CROSS-REFERENCE TO RELATED APPLICATION
This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0001166 filed in the Korean Intellectual Property Office on Jan. 3, 2024, the entire contents of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION
(a) Field of the Invention
The present disclosure relates to a substrate polishing module, a substrate polishing device, and a substrate polishing method using the same.
(b) Description of the Related Art
Chemical mechanical polishing (CMP) process, which planarizes semiconductor substrates, is a process of polishing various thin films on the substrate to planarize or remove the surface of the substrate by making chemical changes to the surface of the material to be polished to facilitate mechanical polishing.
CMP processes may include a process of removing portions of the surface of a substrate or removing a film by changing the film surface to a soft state for polishing by a chemical reaction, and then removing the softened surface by mechanical polishing using a pad rotating at high speed.
In particular, in order to minimize defects occurring in the edge region of the substrate, bevel CMP technology that removes defect sources present in the edge region of the substrate is important.
Bevel CMP technology, which polishes the bevel region, which refers to the rounded edge of the conventional substrate, uses a plurality of polishing tapes with abrasives attached to polish the bevel portion of the substrate.
In the case of the conventional method, the polishing tape, which is a consumable, needs to be frequently replaced, and the structure of the polishing tape and the operation equipment thereof for polishing the bevel portion of the substrate is complicated.
Regarding bevel CMP technology, which polishes the bevel of a substrate, there is a need to simplify equipment structure and improve productivity.
SUMMARY OF THE INVENTION
Embodiments of the present disclosure attempts to solve the above issues, and provide a substrate polishing module, a substrate polishing device, and a substrate polishing method using the same capable of simplifying the bevel CMP equipment structure by performing CMP on the bevel area using a polishing pad disposed on a ring-shaped platen disposed along the circumference of the substrate, respectively on the upper and lower portions of the substrate.
A substrate polishing module according to at least one embodiment includes a pair of ring-shaped platens configured to be, respectively, disposed along a circumference of an upper portion and a lower portion of a substrate; a polishing pad on each platen of the pair of platens such that the polishing pad is configured to be in contact with a corresponding one of an upper and lower surface of the substrate and to polish a bevel of the substrate; and at least one driver configured to rotate the pair of platens.
A substrate polishing module according to at least one embodiment includes a chuck plate configured to seat a substrate; a chuck shaft configured to support and rotate the chuck plate; and a substrate polishing module configured to be disposed on upper and lower portions of the substrate and to polish a bevel of the substrate, wherein the substrate polishing module comprises a pair of ring-shaped platens configured to be disposed along a circumference the upper and lower portions of the substrate, a polishing pad on each of the pair of platens such that the polishing pad is configured to be in contact with a corresponding one of an upper or lower surface of the substrate and to polish the bevel of the substrate, and at least one driver configured to rotate each of the pair of platens.
A substrate polishing method according to at least one embodiment includes seating a substrate on a chuck plate; disposing a pair of ring-shaped platens along a circumference of the substrate such that the pair of platens are respectively on an upper or lower portion of the substrate, and such that polishing pads disposed on each of the pair of platens contacts the substrate; and rotating each of the pair of platens and the chuck plate such that a bevel of the substrate is polished.
According to embodiments, it is possible to increase the replacement cycle of polishing pads, which are consumables, simplify the structure of bevel CMP equipment, and improve productivity, compared to existing bevel CMP equipment.
BRIEF DESCRIPTION OF THE DRAWINGS
FIGS. 1A-1C are diagrams illustrating a substrate polishing module according to at least one embodiment.
FIGS. 2A-2D are diagrams illustrating the substrate polishing module according to FIGS. 1A-1C.
FIGS. 3A and 3B are diagrams illustrating a substrate polishing module according to at least one embodiment.
FIG. 4 is a diagram illustrating at least one embodiment of the substrate polishing module according to FIGS. 3A and 3B.
FIGS. 5A and 5B are diagrams illustrating various embodiments of the substrate polishing module according to FIGS. 3A and 3B.
FIGS. 6A-6D are diagrams illustrating a substrate polishing module according to at least one embodiment.
FIGS. 7A-7C are diagrams illustrating a substrate polishing module according to at least one embodiment.
FIG. 8 is a diagram illustrating at least one embodiment of the substrate polishing module according to FIGS. 7A-7C.
FIGS. 9A-9D are diagrams illustrating a substrate polishing module according to at least one embodiment.
FIGS. 10A-10C are diagrams illustrating the substrate polishing module according to FIGS. 9A-9D.
FIG. 11 is a diagram illustrating the configuration of a substrate polishing device according to at least one embodiment.
FIG. 12 is a diagram illustrating the configuration of a substrate polishing device according to at least one embodiment.
