SURFACE PROTECTIVE FILM PEELING METHOD AND SURFACE PROTECTIVE FILM PEELING APPARATUS

Abstract

A surface protective film peeling method for peeling off a surface protective film (11) attached on the surface of a wafer (20) is disclosed. The wafer is supported on a movable table (31) with the surface protective film directed up, and an incision (15) is formed at one end (28) of the surface protective film along the surface of the wafer, the peeling tape is attached on the front surface of the portion in which the incision is formed, at one end of the surface protective film, the movable table is moved in the direction toward the one end from the other end (29) of the wafer, and the surface protective film is thus peeled off from the front surface of the wafer. As a result, the surface protective film can be peeled without causing cuts or cracks, etc. in the wafer. Also, in the case where the movable table is moved while holding the portion in which the incision is formed, the surface protective film can be peeled off without using the peeling tape.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram showing a surface protective film peeling apparatus according to this invention.

FIG. 2 is a partly enlarged view of the forward end of the incision forming unit.

FIG. 3 is a detailed diagram showing the incision forming portion.

FIG. 4 is a partly enlarged top plan view of the wafer.

FIG. 5 is a partly enlarged view of a surface protective film peeling apparatus according to this invention.

FIG. 6 a is a partly enlarged view showing the incision forming operation of the surface protective film peeling apparatus according to this invention.

FIG. 6 b is another partly enlarged view showing the incision forming operation of the surface protective film peeling apparatus according to this invention.

FIG. 7 a is a partly enlarged view showing the peeling operation of the surface protective film peeling apparatus according to this invention.

FIG. 7 b is a partly enlarged view showing the peeling operation of the surface protective film peeling apparatus according to this invention.

FIG. 7 c is a partly enlarged view showing the peeling operation of the surface protective film peeling apparatus according to this invention.

FIG. 8 is a partly enlarged view showing the surface protective film peeling apparatus according to another embodiment of this invention.

FIG. 9 is an enlarged sectional view of the wafer with the surface protective film attached thereon.

FIG. 10 is a top plan view of a wafer integrated with a mount frame.

FIG. 11 is a sectional view showing the state in which the peeling tape is attached on the surface protective film of the wafer according to the prior art.

Claims

1. A surface protective film peeling method for peeling the surface protective film attached on the front surface of a wafer, comprising the steps of: supporting the wafer on a movable table with the surface protective film directed up;forming an incision into the thickness of the surface protective film at one end of surface protective film along the surface of the wafer;attaching the peeling tape on the portion of the surface protective film, in which the incision is formed, at the one end; andmoving the movable table in the direction toward the one end from the other end of the wafer to peel off the surface protective film from the front surface of the wafer.

2. A surface protective film peeling method for peeling the surface protective film attached on the front surface of a wafer, comprising the steps of: supporting the wafer on a movable table with the surface protective film directed up;forming an incision into the thickness of the surface protective film at one end of surface protective film along the surface of the wafer;holding the portion of the surface protective film in which the incision is formed; andmoving the movable table in the direction toward the one end from the other end of the wafer to peel off the surface protective film from the front surface of the wafer.

3. A surface protective film peeling apparatus for peeling the surface protective film attached on the front surface of a wafer, comprising: a movable table for supporting the wafer with the surface protective film directed up and adapted to move in the horizontal direction;an incision forming means for forming an incision into the thickness of the surface protective film at one end of the surface protective film along the front surface of the wafer; anda peeling tape attaching means for attaching the peeling tape on the portion of the surface protective film, in which the incision is formed, at the one end of the surface protective film;wherein the surface protective film is peeled off from the front surface of the wafer by moving the movable table in the direction toward the one end, from the other end of the wafer, after attaching the peeling tape.

4. A surface protective film peeling apparatus for peeling the surface protective film attached on the front surface of a wafer, comprising: a movable table for supporting the wafer with the surface protective film directed up and adapted to move in the horizontal direction;an incision forming means for forming an incision into the thickness of the surface protective film at one end of the surface protective film along the front surface of the wafer; anda holding means for holding the portion of the surface protective film in which the incision is formed;wherein the surface protective film is peeled off from the front surface of the wafer by moving the movable table in the direction toward the one end, from the other end of the wafer, after holding the portion in which the incision is formed, by the holding means.

5. A surface protective film peeling apparatus according to claim 3 or 4, wherein the incision forming means can be moved in vertical direction.

6. A surface protective film peeling apparatus according to claim 3 or 4, wherein the incision forming means includes a cutting edge portion and a positioning means for setting the forward end of the cutting edge portion in position.

7. A surface protective film peeling apparatus according to claim 6, wherein the incision forming means is arranged rotatably around the horizontal axis,wherein the cutting edge portion is located under a cover of the incision forming means at the time of using the surface protective film peeling apparatus, andat the time of replacing the cutting edge portion, the incision forming means is rotated around the horizontal axis and the cutting edge portion thereby comes to be located above the cover.

8. A surface protective film peeling apparatus according to claim 4, wherein the holding means is formed integrally with the incision forming means.