Claims
- 1. A packaged, in-process semiconductor die, comprising:
a semiconductor die; one or more walls surrounding said semiconductor die and formed of superimposed layers of at least semisolid polymeric material, said superimposed layers defining crevices therebetween; and liquid polymeric material within said crevices behind outer skins of at least semisolid polymeric material.
- 2. The packaged, in-process semiconductor die of claim 1, wherein said liquid polymeric material comprises a photopolymer.
- 3. The packaged, in-process semiconductor die of claim 1, wherein said outer skins comprise partially polymerized photopolymer skins.
- 4. The packaged, in-process semiconductor die of claim 1, wherein each of said one or more walls has a thickness between about 0.0001 inch and 0.0300 inch.
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional of application Ser. No. 09/634,239, filed Aug. 8, 2000, pending.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09634239 |
Aug 2000 |
US |
Child |
10230471 |
Aug 2002 |
US |