SUBSTRATE STRIP AND COMPACT CAMERA MODULE UTILIZING THE SAME

Abstract

A substrate strip includes a plurality of substrate units. A plurality of fingers is disposed in the substrate units. At least one of the corners of the fingers has a lead angle. A plurality of milling slots is formed on the peripheries of the substrate units and exposes out of the exposed sides of the fingers. The lead angles are adjacent to the exposed sides and can reduce the formation of burrs on the fingers during the formation of the milling slots. In another embodiment, a plurality of pads is provided if the fingers fail to be adjacent to the milling slots. Likewise, at least one of the corners of the pads also has a lead angle so as to reduce the formation of burrs on the pads during formation of the milling slots.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of a substrate strip according to the present invention.

FIG. 2 is an enlarged view of a substrate unit of FIG. 1 according to the first embodiment of the present invention.

FIG. 3 is an enlarged view of a portion of the substrate of FIG. 2.

FIG. 4 is a cross-sectional view of a compact camera module utilizing the substrate unit of FIG. 2 according to the present invention.

FIG. 5 is an enlarged view of a substrate unit of FIG. 1 according to the second embodiment of the present invention.

FIG. 6 is an enlarged view of a portion of the substrate of FIG. 5.

Claims

1. A substrate strip, comprising: a plurality of substrate units;a plurality of first metal layers disposed on the substrate units;at least one lead angle formed on at least one of the corners of the first metal layers; anda plurality of milling slots formed on the edges of the substrate units,wherein one of the sides of the first metal layer adjacent to the lead angle is exposed out of the milling slot.

2. The substrate strip as claimed in claim 1, wherein each of the substrate units has an outer connecting surface, and the first metal layers are exposed out of the outer connecting surfaces.

3. The substrate strip as claimed in claim 1, wherein the lead angles of the first metal layers located in the same side of the substrate unit face the same direction.

4. The substrate strip as claimed in claim 1, wherein the milling slots are u-shaped.

5. The substrate strip as claimed in claim 1, wherein the length of the exposed side of the first metal layer is smaller than the width of the first metal layer and greater than the widths of a plurality of traces deployed on the substrate units.

6. The substrate strip as claimed in claim 1, further comprising: a plurality of second metal layers disposed on the substrate units, electrically connecting with the first metal layers.

7. The substrate strip as claimed in claim 6, wherein each of the substrate units has an outer connecting surface, and the first metal layers are exposed out of the outer connecting surfaces.

8. The substrate strip as claimed in claim 7, wherein the second metal layers are exposed out of the outer connecting surfaces.

9. The substrate strip as claimed in claim 6, wherein the lead angles of the first metal layers located in the same side of the substrate unit face the same direction.

10. The substrate strip as claimed in claim 6, wherein the milling slots are u-shaped.

11. The substrate strip as claimed in claim 6, wherein the length of the exposed side of the first metal layer is smaller than the width of the first metal layer and greater than the widths of a plurality of traces deployed on the substrate units.

12. A compact camera module, comprising: a substrate unit;a plurality of first metal layers disposed on the substrate unit, wherein one side of the first metal layer is exposed out of the edge of the substrate unit;at least one lead angle formed on at least one of the corners of the first metal layers and disposed on the exposed sides of the first metal layers; anda sensor chip disposed on the substrate unit.

13. The compact camera module as claimed in claim 12, wherein the substrate unit has a device surface and an outer connecting surface, the sensor chip is disposed on the device surface, the first metal layers are exposed out of the outer connecting surface.

14. The compact camera module as claimed in claim 12, further comprising: a soft circuit board connected to the first metal layers.

15. The compact camera module as claimed in claim 12, wherein the lead angles of the first metal layers located in the same side of the substrate unit face the same direction.

16. The compact camera module as claimed in claim 12, wherein the length of the exposed side of the first metal layer is smaller than the width of the first metal layer and greater than the widths of a plurality of traces deployed on the substrate units.

17. The compact camera module as claimed in claim 12, further comprising: a plurality of second metal layers disposed on the substrate unit, electrically connecting with the first metal layers.