Patent Grant
6869499
1. Field of the Invention
The present invention relates to a technique of processing substrates, such as semiconductor wafers and glass LCD substrates, in processing vessels by using a processing gas, such as ozone gas, more specifically, a technique of purging the interior of the processing vessel after the processing with the processing gas has been completed.
2. Description of the Related Art
Fabrication processes for semiconductor devices include the step of applying a photoresist to a semiconductor wafer, the step of transferring a circuit pattern to a photoresist by photolithography process, the step of developing the photoresist and the step of removing the photoresist from the wafer.
Generally, the resist removing step is performed by dipping wafers in a cleaning tank filled with a chemical liquid called SPM (mixed liquid of H2SO4/H2O2).
However, from the ecological viewpoint, recently the resist removal using ozone aqueous solution whose waste liquid treatment is easy has become prevalent. In this resist removal, wafers are dipped in a cleaning tank filled with ozone aqueous solution to oxidize the resist with radicals of oxygen atoms in the aqueous solution so as to decompose the resist into carbon dioxide, water, etc. In the conventional method for such resist removal, a high concentration of ozone gas is bubbled in pure water to produce ozone aqueous solution, the ozone aqueous solution is fed into the cleaning tank through a piping. However, this method has a disadvantage that while ozone aqueous solution is being fed to the cleaning tank and also during a time from the load of the ozone aqueous solution to the start of the processing, the ozone concentration in the aqueous solution is decreased. Ozone (radicals) of the ozone aqueous solution present in the vicinity of the wafers react with the resist to be extinguished, but the supplementation of ozone is not quickly performed. As a result, a sufficient amount of ozone cannot be fed to the resist surface, and accordingly the reaction speed is not high.
Then, as an innovational substitute of the above-described dip cleaning, a cleaning method using ozone gas and steam has been proposed. This cleaning method includes the following steps (1) to (5) which are sequentially performed: (1) a step of feeding hot air into a processing vessel to raise the wafer temperature; (2) a pre-pressuring step of feeding ozone gas (or ozone gas and steam) to pre-pressurize the interior of the processing vessel; (3) an O3/steam processing step of feeding ozone gas and steam into the processing vessel to process the wafers; (4) an O2 purging step of purging the interior of an ozone gas feed pipe with oxygen gas; and (5) an air purging step of feeding cool air into the processing vessel to purge the interior of the processing vessel with the cool air.
In the O2 purging step, oxygen gas, which is a raw material gas of ozone gas, is introduced into an ozone gas generator with the ozone gas generator being stopped. The interior of the ozone gas generator and the interior of the pipe between the ozone gas generator and the processing vessel are purged with the oxygen gas. Accordingly, the O2 purging step takes a considerably long time. Furthermore, in the air purging step, ozone stagnates and resides at areas located outside of the main stream of the air formed by jetting the cool air. This disadvantageously reduces the effect of the purging step. Consequently, the throughput of the apparatus is low.
Therefore, the object of the present invention is to provide a method and an apparatus which can improve the purging efficiency of purging the interiors of the processing gas feed pipe and the processing vessel.
To achieve the objective, the present invention provides a substrate processing method, which includes the steps of: loading a substrate into a processing vessel; feeding a processing gas into the processing vessel from a processing gas supply source through a processing gas supplying path while feeding a vapor into the processing vessel, thereby processing the substrate with the processing gas and the vapor; and feeding, after the substrates have been processed with the processing gas and the vapor, air into the processing vessel by introducing the air to the processing gas supplying path at a position between the processing gas supply source and the processing vessel, thereby purging the processing vessel with the air.
The present invention further provides a substrate processing method, which includes the steps of: loading a substrate into a processing vessel; feeding a processing gas and a vapor into the processing vessel to process the substrate with the processing gas and the vapor; and feeding, after the substrate has been processed with the processing gas and the vapor, air into the processing vessel, thereby purging the processing vessel with the air, wherein the air feeding step includes: feeding the air into the processing vessel at a first flow rate; feeding the air into the processing vessel at a second flow rate less than the first flow rate; and repeating the step of feeding the air at the first flow rate and the step of feeding the air at the second flow rate.
The present invention further provides a substrate processing method, which includes the steps of: loading a substrate into a processing vessel; feeding a processing gas and a vapor into the processing vessel to process the substrate with the processing gas and the vapor; and feeding, after the substrate has been processed with the processing gas and the vapor, air and the vapor into the processing vessel, thereby purging the processing vessel with the air and the vapor, wherein the step of feeding the air and the vapor includes: feeding the air and the vapor into the processing vessel at a first flow rate; feeding the air and the vapor into the processing vessel at a second flow rate less than the first flow rate; and repeating the step of feeding the air and the vapor at the first flow rate and the step of feeding the air and the vapor at the second flow rate.
The second flow rate may be naught (zero). In this case, the step of feeding the air (or the air and the vapor) into the processing vessel at the second flow rate is equivalent to a step of stopping feeding the air (or the air and the vapor).
The processing gas may be a gas which reacts with the vapor to produce radicals. The processing gas may be ozone gas, chlorine gas or fluorine gas, for example. The processing gas may be chlorine gas, fluorine gas, hydrogen gas or the like, which includes radicals before reacting with the vapor.
The vapor is preferably made by vaporizing a liquid that dissolves the processing gas to produce radicals derived from the processing gas. The vapor is preferably steam of pure water.
The substrates to be processed may be semiconductor wafers, LCD substrates or the like.
