Apparatus for placing on an insulating substrate

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CPC
H01L21/67132

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67132Apparatus for placing on an insulating substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer taping apparatus and method
- Patent number 12,368,063
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Yi Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tape affixing apparatus
- Patent number 12,368,064
- Issue date Jul 22, 2025
- Tokyo Seimitsu Co., Ltd.
- Kiyotaka Kizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for separating semiconductor chip and method for separati...
- Patent number 12,341,033
- Issue date Jun 24, 2025
- LG Chem, Ltd.
- Eun Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet pasting device and sheet pasting method
- Patent number 12,341,034
- Issue date Jun 24, 2025
- Lintec Corporation
- Yoshiaki Sugishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device
- Patent number 12,341,035
- Issue date Jun 24, 2025
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer release stack for light induced transfer of components
- Patent number 12,319,042
- Issue date Jun 3, 2025
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Rob Jacob Hendriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
De-tape tool
- Patent number 12,322,615
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen Liang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer expander for uniformly expanding gap between dies, and die su...
- Patent number 12,322,614
- Issue date Jun 3, 2025
- Semes Co., Ltd.
- Do Youn Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus
- Patent number 12,308,262
- Issue date May 20, 2025
- Disco Corporation
- Takashi Uchiho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip ejector
- Patent number 12,308,263
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Hyeok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus and bonding system
- Patent number 12,300,516
- Issue date May 13, 2025
- YAMAHA ROBOTICS HOLDINGS CO., LTD.
- Hiroshi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system
- Patent number 12,300,524
- Issue date May 13, 2025
- Tokyo Electron Limited
- Yoshifumi Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanding method and expanding apparatus
- Patent number 12,300,544
- Issue date May 13, 2025
- Disco Corporation
- Jinyan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape roll and tape mounter
- Patent number 12,293,931
- Issue date May 6, 2025
- Disco Corporation
- Yoshinori Kakinuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,288,700
- Issue date Apr 29, 2025
- Kabushiki Kaisha Toshiba
- Shinsuke Kozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mass transfer of mini light-emitting diodes (mini-LEDs)...
- Patent number 12,289,932
- Issue date Apr 29, 2025
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and display device manufact...
- Patent number 12,278,223
- Issue date Apr 15, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Yosuke Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-bonding machine
- Patent number 12,272,584
- Issue date Apr 8, 2025
- SHENZHEN XINYICHANG TECHNOLOGY CO., LTD
- Xinrong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system and component mounting method
- Patent number 12,261,070
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die pickup apparatus
- Patent number 12,255,083
- Issue date Mar 18, 2025
- SK hynix Inc.
- Jae Yeong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding system with heated automatic collet changer
- Patent number 12,237,202
- Issue date Feb 25, 2025
- MRSI Systems, LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for multiple axis direct transfers of semicond...
- Patent number 12,230,519
- Issue date Feb 18, 2025
- Cowles Semi, LLC
- Sean Kupcow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective component forming apparatus
- Patent number 12,230,520
- Issue date Feb 18, 2025
- Disco Corporation
- Yoshinori Kakinuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating electronic devices having a back layer and app...
- Patent number 12,224,208
- Issue date Feb 11, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic release tapes for assembly of discrete components
- Patent number 12,211,730
- Issue date Jan 28, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing substrate
- Patent number 12,198,950
- Issue date Jan 14, 2025
- Semes Co., Ltd.
- Myung A Jeon
- B08 - CLEANING
Information Patent Grant
Tape mounter
- Patent number 12,191,172
- Issue date Jan 7, 2025
- Disco Corporation
- Toshiyasu Rikiishi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method and system for manufacturing a semiconductor package structure
- Patent number 12,183,712
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Che-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for bonding a plurality of dies to a carrier p...
- Patent number 12,183,620
- Issue date Dec 31, 2024
- PYXIS CF PTE. LTD.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus and method of controlling the same
- Patent number 12,154,819
- Issue date Nov 26, 2024
- ZEUS CO., LTD.
- Seung Dae Baek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...
- Publication number 20250218871
- Publication date Jul 3, 2025
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFTING HEAD AND LIFTING DEVICE
- Publication number 20250205907
- Publication date Jun 26, 2025
- TORAY ENGINEERING CO., LTD.
- Ken KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USIN...
- Publication number 20250201597
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- YEONG JUN JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ATTACHING DEVICE, CHIP PROCESSING SYSTEM, AND CHIP PROCESSING...
- Publication number 20250183222
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Yasutaka Mizomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Manufacturing Display Device and Display Device Manufact...
- Publication number 20250158000
- Publication date May 15, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Yosuke TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250149355
- Publication date May 8, 2025
- TOKYO ELECTRON LIMITED
- Susumu HAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING A WAFER
- Publication number 20250149357
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Hyuntae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK GRINDING TAPE HAVING TABS TO ASSIST IN REMOVING THE BACK GRIND...
- Publication number 20250087519
- Publication date Mar 13, 2025
- Western Digital Technologies, Inc.
- Seng Yu Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TRANSFER METHOD AND APPARATUS
- Publication number 20250079204
- Publication date Mar 6, 2025
- Silicon Box, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND EQUIPMENT FOR MANUFACTURING A PACKAGE STRUCTURE
- Publication number 20250069916
- Publication date Feb 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR TAKING MATERIALS AFTER CUTTING OF ENCAPSULATED FINISHED...
- Publication number 20250069917
- Publication date Feb 27, 2025
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CLEANING APPARATUS AND METHOD OF CONTROLLING THE SAME
- Publication number 20250062154
- Publication date Feb 20, 2025
- ZEUS CO., LTD.
- Seung Dae BAEK
- B08 - CLEANING
Information Patent Application
METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER
- Publication number 20250054785
- Publication date Feb 13, 2025
- Deca Technologies USA, Inc.
- Benedict SAN JOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE TRANSFER DEVICE
- Publication number 20250038018
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Jwa Hyeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS
- Publication number 20250038037
- Publication date Jan 30, 2025
- UTAC Headquarters Pte. Ltd.
- IL KWON SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE, WAFER MOUNTING DEVICE, DICING D...
- Publication number 20250038038
- Publication date Jan 30, 2025
- Mitsubishi Electric Corporation
- Osamu ZAIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP WET TRANSFER METHOD AND EQUIPMENT USING MAGNETIC FORCE
- Publication number 20250006542
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Youngtek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE...
- Publication number 20250006520
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM, ELECTROSTATIC CARRIER, AND PROCESSING METHOD
- Publication number 20240429073
- Publication date Dec 26, 2024
- TOKYO ELECTRON LIMITED
- Susumu HAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM REMOVAL APPARATUS AND UNCOVERING MECHANISM
- Publication number 20240429072
- Publication date Dec 26, 2024
- WISTRON CORP.
- ZESHAN YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET RELEASE APPARATUS
- Publication number 20240404847
- Publication date Dec 5, 2024
- Tokyo Seimitsu Co., Ltd.
- Hitoshi AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICKUP METHOD AND PICKUP APPARATUS
- Publication number 20240395575
- Publication date Nov 28, 2024
- Disco Corporation
- Yuya MATSUOKA
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND DEVICE FOR TRANSFERRING AND PREPARING COMPONENTS
- Publication number 20240395576
- Publication date Nov 28, 2024
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING AND DETECTING APPARATUS
- Publication number 20240387211
- Publication date Nov 21, 2024
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICKUP APPARATUS AND METHOD OF USING THE SAME
- Publication number 20240387206
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS
- Publication number 20240363398
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE TAPE REMOVING
- Publication number 20240355651
- Publication date Oct 24, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jinhua YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A DETACHABLE FOIL, POWER ELECTRONICS AR...
- Publication number 20240332055
- Publication date Oct 3, 2024
- Infineon Technologies Austria AG
- Gerardo Pantoja
- B32 - LAYERED PRODUCTS
Information Patent Application
HEAT STAMP AND METHOD FOR RELEASING PROTECTIVE TAPE USING HEAT STAMP
- Publication number 20240321606
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Shinsuke KOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO SEMICONDUCTOR CHIP TRANSFER METHOD AND MICRO SEMICONDUCTOR CH...
- Publication number 20240322068
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Youngtek OH
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for placing on an insulating substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer taping apparatus and method

