Patent Application
20110262769
This application claims all benefits accruing under 35 U.S.C. §119 from China Patent Application No. 201010154147.8, filed on Apr. 23, 2010, in the China
Intellectual Property Office, disclosure of which is incorporated herein by reference. This application is related to an application entitled, “SURFACE HARDENED SUBSTRATE AND METHOD MAKING SAME,” filed **** (Atty. Docket No. U.S.30313).
1. Technical Field
The present disclosure relates to a surface hardened substrate and a method for making the same.
2. Description of Related Art
An enhanced film generally is disposed on a surface of a substrate such as a watch shell, an eyeglass frame, a mobile telephone, or a computer, to protect the substrate from being scratched. The enhanced film can have a high wearing resistance, and a high mechanical hardness.
However, the enhanced film such as chromium carbide (CrC) film, or chromium nitride (CrN) film, is brittle. There is a low bonding tension between the enhanced film and the substrate such that the enhanced film is prone to get broken off from the substrate.
What is needed, therefore, is to provide a surface hardened substrate with an enhanced film disposed thereon and a method making the surface hardened substrate, in which the enhanced film is difficult to break off from the substrate.
Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
The base 10 can be a watch shell, an eyeglass frame, a mobile telephone, or a computer. The base 10 can be a metal-based base such as a magnesium-based base, an aluminum-based base, or an iron-based base. The base 10 can be a composite-based base including a metal complex. In one embodiment, the base 10 is steel-based.
The enhanced film 20 can cover the surface of the base 10 and protect the base 10 from being eroded or scratched. The enhanced film 20 can have a thickness greater than about 200 nanometers. In one embodiment, the enhanced film 20 has a thickness from about 500 nanometers to about 5 micrometers. The enhanced film 20 can be a multilayer structure. The enhanced film 20 can include a transition layer 21 disposed on the surface of the base 10, and a hard layer 22 disposed on the transition layer 21.
The transition layer 21 is substantially sandwiched between the base 10 and the hard layer 22 to improve an adhesion between the base 10 and the hard layer 22.
The transition layer 21 can include nickel (Ni) and chromium (Cr). The nickel can be a composite with chromium to form a Ni—Cr alloy. Alternatively, the transition layer 21 can be an alloy based on the nickel and the chromium. The nickel has good tenacity, and stability in high temperature, and good adhesion with the base 10. The chromium can improve the mechanical hardness of the transition layer 21. The nickel in the transition layer 21 can have a weight percent from about 20 percent to about 80 percent, and can have a thickness from about 100 nanometers to about 3 micrometers. In one embodiment, to improve an adhesion between the base 10 and the enhanced film 20 and save a cost of the transition layer 21, the weight percent of the nickel is about 60 percent, and the thickness of the transition layer 21 is about 150 nanometers.
The hard layer 22 can be disposed on a surface of the transition layer 21 away from the base 10. The hard layer 22 can include nickel, chromium, and nitrogen (N) or carbon (C). The nickel and the chromium can be a composite with nitrogen or carbon to form a Ni—Cr—N alloy, a Ni—Cr—C alloy, or a Ni—Cr—N—C alloy. In one embodiment, the hard layer 22 is a Ni—Cr—N—C alloy layer. A hard phase can be formed by nitrogen or carbon with nickel and chromium to improve mechanical hardness and wear resistance of the hard layer 22. Both the transition layer 21 and the hard layer 22 can have nickel and chromium, thus, the transition layer 21 and the hard layer 22 can be adhered together tightly. A thickness of the hard layer 22 can be designed as practical application. In one embodiment, the thickness of the hard layer 22 is in a range from about 100 nanometers to about 3 micrometers. Weight percents of nickel, chromium, and nitrogen or carbon can be designed as practical application. The nitrogen in the hard layer 22 can have a weight percent from about 1 percent to about 50 percent, the carbon in the hard layer 22 can have a weight percent from about 1 percent to about 50 percent. The weight percent of the nitrogen plus the weight percent of the carbon can be of about 1 percent to about 90 percent. In one embodiment, the hard layer 22 obtains excellent adhesion with the transition layer 21 and high mechanical hardness, if the weigh percent of nickel is about 62 percent, the weight percent of chromium is about 16 percent, the weight percent of carbon is about 12 percent, and the weight percent of nitrogen is about 10 percent.
