism 156 into the channel 138.
In at least some examples, the lower surface 166 of the head portion 158 faces and/or extends substantially parallel to the upper surface 128 of the housing mechanism shaft portion 122 when the fastening mechanism 156 engages the housing mechanism 118. In at least some examples, the head portion 158 engages the housing mechanism shaft portion 122 such that the upper surface 164 of the head portion 158 is below or flush with the PCB upper surface 108.
Additionally or alternatively, the first outer surface 174 of the shaft portion 160 faces and/or extends substantially parallel to the first inner surface 134 of the housing mechanism shaft portion 122 and/or the second inner surface 152 of the housing mechanism shoulder portion 148 when the fastening mechanism 156 engages the housing mechanism 118. In at least some examples, the shaft portion 160 is sized to expand and/or contract radially and/or move laterally within the channel 138 when at least the part of the shaft portion 160 is positioned and/or extends through the channel 138.
In some examples, the fastening mechanism 156 includes a shoulder portion 182 between the head portion 158 and the shaft portion 160. In at least some examples, the shoulder portion 182 includes a lower surface 184 and a second outer surface 186 radially outward of the first outer surface 174 and having an outer diameter 188 sized to fit within the channel 138 while providing at least some vertical support to the fastening mechanism 156 (e.g., the outer diameter 188 is less than or equal to the first inner diameter 136 of the housing mechanism 118 and greater than or equal to the second inner diameter 154 of the housing mechanism 118).
In some examples, the fastening mechanism 156 is configured to engage the housing mechanism 118 such that the shoulder portion 182 is positioned and/or extends at least partially through the channel 138. In at least some examples, the shoulder portions 148 and/or 182 are sized such that the fastening mechanism 156 does not fully traverse and/or pass through the housing mechanism 118. For example, the lower surface 184 of the fastening mechanism shoulder portion 182 may engage the upper surface 150 of the housing mechanism 148 when inserting the fastening mechanism 156 into the channel 138.
In at least some examples, the lower surface 184 of the fastening mechanism shoulder portion 182 faces and/or extends substantially parallel to the upper surface 150 of the housing mechanism shoulder portion 148 when the fastening mechanism 156 engages the housing mechanism 118. Additionally or alternatively, the second outer surface 186 of the fastening mechanism shoulder portion 182 faces and/or extends substantially parallel to the first inner surface 134 of the housing mechanism shaft portion 122 when the fastening mechanism 156 engages the housing mechanism 118. In at least some examples, the shoulder portion 182 is sized to expand and/or contract radially and/or move laterally within the channel 138 when at least the part of the shoulder portion 182 is positioned and/or extends through the channel 138.
In some examples, the shaft portion 722 has a first end section 742 coupled to the head portion 720, and a second end section 744 opposite the first end section 742. In some examples, the second end section 744 includes and/or has a chamfer 790. In at least some examples, chamfer 790 at least partially defines a chamber or cavity between the shaft portion 722 and the PCB 102 that is configured to retain soldering material (shown in
In some examples, the shaft portion 922 has an outer surface 930 and a plurality of projection members 992 extending radially outward from the outer surface 930. In at least some examples, a chamber or cavity is defined between adjacent projection members 930 and the PCB 102 and/or between a projection member 930 and the head portion 920 that are configured to retain soldering material (shown in
In some examples, the vias 1494 enable increasing a load and/or strength associated with the PCB 1402. In at least some examples, one or more vias 1494 include and/or have a respective component (e.g., a metal barrel) extending through the via 1494. In at least some examples, the components at least partially reinforce a layer (e.g., an epoxy matrix) of and/or associated with the PCB 1402. For example, the components are configured to at least partially reinforce an epoxy matrix to reduce a probability of the epoxy matrix delaminating. In this example, the vias 1494 extend perpendicular and/or substantially perpendicular to the upper surface 1408 and/or lower surface 1410. Alternatively, the vias 1494 may be aligned and/or oriented in any direction that enables the PCB 1402 to function as described herein.
The vias 1494 may be arranged about the PCB 1402 in a predetermined pattern. For example, the vias 1494 may be arranged in a symmetrical pattern (e.g., a pattern having reflection symmetry, rotation symmetry, and/or translation symmetry). In this example, the vias 1494 are arranged in a radial pattern about the opening 1414. More specifically, in this example, the vias 1494 are oriented to be perpendicular to the upper surface 1408 and the lower surface 1410, and are arranged in a symmetrical pattern, such that the arrangement of the vias 1494 appears to be the same, similar, and/or substantially similar when viewed from the lower side (see, e.g.,
In some examples, the system 1400 includes a frame and/or stencil 1496 (shown in
In some examples, a housing mechanism (e.g., housing mechanism 118, 518, 718, 918, 1118, 1218, 1318) is coupled to the printed circuit board (PCB) 102 at 1610. In at least some examples, the housing mechanism 118 is positioned such that an upper surface 124 of a head portion 120 of the housing mechanism 118 extends substantially parallel to a lower surface 110 of the PCB 102. In at least some examples, the housing mechanism 118 is coupled to the lower surface 110 of the PCB 102 such that the head portion 120 of the housing mechanism 118 engages the lower surface 110 of the PCB 102, and/or a shaft portion 112 of the housing mechanism 118 extends at least partially through an opening 114 defined in the PCB 102.