According to the second aspect of the present invention, a substrate processing apparatus is provided, which includes: a processing vessel; a processing gas supplying path, through which a processing gas is fed to the processing vessel; a vapor supplying path, through which a vapor is fed to the processing vessel; an air supplying path connected to the processing gas supplying path to feed air into the processing vessel through the processing gas supplying path; and at least one first valve adapted to change gas-feeding condition between a first state in which only the processing gas is fed to the processing vessel and a second state in which only the air is fed to the processing vessel.
An embodiment of the present invention will be described with reference to the drawings. In the present embodiment, a resist is removed from semiconductor wafers W by using ozone gas and steam.
A substrate processing apparatus is equipped with: a processing vessel 10; a wafer guide 20 for holding wafers W in the processing vessel 10; a steam supply system 30 (i.e., a solvent-vapor supply system) for supplying steam into the processing vessel 10; an ozone gas supply system 40 (i.e., processing gas supply system) for supplying ozone gas into the processing vessel 10; an air supply system 50 for supplying air into the processing vessel 10; an exhaust system 60 for exhausting the interior of the processing vessel 10; a diffusion preventing means 70 for preventing the diffusion of ozone gas or toxic gas around the processing vessel 10; an ozone killer 80 (i.e., ozone treating device) for decomposing ozone included in the exhaust gas discharged from the processing vessel 10; and a drain system 90 for draining the condensed liquid from the interior of the processing vessel 10. The drain system 90 is used as a second exhaust system for exhausting the interior of the processing vessel 10.
The processing vessel 10 includes a vessel body 11 having a volume allowing for a plurality of wafers W, for example fifty wafers, and a vessel cover 12 for opening and closing a loading/unloading opening 14 formed in the upper end of the vessel body 11.
The vessel cover 12 can be moved up and down by a lift mechanism 15. The lift mechanism 15 is operated in response to a control signal from a controller, for example a central processing unit 100 (hereinafter called a CPU 100) to open or close the vessel cover 12. When the vessel cover 12 is lifted, the loading/unloading opening 14 is opened to admit wafers W into the vessel body 11. After the wafers W have been loaded in the vessel body 11, the vessel cover 12 is lowered to close the loading/unloading opening 14. At this time, a gap between a flange la on the upper end of the vessel body 11 and a flange 12a on the lower end of the vessel cover 12 is tightly closed by a hollow sealing member 16 which is inflatable by injection of air. The interior of the processing vessel 10 is a tightly closed space, from which no gas leaks outside. A locking mechanism (not shown) for keeping the vessel cover closed is provided on the upper end of the vessel body 11.
A rubber heater 17 is mounted on the outer peripheral surface of the vessel body 11. Rubber heaters 18 and 19 are mounted on the outer peripheral surface of the vessel cover 12 and the outer peripheral surface of the vessel body 11. These rubber heaters 17, 18 and 19 are connected to an electric power source (not shown) and generate heat to maintain an internal atmosphere of the processing vessel 10 at a prescribed temperature (in a range of, e.g., 80-120° C.). The CPU 100 controls calories of the rubber heaters 17, 18 and 19, based on a temperature of the interior of the processing vessel 10 detected by a temperature sensor TS1 so as to maintain an internal atmosphere of the processing vessel 10 at the above-mentioned prescribed temperature. The rubber heaters 17, 18 and 19 also play the role of preventing dewing (condensation of steam) in the processing vessel 10.
A steam supply system 30 includes: a pure water supply pipe 32 connected to a pure water source 31; a steam generator 33 which evaporates pure water supplied through the pure water supply pipe 32 to generate steam; a steam supply pipe 34 which supplies the steam in the steam generator 33; and a pair of steam nozzles 35 which inject into the processing vessel 10 the steam supplied through the steam supply pipe 34.
The pure water supply pipe 32 has one end connected to the pure water source 31. An open-close valve V0 and a flow rate controller FM0 are inserted in the pure water supply pipe 32 sequentially from the side of the pure water source 31. The open-close valve V0 and the flow rate controller FM0 are controlled based on a control signal from the CPU 100. The open-close valve V0 is controlled between the full-open state and the full-closed state, and an opening of the flow rate controller FM0 is controlled to control the flow rate of the pure water.
As shown in
The steam generator 33 has a first temperature sensor TSa that detects a water temperature in the tank, a second temperature sensor TSb that detects a temperature the heater 37 for adjusting the temperature of the heater 37, and a third temperature sensor TSc that detects an excessive temperature rise of the heater 37. The steam generator 33 has a pressure sensor PS2 that detects a pressure of the generated steam in the tank 36. The CPU 100 can monitor a state of the steam generator 33 based on detection signals from the first thru the third temperature sensors TSa-TSc and the pressure sensor PS2.
A first open-close valve V1 is inserted in the steam supply pipe 34 interconnecting the steam generator 33 and the steam nozzle 35. A drainpipe 39 connected to a condenser 192 (which will be described later) is branched from the steam supply pipe 34 upstream (nearer the tank 36) of the first open-close valve V1. A second open-close valve V2 is inserted in the drain pipe 39. A bypass pipe 39A bypassing the second open-close valve V2 is inserted in the drain pipe 39. A relief valve CV0, which prevents a pressure in the steam generator 33 from exceeding a prescribed value (a pressure resistance value of the tank 36 or critical pressure resistance values of the valves V1, V2, V3, etc.), is inserted in the bypass pipe 39A. An orifice 39a, which prevents a pressure in the steam generator 33 from abruptly lowering, is inserted in the drain pipe 39 downstream of the second open-close valve V2 and the relief valve CV0 and upstream of the condenser 192.
