Patent Application
20240128111
This application claims the benefit of Korean Patent Application No. 10-2022-0131691, filed on Oct. 13, 2022, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.
The present invention relates to a substrate processing apparatus and substrate processing method and, more particularly, to a substrate processing apparatus and substrate processing method capable of increasing utilization of equipment and minimizing a footprint of the equipment because the function of a dual loader is performed with one load port module by using an embedded dual adaptor.
In general, prober equipment for performing an electrical test process on substrates such as wafers may include, for example, a load port module loaded with a carrier such as a cassette, a front opening unified pod (FOUP), or a front opening shipping box (FOSB), a transfer robot for transferring substrates from the load port module, and a test module for performing an electrical test process on the transferred substrates by using a probe card having a plurality of probes.
The existing prober equipment is operated using a so-called come back home method by which first substrates, which were stored in a first carrier loaded onto the load port module, are returned to the first carrier after the test is completed.
However, according to the come-back-home prober equipment, because the carrier must stay on the load port module until the substrates, which were originally stored in the carrier, are returned to the carrier, severe carrier congestion may occur and thus productivity may be greatly reduced. Even when a so-called dual loader including two or more load port modules to load two or more carriers is used to solve the above problem, many other problems may be caused. For example, a footprint of equipment may be increased, a cost may be significantly increased due to installation of additional load port modules, the number of carriers used may be greatly increased, and an internal transfer path, i.e., a loading and unloading path, of the substrates may be very complicated.
The present invention provides a substrate processing apparatus and substrate processing method capable of increasing utilization of equipment and minimizing a footprint of the equipment because substrates are returned to a next carrier other than a carrier where the substrates were originally stored, and the function of a dual loader is performed with one load port module by using an embedded dual adaptor. However, the above description is merely an example, and the scope of the present invention is not limited thereto.
According to an aspect of the present invention, there is provided a substrate processing apparatus including a load port module loaded with a first carrier in which first substrates are stored, a transfer robot for transferring the first substrates from the first carrier, a first adaptor region for temporarily storing the first substrates transferred by the transfer robot, a second adaptor region for temporarily storing second substrates transferred by the transfer robot from a second carrier loaded onto the load port module, after the first carrier is unloaded from the load port module, and a controller for applying a first substrate transfer control signal to the transfer robot to store the first substrates, which were temporarily stored in the first adaptor region and on which a process is completed, in the empty second carrier.
The controller may apply a third substrate transfer control signal to the transfer robot to transfer third substrates from a third carrier loaded onto the load port module, to the empty first adaptor region after the second carrier is unloaded from the load port module.
The controller may apply a second substrate transfer control signal to the transfer robot to store the second substrates, which were temporarily stored in the second adaptor region and on which a process is completed, in the empty third carrier.
The controller may apply a second substrate transfer control signal to the transfer robot to transfer the second substrates, which were temporarily stored in the second adaptor region and on which a process is completed, to the first carrier after the second carrier is unloaded from the load port module and the empty first carrier is loaded again.
The load port module may be a single load port module loaded with only one carrier at a time to reduce a footprint of equipment.
The transfer robot may be lifted or lowered from a height of the first carrier seated on the load port module to a height of the first adaptor region or a height of the second adaptor region.
The first and second adaptor regions may be disposed in a vertical direction to reduce a footprint of equipment.
The substrate processing apparatus may further include a test module for performing an electrical test process on the substrates by using a probe card having a plurality of probes.
The transfer robot may transfer the first substrates stored in the first adaptor region, to the test module and store the first substrates, on which a test process is completed, back in the first adaptor region, or transfer the second substrates stored in the second adaptor region, to the test module and store the second substrates, on which a test process is completed, back in the second adaptor region.
The first or second substrates may be wafers, and the first or second carrier may include at least one of a cassette, a front opening unified pod (FOUP), and a front opening shipping box (FOSB).
The first adaptor region may store a number of substrates greater than or equal to a maximum number of first substrates stored in the first carrier.
The first adaptor region may be rotated by a rotating device or lifted by a lifting device.
