SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Information

  • Patent Application
  • 20070175387
  • Publication Number
    20070175387
  • Date Filed
    January 30, 2007
    18 years ago
  • Date Published
    August 02, 2007
    17 years ago
Abstract
A substrate processing apparatus of the present invention comprises a cooling mechanism for cooling a processing solution and a filter for removing impurities contained in the processing solution, at some midpoint in a circulation path of the processing solution. With this constitution, the substrate processing apparatus can precipitate the impurities dissolved in the processing solution and remove the precipitated impurities. It therefore becomes possible to maintain the performance of the processing solution and reuse the processing solution. Further, the frequency of changing the processing solution to a new solution decreases, and this causes an increase in availability of the substrate processing apparatus and a decrease in consumption and drainage of the processing solution.
Description

BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a view showing a constitution of a substrate processing apparatus in accordance with a first preferred embodiment;



FIG. 2 is a block diagram showing an electric connection between a control part and constituent elements in accordance with the first preferred embodiment;



FIG. 3 is a flowchart showing an operation flow of the substrate processing apparatus in accordance with the first preferred embodiment;



FIG. 4 is a flowchart showing a detailed operation flow for cleaning a filter in accordance with the first preferred embodiment;



FIG. 5 is a flowchart showing an operation flow of the substrate processing apparatus in accordance with the first preferred embodiment;



FIG. 6 is a view showing a constitution of a substrate processing apparatus in accordance with a second preferred embodiment;



FIG. 7 is a block diagram showing an electric connection between the control part and the constituent elements in accordance with the second preferred embodiment;



FIG. 8 is a flowchart showing an operation flow of the substrate processing apparatus in accordance with the second preferred embodiment;



FIG. 9 is a flowchart showing a detailed operation flow for discharging impurities in accordance with the second preferred embodiment;



FIG. 10 is a flowchart showing an operation flow of the substrate processing apparatus in accordance with the second preferred embodiment; and



FIG. 11 is a view showing a general constitution of a substrate processing apparatus of the background art.


Claims
  • 1. A substrate processing apparatus for processing a substrate with a processing solution, comprising: a processing bath for accommodating a substrate and pooling a processing solution therein;a circulation path for supplying a processing solution discharged from said processing bath to said processing bath again;cooling part for cooling a processing solution at some midpoint in said circulation path; andimpurity removing part for removing impurities contained in a processing solution on the downstream side of said cooling part at some midpoint in said circulation path.
  • 2. The substrate processing apparatus according to claim 1, further comprising heating part for heating a processing solution on the downstream side of said impurity removing part at some midpoint in said circulation path.
  • 3. The substrate processing apparatus according to claim 2, wherein said processing bath comprises an inside bath for accommodating a substrate and processing the substrate and an outside bath provided at an upper portion outside said inside bath, for receiving a processing solution which overflows from said inside bath, andsaid circulation path supplies a processing solution discharged from said outside bath to said inside bath again.
  • 4. The substrate processing apparatus according to claim 2, wherein said circulation path supplies a processing solution discharged from a bottom of said processing bath to said processing bath again.
  • 5. The substrate processing apparatus according to claim 2, wherein said circulation path comprises a first circulation path and a second circulation path, andsaid impurity removing part is provided in each of said first circulation path and said second circulation path,said substrate processing apparatus further comprisingcirculation path switching part for switching between said first circulation path and said second circulation path.
  • 6. The substrate processing apparatus according to claim 5, wherein said impurity removing part comprises a filter for filtering impurities in a processing solution,said substrate processing apparatus further comprisingfilter cleaning part for cleaning said filter.
  • 7. The substrate processing apparatus according to claim 6, wherein said filter cleaning part comprises filter cleaning solution supply part for supplying a filter cleaning solution which dissolves impurities to said filter.
  • 8. The substrate processing apparatus according to claim 7, further comprising: a drainage path which branches out from said circulation path on the downstream side of said filter at some midpoint in said circulation path; anddrainage switching part for switching between said circulation path and said drainage path.
  • 9. The substrate processing apparatus according to claim 8, further comprising processing solution supply part for supplying a processing solution on the upstream side of said filter at some midpoint in said circulation path.
  • 10. The substrate processing apparatus according to claim 2, further comprising a processing solution pooling bath for pooling a processing solution therein on the downstream side of said impurity removing part at some midpoint in said circulation path,wherein said heating part heats the processing solution pooled in said processing solution pooling bath.
  • 11. A substrate processing apparatus for processing a substrate with a processing solution, comprising: a processing bath for accommodating a substrate and pooling a processing solution therein;a circulation path for supplying a processing solution discharged from said processing bath to said processing bath again;a cooling bath for pooling a processing solution and cooling the processing solution at some midpoint in said circulation path; anddischarge part for discharging impurities settled in said cooling bath from said cooling bath.
  • 12. The substrate processing apparatus according to claim 11, further comprising a circulation mechanism for drawing a supernatant fluid of a processing solution pooled in said cooling bath and supplying the processing solution toward the downstream of a circulation path.
  • 13. The substrate processing apparatus according to claim 12, further comprising heating part for heating a processing solution on the downstream side of said cooling bath at some midpoint in said circulation path.
  • 14. The substrate processing apparatus according to claim 13, wherein said processing bath comprises an inside bath for accommodating a substrate and processing the substrate and an outside bath provided at an upper portion outside said inside bath, for receiving a processing solution which overflows from said inside bath, andsaid circulation path supplies a processing solution discharged from said outside bath to said inside bath again.
  • 15. The substrate processing apparatus according to claim 13, wherein said circulation path supplies a processing solution discharged from a bottom of said processing bath to said processing bath again.
  • 16. The substrate processing apparatus according to claim 13, wherein said circulation path comprises a first circulation path and a second circulation path, andsaid cooling bath is provided in each of said first circulation path and said second circulation path,said substrate processing apparatus further comprisingcirculation path switching part for switching between said first circulation path and said second circulation path.
  • 17. The substrate processing apparatus according to claim 16, further comprising a filter for filtering impurities in a processing solution on the downstream side of said cooling bath in said circulation path.
  • 18. The substrate processing apparatus according to claim 17, further comprising processing solution supply part for supplying a processing solution on the upstream side of said cooling bath at some midpoint in said circulation path.
  • 19. The substrate processing apparatus according to claim 13, further comprising a processing solution pooling bath for pooling a processing solution therein on the downstream side of said cooling bath at some midpoint in said circulation path,wherein said heating part heats the processing solution pooled in said processing solution pooling bath.
  • 20. A substrate processing method for processing a substrate with a processing solution, comprising the steps of: a) pooling a processing solution in a processing bath; andb) supplying a processing solution discharged from said processing bath to said processing bath again,wherein said step b) includesb-1) a cooling step of cooling a processing solution in mid-course of circulation; andb-2) an impurity removing step of removing impurities contained in a processing solution.
Priority Claims (2)
Number Date Country Kind
JP2006-020388 Jan 2006 JP national
JP2006-020412 Jan 2006 JP national