Patent Application
20200158502
This application claims priority to Taiwan Application Serial Number 107140914, filed Nov. 16, 2018, which are herein incorporated by reference.
The present disclosure relates to a surface measuring device and a surface measuring method.
With the advancement of technology, more and more electronic products use transparent materials (e.g., glass or acrylic) as product components (e.g., mobile phone panels, mobile phone cases or lenses). In order to ensure quality, the product components can be measured by a measuring device to obtain their surface topography. However, measuring transparent components has technical difficulties. For example, the transparent material has a low reflectivity. To measure a sufficiently accurate transparent component image, it is necessary to increase the exposure time or light source intensity of the transparent component. If the interior or surface of the transparent component has sputum or particles measured by a measurement device, it may cause a wrong result about misjudged signal. In addition, if the surface of the transparent component is a curved surface, it is easy to be affected by a deviation of the surface of the object to be measured by the inclination of the surface of the object to be measured, which leads to a situation in which the height measurement is misjudged.
With the above technical problems, the prior art attempts to use a coordinate measuring machine and spray non-transparent particles (e.g., titanium dioxide particles) to attempt to reconstruct the three-dimensional topography of the product components. However, the time and money cost of the coordinate measuring machine is too high, and spraying non-transparent particles is easy to damage the product component body. Therefore, people in the field want to find a lower cost, fast and effective measurement of product components.
According to an embodiment of the present disclosure, a surface measuring device is used to measure a surface of an object. The surface measuring device includes an airflow generator, a light emitting device and a light sensor. The airflow generator is configured to inject a vapor flow onto the object and generating a condensing layer on the surface of the object. The light emitting device is configured to project a light toward the condensing layer. The light sensor is located on the object and configured to receive the light scattered by the condensing layer.
In some embodiment, the airflow generator further includes a temperature regulator, a humidity regulator and a wind speed regulator. The temperature regulator is configured to control a temperature of the vapor flow. The humidity regulator configured to control a humidity of the vapor flow. The wind speed regulator is configured to control a wind speed of the vapor flow.
In some embodiment, an included angle between a direction of the vapor flow generated by the airflow generator and a direction of the light generated by the light emitting device is an acute angle.
In some embodiment, the condensing layer further includes a plurality of water particles. Each of the water particles has a radius ranging from 0.1 μm to 100 μm.
According to another embodiment of the present disclosure, a surface measuring device is used to measure a surface of an object. The surface measuring device includes an airflow generator, a platform, a light emitting device and a light sensor. The airflow generator is configured to inject a vapor flow. The platform is configured under the airflow generator to support the object. The platform is used to transfer the object through the airflow generator, and a condensing layer is formed on the surface of the object. The light emitting device is located on the platform and configured to project a light toward the condensing layer. The light sensor is located on the platform and configured to receive the light scattered by the condensing layer.
In some embodiment, the airflow generator further includes a temperature regulator, a humidity regulator and a wind speed regulator. The temperature regulator is configured to control a temperature of the vapor flow. The humidity regulator configured to control a humidity of the vapor flow. The wind speed regulator is configured to control a wind speed of the vapor flow.
In some embodiment, the platform further includes a moving member. The moving member is configured to move the object below the airflow generator at a first time, and the moving member is configured to move the object below the light emitting device at a second time.
In some embodiments, there is no cooling device at a first location during the first time. The first location is located on the platform.
According to an embodiment of the present disclosure, a surface measuring method is used to measure a surface of an object through a platform having a moving member to transfer the object. The surface measuring method includes following steps. Inject a vapor flow onto the surface to form a condensing layer on the surface by using the airflow generator. Project a light toward the condensing layer by using the light emitting device. Receive the light scattered by the condensing layer by using a light sensor.
In some embodiment, the surface measuring method further includes following steps. Control a temperature and a humidity of the vapor flow to causing a dew point of the vapor flow to be higher than a temperature of the object. Control a wind speed of the vapor flow.
In some embodiment, the light scattered by the condensing layer is a light of Mie scattering.
In summary, the surface measuring method and the surface measuring device proposed in the present disclosure have many advantages over the prior art. Firstly, the surface of the object to be measured is shielded by the condensing layer, so that the surface measuring method and the surface measuring device can measure the transparent object, thereby effectively preventing the light from penetrating the object and causing the photosensitive element to receive a large amount of background noise. Secondly, by controlling the particle size of the liquid particles in the condensing layer and selecting the light of the appropriate wavelength, the light is scattered by the condensing layer, so that the surface measuring method and the surface measuring device can measure the surface with the bending. Effectively avoiding the problem that the photosensitive element cannot receive the signal because of the light excessively deflected on the bent surface.