According to another aspect of the present invention, there is provided a substrate processing method including (a) primarily loading a first carrier in which first substrates are stored, onto a load port module, (b) transferring, by a transfer robot, the first substrates from the first carrier to a first adaptor region, (c) unloading the first carrier from the load port module, (d) secondarily loading a second carrier in which second substrates are stored, onto the load port module, (e) transferring, by the transfer robot, the second substrates from the second carrier to a second adaptor region, and (f) transferring, by the transfer robot, the first substrates of the first adaptor region, on which a process is completed, to the empty second carrier.
The substrate processing method may further include (g) unloading the second carrier from the load port module, (h) tertiarily loading a third carrier in which third substrates are stored, onto the load port module, and (i) transferring, by the transfer robot, the third substrates from the third carrier to the empty first adaptor region, after step (f).
The substrate processing method may further include (j) transferring, by the transfer robot, the second substrates of the second adaptor region, on which a process is completed, to the empty third carrier, after step (i).
The substrate processing method may further include (k) unloading the second carrier from the load port module, (l) loading the empty first carrier onto the load port module again, and (m) transferring, by the transfer robot, the second substrates of the second adaptor region, on which a process is completed, to the first carrier, after step (f).
In step (b), the transfer robot may be lifted or lowered from a height of the first carrier seated on the load port module to a height of the first adaptor region and, in step (e), the transfer robot may be lifted or lowered from a height of the second carrier seated on the load port module to a height of the second adaptor region.
The substrate processing method may further include (n) performing, by a test module, an electrical test process on the first substrates of the first adaptor region by using a probe card having a plurality of probes, after step (b).
In step (n), the transfer robot may transfer the first substrates stored in the first adaptor region, to the test module and store the first substrates, on which a test process is completed, back in the first adaptor region.
According to another aspect of the present invention, there is provided a substrate processing apparatus including a load port module loaded with a first carrier in which first substrates are stored, a transfer robot for transferring the first substrates from the first carrier, a first adaptor region for temporarily storing the first substrates transferred by the transfer robot, a second adaptor region for temporarily storing second substrates transferred by the transfer robot from a second carrier loaded onto the load port module, after the first carrier is unloaded from the load port module, and a controller for applying a first substrate transfer control signal to the transfer robot to store the first substrates, which were temporarily stored in the first adaptor region and on which a process is completed, in the empty second carrier, wherein the controller applies a third substrate transfer control signal to the transfer robot to transfer third substrates from a third carrier loaded onto the load port module, to the empty first adaptor region after the second carrier is unloaded from the load port module, and applies a second substrate transfer control signal to the transfer robot to store the second substrates, which were temporarily stored in the second adaptor region and on which a process is completed, in the empty third carrier, or applies a second substrate transfer control signal to the transfer robot to transfer the second substrates, which were temporarily stored in the second adaptor region and on which a process is completed, to the first carrier after the second carrier is unloaded from the load port module and the empty first carrier is loaded again.
The above and other features and advantages of the present invention will become more apparent by describing in detail embodiments thereof with reference to the attached drawings in which:
Hereinafter, the present invention will be described in detail by explaining embodiments of the invention with reference to the attached drawings.
The invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to one of ordinary skill in the art. In the drawings, the thicknesses or sizes of layers are exaggerated for clarity and convenience of explanation.
The terminology used herein is for the purpose of describing particular embodiments and is not intended to limit the invention. As used herein, the singular forms “a”, “an”, and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising”, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Embodiments of the invention are described herein with reference to schematic illustrations of idealized embodiments (and intermediate structures) of the invention. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the embodiments of the invention should not be construed as limited to the particular shapes of regions illustrated herein, but are to include deviations in shapes that result, for example, from manufacturing.
Initially, as shown in
For example, the load port module 10 may be a module onto which a first carrier C1 in which first substrates W1 are stored is primarily loaded, and be provided with a load port stage corresponding to a bottom surface of the first carrier C1, and a shutter corresponding to an openable front surface of the first carrier C1.
Specifically, for example, the load port module 10 may be a single load port module loaded with only one carrier at a time to reduce a footprint of equipment.
However, the load port module 10 is not limited to the single load port module and may also use a dual or multi load port module.
Therefore, carriers storing substrates may be loaded onto and unloaded from the apparatus one by one by using the load port module 10.
For example, the transfer robot 20 may be a kind of transfer device capable of transferring the first substrates W1 from the first carrier C1 to the dual adaptor or the test module 40, and be mounted between the load port module 10 and the dual adaptor or between the load port module 10 and the test module 40.