FIGS. 13A-13C are diagrams illustrating a substrate polishing method according to at least one embodiment; and FIG. 13D is a flowchart illustrating the substrate polishing method.
FIGS. 14A-14B are diagrams illustrating a substrate polishing method according to at least one embodiment.
DETAILED DESCRIPTION OF THE EMBODIMENTS
Hereinafter, the present disclosure will be described in detail hereinafter with reference to the accompanying drawings, in which embodiments of the present disclosure are shown. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present disclosure.
The drawings and description are to be regarded as illustrative in nature and not restrictive. Like reference numerals designate like elements throughout the specification.
Size and thickness of each constituent element in the drawings are illustrated for better understanding and ease of description, the following embodiments are not limited thereto. In the drawings, the thickness of layers, films, panels, regions, etc., may be exaggerated for clarity. In the drawings, the thickness of some layers and regions may be exaggerated for ease of description.
Throughout the specification, the term “coupled” does not mean only that “directly coupled”, but also mean that “indirectly coupled” with another element in between. In addition, unless explicitly described to the contrary, the word “comprise”, and variations such as “comprises” or “comprising”, will be understood to imply the inclusion of stated elements but not the exclusion of any other elements.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “above” another element, it can be “directly on” the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present. Further, when an element is referred to as being “on” or “above” a reference element, it can be positioned above or below the reference element, and it is not necessarily referred to as being positioned “on” or “above” in a direction opposite to gravity.
In addition, the phrase “on a plane” means a view from a position above the object (e.g., from the top), and the phrase “on a cross-section” means a view of a cross-section of the object which is vertically cut from the side.
Hereinafter, a substrate polishing module, a substrate polishing device 10, and a substrate polishing method using the same according to at least one embodiment of the present disclosure will be described in more detail with reference to the drawings.
FIGS. 1A-1C are a diagram illustrating a substrate polishing module according to at least one embodiment, and FIGS. 2A-2D are a diagram illustrating the substrate polishing module according to FIG. 1S1A-1C.
As shown in FIGS. 1A-1C, a substrate polishing module 100 according to the present disclosure may include a pair of ring-shaped platens 110 disposed along the circumference of a substrate 1 (respectively on the upper and lower portions of the substrate 1), a polishing pad 120 disposed on the pair of platens 110 to contact the upper and lower surfaces of the substrate 1 and configured to polish a bevel of the substrate 1, and at least one driver 140 that is configured to rotate each of the platens 110.
The bevel of the substrate 1 refers to an inclined region among the edge portions of the substrate 1, and refers to a rounded edge portion among the edge portions of the substrate 1.
First, FIG. 1A is for describing the arrangement relationship between the substrate 1 and a pair of ring-shaped platens 110. Each of the platens 110 is configured to be disposed on the upper and lower portions of the substrate 1 by the platens 110 moving closer to the substrate 1 for polishing, and then rotating in the clockwise (or anti-clockwise) direction with a direction perpendicular to the substrate 1 around the rotation axis, thereby polishing the bevel of the substrate 1.
FIG. 1B shows a plan view of the platen 110 representing the upper and/or lower surface, and a polishing pad 120 may be disposed on the platen 110 as shown in FIG. 1B. An example of the specific structure of the platen 110 and the polishing pad 120 will be described with reference to FIGS. 2A-2D.
FIG. 1C shows the driver 140 that provides torque to each of the ring-shaped platens 110. As shown in FIG. 1C, the platen 110 and the driver 140 that transmits driving force to the platen 110 may be connected through a connecting portion 142. The driver 140 may include, for example, a motor and/or a gear train configured to provide spin a corresponding platen 110.
Since the driver 140 is not disposed on the same plane as the ring-shaped platen 110, the connecting portion 142 connecting the driver 140 and the platen 110 may include a planar connecting portion disposed on the same plane as the ring-shaped platen 110, and a vertical connecting portion disposed perpendicular to the planar connecting portion and one end of which is connected to the driver 140.
FIG. 1C exaggerates the connecting portion 142 for illustrative purposes. Substantially, the connecting portion 142 may have a structure that does not interfere with the process of fixing the substrate 1 to the chuck. FIG. 1C shows an example of a connection structure between the driver 140 and the platen 110, wherein the structure and arrangement of the connecting portion 142 is shown, but is not limited thereto.
In addition, the driver 140 is not limited to the position shown in FIG. 1C, and if it is connected to the platen 110 and may rotate the platen 110, the position where the driver 140 is disposed and the connection structure is not limited.
In the drawings below, the connecting portion 142 and the driver 140 connected to the platen 110 are not shown, and only the platen 110 is shown.