Air intake pipe 39b opened to the atmosphere is connected to the pure water supply pipe 32, in which the valve V3 and a filter F0 is inserted. Air is introduced into the steam generator 33 via the air intake pipe 39b, when water in the steam generator 33 is drained. The above-described constitution makes it possible to supply steam of a pressure which is above a pressure in the processing vessel 10.
The first and the second open-close valves V1 and V2 are opened and closed by control signals from the CPU 100. When steam is fed into the processing vessel 10, the valve V1 is opened and the valve V2 is closed. In view of improvement of throughput, the heater 37 of the steam generator 33 is always energized to generate steam. Thus, when steam is not fed to the processing vessel 10 and thus the valve V1 is closed, the open-close valve V2 is opened or closed to maintain pressure in the steam generator 33 within a prescribed range.
Steam having been passed through the relief valve CV0 and steam having been passed through the second open-close valve V2, when a pressure in the steam generator 33 has been adjusted, is led to the condenser 192 via the drain pipe 39. The steam is condensed while it is passing through the condenser 192. The condensed water is directed to a pure water drain system 142 through the pure water drain pipe 39c to be re-used.
Pure water drained from the steam generator 33 is directed to the pure water drain system 124 through the pure water drain pipe 39c with the open-close valve V12 inserted in to be re-used. Alternatively, pure water drained from the steam generator 33 may be drained to a drain system 123 exclusive for plant acid liquids, which will be described later, through the pure water drain pipe 39d branched from the pure water drain pipe 39c. The open-close valve V12, and the open-close valve V12a inserted in the pure water drain pipe 39d are opened and closed in response to control signals from the CPU 100. Thus, acid drain liquids can be diluted as required.
As shown in
Each of the steam nozzles 35 is secured to the vessel body 11 of the processing vessel 10 so that the longitudinal axis of the nozzle 35 extends horizontally, by using an application screw (not shown) passed through the flange 35c.
The axial lines of the nozzle ports 35f are directed toward the inside wall surface of the processing vessel 10 and obliquely upward (suitably, tilted by 45° to the horizontal plane) (see FIG. 2). The nozzle ports 35f are directed toward the inside wall surface of the processing vessel 10 so as to prevent the steam from being blown directly onto the wafers W, which would result in the formation of liquid drops on the wafers W.
The nozzle ports 35f are tilted toward the inside wall surface and obliquely upward (see FIG. 2), so that the steam rises along the inside wall of the processing vessel to be mixed at an upper part of the interior of the processing vessel with ozone gas injected from ozone gas nozzles 43 which will be described later, and the mixed gas is fed to the wafers W in a downward stream.
The ozone gas supply system 40 includes: an ozone gas generator 41; an ozone gas supply pipe 42 (i.e., a processing gas supply pipe) connected to the ozone gas generator 41; and a pair of zone gas nozzles 43 which inject ozone gas supplied through the ozone gas supply pipe 42 onto both sides of the wafers W in the processing vessel 10.
As shown in
A switch 48 is inserted in an electric circuit 47 connecting the discharge electrodes 45 and 46 to the high-frequency power source 44. The switch 48 is opened and closed, based on control signals from the CPU 100.
An open-close valve V4 is inserted in the ozone gas supply pipe 42. The secondary side (the side of the processing vessel 10) of the open-close valve V4 is connected to an air supply pipe 51B connected to an air supply source 55. An open-close valve V8 is inserted in the air supply pipe 51B. The open-close valves V4 and V5 are opened and closed in response to control signals from the CPU 100. When the ozone gas is supplied into the processing vessel 10, the open-close valve V4 is opened while the open-close valve V8 is closed. When air is supplied into the processing vessel 10, the open-close valve V4 is closed while the open-close valve V8 is opened. When the supply of the ozone gas and air is stopped, both the open-close valves V4 and V8 are closed. In place of the open-close valves V4 and V8, a three-way valve may be placed in the ozone gas supply pipe 42 at a position where the air supply pipe 51B is connected thereto.
As shown in
Each of the ozone gas nozzles 43 is secured to the vessel body 11 of the processing vessel 10 by means of an application screw (not shown) passed through the application flanges 43, with the longitudinal axis of the nozzle 43 extending horizontally. The axial lines of the ozone injection ports 43a are directed toward the inside wall surface of the processing vessel 10 and obliquely upward (suitably, tilted by 45° to the horizontal surface) (see FIG. 2), in order to prevent the ozone gas from being injected directly onto the surfaces of the wafers W.
Since the communication ports 43c are located opposite the ozone injection ports 42a, the ozone gas can be uniformly injected through the respective ozone gas injection ports 43a. The ozone gas introduced into the ozone gas passages 43e flows through the communication ports 43a into the gap 43j between the outer pipe 43b and the inner pipe 43d to be dispersed in the gap 43j, and is led into the ozone injection ports 43a, whereby the ozone gas can be uniformly supplied into the respective ozone injection ports 43a.
The air supply system 50 includes a first sub-system (heating air supply system) for supplying air for raising temperature of the wafers W, and a second sub-system (purge-air supply system) for supplying air for purging the interior of the processing vessel 10.
