1. Technical Field
The exemplary disclosure generally relates to surface treatment method for plastic substrate and housing using the plastic substrate.
2. Description of Related Art
Electronic products having weave-surface appearance are very popular. The weave can be formed by wire-drawing, hot pressing metal net, and CNC numerical control machine engraving. However, wire-drawing cannot make the weave to appear three-dimensional. Metal net cannot firmly attach to the housing and the weave formed by CNC appear disorderly.
Therefore, there is room for improvement within the art.
Many aspects of the housing can be better understood with reference to the following figures. The components in the figures are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the housing. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
(1) A film 10 is provided.
The film 10 is transparent or translucent. The thickness of the film 10 is about 0.075 cm to about 0.175 cm. In the exemplary embodiment, the film 10 is made of polyethylene terephthalate.
(2) A first pattern layer 13 is formed on the film 10.
Referring to
Referring to
The first pattern layer 13 may be made of ink containing polyurethane resin and aluminum powder. The first pattern layer 13 is silvery white and translucent. The aluminum powder provides an aluminum metal appearance to the first pattern layer 13.
(3) A second pattern layer 15 is formed on the first pattern layer 13.
Referring to
The second shielding sheet 50 is pasted on the first shielding sheet 30 to cover portions of the first pattern layer 13 and/or the film 10, and then a second pattern layer 15 is formed on the first pattern layer 13 by printing. The second pattern layer 15 has a plurality of second decorative areas 151 arranged at spaced intervals corresponding to the second holes 50. The second decorative area 151 has a circular shape.
The diameter of the second decorative area 151 is about 0.1 mm to about 0.55 mm. The diameters of the second decorative areas 151 gradually decrease from the edges of the second pattern layer 15 to the center of the second pattern layer 15. The distance d4 between the centers of each two adjacent decorative areas 151 is about 0.25 mm to about 1 mm. The second pattern layer 15 has a thickness of about 5 μm to about 8 μm. The second pattern layer 15 is brown and translucent.
(4) A background layer 17 is formed on the second pattern layer 15 by printing.
The background layer 17 has a thickness of about 5 μm to about 8 μm. The background layer 17 has a color different from the color of the first pattern layer 13 and the second pattern layer 15. In the exemplary embodiment, the background layer 17 is black.
A protecting layer 19 is formed on the background layer 17 by printing.
The protecting layer 19 has a thickness of about 10 μm to about 12 μm. In the exemplary embodiment, the first pattern layer 13, the second pattern layer 15, the background layer 17, and the protecting layer 19 comprises ink containing polyurethane resin.
(6) A back adhesive layer 21 is formed on the protecting layer 19 by printing.
The back adhesive layer 21 includes acrylic acid, ethylene-vinyl acetate copolymer, or polypropylene. The back adhesive layer 21 has a thickness of about 10 μm to about 12 μm.
(7) A plastic substrate 70 is formed on the back adhesive layer 21 by insert molding.
In the exemplary embodiment, the plastic substrate 70 is made of polycarbonate resin.
Referring to
The housing 100 further includes a first pattern layer 13, a second pattern layer 15, a background layer 17, a protecting layer 19, and a back adhesive layer 21 formed between the film 10 and the plastic substrate 70.
The first pattern layer 13 is formed on the film 10. The first pattern layer 13 has a plurality of rows of first decorative areas 131. The first decorative areas 131 of adjacent two rows are staggered from each other. The thickness of the first pattern layer 13 is about 5 μm to about 8 μm. In the exemplary embodiment, the distance d2 between two adjacent first decorative areas 131 in a row is about 0.75 mm.
The first pattern layer 13 contains polyurethane resin and aluminum powder. The first pattern layer 13 is silvery white. The aluminum powder makes the first pattern layer 13 present an appearance like aluminum metal.
A second pattern layer 15 is formed on the first pattern layer 13. The second pattern layer 15 has a plurality of second decorative areas 151. The second decorative area 151 has a circular shape. The diameter of the decorative area 151 is about 0.1 mm to about 0.55 mm. The diameter of the decorative areas 151 gradually decreases from the edges of the second pattern layer 15 to the center of the second pattern layer 15. The distance d4 between the centers of each two adjacent decorative areas 151 is about 0.25 mm to about 1 mm. The second pattern layer 15 has a thickness of about 5 μm to about 8 μm. The second pattern layer 15 is brown and translucent.
The background layer 17 is formed on the second pattern layer 15, and is directly formed on either the first pattern layer 13 or the film 10. The background layer 17 has a thickness of about 5 μm to about 8 μm. The color of the background layer 17 is different from the colors of the first pattern layer 13 and the second pattern layer 15. In the exemplary embodiment, the background layer 17 is black.
The protecting layer 19 is formed on the background layer 17. The protecting layer 19 protects the background layer 17, the second pattern layer 15 and the first pattern layer 13 from damage by melted resin materials during insert molding process. The protecting layer 19 has a thickness of about 10 μm to about 12 μm.
The back adhesive layer 21 is formed on the protecting layer 19 and abuts the plastic substrate 70. The back adhesive layer 21 provides an enhanced bond between the film 10 and the plastic substrate 70. The back adhesive layer 21 contains acrylic acid, ethylene-vinyl acetate copolymer, or polypropylene. The back adhesive layer 21 has a thickness of about 10 μm to about 12 μm.
Alternatively, the protecting layer 19, and the back adhesive layer 21 can be omitted.
Referring to
It is believed that the exemplary embodiment and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its advantages, the examples hereinbefore described merely being preferred or exemplary embodiment of the disclosure.
Number | Date | Country | Kind |
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2013100426014 | Feb 2013 | CN | national |