This is for describing the structure of the platen 110, and although not shown, the driver 140 is connected to the platen 110 in the substrate polishing module 100 according to the present disclosure, and the platen 110 is rotatable by the driver 140.
FIGS. 2A-2D are cross-sectional views showing the structure of the polishing pad in detail.
In the substrate polishing module 100 according to FIGS. 1A-2D, the platens 110 are disposed on the upper and lower portions of the substrate 1, respectively, and a plurality of polishing pads 120 may be disposed on (or in) each of the platens 110.
The following description of FIGS. 2A-D are descriptions of one example of the pair of platens 110.
First, FIG. 2A shows a top view of the platen 110 on which the polishing pad 120 is disposed, and FIG. 2B shows a cross-section according to S1 in FIG. 2A.
As shown in FIG. 2A, the polishing pad 120 according to the present disclosure has a length, and the polishing pad 120 may be disposed on the platen 110 along the ring shape of the platen 110, as shown in FIG. 2A. Although only one platen 110 is shown in FIG. 2A, the polishing pad 120 may be equally disposed on each of the platens 110 disposed on upper and lower portions of the substrate 1.
FIG. 2B is an enlarged view of one polishing pad 120 disposed on the cross-section S1 in FIG. 2A, and FIG. 2C shows a cross-section at S2 in FIG. 2B.
As shown in FIGS. 2B and 2C, the polishing pad 120 is disposed to be built in the platen 110, and may include a plurality of roll pad supports 122 rotating around the longitudinal direction as an axis. The plurality of roll pad supports 122 built in each of the platens 110 may be configured to rotate on an axis disposed in parallel in each of the platens 110.
Additionally, the polishing pad 120 may include a plurality of roll pads 124 surrounding the roll pad support 122 and are partially disposed to protrude from the upper and lower surfaces of the platen 110.
The roll pad 124 comes into contact with the substrate 1 through a portion disposed to protrude from the plane of the platen 110, and thus the bevel region of the substrate 1 may be polished. That is, the polishing for the substrate 1 may be performed according to the rotation of the roll pad 124 that rotates together with the roll pad support 122.
Although not shown, rotation of the roll pad support 122 and the roll pad 124 may be operated through a rotation driver (not shown). The rotation driver may be disposed inside each of the platens 110, but the placement position of the rotation driver is not limited to a specific location.
FIG. 2D shows a cross-section at S3 in FIG. 2C. As in FIGS. 2(c) and 2(d), the roll pad 124 may include a polishing portion 130 that contacts the substrate 1 and polishes the bevel of the substrate 1, and an adhesive portion 132 disposed between the roll pad support 122 and the polishing portion 130 to adhere the roll pad support 122 and the polishing portion 130.
The polishing portion 130 in contact with the substrate 1 may include an abrasive A and an adhesive B binding the abrasive A. The abrasive A may include diamond, etc., and the particles of the abrasive A may form the roll pad 124 together with the adhesive B.
FIG. 3A-3B are a diagram illustrating a substrate polishing module according to at least one embodiment.
FIG. 3A shows the ring-shaped pair of platens 110 disposed on each of the platens 110 rotating (while in contact with the bevel region of the substrate 1) after being moved close to the substrate 1.
In at least one embodiment, the substrate polishing module 100 may further include a conditioning portion 150 that conditions the polishing pad 120 when the polishing pad 120 is polishing the bevel region of the substrate 1.
As shown in FIG. 3A, the conditioning portion 150 may include a conditioning body 152, a conditioning pad 154, and a body support 156.
The conditioning body 152 may be disposed on the outer upper and lower portions of each of the pair of platens 110 disposed on the upper and lower portions of the substrate 1 and may be disposed to face the polishing pad 120. The conditioning pad 154 may be fixed to the conditioning body 152 and disposed to face the polishing pad 120 and be in contact with an exposed portion of the polishing pad 120.
The body support 156 that supports the conditioning body 152 may be connected to the conditioning body 152 and may be configured to move the conditioning body 152 up and down. Through the vertical movement of each body support part 156, which is respectively disposed on the upper and lower portions of the substrate 1, the conditioning pad 154 may be positioned to contact with the roll pad 124 when the polishing pad 120 requires conditioning.
FIG. 3B is an enlarged view of the conditioning body 152 and the conditioning pad 154 that condition the polishing pad 120 disposed on the platen 110 disposed on the lower portion of the substrate 1 in FIG. 3A.
In FIG. 3B, only a portion of the conditioning pad is shown to illustrate the state of conditioning, but in reality, the conditioning pad 154 may be individually disposed to condition both the roll pad 124 protruding from the upper surface of the platen 110 disposed on the upper portion of the substrate 1, and the roll pad 124 protruding from the lower surface of the platen 110 disposed on the lower portion of the substrate 1.