The following embodiments are disclosed with accompanying diagrams for detailed description. For illustration clarity, many details of practice are explained in the following descriptions. However, it should be understood that these details of practice do not intend to limit the present invention. That is, these details of practice are not necessary in parts of embodiments of the present invention. Furthermore, for simplifying the drawings, some of the conventional structures and elements are shown with schematic illustrations. Also, the same labels may be regarded as the corresponding components in the different drawings unless otherwise indicated. The drawings are drawn to clearly illustrate the connection between the various components in the embodiments, and are not intended to depict the actual sizes of the components.
Please refer to
As illustrated in
A specific configuration of each device employed in the surface measuring method 100 will be described later with reference to the drawings. For the purpose of explanation, please refer to
As illustrated in
In this embodiment, the platform 220 can have a moving member. The moving member can be located under the airflow generator 210 and the light emitting device 230. The object 300 is at a position above the moving member. As illustrated in
As illustrated in
In this embodiment, the airflow generator 210 can be various devices that generate airflow (such as a fan, a pneumatic pump, etc.) and configured to manufacture gas convection near the surface 310 of the object 300. After the vapor flow 211 contacts the surface 310, a portion of the vapor in the vapor flow 211 condenses above the surface 310 and form a plurality of liquid particles, which in turn constitute the condensing layer 311.
In this embodiment, the vapor flow 211 includes water steam. After the vapor flow 211 contacts the surface 310, the water steam in the vapor flow 211 condenses into liquid water droplets, and the water droplets form the condensing layer 311. In other embodiments, the vapor flow 211 can also include vapors of different materials. In some embodiments, substances (such as water, inert particles, micro-metal particles, etc.) that have less influence on the object 300 can be used. Alternatively, a substance which is more easily removed from the surface 310 of the object 300, such as various organic solvents (e.g., methyl ether, ethanol, etc.) can be used.
In this embodiment, there is no cooling device at the first location during the first time to the second time. That is, at the first location, the object 300 do not require additional cooling, and the condensing layer 311 can still be formed over the surface 310 of the object 300. Specifically, it is only necessary to monitor the ambient temperature and adjust the parameters of the airflow generator 210 (e.g., the humidity and the temperature of the vapor flow 211) to achieve the effect of generating a condensing layer 311 on the surface 310 of the object 300. In the absence of a cooling device, the time taken for the entire surface detecting method 100 is saved.
In this embodiment, in addition to the different materials to form the condensing layer 311, the airflow generator 210 can adjust a temperature and pressure of the vapor flow 211, thereby controlling the properties of the condensing layer 311. For example, the properties of the condensing layer 311 include a number of the liquid particles, distribution of liquid particles and particle sizes of each liquid particle (e.g., radius of the particles), and the like.
Specifically, please refer to
In some embodiments, the temperature regulator 212 can include a heater. The heater is configured to increase the temperature of the vapor flow 211. Specifically, the temperature of the vapor flow 211 is larger than a temperature of the surface 310 of the object 300. Through the structure above, when the vapor flow 211 contacts the surface 310, the temperature of the vapor flow 211 is reduced by the surface 310, and the vapor in the vapor flow 211 is more easily condensed into liquid particles and attached to the surface 310. It can effectively increase the formation rate of liquid particles of the condensing layer 311.
In some embodiments, the humidity regulator 213 can include an evaporator such that the pressure of a particular substance in vapor flow 211 is greater than the pressure of that particular substance in the environment. In this embodiment, the humidity regulator 213 evaporates the liquid water so that the humidity of the vapor flow 211 is increased. Since the vapor flow 211 includes a relatively high humidity, the vapor in the vapor flow 211 is more likely to condense into liquid particles and attached to the surface 310, and the formation rate of the liquid particles in the condensing layer 311 can be effectively increased.
In some embodiments, the temperature and humidity of the vapor flow 211 can be respectively controlled by the temperature regulator 212 and the humidity regulator 213, so that the dew point temperature of the vapor flow 211 is larger than the temperature of the object 300. Therefore, the condensing layer 311 is formed on the surface 310 of the object 300.
In some embodiments, the wind speed regulator 214 can include a fan. By adjusting the rotating speed of the fan, the wind speed of the vapor flow 211 can be adjusted. When the flow rate of the vapor flow 211 is large, convection of the vapor flow 211 near the surface 310, and thereby the formation and evaporation rate of the liquid particles in the condensing layer 311 are affected. In some embodiments, the wind speed regulator 214 can also include an airflow integration module such that the vapor flow 211 exits the airflow generator 210 with a uniform flow rate throughout, thereby controlling the distribution of liquid particles on the surface 310.
As described in paragraph above, by using the temperature regulator 212, the humidity regulator 213 and the wind speed regulator 214 of the airflow generator 210 to adjust the properties of the vapor flow 211, the formation rate of the liquid particles in the condensing layer 311 can be change. In this case, it is only necessary to control the time at which the vapor flow 211 contacts the surface 310 and the amount of liquid particles in the condensing layer 311 and the particle size can be controlled.
