This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2022-163281, filed on Oct. 11, 2022, the entire contents of which are incorporated herein by reference.
The present disclosure relates to a substrate processing apparatus.
A substrate processing apparatus that includes a loading/unloading part having a storage shelf for temporarily storing a cassette and having a cassette transfer device capable of accessing the storage shelf is known (for example, see Patent Document 1).
According to one embodiment of the present disclosure, there is provided a substrate processing apparatus including: a loading/unloading part having a first side surface into or from which a container accommodating a substrate is loaded or unloaded and a second side surface opposite to the first side surface; a substrate transfer part extending in a first direction orthogonal to the second side surface; and a plurality of batch processors adjacent to each other in a length direction of the substrate transfer part. The loading/unloading part includes: a first transfer device and a second transfer device configured to transfer the container; a first area accessible to the first transfer device and having a plurality of first storage shelves configured to store the container, a second area accessible to the second transfer device and having a plurality of second storage shelves configured to store the container; and a movable shelf configured to be movable between the first area and the second area.
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present disclosure, and together with the general description given above and the detailed description of the embodiments given below, serve to explain the principles of the present disclosure.
Reference will now be made in detail to various embodiments, examples of which are illustrated in the accompanying drawings. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be apparent to one of ordinary skill in the art that the present disclosure may be practiced without these specific details. In other instances, well-known methods, procedures, systems, and components have not been described in detail so as not to unnecessarily obscure aspects of the various embodiments.
In each of the drawings, the same or corresponding members or components are denoted by the same or corresponding reference symbols, and redundant descriptions thereof will be omitted.
A substrate processing apparatus 1 according to an embodiment will now be described with reference to
The substrate processing apparatus 1 includes a loading/unloading part 2, a substrate transfer part 3, and a plurality of batch processors 4.
The loading/unloading part 2 has a front surface 2a into or from which a cassette C is loaded or unloaded and a rear surface 2b opposite to the front surface 2a. The front surface 2a is an example of a first side surface and is located on the negative side of the Y-axis direction of the loading/unloading part 2. The rear surface 2b is an example of a second side surface and is located on the positive side of the Y-axis direction of the loading/unloading part 2. The cassette C is a container that accommodates a plurality of (for example, 25) substrates W. The cassette C is, for example, a front-opening unified pod (FOUP). The substrates W indicate, for examples, semiconductor wafers. The inside of the loading/unloading part 2 is under, for example, an atmospheric atmosphere.
As illustrated in
The load port 21 is provided on the negative side (
The FIMS port 22 is provided on the positive side (
A plurality of storage shelves 23 is provided in each of the first area A1 and the second area A2. Each storage shelf 23 temporarily stores a cassette C in which a substrate W before processing is stored, a cassette C from which the substrate W is taken out so that the inside thereof is empty, and the like. The plurality of storage shelves 23 includes a plurality of first storage shelves 23a and a plurality of second storage shelves 23b.
The plurality of first storage shelves 23a is provided on the negative side of the Y-axis direction of the first area A1 (
The plurality of second storage shelves 23b is provided on the negative side of the Y-axis direction of the second area A2 (
The movable shelf 24 is configured to be movable in the horizontal direction between the first area A1 and the second area A2. The movable shelf 24 is provided, for example, on the positive side of the Y-axis direction of the loading/unloading part 2. The movable shelf 24 may be provided on the negative side of the Y-axis direction of the loading/unloading part 2. The movable shelf 24 may be provided on both the positive side of the Y-axis direction and the negative side of the Y-axis direction of the loading/unloading part 2. The movable shelf 24 is movable in the horizontal direction (X-axis direction).
The driver is not limited to the rodless cylinder 241 and the rod-provided cylinder 242. For example, the driver may be a linear motor, a combination of a rotary motor and a ball screw, or a combination of the rotary motor and a rack pinion.