In other words, the conditioning portion 150 may be disposed, respectively, on the outer upper and lower portions of each of the platens 110, to be contact with each polishing pad 120, and serves the role of conditioning the roll pad 124 of the polishing pad 120. At this time, the conditioning pad 154 may be made of diamond.
When the platen 110 rotates with the conditioning pad 154 disposed in contact with the roll pad 124, the plurality of roll pads 124 disposed to protrude from the platen 110 may be conditioned by the conditioning pad 154. For example, the conditioning pad 154 may remove debris from the plurality of roll pads 124 and/or ensure even wearing of the plurality of roll pads 124.
FIG. 4 is a diagram illustrating at least one embodiment of the substrate polishing module according to FIG. 3.
In the conditioning portion 150 shown in FIG. 3A, one end of the body support 156 is connected to the conditioning body 152. The other ends of the body supports 156 are fixed to other components, and each body support 156 may move up and down independently.
In contrast, the conditioning portion 150 shown in FIG. 4 has a structure in which each of the body supports 156 disposed on the upper and lower portions of the substrate 1 are connected to each other.
Specifically, the conditioning portion 150 has a structure in which the other end of each body support 156 is connected by a vertically arranged linkage portion 158. In this case, the separation distance of each body support 156 is fixed as the length of the linkage portion 158. In at least one example, the linkage portion 158 may include, e.g., a piston, a gear train, and/or the like.
The conditioning portion 150 in FIG. 4 may move horizontally on the side of the substrate 1 rather than moving up and down.
Specifically, when not conditioning the polishing pad 120, the conditioning portion 150 leaves the substrate 1 and moves to the side, but when conditioning the polishing pad 120, the conditioning portion 150 moves closer to the substrate 1. That is, for conditioning, the position of the conditioning pad 154 may be adjusted to the position of the polishing pad 120 so that the conditioning pad 154 corresponds to the roll pad 124 of the polishing pad 120.
FIGS. 5A-5B are a diagram illustrating various embodiments of the substrate polishing module according to FIG. 3.
As shown in FIGS. 5A and 5B, the conditioning body 152 may have a ring shape.
At this time, a plurality of conditioning pads 154 that are fixed to the conditioning body 152 and condition the polishing pad 120 may be disposed along the conditioning body 152.
First, FIG. 5A shows at least one embodiment in which a plurality of conditioning pads 154 are disposed on the ring-shaped conditioning body 152. The body support 156 shown in FIG. 5A has one end connected to the conditioning body 152, and the other end is fixed to other components and may be moved independently, as shown in FIG. 3,
FIG. 5B shows at least one embodiment in which a plurality of conditioning pads 154 are disposed on the ring-shaped conditioning body 152, and as shown in FIG. 4, each body support 156 is connected to each other. Since the separation distance between the body supports 156 respectively disposed on the upper and lower portions is fixed as the length of the linkage portion 158, the position may be adjusted by moving horizontally rather than moving up and down.
As shown in FIG. 4, when not conditioning the polishing pad 120, the conditioning portion 150 leaves the substrate 1 and moves to the side, but when conditioning the polishing pad 120, the conditioning portion 150 moves closer to the substrate 1, so that the position of the conditioning pad 154 may be adjusted to correspond to the roll pad 124 of the polishing pad 120.
FIGS. 6A-6D is a diagram illustrating a substrate polishing module according to at least one embodiment.
As shown in FIGS. 6A-6C, the substrate polishing module 100 according to the present disclosure may include the pair of ring-shaped platens 110 disposed along the circumference of the substrate 1, respectively on the upper and lower portions of the substrate 1, and the polishing pad 120 disposed on each of the pair of platens 110, contacting the upper and lower surfaces of the substrate 1 and polishing the bevel of the substrate 1. The polishing pad 120 may be attached to the surface where each of the platens 110 faces the substrate 1 along the ring shape of each of the platens 110.
Although the driver 140 is not shown in FIGS. 6A-6C, the driver 140 may have a structure connected to each of the platens 110 as shown in FIG. 1. The driver 140 may be disposed in any position as long as it has a structure that moves each platen 110 up and down and rotates each platen 110 on the substrate 1.
First, FIG. 6A is for describing the arrangement relationship between the substrate 1 and the pair of ring-shaped platens 110. Each platen 110 disposed on the upper and lower portions of the substrate 1 may move close to the substrate 1 for polishing and then rotate to polish the edge portion of the substrate 1, especially the inclined bevel portion.