The heating air supply system comprises a first air supply pipe 51, a hot air generator 52, a second air supply pipe 53 and a pair of air nozzles 54. Air is supplied to the hot air generator 52 from the air supply source 55 through the first air supply pipe 51, and the heated air is supplied to the pair of air nozzles 54 through the second air supply pipe 53 to be fed into the processing vessel 10.
The purge-air supply system comprises a purge-air supply pipe 51A connected to the first air supply pipe 51 and the second air supply pipe 53, and a purge-air supply pipe 51B connected to the first air supply pipe 51 and the ozone gas supply pipe 42.
The first air supply pipe 51 has one end connected to an air supply source 55. A flow rate controller FM1, a filter F1 and an open-close valve V5 are inserted in the first air supply pipe 51 from the side of the air supply source 55. The flow rate controller FM1 and the filter F1 are operated in response to control signals from the CPU 100 to control the air supply/air supply stop, and the air flow rate. A heater 56 is disposed in the hot air generator 52. An open-close valve V6 is inserted in the second air supply pipe 53. The operation of the open-close valve V6 is controlled by the CPU 100.
A flow rate controller FM2, a filter F2 and an open-close valve V7 are inserted in the purge-air supply pipe 51a from the side of the air supply source 55. A flow rate controller FM3, a filter F3 and an open-close valve V8 are inserted in the purge-air supply pipe 51B from the side of the air supply source 55. The open-close valves V7 and V8 and the flow rate controllers FM2 and FM3 are operated based on control signals from the CPU 100 to control the air supply/air supply stop and the flow rates of air. When the interior of the processing vessel 10 is purged with an ejector 63 (which will be described later) being operated, since the drain flow rate of the ejector 63 is fixed, the flow rate of purge-air fed into the processing vessel 10 from the air supply pipe 51B is controlled so as to correspond to the drain flow rate of the ejector 63.
As shown in
Extending beyond the proximal end of the outer pipe 54b is the proximal end of the inner pipe 54c, which is provided with a female thread 54e and an application flange 54f for connecting the air nozzle 54 to the second air supply pipe 53. Each of the air nozzles 54 has a securing member 54g for securing the air nozzle 54 to the side wall of the vessel body 11 of the processing vessel 10. The securing member 54g is connected to the distal end of the inner pipe 54c by an interconnection screw 54i put in a through-hole 54h formed in the securing member 54g.
Each of the air nozzles 54 are secured to the vessel body 11 of the processing vessel 10 so that the longitudinal axes of the nozzles 54 extends horizontally, by using application screws (not shown) put through the application flange 54f. The air nozzles 54 are arranged on both sides of the wafers W loaded in the processing vessel 10 at a height corresponding to the lower end of the wafers W.
The interconnection screw 54i is adjusted so that the axial lines of the air injection ports 54a are directed toward the inside wall surface of the processing vessel 10 and obliquely upward (suitably, titled by about 45° to the horizontal surface) (see FIG. 2), in order to prevent the air from being injected directly onto the surfaces of the wafers W.
As described above, the drain system 90 not only drains liquids in the processing vessel 10, specifically water, which is the condensed steam, but also functions as a second exhaust system. The drain system 90 includes a first drain pipe 91 connected to the bottom of the processing vessel 10, a condenser 92 connected to a first drain pipe 91, and a mist trap 95 connected to the condenser 92 at the downstream thereof and having a liquid reservoir 95a. An open-close valve V9 is inserted in the first drain pipe 91. A sub-open-close valve V10 which facilitates an open/close operation opposite to that of the open-close valve V9, and an orifice are inserted in a bypass pipe 94 bypassing the open-close valve V9. An open-close valve V11 is inserted in the second drain pipe 93. For the risk that ozone may remain in the liquid, the second drain pipe 93 is connected to the “factory acid drain” 123, which is a drain system exclusive for acid liquids and is provided in the factory where the substrate processing apparatus of the present invention is installed.
In the mist trap 95, four water level sensors 96, 97, 98 and 99 are arranged sequentially from the bottom. The CPU 100 opens and closes the open-close valves V9, V10 and V11 based on detected signals from the sensors 96, 97, 98 and 99. During a cleaning operation, the open-close valve V9 is kept closed while the open-close valve V10 is kept opened to drain small amounts of ozone and steam from the interior of the processing vessel 10, whereby a pressure in the processing vessel 10 is adjusted. After the cleaning operation, the open-close valve V10 is closed while the open-close valve 9 is opened to exhaust the interior of the processing vessel 10.
Water stays in the mist trap 95 and raises a water level, and when the water surface is detected by the sensor 87, the open-close valve V11 is opened in response to the control signal from the CPU 100 to start draining the liquid. When the water level of the mist trap 95 is lowered, and the liquid surface is detected by the sensor 98, the open-close valve V11 is closed in response to the control signal from the CPU 100 in order to stop draining the liquid. When the water level in the mist trap 95 abnormally rises, and a height of the water surface reaches the sensor 99, an alarm signal from the sensor 98 is sent to the CPU 100.
When the water level in the mist trap 95 abnormally lowers, and the liquid surface is lower than the sensor 96, the open-close valve V11 is closed in response to the control signal from the CPU 100, thereby preventing the leakage of the ozone gas into the factory acid drain due to the emptiness of the mist trap 95.
An exhaust pipe 110 is connected to an upper part of the mist trap 95, and the ozone killer 80 and an exhaust manifold 81 are inserted in the exhaust pipe 110.