The dummy stocker 25 is provided on the positive side of the Y-axis direction of the first area A1 (
The first cassette transfer device 26 is an example of a first transfer device and is configured to be capable of accessing the first area A1. The first cassette transfer device 26 is configured to be capable of transferring the cassette C between the load port 21, the FINIS port 22, the first storage shelf 23a, and the movable shelf 24. The first cassette transfer device 26 is configured to be movable in the vertical direction (Z-axis direction) and horizontal directions (X-axis direction and Y-axis direction).
The first cassette transfer device 26 includes a first guide 26a, a second guide 26b, a moving part 26c, and a holder 26d. The first guide 26a extends in the vertical direction (Z-axis direction). The second guide 26b moves in the vertical direction while being guided to the first guide 26a. The second guide 26b extends in the horizontal direction (X-axis direction). The moving part 26c moves in the horizontal direction (X-axis direction) while being guided to the second guide 26b. The holder 26d is installed at the moving part 26c. The holder 26d moves the cassette C in the horizontal direction (Y-axis direction) in a state of holding and supporting the cassette C.
The first cassette transfer device 26 is incapable of accessing, for example, the second area A2. In this case, since an operating range in the horizontal direction (X-axis direction) of the first cassette transfer device 26 may be narrowed, the first cassette transfer device 26 may be suppressed from being enlarged. For example, since the length of the horizontal direction (X-axis direction) of the second guide 26b may be shortened, deterioration of transfer position accuracy due to bending of the second guide 26b may be suppressed.
The second cassette transfer device 27 is an example of a second transfer device and is configured to be capable of accessing the second area A2. The second cassette transfer device 27 is configured to be capable of transferring the cassette C between the second storage shelf 23b and the movable shelf 24. The second cassette transfer device 27 is configured to be movable in the vertical direction (Z-axis direction) and horizontal directions (X-axis direction and Y-axis direction).
The second cassette transfer device 27 includes a first guide 27a, a second guide 27b, a moving part 27c, and a holder 27d. The first guide 27a extends in the vertical direction (Z-axis direction). The second guide 27b moves in the vertical direction while being guided to the first guide 27a. The second guide 27b extends in the horizontal direction (X-axis direction). The moving part 27c moves in the horizontal direction (X-axis direction) while being guided to the second guide 27b. The holder 27d is installed at the moving part 27c. The holder 27d moves the cassette C in a horizontal direction (Y-axis direction) in a state of holding and supporting the cassette C.
The second cassette transfer device 27 is incapable of accessing, for example, the first area A1. In this case, since an operating range in the horizontal direction (X-axis direction) of the second cassette transfer device 27 may be narrowed, the second cassette transfer device 27 may be suppressed from being enlarged. For example, since the length of the horizontal direction (X-axis direction) of the second guide 27b may be shortened, deterioration of transfer position accuracy due to bending of the second guide 27b may be suppressed.
The passage 28 passes through the loading/unloading part 2 to communicate with the front surface 2a and the rear surface 2b. The passage 28 is connected to a maintenance area B1 described later. Since the passage 28 is formed, an operator may enter and exit the maintenance area B1 from the front surface 2a of the loading/unloading part 2. The passage 28 is used when performing maintenance of the batch processors 4.
The loading/unloading part 2 illustrated in
According to the loading/unloading part 2 illustrated in
The substrate transfer part 3 is disposed on the positive side of the Y-axis direction of the loading/unloading part 2. The substrate transfer part 3 extends in a first direction (Y-axis direction) orthogonal to the rear surface 2b of the loading/unloading part 2. The substrate transfer part 3 is installed on a floor F. One substrate transfer part 3 is provided in common with respect to a plurality of batch processors 4. That is, the plurality of batch processors 4 has the substrate transfer part 3 which is common thereto. In an embodiment, the inside of the substrate transfer part 3 is under an inert gas atmosphere such as a nitrogen gas atmosphere. This may suppress oxidation of the substrate W in the substrate transfer part 3.
The substrate transfer part 3 includes a substrate transfer device 31. The substrate transfer device 31 transfers the substrate W between the loading/unloading part 2 and each of the plurality of batch processors 4. The substrate transfer device 31 has a plurality of peaks 31p. Thereby, the substrate transfer device 31 may transfer a plurality of substrates W simultaneously. For this reason, the time required to transfer the substrates W may be shortened. The number of peaks 31p is not particularly limited.