As shown in FIGS. 6A and 6B, the polishing pad 120 may be disposed on each platen 110 to respectively contact the upper and lower surfaces of the substrate 1, so that the bevel of the substrate 1 may be polished. As shown, the ring-shaped polishing pad 120 may be attached to the upper and lower surfaces of the platen 110 where each platen 110 is in contact with the substrate 1.
FIG. 6B shows the platen 110 and the polishing pad 120 disposed on the lower portion of the substrate 1 in FIG. 6A, with the polishing pad 120 positioned on the upper portion of the platen 110 to contact with the substrate 1 that will be disposed on the upper portion.
FIG. 6C shows a cross-section along S4 in FIG. 6B, where the polishing pad 120 may include the polishing portion 130 that contacts the substrate 1 and polishes the bevel of the substrate 1, and the adhesive portion 132 that adheres the polishing portion 130 to each platen 110.
FIG. 6D shows the upper surface of FIG. 6B, and the surface shown in FIG. 6D corresponds to the polishing portion 130 in contact with the substrate 1.
As shown in FIGS. 6C and 6D, the polishing portion 130 of the polishing pad 120 that is in contact with the substrate 1 may include the abrasive A. The abrasive A may include diamond, etc., and the particles of the abrasive A may be formed into a ring shape together with the adhesive B.
FIGS. 7A-7C are a diagram illustrating a substrate polishing module according to at least one embodiment, and FIG. 8 is a diagram illustrating at least one embodiment of the substrate polishing module according to FIG. 7.
As shown in FIGS. 7A-7C, the substrate polishing module 100 according to the present disclosure may include the pair of ring-shaped platens 110 disposed along the circumference of the substrate 1, respectively on the upper and lower portions of the substrate 1, and the polishing pad 120 disposed on each of the pair of platens 110, contacting the upper and lower surfaces of the substrate 1 and polishing the bevel of the substrate 1. Here, the polishing pad 120 may be attached to the surface where each of the platens 110 faces the substrate 1 along the ring shape of each of the platens 110.
Although the driver 140 is not shown in FIGS. 7A-7C, the driver 140 capable of moving up and down and rotating each platen 110 may be included.
First, as shown in FIG. 7A, each platen 110 disposed on the upper and lower portions of the substrate 1 may move close to the substrate 1 for polishing and then rotate to polish the edge portion of the substrate 1, especially the inclined bevel portion.
As shown in FIG. 7B, the polishing pad 120 may be disposed on each platen 110 to be in contact with the upper and lower surfaces of the substrate 1, so that the bevel of the substrate 1 may be polished.
The ring-shaped polishing pad 120 may be attached to the upper and lower surfaces of each platen 110 where the platen 110 is in contact with the substrate 1.
FIG. 7B shows the platen 110 and the polishing pad 120 disposed on the lower portion of the substrate 1, with the polishing pad 120 positioned on the upper portion of the platen 110 to contact with the substrate 1 that will be disposed on the upper portion.
FIG. 7C shows a cross-section along S5 in FIG. 7B, where the polishing pad 120 may include the polishing portion 130 that contacts the substrate 1 and polishes the bevel of the substrate 1, and the adhesive portion 132 that adheres the polishing portion 130 to each platen 110. The polishing portion 130 may be formed of, e.g., a non-abrasive, e.g., a polymer such as polyurethane, configured to facilitate a polishing fluid.
Unlike in FIGS. 1A-6D, the polishing portion 130 in FIG. 7 is different in that the polishing portion 130 is formed of a bulk polyurethane and is configured to facilitate polishing, but without including an abrasive therein.
More specifically, unlike in the case of FIG. 1 A6D, wherein the polishing portion 130 includes an abrasive material A and is a physical polishing method using friction force, in the case of FIGS. 7A-7C, a chemical polishing method is used using a slurry L facilitated by the polishing portion 130.
Accordingly, in the case of FIG. 7A-7C, where the bevel of the substrate 1 is polished using the polishing pad 120 and a slurry, as shown in FIG. 8, a slurry portion 160 supplying the slurry L toward the substrate 1 may be further included.
FIGS. 9A-9D are a diagram illustrating a substrate polishing module according to at least one embodiment, and FIGS. 10A-10C are a diagram illustrating the substrate polishing module according to FIGS. 9A-9D.
As shown in FIGS. 9A-10C, the substrate polishing module 100 may include the pair of ring-shaped platens 110 disposed along the circumference of the substrate 1, respectively on the upper and lower portions of the substrate 1, the polishing pad 120 disposed on each of the pair of platens 110, contacting the upper and lower surfaces of the substrate 1 and polishing the bevel of the substrate 1, and the driver 140 that rotates each of the platens 110.