The steam and the ozone gas, which are exhausted from the interior of the processing vessel 10 through the first liquid drain pipe 91, flow into the mist trap 95 through the condenser 92. The steam exhausted from the interior of the processing vessel 10 is cooled and condensed during passage through the condenser 92. The condensed water flows down into the mist trap 95, and is discharged from the mist trap 95 through the second drain pipe 93. On the other hand, the ozone gas (not condensed) is introduced into the mist trap 95, and is discharged from the mist trap 95 through the exhaust pipe 110.
As shown in
Similar to the condenser 92, the condenser 192 has a double-pipe structure having a cooling water supply pipe 92a disposed in a helical portion of the exhaust pipe 39. In the condenser 192, the steam flows down through the exhaust pipe 30, and the cooling water flows up through the cooling water supply pipe 92a.
The condenser 92 and the condenser 192 are arranged separate from each other. However, the condenser 92 and condenser 192 may be integrally arranged. As shown in
The ozone killer 80 heats the ozone gas to thermally decompose the ozone to convert it into oxygen. A treating temperature of the ozone killer 80 is above 400° C. It is preferable, for safety reasons, that the ozone killer 80 is connected to a power-failure-free power supply (not shown) provided in the factory so that electric power can be stably supplied to the ozone killer 80 even in the event of an electrical power failure. Since the (ozone) gas is abruptly inflated in the ozone killer 80 and the ozone killer 80 has a helical exhaust passage, the ozone killer 80 acts as an exhaust resistance of the exhaust system.
The ozone killer 80 has a temperature sensor (not shown) which detects an operational state of the ozone killer 80. The temperature sensor detects a temperature of the ozone killer 80. The CPU 100 judges whether the ozone killer 80 is sufficiently prepared to decompose the ozone into oxygen based on detected signals from the temperature sensor.
The oxygen gas generated by decomposing ozone gas in the ozone killer 80 is exhausted into a factory acid exhaust 122, which is a exhaust system exclusive for acid gas and is provided in the factory. Since temperature of the ozone killer 80 is high (e.g., 400°), the ozone killer 80 is cooled with cooling water fed from a cooling water supply source 125. The cooling water used for the cooling is drained to a drain system 121 of the factory.
The exhaust gases discharged through the respective exhaust pipes of the processing apparatus are collected in the exhaust manifold 81. A plurality of pipes (not shown) for taking in an atmosphere behind the processing apparatus in order to prevent the diffusion of the ozone gas from the processing apparatus, are connected to the exhaust manifold 81. The exhaust manifold 81 is connected to the factory acid exhaust 122.
An ozone concentration sensor (not shown) is disposed in the exhaust manifold 81. Based on a detected signal from the ozone concentration sensor, the CPU 100 monitors an ozone removing capacity of the ozone killer 80. If a large amount of the ozone gas flows to the factory acid exhaust 122 due to a malfunction of the ozone killer 80 for example, such a malfunction can be detected.
Next, the exhaust system 60 will be explained. The exhaust system 60 discharges a gas (and steam) in the processing vessel 10 into the ozone killer 80 without passing the gas through the condenser 92 and the mist trap 95. The exhaust system 60 includes an exhaust port 61 provided in the processing vessel 10; an exhaust pipe 62 connecting the exhaust port 61 to the exhaust pipe 110; and a first exhaust open-close valve V13, an ejector 63 and a mist separator 66 inserted sequentially in the exhaust pipe 62.
A sub-exhaust pipe 68 is connected to a lower part of the processing vessel 10. The sub exhaust pipe 68 is connected to the exhaust pipe 62 downstream of the first exhaust open-close valve V13. Inserted in the sub exhaust pipe 68A is a relief valve CV2, which releases the pressure in the processing vessel 10 when pressure in the processing vessel 10 is abnormally high.
A branched exhaust pipe 64 connects the exhaust pipe 62 to the exhaust pipe 110. The exhaust pipe 64 has one end connected to the exhaust pipe 62 at a position upstream of the first exhaust open-close valve V13, and the other end connected to exhaust pipe 110 at a position between the ozone killer 80 and the manifold 81.
A second exhaust open-close valve V14 and a damper 65 are inserted in the branched exhaust pipe 64, and is connected to an exhaust pipe 64a, which exhausts the interior of a case 71, which will be described later (see FIG. 1). The first exhaust open-close valve V13, the second exhaust open-close valve V14 and the damper 65 are operated in response to control signals from the CPU 100.
A negative pressure, generated by supplying the air fed from the air supply source 55 to the ejector 63 through the open-close valve V16, is utilized to exhaust the steam and the ozone gas from the processing vessel 10 by suction. The open-close valve V13 and the open-close valve V16 are operated in response to control signals from the CPU 100. The mist separator 66 inserted in the exhaust pipe 62 separates water, which is a condensed steam condensed when travelling in the exhaust pipe 60 from the processing vessel 10 to the mist separator 66. The water in the mist separator 66 is drained to a drain pipe 72 (which will be described later).
The diffusion preventing means 70 includes the case 71 surrounding the processing vessel 10, and the drain pipe 72 having one end connected to the bottom of the case 71 and the other end connected the factory acid drain 123.
In the case 71, a down-flow of clean air is fed from above. The down-flow prohibits the leakage of an internal atmosphere of the case 71, namely an atmosphere surrounding the processing vessel 10, from leaking outside the case 71. The internal atmosphere of the case 71 moves downward with the down-flow, and is led into the exhaust pipe 64a and the drain pipe 72.