The transfer robot 20 is not limited to the illustration and may use any of various types of robots or transfer devices capable of lifting a substrate from a bottom surface and transferring the same to a desired place by using a transfer arm or the like.
For example, the dual adaptor may be a kind of buffer or stage structure inside the apparatus, which has a capacity to store all substrates which were stored in two or more carriers.
For example, when up to 25 substrates are stored in each carrier, the dual adaptor may have a capacity to store 50 substrates or more.
Specifically, the dual adaptor may include a first adaptor region A primarily temporarily storing the first substrates W1 transferred by the transfer robot 20, and a second adaptor region B secondarily temporarily storing second substrates W2 transferred by the transfer robot 20 from a second carrier C2 secondarily loaded onto the load port module 10 after the first carrier C1 is unloaded from the load port module 10.
Herein, the first and second adaptor regions A and B may be integrally provided in one body or mounted in separate bodies, and be rotated by a rotating device 50 or lifted by a lifting device 60 separately or together.
For example, the first adaptor region A may store a number of substrates greater than or equal to the maximum number of first substrates W1 stored in the first carrier C1, and the second adaptor region B may store a number of substrates greater than or equal to the maximum number of second substrates W2 stored in the second carrier C2. For example, when up to 25 substrates are stored in each carrier, the first adaptor region A may have a capacity to store 25 substrates or more and the second adaptor region B may also have a capacity to store 25 substrates or more.
Therefore, when the dual adaptor is used, after all the first substrates W1 which were stored in the first carrier C1 loaded onto the load port module 10 are transferred to the first adaptor region A, the first carrier C1 may be unloaded from the load port module 10, and then the second carrier C2 may be loaded onto the load port module and all the second substrates W2 which were stored in the second carrier C2 may be transferred to the second adaptor region B.
For example, the controller 30 may be any of various control devices (e.g., a control circuit, a control board, an arithmetic unit, a central processing unit, a program-installed storage device, a microprocessor, an integrated circuit, a semiconductor chip, an electronic component, a control panel, an electronic communication terminal, a smartphone, a smart pad, a computer, a server computer, and a smart device) capable of applying control signals to and controlling the load port module 10, the transfer robot 20, the dual adaptor, and the test module 40.
Specifically, for example, the controller 30 may apply a first substrate transfer control signal to the transfer robot 20 to store the first substrates W1, which were temporarily stored in the first adaptor region A and on which a process is completed, in the empty second carrier C2.
For example, the controller 30 may apply a third substrate transfer control signal to the transfer robot 20 to transfer third substrates W3 from a third carrier C3 tertiarily loaded onto the load port module 10, to the empty first adaptor region A after the second carrier C2 is unloaded from the load port module 10.
For example, the controller 30 may apply a second substrate transfer control signal to the transfer robot 20 to store the second substrates W2, which were temporarily stored in the second adaptor region B and on which a process is completed, in the empty third carrier C3.
For example, the controller 30 may apply a second substrate transfer control signal to the transfer robot 20 to transfer the second substrates W2, which were temporarily stored in the second adaptor region B and on which a process is completed, to the first carrier C1 after the second carrier C2 is unloaded from the load port module and the empty first carrier C1 is loaded again.
The transfer robot 20 controlled by the controller 30 may be lifted or lowered from a height of the first carrier C1 seated on the load port module 10 to a height of the first adaptor region A or a height of the second adaptor region B.
Herein, the first and second adaptor regions A and B may be disposed in a vertical direction to reduce a footprint of equipment.
Meanwhile, for example, the test module 40 may be a test device for performing an electrical test process on the substrates by using a probe card 42 having a plurality of probes 41.
Therefore, the transfer robot 20 may transfer the first substrates W1 stored in the first adaptor region A, to the test module 40 and store the first substrates W1, on which a test process is completed, back in the first adaptor region A, or transfer the second substrates W2 stored in the second adaptor region B, to the test module 40 and store the second substrates W2, on which a test process is completed, back in the second adaptor region B.
Herein, for example, the first, second, and third substrates W1, W2, and W3 may be wafers, and the first, second, and third carriers C1, C2, and C3 may include at least one of cassettes, front opening unified pods (FOUPs), and front opening shipping boxes (FOSBs).
