Claims
- 1. A subminiature lamp having a bulb with lead wires and a socket, the socket comprising:a socket base; and a bulb holder, connected to the socket base, for holding the bulb in a predetermined position, wherein a front surface and a back surface of the socket base form a substantially flat plate and are parallel with each other; the bulb holder is attached on the front surface of the socket base and the shape of the bulb holder is substantially a cylinder with a bottom corresponding to a portion of the front surface of the socket base; and a slit extends through the diameter of the bulb holder, wherein the lead wires extend through the slit of the bulb holder and are configured to be disposed along the front and back surface of the socket base.
- 2. The subminiature lamp of claim 1, further comprising at least one pair of projections formed on at least one surface of the socket base between which at least one of the lead wire passes.
- 3. The subminiature lamp of claim 1, further comprising at least two pairs of projections formed on at least one surface of the socket base between which at least one lead wire passes.
- 4. The subminiature lamp of claim 1, further comprising at least one pair of projections formed on the front and back surfaces of the socket base between which at least one lead wire passes.
- 5. The subminiature lamp of claim 1, wherein the socket base has at least one surface for attachment.
- 6. The subminiature lamp of claim 2, wherein the height of the projections substantially corresponds to the height of the lead wire disposed on the surface of the socket base.
- 7. The subminiature lamp of claim 1, wherein a guide ditch is formed in an end of the socket base to facilitate introduction of a lead wire from one surface of the socket base to another surface of the socket base.
- 8. The socket according to claim 5, wherein the top surface and bottom surface are capable of attachment to at least one object.
- 9. The socket according to claim 5, wherein the at least one lead wire is disposed along the top and bottom surfaces of the socket base.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-243822 |
Aug 1998 |
JP |
|
Parent Case Info
This invention claims the benefit of Japanese Patent Application No. HEI 10-243822, filed on Aug. 28, 1998, which is hereby incorporated by reference.
US Referenced Citations (5)
Foreign Referenced Citations (3)
Number |
Date |
Country |
2-117656 |
Sep 1990 |
JP |
3-94763 |
Sep 1991 |
JP |
4-87158 |
Jul 1992 |
JP |