Although the driver 140 is not shown in FIGS. 9A-9C, the driver 140 may have a structure connected to each of the platens 110 as shown in FIG. 1. However, the structure, connection position, and method of the driver 140 are not limited to those shown in FIG. 1, and the method of connection and the position of placement may be freely adjusted as long as the driver 140 is a structure that may move up and down and rotate each platen 110.
First, FIG. 9A is for describing the arrangement relationship between the substrate 1 and the pair of ring-shaped platens 110. Each platen 110 disposed on the upper and lower portions of the substrate 1 and including the polishing pad 120 may move close to the substrate 1 for polishing and then rotate to polish the edge portion of the substrate 1, especially the inclined bevel portion.
However, compared to the substrate polishing module 100 according to the embodiment shown in FIG. 1 and the substrate polishing module 100 according to the embodiment shown in FIG. 9, the difference is that the substrate polishing module 100 in FIG. 9 includes one more pair of recovery platens 128 for recovering the used polishing pads 120, in addition to the pair of platens 110 including the polishing pads 120 for performing the polishing.
As in FIGS. 9A and 9B, on the outer upper and lower portions of the pair of platens 110 disposed with the substrate 1 in between, a pair of recovery platens 128, disposed parallel to each platen 110 of the pair of platens 110, may be respectively disposed.
In other words, the pair of platens 110 including the polishing pad 120 are positioned close to the substrate 1, and each recovery platen 128 is positioned close to each platen 110 rather than the substrate 1, so that each platen 110 including the polishing pad 120 may be disposed between each recovery platen 128 and the substrate 1.
FIG. 9B shows the platen 110 and the polishing pad 120 disposed on the lower portion of the substrate 1 in FIG. 9A, with the polishing pad 120 protruding from the platen 110 contacting with the substrate 1 to be disposed on the upper portion, and the recovery platen 128 may be disposed on the lower portion of the platen 110.
FIG. 9C shows the upper surface of the platen 110 in FIG. 9B, and FIG. 9D shows the lower surface of the recovery platen 128 in FIG. 9B. As shown, the recovery platen 128 also includes the polishing pad 120, which will be described in detail in FIG. 10.
As shown in FIGS. 9B-9D, each polishing pad 120 is disposed on the pair of platens 110 and the pair of recovery platens 128 has a long extending band shape and may be in the form of a ribbon. A plurality of polishing pads 120 may be disposed along the ring shape of each platen 110 and recovery platen 128.
FIG. 10A shows the same pair of platens 110 and the pair of recovery platens 128 as in FIG. 9B, and FIG. 10B is an enlarged view of the cross-section of the platen 110 and the recovery platen 128 disposed on the lower portion of the substrate 1 in FIG. 10A, as in the enlarged view in FIG. 9B.
That is, FIG. 10B is an enlarged view of any one polishing pad 120 among the plurality of polishing pads 120, with the platen 110 disposed on the upper portion and the recovery platen 128 disposed on the lower portion.
Looking at the polishing pad 120 disposed on the platen 110 in FIG. 10B, the platen 110 may include a plurality of tape supports 126 that are built into the platen 110 and rotate around the length direction as an axis. Specifically, the plurality of tape supports 126 built into the platen 110 may rotate on an axis disposed in parallel within the platen 110.
Additionally, the polishing pad 120 may include a plurality of tape portions 127 that surround the tape support 126 and have a portion of the tape portions protruding from at least one of the upper and lower surfaces of the platen 110.
FIG. 10B shows the platen 110 disposed on the lower portion of the substrate 1, and shows the tape portion 127 protruding from the upper surface of the platen 110. In the case of the platen 110 disposed on the upper portion of the substrate 1, the tape portion 127 may protrude from the lower surface of the platen 110.
In the platen 110 shown in FIG. 10B, the tape portion 127 protruding from the upper surface of the platen 110 is in contact with the substrate 1 disposed on the upper portion, and polishes the bevel region of the substrate 1.
The tape portion 127 protruding from the lower surface of the platen 110 may be connected to the recovery platen 128 disposed on the lower portion of the platen 110.
The tape portion 127 wound around the tape support 126 may be released from the tape support 126 by rotation of the tape support 126 built in the platen 110. The recovery platen 128 may include a recovery portion 129 that recovers the unwound tape portion 127.
The recovery portion 129 is built into the recovery platen 128 and has a structure capable of rotating along the length of the recovery portion 129. Specifically, the recovery portion 129 built inside the recovery platen 128 may rotate on an axis disposed parallel to the inside of the recovery platen 128.
The recovery portion 129 may recover the used tape portion 127 according to the rotation of the recovery portion 129.
Although not shown, the rotation of the tape support 126 and the recovery portion 129 may be operated through a rotation driver (not shown). The rotation driver may be disposed inside the platen 110 and the recovery platen 128, respectively. However, the placement position of the rotation driver is not limited to a specific position.