The plurality of batch processors 4 is disposed on the negative side of the X-axis direction of the substrate transfer part 3. The plurality of batch processors 4 is disposed adjacent to each other in the longitudinal direction (Y-axis direction) of the substrate transfer part 3. In the illustrated example, four batch processors 4 are disposed adjacent to each other in the longitudinal direction of the substrate transfer part 3. Each of the batch processors 4 processes the plurality of substrates W collectively. In an embodiment, the inside of each of the batch processors 4 is under an inert gas atmosphere such as a nitrogen gas atmosphere. Oxidation of the substrates W in the batch processors 4 may thereby be suppressed. Each of the batch processors 4 includes a heat treatment unit 41, a load unit 42, a gas supply unit 43, an exhaust unit 44, a process module control unit 45, and a forced air cooling unit 46, a gas control unit 47, and a floor box 48.
The heat treatment unit 41 performs predetermined heat treatment on the plurality of substrates W. The heat treatment unit 41 includes a processing container 411 and a heater 412.
The processing container 411 accommodates a substrate holder 414. The substrate holder 414 holds and supports the substrates W substantially horizontally at a predetermined interval in a vertical direction. The substrate holder 414 is made of, for example, a heat-resistant material such as quartz or silicon carbide. The processing container 411 is provided with a gas introduction port 411a and an exhaust port 411b.
The gas introduction port 411a introduces gas into the processing container 411. The gas introduction port 411a is provided on the negative side of the X-axis direction of the processing container 411.
The exhaust port 411b exhausts the gas inside the processing container 411. The exhaust port 411b is provided on the negative side of the X-axis direction of the processing container 411.
The heater 412 has, for example, a cylindrical shape and is provided around the processing container 411. The heater 412 heats the substrates W accommodated in the processing container 411. A shutter 415 is provided below the processing container 411. The shutter 415 is configured to move horizontally between a position at which an opening of a lower end of the processing container 411 is closed and a position at which the opening of the lower end of the processing container is not closed. The shutter 415 closes the opening of the lower end of the processing container 411 during a period in which the substrate holder 414 is unloaded from the processing container 411 and then the next substrate holder 414 is loaded thereinto.
The load unit 42 is provided below the heat treatment unit 41. The load unit 42 is installed on the floor F with the floor box 48 interposed therebetween. The floor box 48 may be configured to be integrated with the load unit 42 by being built thereinto. The load unit 42 transfers and receives the substrates W accommodated in the processing container 411 to and from the substrate transfer part 3. In the load unit 42, the substrate holder 414 is loaded on a cover 417 with a heat-insulating tube 416 interposed therebetween. The cover 417 is supported by a lifting mechanism, which is not illustrated. The lifting mechanism loads or unloads the substrate holder 414 into or from the processing container 411 by lifting the cover 417. The lifting mechanism includes, for example, a ball screw. The load unit 42 also functions as a space for cooling the substrates W treated in the heat treatment unit 41.
The gas supply unit 43 is disposed on the side opposite to the side on which the substrate transfer part 3 of the heat treatment unit 41 is disposed. The gas supply unit 43 supplies treatment gas to the gas introduction port 411a. The gas supply unit 43 is installed on, for example, the exhaust unit 44. The gas supply unit 43 is disposed at substantially the same height as the processing container 411, for example. The gas supply unit 43 includes a flow controller, an on/off valve, and the like.
The exhaust unit 44 is disposed on the same side as the gas supply unit 43. In one embodiment, the exhaust unit 44 is disposed at a different height from the gas supply unit 43 such as below the gas supply unit 43. The exhaust unit 44 has an inverse L-shape when viewed in a plane from a first direction (Y-axis direction). The exhaust unit 44 forms a maintenance area B1 between the load unit 42 and the exhaust unit 44. The maintenance area B1 is a maintenance area that is located at a lower place of the apparatus to allow an operator to enter and exit. The operator may easily perform maintenance of the plurality of batch processors 4 arranged in front and rear directions in the maintenance area B1.
