Substrate for forming passive elements in chip type

Abstract

A substrate for forming passive elements in chip type has a top surface, a thickness, multiple parallel grooves, multiple through holes and multiple chip regions. The parallel grooves are formed on the top surface of the substrate. The through holes are formed between and across two adjacent parallel grooves, and each through hole is separated from other through holes and has smooth inner walls. The chip regions are defined between adjacent through holes and parallel grooves and are arranged in a matrix.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of a first embodiment of a substrate in accordance with the present invention;

FIG. 2 is a flow chart of a conventional method of manufacturing chip resistors; and

FIG. 3 is a side view in partial section of a chip resistor manufactured by the method in FIG. 3 without the inner and outer electrodes.

Claims

1. A substrate for forming passive elements in chip type having: a top surface;a thickness;multiple parallel grooves formed on the top surface of the substrate;multiple through holes formed between and across two adjacent parallel grooves, and each through hole being separated from other through holes and having smooth inner walls; andmultiple chip regions defined between adjacent through holes and parallel grooves and being arranged in a matrix.

2. The substrate as claimed in claim 1 further having multiple perpendicular grooves formed across the parallel grooves on the top surface of the substrate and respectively having a depth.

3. The substrate as claimed in claim 1, wherein each parallel groove has a depth being deeper than half the thickness of the substrate.

4. The substrate as claimed in claim 1, wherein the substrate is made of cermet.

5. The substrate as claimed in claim 2, wherein each perpendicular groove has a depth being deeper than half the thickness of the substrate.

6. The substrate as claimed in claim 2, wherein each parallel groove has a depth being deeper than half the thickness of the substrate.

7. The substrate as claimed in claim 2, wherein the substrate is made of cermet.

8. The substrate as claimed in claim 3, wherein the substrate is made of cermet.

9. The substrate as claimed in claim 3, wherein each perpendicular groove has a depth being deeper than half the thickness of the substrate.

10. The substrate as claimed in claim 4, wherein each perpendicular groove has a depth being deeper than half the thickness of the substrate.