FIG. 10C is a diagram showing a cross-section of the tape portion 127 of FIG. 10B. The tape portion 127 disposed on the upper portion is formed to surround the tape support 126 and polishes the bevel region of the substrate 1 to be disposed on the platen 110. The tape portion 127 disposed on the lower portion, formed to surround the recovery portion 129 and recovered to the recovery portion 129, represents the used tape portion 127 after polishing the bevel of the substrate 1 on the upper portion.
When using the substrate polishing module 100 including the polishing pad 120 including the tape portion 127 shown in FIGS. 9 and 10, it has the effect of increasing the lifetime of the polishing pad 120, compared to the substrate polishing module 100 shown in FIGS. 1 to 8.
FIG. 11 is a diagram illustrating the configuration of a substrate polishing device according to at least one embodiment.
As shown in FIG. 11, the substrate polishing device 10 according to the present disclosure may include a chuck plate 200 for seating the substrate 1, a chuck shaft 300 disposed on lower portion of the chuck plate 200 to support and rotate the chuck plate 200, a controller 400 configured to control the operations of, at least, the substrate polishing module 100, and the substrate polishing module 100 disposed on upper and lower portions of the substrate 1 to polish the bevel of the substrate 1. The controller 400 may be configured to control, e.g., the position of the platen 110, the speed of rotation, the duration of the polishing, etc., and may be implemented with processing circuitry including hardware, software, or a combination of hardware and software. For example, the processing circuitry more specifically may include, but is not limited to, a central processing unit (CPU), a neural processing unit (NPU), a graphics processing unit (GPU), an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a System-on-Chip (SoC), a programmable logic unit, a microprocessor, application-specific integrated circuit (ASIC), etc.
As such the controller 400 may communicate with any or all other elements described with reference to FIG. 11. For example, controller 400 may engage in one-way and/or two-way and/or broadcast communication with the substrate polishing module 100 and/or the chuck shaft 300, a transfer arm (not illustrated), etc. to transfer and/or exchange and/or receive information such as but not limited to data and/or commands, in a manner such as in a serial and/or parallel manner, via a bus such as a wireless and/or a wired bus (not illustrated). The information may be in encoded various formats, such as in an analog format and/or in a digital format.”
Here, the substrate polishing module 100 is the substrate polishing module 100 described in FIGS. 1A-6D and/or 9A-10C, and may include the pair of ring-shaped platens 110 disposed along the circumference of the substrate 1, respectively on the upper and lower portions of the substrate 1, the polishing pad 120 disposed on each of the pair of platens 110, contacting the upper and lower surfaces of the substrate 1 and polishing the bevel of the substrate 1, and the driver 140 that rotates each of the platens.
Depending on the embodiments, the polishing pad 120 may include the plurality of roll pad supports 122 disposed inside each platen 110 and the plurality of roll pads 124 surrounding each roll pad support 122.
For example, the plurality of roll pad supports 122 are built into each platen 110 and may rotate on an axis disposed in parallel in each platen 110. The plurality of roll pads 124, each surrounding the plurality of roll pad supports 122, may have a portion protruding from the upper and lower surfaces of the platen 110.
The roll pad 124 may include the polishing portion 130 that contacts the substrate 1 and polishes the bevel of the substrate 1, and the adhesive portion 132 disposed between the roll pad support 122 and the polishing portion 130 to adhere the roll pad support 122 and the polishing portion 130.
The polishing portion 130 in the substrate polishing device 10 according to FIG. 11 includes the abrasive A, and the substrate polishing module 100 may further include the conditioning portion 150 for conditioning the polishing portion 130.
The conditioning portion 150 may further include the conditioning body 152 disposed on the outer upper and lower portions of each of the platens 110 disposed on the upper and lower portions of the substrate 1 and facing the polishing pad 120, the conditioning pad 154 fixed to the conditioning body 152 and in contact with the polishing pad 120, and the body support 156 supporting the conditioning body 152.
According to the embodiment, the body support 156 may move up and down independently, allowing each of the conditioning bodies 152 to move up and down.
According to at least one embodiment, the conditioning body 152 may have a ring shape, and in this case, a plurality of conditioning pads 154 may be disposed along the conditioning body 152.
FIG. 12 is a diagram illustrating the configuration of a substrate polishing device according to at least one embodiment.
As shown in FIG. 12, the substrate polishing device 10 according to the present disclosure may include the chuck plate 200 for seating the substrate 1, the chuck shaft 300 disposed on lower portion of the chuck plate 200 to support and rotate the chuck plate 200, and the substrate polishing module 100 disposed on upper and lower portions of the substrate 1 to polish the bevel of the substrate 1.