The exhaust unit 44 has one end connected to the exhaust port 411b and the other end extending downward to pass through the floor F and connected to an exhaust device, which is not illustrated, disposed below the floor F. The exhaust device exhausts the inside of the processing container 411 via the exhaust port 411b and the exhaust unit 44 to reduce pressure. The exhaust device includes a vacuum pump, a valve, and the like.
The forced air cooling unit 46 is a unit that generates a refrigerant supplied to the heater 412 and includes a heat exchanger, a blower, a valve, and a pipe. The refrigerant may be air. The forced air cooling unit 46 is provided on the positive side of the X-axis direction of the heat treatment unit 41. The refrigerant sent from the forced air cooling unit 46 is supplied to a space between the processing container 411 and the heater 412. Thereby, the processing container 411 may be cooled in a short time.
The process module control unit 45 and the gas control unit 47 are disposed on the ceiling of the heat treatment unit 41. The process module control unit 45 and the gas control unit 47 control the operation of each part of the batch processors 4. The process module control unit 45 and the gas control unit 47 include various control devices.
In addition, the arrangement of the heat treatment unit 41, the load unit 42, the gas supply unit 43, the exhaust unit 44, the process module control unit 45, the forced air cooling unit 46, the gas control unit 47, and the floor box 48 is exemplary and is not particularly limited.
As described above, in the substrate processing apparatus 1 according to the embodiment, the loading/unloading part 2 includes the movable shelf 24 that is movable between the first area A1 accessible to the first cassette transfer device 26 and the second area A2 accessible to the second cassette transfer device 27. This may make it possible to narrow the operating range of the first cassette transfer device 26 and the second cassette transfer device 27 in the horizontal direction (X-axis direction). Thereby, the number of the cassettes C capable of being stored may be increased without enlarging the first cassette transfer device 26 and the second cassette transfer device 27.
In addition, in the substrate processing apparatus 1 according to the embodiment, since a plurality of batch processors 4 is disposed for one substrate transfer part 3, the installation area of the substrate processing apparatus 1 may be reduced as compared with the case in which one batch processor 4 is disposed for one substrate transfer part 3. Thereby, productivity per unit area is improved.
In addition, the substrate processing apparatus 1 has the maintenance area B1 formed between the load unit 42 and the exhaust unit 44. Thereby, in the maintenance area B1, an operator may easily perform maintenance of the plurality of batch processors 4 arranged in front and rear directions.
It is to be noted that the embodiments disclosed herein are exemplary in all respects and are not restrictive. The above-described embodiments may be omitted, replaced, and/or modified in various forms without departing from the scope and spirit of the appended claims.
In the above embodiments, while the case where one substrate processing apparatus 1 is disposed has been described, the present disclosure is not limited thereto. For example, a plurality of substrate processing apparatuses may be disposed in the X-axis direction to form a substrate processing apparatus group.
In the substrate processing apparatus group in which a plurality of substrate processing apparatuses is disposed in the X-axis direction, loading/unloading parts 2X, 2Y, and 2Z are disposed in the X-axis direction, as illustrated in
The substrate processing apparatus group may also include, for example, the substrate processing apparatus 1 provided with a plurality of batch processors 4 and a substrate processing apparatus provided with one batch processor 4. The substrate processing apparatus group may include the substrate processing apparatus 1 provided with a plurality of batch processors 4 and may not include a substrate processing apparatus provided with one batch processor 4. In this way, the substrate processing apparatus group includes at least one substrate processing apparatus 1 provided with a plurality of batch processors 4.
According to the present disclosure in some embodiments, the number of cassettes capable of being stored can be increased without enlarging the transfer device.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the disclosures. Indeed, the embodiments described herein may be embodied in a variety of other forms. Furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the disclosures. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the disclosures.
Number | Date | Country | Kind |
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2022-163281 | Oct 2022 | JP | national |