Tape affixing apparatus

Apparatus for separating semiconductor chip and method for separati...

Sheet pasting device and sheet pasting method

Mounting device

Multi-layer release stack for light induced transfer of components

De-tape tool

Wafer expander for uniformly expanding gap between dies, and die su...

Processing apparatus

Chip ejector

Wafer cleaning apparatus and bonding system

Substrate processing system

Expanding method and expanding apparatus

Tape roll and tape mounter

Semiconductor manufacturing apparatus and method of manufacturing s...

Method for mass transfer of mini light-emitting diodes (mini-LEDs)...

Method for manufacturing display device and display device manufact...

Die-bonding machine

Component mounting system and component mounting method

Semiconductor die pickup apparatus

Die bonding system with heated automatic collet changer

Method and apparatus for multiple axis direct transfers of semicond...

Protective component forming apparatus

Method of separating electronic devices having a back layer and app...

Dynamic release tapes for assembly of discrete components

Apparatus and method for processing substrate

Tape mounter

Method and system for manufacturing a semiconductor package structure

Apparatus and method for bonding a plurality of dies to a carrier p...

Wafer cleaning apparatus and method of controlling the same

Patents Applicationslast 30 patents

EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...

LIFTING HEAD AND LIFTING DEVICE

LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USIN...

CHIP ATTACHING DEVICE, CHIP PROCESSING SYSTEM, AND CHIP PROCESSING...

Method For Manufacturing Display Device and Display Device Manufact...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

APPARATUS FOR PROCESSING A WAFER

BACK GRINDING TAPE HAVING TABS TO ASSIST IN REMOVING THE BACK GRIND...

DIE TRANSFER METHOD AND APPARATUS

METHOD AND EQUIPMENT FOR MANUFACTURING A PACKAGE STRUCTURE

DEVICE FOR TAKING MATERIALS AFTER CUTTING OF ENCAPSULATED FINISHED...

WAFER CLEANING APPARATUS AND METHOD OF CONTROLLING THE SAME

METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER

TAPE TRANSFER DEVICE

WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS

SEMICONDUCTOR MANUFACTURING DEVICE, WAFER MOUNTING DEVICE, DICING D...

CHIP WET TRANSFER METHOD AND EQUIPMENT USING MAGNETIC FORCE

APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE...

PROCESSING SYSTEM, ELECTROSTATIC CARRIER, AND PROCESSING METHOD

FILM REMOVAL APPARATUS AND UNCOVERING MECHANISM

SHEET RELEASE APPARATUS

PICKUP METHOD AND PICKUP APPARATUS

METHOD AND DEVICE FOR TRANSFERRING AND PREPARING COMPONENTS

PROCESSING AND DETECTING APPARATUS

PICKUP APPARATUS AND METHOD OF USING THE SAME

SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS

WORKPIECE TAPE REMOVING

SEMICONDUCTOR DEVICE HAVING A DETACHABLE FOIL, POWER ELECTRONICS AR...

HEAT STAMP AND METHOD FOR RELEASING PROTECTIVE TAPE USING HEAT STAMP

MICRO SEMICONDUCTOR CHIP TRANSFER METHOD AND MICRO SEMICONDUCTOR CH...