The substrate polishing module 100 herein is the substrate polishing module 100 described in FIGS. 7A-8, and may include the pair of ring-shaped platens 110 disposed along the circumference of the substrate 1, respectively on the upper and lower portions of the substrate 1, and the polishing pad 120 disposed on each of the pair of platens 110, contacting the upper and lower surfaces of the substrate 1 and polishing the bevel of the substrate 1. Specifically, the polishing pad 120 may be attached to the surface of each platen 110 facing the substrate 1 along the ring shape of each platen 110.
In addition, the polishing pad 120 may include the driver 140 configured to move each platen 110 up and down and rotating each platen 110 on the substrate 1.
The polishing pad 120 in the substrate polishing device 10 according to FIG. 12 may include the polishing portion 130 that contacts the substrate 1 and polishes the bevel of the substrate 1, and the adhesive portion 132 that adheres the polishing portion 130 to each platen 110.
The polishing portion 130 may further include the slurry portion 160 that supplies slurry L towards the substrate 1 to polish the bevel of the substrate 1 using the polishing pad 120 formed of polyurethane.
FIGS. 13A-13C are a diagram illustrating the substrate polishing method according to at least one embodiment. FIG. 13D is a flowchart illustrating the substrate polish method.
As shown in FIGS. 13A-13C, the substrate 1 polishing method using the substrate polishing device 10 according to the present disclosure may include, seating the substrate 1 on the chuck plate 200 (S100), disposing a pair of ring-shaped platens 110 along the circumference of the substrate 1, such that the pair of ring-shaped platens 110 are respectively on the upper and lower portions of the substrate 1, and such that the polishing pads 120 disposed on each of the pair of platens 110 contact with the substrate 1 (S200), and rotating the pair of ring-shaped platens 110 relative to the substrate 1 (S300). For example, the driver 140 may rotate each of the platens 110, and/or the chuck shaft 300 may rotate the chuck plate 200, as shown in FIGS. 13A and 13B.
FIG. 13A-D are for describing the structure of the platen 110, and although not shown, the driver 140 is connected to the platen 110 in the substrate polishing module 100 according to the present disclosure, and the platen 110 is rotatable by the driver 140.
The substrate polishing module 100 in FIGS. 13A-13C corresponds to the substrate polishing module 100 according to the embodiment in FIGS. 1, 2, 9, and 10. Accordingly, the polishing portion 130, which contacts the bevel of the substrate 1 and polishes the bevel of the substrate 1, and the tape portion 127, are structured to partially protrude from at least a portion of the upper and lower surfaces of each platen 110, and the polishing portion 130 and the tape portion 127 include the abrasive A.
Accordingly, as shown in FIG. 13C, the conditioning pad 154 conditions the polishing pad 120 positioned on the upper and lower portions of the substrate 1, may be further included.
The conditioning pad 154 conditions the polishing pad 120 positioned on the upper and lower portions of the substrate 1, may further include the conditioning pad 154 disposed on the outer upper and lower portions of each of the platens 110 move toward the polishing pad 120, and the conditioning pad 154 fixed to the conditioning body 152 conditions the polishing pad 120 by contacting with the polishing pad 120.
FIGS. 14A-14B are a diagram illustrating a substrate polishing method according to at least one embodiment.
The substrate 1 polishing method using the substrate polishing device 10 according to the present disclosure may include, the driver 140 rotates each of the platens 110, and/or the chuck shaft 300 rotates the chuck plate 200, as shown in FIGS. 14A, after seating the substrate 1 on the chuck plate 200, and a pair of ring-shaped platens 110 disposed along the circumference of the substrate 1, respectively on the upper and lower portions of the substrate 1, move close to the upper and lower surfaces of the substrate 1, and the polishing pads 120 disposed on each of the pair of platens 110 contact with the substrate 1.
FIG. 14 is for describing the structure of the platen 110, and although not shown, the driver 140 may be connected to the platen 110 in the substrate polishing module 100 according to the present disclosure, and the platen 110 is rotatable by the driver 140.
The substrate polishing module 100 in FIGS. 14A and 14B uses the substrate polishing device 10 according to the embodiment in FIG. 7, wherein the polishing portion 130 that contacts with the bevel of the substrate 1 to polish the bevel of the substrate 1 includes polyurethane.
Accordingly, as shown in FIG. 14B, supplying a slurry L, e.g., through the slurry portion 160 configure to supply the slurry L toward the substrate 1, may be further included.
While this disclosure has been described in connection with what is presently considered to be practical embodiments, it is to be understood that the disclosure is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
Patent Application
20250214195