An ozone concentration sensor (not shown) for detecting an ozone concentration of a peripheral atmosphere of the processing vessel 10 is provided in the case 71. Based on a detected signal supplied by the ozone concentration sensor, the CPU 100 detects leakage of the ozone gas.
The drain pipe 72 is connected to a drain pipe 67, which passes the condensed water separated by the mist separator 66 inserted downstream of the ejector 63. An open-close valve V15 is inserted in the drain pipe 67. The drain pipe 72 is connected to the second drain pipe 93 connected to the mist trap 95.
Next, the operational steps of the substrate processing apparatus according to the present invention will be explained. TABLE 1 shows the states of the respective open-close valves in the respective steps.
First, wafers W are loaded into the processing vessel 10. Next, the open-close valves V5 and V6 of the air supply system 50 are opened, the second exhaust open-close valve V14 is opened, and the hot air generator 52 is actuated. Hot air at a temperature of about 280° C. is fed into the processing vessel 10, whereby a temperature of the wafers W and an atmospheric temperature in the processing vessel 10 are raised from the room temperature (25° C.) to a prescribed temperature, e.g., 80-90° C. (Wafer Temperature Raising Step).
Then, the ozone gas generator 41 is actuated to generate ozone gas. The sub open-close valve V10 is opened (the open-close valve V9 is closed), the open-close valve V4 is opened, and the ozone gas is fed into the processing vessel 10. At this time, the ozone gas of about 9 vol % (percent by volume) ozone concentration is supplied at a flow rate of about 10 L/min (liters per minute). Thereby, pressure in the processing vessel 10 becomes higher by 0.01-0.03 MPa than the atmospheric pressure (0.1 MPa) (Pre-Pressuring Step).
The pre-pressuring step using the ozone gas prevents, in the O3/steam processing step (which will be described later), steam fed into the processing vessel 10 from condensing on the inside wall of the processing vessel 10, the surfaces of the wafers W, etc. due to a pressure difference. Furthermore, the pre-pressuring step modifies the surface of a hydrophobic resist, such as ArF resist, having poor wettability so that the steam can be easily adsorbed on the surface. Furthermore, during the pre-pressuring step, the concentration of the ozone gas generated by the ozone gas generator 41 becomes sufficiently stable and high. Thus, a sufficient concentration of the ozone gas can be supplied in the following O3/steam processing step. In addition, during the period of time when the pre-pressuring step is carried out, temperature distribution of the wafers, having been heated in the wafer temperature raising step, becomes uniform.
After the pre-pressuring step is performed for a prescribed period of time (e.g., 1-2 minutes), the ozone gas is continuously fed into the processing vessel 10. The open-close valve V1 is opened to feed steam into the processing vessel 10 from the steam supply system 30. In this state, water molecules and ozone molecules react with each other on the surfaces of the wafers W to generate oxygen atom radicals and hydroxyl group radicals. These radicals decompose a resist film, which is not water-soluble, into carboxylic acid, carbon dioxide, water, etc., and the resist film is thus modified to a water-soluble film. At this time, the open-close valve V9 is closed, and the sub-open-close valve V10 is opened (O3/steam processing step; see “O3/steam process” in TABLE 1).
Finally, the ozone gas in the processing vessel 10 is air-purged by either of the methods, which will be described later (Air-Purging step). Then, the loading/unloading opening 14 of the vessel body 10 is opened to unload the wafers W. The unloaded wafers W are conveyed to a rinse apparatus (not shown) to be rinsed. The resist film deformed to a water-soluble film is removed from the wafers W by rinsing. The wafers are conveyed to a drying apparatus (not shown) to be dried.
The purging methods will be explained with reference to
After the wafers W have been processed by supplying the ozone gas and the steam into the processing vessel 10 (after the O3/steam processing step has been completed), air is supplied from the air supply source 55 connected to the ozone gas supply pipe 42 to purge the ozone gas and the steam remaining in the ozone gas supply pipe 42 and the processing vessel 10.
In this method, after the O3/steam processing step has been completed, in response to control signals from the CPU 100, the open-close valve V4 is closed, and the open-close valve V8 is opened. Air is thus fed into the processing vessel 10 from the air supply source 55 through the air supply pipe 51B and the ozone gas supply pipe 42. The open-close valve V9 is opened, and the sub open-close valve V10 is closed. The ozone gas remaining in the ozone gas supply pipe 42 and the processing vessel 10 is expelled therefrom by the air and discharged from the processing vessel 10 through the pipe 91. An air atmosphere is established in the processing vessel 10 (see “Air-purge (2)” in TABLE 1).
The interior of the processing vessel 10 may be exhausted by suction using the ejector 63, in place of exhausting via the pipe 91. In this case, the open-close valve V8 is opened to feed the air into the processing vessel 10 while the open-close valves V9, V10 are closed, and the open-close valve V13 is opened. Then, the open-close valve V16 is opened, and the ejector 63 is actuated (see “Exhaust by ejector” in TABLE 1).
Conventionally, a raw material gas oxygen (O2) to be fed to the ozone gas generator 41 is used to purge the ozone gas and the steam remaining in the ozone gas supply pipe 42, the ozone gas generator 41 and the processing vessel 10. Accordingly, the purging efficiency is low, and throughput cannot be improved. However, the first purging method makes it unnecessary to purge the interior of the ozone gas generator 41 with the oxygen, which makes it possible to efficiently purge the ozone gas and the steam remaining in the processing vessel 10, with a result of higher throughput.