The transition metals in the transition layer 21 and the hard layer 22 cannot be limited. If only two kinds of the transition metals can be contained in the transition layer 21 and the hard layer 22. The transition metals in the transition layer 21 are substantially the same as the transition metals in the hard layer 22. The transition metals can also be rhodium, cobalt, manganese, titanium, tungsten, palladium, cadmium, zirconium, or combinations thereof. One of the at least two kinds of the transition metals, such as nickel, or titanium, can have an excellent adhesion with the base 10. The other one of the two kinds of the at least two kinds of transition metals, such as tungsten, or chromium, can form a hard phase with the nonmetal to improve the mechanic hardness and the wearing resistance of the enhanced film 20.
The enhanced film 20 can be firmly fixed on the base 10, due to the excellent adhesion of the transition layer 21. Thus, the enhanced film 20 can be tightly adhered to the base 10. The hard layer 22 having high mechanical hardness and high wearing resistance can protect the base 10 from being scratched. In addition, both the transition layer 21 and the hard layer 22 can have the at least two kinds of transition metals such as nickel and chromium therein, therefore, a thermal expansion coefficient of the transition layer 21 can be substantially equal to a thermal expansion coefficient of the hard layer 22. A Young's modulus of the transition layer 21 can be similar to a Young's modulus of the hard layer 22. When a temperature of the surface hardened substrate 100 is changed, a volume of the enhance film 20 will change with the temperature. A deformation of the transition layer 21 can be substantially equal to a deformation of the hard layer 22, thus, an intensity of internal stress formed in the enhanced film 20 can be decreased. Thus, the enhanced film 20 can be difficult to brake off from the base 10.
Referring to
A depth profiling analysis of the surface hardened substrate 100 in
One embodiment of a method for making the surface hardened substrate 100 in
In step S10, the base 10 can be cleaned. The cleaning can be performed by the following steps: S11, cleaning a surface of the base 10 with an ultrasonic in a solvent; and S12, plasma cleaning the base 10 with an inert gas in a vacuum environment.
In step S11, the solvent can be an organic solvent such as an acetone or an ethanol. In steps S12, the vacuum environment can be supplied by a chamber in a sputtering equipment. The inert gas can be argon or helium dispersed in the chamber. In one embodiment, the base 10 can be received in the sputtering equipment having a vacuum degree of about 3*10−5 Torres. The base 10 is bombarded with the pure argon in the sputtering equipment from about 3 minutes to about 10 minutes.
In step S20, the base 10 can have a temperature from about 100 degrees to about 200 degrees, to make the transition layer 21 firmly disposed on the base 10. The transition layer 21 can be formed on the base 10 by means of sputtering and formed by following step: S21, bombarding a sputtering alloy target including the at least two kinds of transition metals and forming the transition layer 21 on the surface of the substrate 100.
In step S21, the sputtering alloy target can be a Ni—Cr alloy target including nickel and chromium. The nickel in the Ni—Cr alloy target can have a weight percent from about 20 percent to about 80 percent. When the Ni—Cr alloy target is turned on for about 20 minutes to about 60 minutes, a Ni—Cr alloy layer having a thickness from about 100 nanometers to about 3 micrometers can be formed on the surface of the base 10.
In step S30, the hard layer 22 can be formed by means of sputtering and disposed by following steps: S31, introducing a carbonaceous gas and a nitrogenous to the transition layer 21; and S32, bombarding a sputtering alloy target that comprises the material of at least two transition metals.
In step S31, the carbonaceous gas can be acetylene or methane. The nitrogenous gas can be a nitrogen gas or an ammonia gas. In one embodiment, the carbonaceous gas is the acetylene, and the nitrogenous gas is the nitrogen gas.
In step S32, the at least two kinds of transition metals can react with the carbonaceous gas and the nitrogenous gas to form an alloy deposited on the transition layer 21. In one embodiment, the sputtering alloy target is the Ni—Cr alloy target, the nickel and the chromium can react with the carbonaceous gas and the nitrogenous to form a Ni—Cr—N—C alloy. The Ni—Cr—N—C alloy can be deposited on the transition layer 21 to form the hard layer 22.
Depending on the embodiment, certain of the steps of methods described may be removed, others may be added, and the sequence of steps may be altered. It is also to be understood that the description and the claims drawn to a method may include some indication in reference to certain steps. However, the indication used is only to be viewed for identification purposes and not as a suggestion as to an order for the steps.
It is to be understood that the above-described embodiments are intended to illustrate rather than limit the present disclosure. Any elements described in accordance with any embodiments is understood that they can be used in addition or substituted in other embodiments. Embodiments can also be used together. Variations may be made to the embodiments without departing from the spirit of the disclosure. The above-described embodiments illustrate the scope, but do not restrict the scope of the disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201010154147.8 | Apr 2010 | CN | national |