In at least some examples, the housing mechanism 118 is soldered to the lower surface 110 of the PCB 102 using a soldering material 146. In at least some examples, the soldering material 146 is applied such that the soldering material 146 is between the upper surface 124 of the head portion 120 and the lower surface 110 of the PCB 102 and/or the outer surface 130 of the shaft portion 122 and the inner surface 112 of the PCB 102. In at least some examples, at least a portion of the soldering material 146 is within a cavity at least partially defined by a chamfer 790 of the housing mechanism 118. Alternatively, the soldering material 146 may be applied in any position that enables the system 100 to function as described herein.
In some examples, a fastening mechanism 156 is coupled to the chassis 107 at 1620. In at least some examples, the fastening mechanism 156 is positioned such that an outer surface 174 of a shaft portion 160 of the fastening mechanism 156 extends substantially parallel to the inner surface 134 of the housing mechanism shaft portion 112. Additionally or alternatively, the fastening mechanism 156 is positioned such that an upper surface 164 of a head portion 158 of the fastening mechanism 156 is below or flush with an upper surface 108 of the PCB 102 to facilitate reducing and/or controlling a thickness of the system 100 and/or reducing protrusions (or opportunities for protrusions) that may occur on the cover 105 used with the system 100 when the cover 105 is compressed onto the system 100 during use.
In at least some examples, the fastening mechanism 156 is coupled to the chassis 107 such that a head portion 158 of the fastening mechanism 156 engages an upper surface of the shaft portion 112 of the housing mechanism 118, and at least a part of the shaft portion 160 of the fastening mechanism 156 extends through a channel 138 defined by the housing mechanism 118. In at least some examples, the fastening mechanism 156 is positioned such that a shoulder portion 182 of the fastening mechanism 156 engages a shoulder portion 146 of the housing mechanism 118.
In at least some examples, the shaft portion 112 of the housing mechanism 118 and/or the channel 138 are sized such that the shaft portion 112 may expand and/or contract radially and/or move laterally within the channel 138. For example, the fastening mechanism 156 may expand and/or contract during operation and/or use of a computing device 100 in which the system 100 is included due to increased temperatures. For another example, the housing mechanism 118 may be configured to accommodate for lateral tolerances (e.g., components within the system 100 shifting laterally). For yet another example, the housing mechanism 118 may be configured to accommodate for part tolerances (e.g., components within the system 100 may not be manufactured and/or fabricated to specification).
The subject matter described herein enables a component (e.g., printed circuit board) to be coupled to a chassis. In some examples, an insert and/or housing mechanism is used to accommodate a screw and/or fastening mechanism such that a head of the fastening mechanism is flush with and/or below an upper surface of the component and/or a shaft of the fastening mechanism is allowed to expand, contract, and/or laterally move within the housing mechanism. In this way, the component may maintain a low profile and/or be exposed to a reduced amount of pressure and/or stress.
Although described in connection with an example computing system environment, examples of the disclosure are capable of implementation with numerous other general purpose or special purpose computing system environments, configurations, or devices.
Examples of well-known computing systems, environments, and/or configurations that may be suitable for use with aspects of the disclosure include, but are not limited to, mobile computing devices, personal computers, server computers, hand-held or laptop devices, multiprocessor systems, gaming consoles, microprocessor-based systems, set top boxes, programmable consumer electronics, mobile telephones, mobile computing and/or communication devices in wearable or accessory form factors (e.g., watches, glasses, headsets, or earphones), network PCs, minicomputers, mainframe computers, distributed computing environments that include any of the above systems or devices, and the like. Such systems or devices may accept input from the user in any way, including from input devices such as a keyboard or pointing device, via gesture input, proximity input (such as by hovering), and/or via voice input.
The examples illustrated and described herein as well as examples not specifically described herein but within the scope of aspects of the disclosure constitute example means for coupling a housing mechanism to a printed circuit board and/or example means for coupling a fastening mechanism to a chassis.
The order of execution or performance of the operations in examples of the disclosure illustrated and described herein is not essential, unless otherwise specified. That is, the operations may be performed in any order, unless otherwise specified, and examples of the disclosure may include additional or fewer operations than those disclosed herein. For example, it is contemplated that executing or performing a particular operation before, contemporaneously with, or after another operation is within the scope of aspects of the disclosure.
When introducing elements of aspects of the disclosure or the examples thereof, the articles “a,” “an,” “the,” and “said” are intended to mean that there are one or more of the elements. The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements. The phrase “one or more of the following: A, B, and C” means “at least one of A and/or at least one of B and/or at least one of C.”
Having described aspects of the disclosure in detail, it will be apparent that modifications and variations are possible without departing from the scope of aspects of the disclosure as defined in the appended claims. As various changes could be made in the above constructions, products, and methods without departing from the scope of aspects of the disclosure, it is intended that all matter contained in the above description and shown in the accompanying drawings shall be interpreted as illustrative and not in a limiting sense.
Alternatively or in addition to the other examples described herein, examples include any combination of the following:
While the aspects of the disclosure have been described in terms of various examples with their associated operations, a person skilled in the art would appreciate that a combination of operations from any number of different examples is also within scope of the aspects of the disclosure.