Second Purging Method
After the O3/steam processing step has been completed, air is intermittently fed into the processing vessel 10 for a prescribed period of time to purge the ozone and the steam remaining in the processing vessel 10.
In this case, the air is fed: (i) from the air nozzles 54 through the second air supply pipe 53; (ii) from the ozone gas nozzles 43 through the air supply pipe 51B; or (iii) both from the air nozzles 54 and from the ozone gas nozzles 43.
(i) Feeding and stopping feeding of the air from the air nozzles 54 are performed by opening and closing V6 and V7, with the open-close valve V9 being opened and the sub open-close valve V10 being closed, after the open-close valves V1 and V4 have been closed to stop supplying the steam and the ozone gas. The open-close valves V6 and V7 are opened and closed by the CPU 100; the open-close valves V6 and V7 are opened for a prescribed period of time of, e.g., 20 seconds (see “Air-purge (1)” in TABLE 1), and closed for a prescribed period of time of e.g., 25 seconds (see “Stop feeding purge gas”, in TABLE 1). Such opening and closing operations are repeated a number of prescribed times, e.g., seven times.
(ii) Feeding and stopping feeding the air from the air supply pipe 51B are performed by opening and closing the open-close valve V8 with the open-close valve V9 being opened and the sub open-close valve V10 being closed, after the open-close valves V1 and V4 have been closed to stop supplying the steam and the ozone gas. The open-close valve V8 is opened and closed by the CPU 100; the open-close valve V8 is opened for a prescribed period of time of, e.g., 20 seconds (see “Air-purge (2)” in TABLE 1), and the open-close valve V8 is closed for a prescribed period of time of, e.g., 25 seconds (see “Stop feeding purge gas” in TABLE 1). Such opening and closing operations are repeated a prescribed number of times, e.g., seven times.
(iii) In the event that the air is supplied by means of both the air nozzles 54 and the ozone gas nozzles 43, the open-close valves V6, V7 and V8 are opened and closed with the open-close valve V9 being opened and the sub open-close valve V10 being closed, after the open-close valves V1 and V4 have been closed to stop supplying the steam and the ozone gas. The open-close valves V6, V7 and V8 are opened and closed by the CPU 100; the open-close valves V6, V7 and V8 are opened for a prescribed period of time of, e.g., 20 seconds (see “Air-purge (1)+(2)” in TABLE 1), and are closed for a prescribed period of time of, e.g., 25 seconds. Such opening and closing operations are repeated a prescribed number of times, e.g., 7 times.
Pressure in the processing vessel 10 increases to a pressure greater than an atmospheric pressure by feeding the air. The pressure in the processing vessel 10 is reduced after stopping feeding the air into the processing vessel. Preferably, the feed of the air restarts when the pressure in the processing vessel 10 is reduced to a pressure below the atmospheric pressure.
According to the second purging method, even if a gas in the processing vessel 10 should stagnate when the air is fed into the processing vessel 10, the stagnant gas is diffused when the air feeding is stopped, resulting in higher purging efficiency.
It should be noted that it is preferable but not absolutely necessary to stop feeding the air into the processing vessel 10. In other words, the purging process may be carried out by feeding the air at a first flow rate and feeding the air at a second flow rate lower than the first flow rate, alternately.
Preferably, the system is configured so that the air can be fed from the air supply source 55 through an open-close valve into the steam supply pipe 34. In such a case, ozone gas that has intruded into the steam supply pipe 34 also can be purged quickly.
After the wafers W have been processed by supplying the ozone gas and the steam into the processing vessel 10, air and steam are intermittently fed into the processing vessel 10 for a prescribed period of time to purge the processing vessel 10.
In this case, feeding and stopping feeding the steam is performed by opening and closing the open-close valve V1 with the open-close valve V9 being opened and the sub open-close valve V10 being closed, after the open-close valve V4 has been closed in order to stop feeding the ozone gas. The air feed is the same as in the above-described second process, and thus its explanation is not repeated herein. The open-close valve V1 is opened and closed by the CPU 100; the open-close valve V1 is opened for a prescribed period of time, e.g., 20 seconds (see “Steam/Air purge (1)”, “Steam/Air purge (2)” and “Steam/Air purge (1)+(2)” in TABLE 1), and is closed for a prescribed period of time of, e.g., 25 seconds (see “Stop feeding purge gas” in TABLE 1). Such opening and closing operations are repeated a prescribed number of times, e.g., seven times.
According to the third purging method, the ozone remaining in the processing vessel 10 is absorbed by the steam and is exhausted together with the steam, resulting in higher purging efficiency.
Similar to the second purging method, the third purging method may be carried out by feeding the steam/air at a first flow rate and feeding the steam/air at a second flow rate lower than the first flow rate, alternately.
When air feeding is stopped in the second purging method or when air/steam feeding is stopped in the third purging method, an atmosphere in the processing vessel 10 is sucked by means of the ejector 63.
The open-close valves V1, V6 and V7 are closed to stop feeding the air and the steam. Thereafter, the open-close valve V16 is opened in response to a control signal of the CPU 100 to actuate the ejector 63 while closing the open-close valves V9 and V10, and opening the open-close valve V13. Whereby, the steam, the ozone gas and the air present in the processing vessel is removed by suction (see “Stop feeding purge gas and exhaust by ejector” in TABLE 1).
The fourth purging method can decrease the period of time of the feed stop of the air (the air and the steam), resulting in higher purging efficiency.