The operation of the substrate processing apparatus 100 according to some embodiments of the present invention will now be described in detail step by step with reference to
In this case, both the first and second adaptor regions A and B may be empty.
Then, as shown in
In this case, the transfer robot 20 may be lifted or lowered from a height of the first carrier C1 seated on the load port module 10 to a height of the first adaptor region A to transfer the first substrates W1.
Herein, although the first adaptor region A is mounted at an upper side and the second adaptor region B is mounted at a lower side in the drawings, the first and second adaptor regions A and B are not limited to thereto and may be mounted in various ways. For example, the first adaptor region A may be mounted at a lower side and the second adaptor region B may be mounted at an upper side.
At this time, as shown in
Then, as shown in
Then, as shown in
In this case, the transfer robot 20 may be lifted or lowered from a height of the second carrier C2 seated on the load port module 10 to a height of the second adaptor region B to transfer the second substrates W2.
At this time, as shown in
Herein, the transfer robot 20 may transfer the first substrates W1 stored in the first adaptor region A, to the test module 40 and store the first substrates W1, on which a test process is completed, back in the first adaptor region A.
Then, as shown in
That is, the first substrates W1 on which a test is completed may not come back home to the first carrier C1 where they were originally stored, but stored in the new second carrier C2 instead.
Then, as shown in
Then, as shown in
Then, as shown in
Therefore, although the initial first carrier C1 may be empty, the first substrates W1 may be ultimately stored in the second carrier C2 and the second substrates W2 may be ultimately stored in the third carrier C3, and the above-described procedure may be repeated in a subsequent process.
Meanwhile, when a carrier size and a substrate size need to be matched, as shown in
As such, the transfer robot 20 may transfer the second substrates W2 of the second adaptor region B, on which a process is completed, to the first carrier C1.
That is, in this case, the second substrates W2 may be ultimately stored in the first carrier C1 and the first substrates W1 may be ultimately stored in the second carrier C2.
Therefore, according to the present invention, because substrates are returned to a next carrier other than a carrier where the substrates were originally stored, and the function of a dual loader is performed with one load port module 10 by using an embedded dual adaptor, utilization of equipment may be increased, a footprint of the equipment may be minimized, carrier congestion may be prevented to greatly increase productivity, waste of cost due to installation of additional modules may be prevented, the number of carriers used may be reduced, and an internal transfer path, i.e., a loading and unloading path, of the substrates may be simplified.
As shown in
Herein, for example, in step (b), the transfer robot 20 may be lifted or lowered from a height of the first carrier C1 seated on the load port module 10 to a height of the first adaptor region A and, in step (e), the transfer robot 20 may be lifted or lowered from a height of the second carrier C2 seated on the load port module 10 to a height of the second adaptor region B.
For example, in step (n), the transfer robot 20 may transfer the first substrates W1 stored in the first adaptor region A, to the test module 40 and store the first substrates W1, on which a test process is completed, back in the first adaptor region A.
As shown in
As shown in
Then, it may be determined whether the wafers are the first wafers in the first adaptor A (S103). When the wafers are not the first wafers, it may be determined whether all wafers are transferred to the first adaptor A (S104). When the wafers are the first wafers, a process (test) may be performed on a stage (or test module) (S105). When all wafers are transferred, the transfer of the wafers (or first substrates) in the cassette 1 (or first carrier) may be terminated (S106).
Thereafter, the cassette 1 (or first carrier) may be unloaded and then a cassette 2 (or second carrier) may be loaded (S107), and wafers (or second substrates) in the cassette 2 may be transferred to a second adaptor B (or second adaptor region) (S108).
Then, it may be determined whether all wafers (or second substrates) in the cassette 2 (or second carrier) are transferred to the second adaptor B (S109), and the transfer of the wafers (or second substrates) in the cassette 2 (or second carrier) may be terminated (S110).
Then, the wafers (or first substrates) of the first adaptor A, on which a test is completed, may be transferred to the cassette 2 (or second carrier) (S111).
Subsequently, it may be determined whether all wafers (or first substrates) in the first adaptor A are transferred to the cassette 2 (or second carrier) (S112), and the transfer to the cassette 2 (or second carrier) may be terminated and then the cassette 2 (or second carrier) may be unloaded (S113).