For example, the longer the object 300 remains under the airflow generator 210, the greater the number of liquid particles in the condensing layer 311 and the larger the particle size of the liquid particles of the condensing layer 311. In this embodiment, the time at which the object 300 remains below the airflow generator 210 can be determined only by controlling the speed at which the moving member of the platform 220 moves the object 300. In some embodiments, the time during which the vapor flow 211 contacts the surface 310 can also be controlled by turning the airflow generator 210 on and off.
Please refer to
In this embodiment, by controlling the particle sizes of the liquid particles in the condensing layer 311, the interference phenomenon that occurs when the light 231 is incident on the condensing layer 311 can be controlled. Specifically, the interference phenomenon can be transmission, reflection, refraction or scattering, and the like.
Specifically, please refer to
In this embodiment, by controlling the wavelength λ of the light 231 and the particle size R of the liquid particles in the condensing layer, Mie scattering occurs in the light 231 incident on the condensing layer 311. Specifically, the light 231 can be ultraviolet light, visible light or infrared light, and the particle sizes R of the liquid particles in the condensing layer 311 can be between about 0.1 μm and 100 μm. In some embodiments, the particle sizes R of the liquid particles can be controlled to about 4 μm, and the scattered light has uniform and high intensity, which can further improve the accuracy of the surface measuring device 200.
In some embodiments, the light emitting device 230 and the light sensor 240 are integrated into a module and are movable relative to the platform 220. That is, only the light 231 emitted by the light emitting device 230 is projected onto the surface 310 of the object 300 in
In this embodiment, when the light 231 is swept across the surface 310 of the object 300, the light sensor 240 can transmit the received light intensity signals to an outer processor, and the processor can rebuild the three-dimensional image information based on the light intensity signals. According to the rebuilding result, it can be determined whether the contour of the surface 310 of the object 300 is reasonable. Therefore, the surface measuring device 200 has successfully completed all the steps in the surface measuring method 100.
In summary, this disclosure provide a surface measuring method 100 used to measure the surface 310 of the object 300 and a surface measuring device 200 used to perform surface measuring method 100. After completing all the steps in the surface measuring method 100, the contour information of the surface 310 of the object 300 is provided.
Compared with prior arts, the surface measuring method 100 and the surface measuring device 200 have various advantages. First, the object 300 is covered by the condensing layer 311, so that the surface measuring method 100 and the surface measuring device 200 can measure the transparent object 300, effectively preventing the light 231 from penetrating the object 300 and being reflected by the platform 220, and it prevents the light sensor 240 receives a large amount of background noise caused by the reflection from the platform 220. Next, by controlling the particle sizes R of the liquid particles in the condensing layer 311 and selecting the light 231 of the appropriate wavelength λ, the light 231 and the condensing layer 311 are subjected to Mie scattering, and the surface measuring method 100 and the surface measuring device 200 can measure the object 300 having the bent surface 310. It effectively avoids the problem that the light 231 is excessively deflected on the bent surface 310 and the light sensor 240 cannot receive the signal. Finally, in the structure of the surface measuring device 200, multiple objects 300 can be continuously placed on the platform 220, and the surface measuring method 100 can be continuously executed, and a large number of objects can be measured under the condition of low time cost and low cost. 300. By contrast, conventional techniques can only measure object in a sampled manner.
As described above, the surface measuring device 200 is an example implementing surface measuring method 100. Those skilled in the art can design different systems to implement the surface measuring method 100 in accordance with practical needs. For example, please refer to
As illustrate in
The airflow generator 410 in
In addition, the light emitting device 430 and the light sensor 440 are respectively similar to the light emitting device 230 and the light sensor 240 in
The surface measuring device 400 in
In summary, the surface measuring device 400 can be used to measure the transparent object 300 or to measure the object 300 having the curved surface 310. The object 300 in the surface measuring device 400 is placed on the platform 420, and it has the advantage of high stability. In addition, the surface measuring device 400 has a small volume, and it has the advantage of saving space.
In some embodiments, in order to further control the properties of the condensing layer 311 on the surface 310, various airflow generators 410 can be configured on the platform 420. Specifically, please refer to
As illustrated in
The surface measuring device 400a can also be used to perform surface measuring method 100, and the flow of performing the surface measuring method 100 using the surface measuring device 400a is the same as that of the surface measuring device 400. Further, in addition to all the advantages of the surface measuring device 400, the surface measuring device 400a can control the properties of the condensing layer 311 in a more detailed manner since one airflow generator 410 is provided. For the remaining advantages, please refer to the previous paragraph, which will not be repeated.
Some embodiments of this disclosure have been described by the foregoing examples and embodiments, and it should be understood that this disclosure is not limited to the disclosed embodiments. On the contrary, the present invention is intended to include a variety of modifications and approximate designs (as would be apparent to those of ordinary skill in the art). Therefore, additional claims should be based on the broadest interpretation to include all such modifications and designs.
| Number | Date | Country | Kind |
|---|---|---|---|
| 107140914 | Nov 2018 | TW | national |