The suction-exhaust by using the ejector 63 may be performed not only when the feed of the air (or the air and the steam) is stopped but also when the air (or the air and the steam) is fed into the processing vessel 10.
To perform the fifth purging process, a second air nozzle 59 for preventing stagnation is further provided in the processing vessel 10 as shown in FIG. 10. Air is injected from the air nozzles 54, thereby forming streams of the air in the processing vessel 10. However, it is possible that stagnation may occur in certain regions, such as corners of the interior of the processing vessel 10 and the gaps between the wafers W, those regions likely being unexposed to the main stream of air.
It is difficult to remove the ozone present in the region where the stagnation is present. To overcome this problem, the second air nozzle 59 jets the air to the region where the stagnation is present, or directs streams of air toward the region where the stagnation is present.
The stagnation preventing nozzle 59 shown in
The nozzle 59 is connected to the air supply source 55 through the air supply pipe 58 with an open-close valve V17 inserted therein. The open-close valve V17 is opened and closed in response to control signals from the CPU 100.
The fifth purging method can quickly diffuse the ozone gas in the processing vessel 10, resulting in higher purging efficiency.
To perform the sixth purging method, a rotatable air nozzle 54A shown in
The air nozzle 54A is rotatable on the longitudinal axis by rotary drive means disposed outside the processing vessel 10 to thereby vary an angle of the air injection port. The rotary drive means varies a direction of the air injection port 54a in response to a control signal from the CPU 100. The rotary drive means can be a motor, which can be rotated intermittently clockwise and counterclockwise in a prescribed angle range.
The sixth purging process can vary the air streams formed in the processing vessel 10, whereby the occurrences of stagnation at specific parts of the interior of the processing vessel 10 can be prevented.
The ozone gas nozzles 43 may be rotatable and may also be used to discharge the air therefrom.
To perform the seventh purging method, as shown in
The air nozzles 54B and 54C shown in
The seventh purging method can vary the condition of streams of the air formed in the processing vessel 10, whereby the occurrence of the stagnation can be prevented. The ozone gas nozzle 43 may be arranged to inject the air, and a flow rate of the air to be injected from the ozone gas nozzle 43 may be made variable by means of a flow rate adjusting valve.
Experiments were made to confirm changes of the purging efficiency of the purging methods. The wafer temperature increasing step, the pre-pressuring step (3 minutes) and the O3/steam processing step (10 seconds) were followed by the 8 minute-purging processes of a Control and Examples 1 to 4.
Control:
After stopping energizing the ozone gas generator 41, oxygen gas was fed into the ozone gas generator 41 from the oxygen gas source for 2 minutes to feed the oxygen gas into the processing vessel 10 through the ozone gas supply pipe 42.
Thereafter, the internal atmosphere of the processing vessel 10 was sucked by means of the ejector 63 for 2 minutes with the open-close valves V1, V4, V6, V8, V9, V10 and V14 being closed and the open-close valves V13 and V16 being opened. Thereby, the pressure in the processing vessel 10 was reduced to a pressure slightly below the atmospheric pressure.
Thereafter, the open-close valves V1, V4, V8, V13 and V14 were closed, and the open-close valves V6, V7, V9 and V10 were opened, thereby purging the processing vessel 10 with cool dry air for 4 minutes.
The processing apparatus was set to be in the condition “air-purge (1)+(2)” shown in Table 1 for 15 seconds. Next, the open-close valves V7 and V8 were closed for 20 seconds to stop feeding the air, and then open-close valves V7 and V8 were opened for 15 seconds. Opening and closing operations of the open-close valves V7 and V8 were performed alternately and repeatedly.
The processing apparatus was set to be in the condition “air-purge (1)+(2)” shown in Table 1 for 25 seconds. Next, the open-close valves V7 and V8 were closed for 25 seconds to stop feeding the air, and then open-close valves V7 and V8 were opened for 15 seconds. Opening and closing operations of the open-close valves V7 and V8 were performed alternately and repeatedly.
The processing apparatus was set to be in the condition “air-purge (1)+(2)” shown in Table 1 for 25 seconds. Next, the open-close valves V7 and V8 were closed for 25 seconds to stop feeding the air, and then open-close valves V7 and V8 were opened for 15 seconds. Opening and closing operations of the open-close valves V7 and V8 were performed alternately and repeatedly.
The processing apparatus was set to be in the condition “steam/air-purge (1)+(2)” shown in Table 1 for 4 seconds. Next, the processing apparatus was set to be in the condition “air-purge (1)+(2)” shown in Table 1 for 16 seconds. Next, the open-close valves V7 and V8 were closed for 25 seconds to stop feeding the air. Then, the processing apparatus was set to be in the condition “steam/air-purge (1)+(2)” again. These operations were performed in the above-mentioned order, repeatedly.
The volume of the processing vessel 10 was 44.6 liters.
In the Control, the O2 feeding rate was 10 L/min (liters per minute).
In Examples 1 and 2, the air feeding rate of “air-purge (1)” was 80 L/min.
In Examples 3 and 4, the air feeding rate of “air-purge (1)” was 140 L/min.
In Examples 1 to 4, the air feeding rate “air-purge (2)” was 40 L/min.
In Example 4, the steam feeding rate was 100 ml/min, and the temperature of the steam was 120° C.
As shown in
However, Examples 1 to 4 could decrease the ozone gas concentrations in the processing vessel to below the tolerable value in 8 minutes.
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