Thereafter, the cassette 2 (or second carrier) may be unloaded and then a cassette 3 (or third carrier) may be loaded (S114), and wafers (or third substrates) in the cassette 3 may be transferred to the first adaptor A (S115).
Then, it may be determined whether all wafers (or third substrates) in the cassette 3 (or third carrier) are transferred to the first adaptor A (S116), and the transfer of the wafers (or third substrates) in the cassette 3 (or third carrier) may be terminated (S117).
Then, the wafers (or second substrates) of the second adaptor B, on which a test is completed, may be transferred to the cassette 3 (or third carrier) (S118).
Subsequently, it may be determined whether all wafers (or second substrates) in the second adaptor B are transferred to the cassette 3 (or third carrier) (S119), and the transfer to the cassette 3 (or third carrier) may be terminated and then the cassette 3 (or third carrier) may be unloaded (S120).
Then, the above-described procedure may be repeated to a cassette n (S121) and terminated when a lot end event occurs (S122).
As shown in
Then, it may be determined whether the wafers are the first wafers in the first adaptor A (S203). When the wafers are not the first wafers, it may be determined whether all wafers are transferred to the first adaptor A (S204). When the wafers are the first wafers, a process (test) may be performed on a stage (or test module) (S205). When all wafers are transferred, the transfer of the wafers (or first substrates) in the cassette 1 (or first carrier) may be terminated (S206).
Thereafter, the cassette 1 (or first carrier) may be unloaded and then a cassette 2 (or second carrier) may be loaded (S207), and wafers (or second substrates) in the cassette 2 may be transferred to a second adaptor B (or second adaptor region) (S208).
Then, it may be determined whether all wafers (or second substrates) in the cassette 2 (or second carrier) are transferred to the second adaptor B (S209), and the transfer of the wafers (or second substrates) in the cassette 2 (or second carrier) may be terminated (S210).
Then, the cassette 2 (or second carrier) may be unloaded (S211).
Then, the cassette 1 (or first carrier) may be loaded again (S212), and the wafers (or first substrates) of the first adaptor A, on which a test is completed, may be transferred to the cassette 1 (or first carrier) (S213).
Subsequently, it may be determined whether all wafers (or first substrates) in the first adaptor A are transferred to the cassette 1 (or first carrier) (S214), and the transfer to the cassette 1 (or first carrier) may be terminated and then the cassette 1 (or first carrier) may be unloaded (S215).
Thereafter, the cassette 1 (or first carrier) may be unloaded and then a cassette 3 (or third carrier) may be loaded (S216), and wafers (or third substrates) in the cassette 3 may be transferred to the first adaptor A (S217).
Then, it may be determined whether all wafers (or third substrates) in the cassette 3 (or third carrier) are transferred to the first adaptor A (S218), and the transfer of the wafers (or third substrates) in the cassette 3 (or third carrier) may be terminated (S219).
Then, the cassette 3 (or third carrier) may be unloaded (S220).
Then, the cassette 2 (or second carrier) may be loaded again (S221), and the wafers (or second substrates) of the second adaptor B, on which a test is completed, may be transferred to the cassette 2 (or second carrier) (S222).
Subsequently, it may be determined whether all wafers (or second substrates) in the second adaptor B are transferred to the cassette 2 (or second carrier) (S223), and the transfer to the cassette 2 (or second carrier) may be terminated and then the cassette 2 (or second carrier) may be unloaded (S224).
Then, the above-described procedure may be repeated to a cassette n (S225) and terminated when a lot end event occurs (S226).
According to the afore-described embodiments of the present invention, because substrates are returned to a next carrier other than a carrier where the substrates were originally stored, and the function of a dual loader is performed with one load port module by using an embedded dual adaptor, utilization of equipment may be increased, a footprint of the equipment may be minimized, carrier congestion may be prevented to greatly increase productivity, waste of cost due to installation of additional modules may be prevented, the number of carriers used may be reduced, and an internal transfer path, i.e., a loading and unloading path, of the substrates may be simplified. However, the scope of the present invention is not limited to the above effects.
While the present invention has been particularly shown and described with reference to embodiments thereof, it will be understood by one of ordinary skill in the art that various changes in form and details may be made therein without departing from the scope of the present invention as defined by the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2022-0131691 | Oct 2022 | KR | national |
