This invention relates generally to the surface of metal implants, such as those placed in the human body.
This invention principally relates to the surface of titanium alloy dental implants, although it has application to other types of implants made of titanium alloys. More specifically, the invention relates to roughened surfaces provided on dental implants to improve the osseointegration of the implant surface with the bone, thereby shortening the time between initial insertion of the implant and the installation of a prosthetic tooth.
Various techniques have been suggested for roughening implants, each producing a unique surface. One approach has been to apply materials to the surface of the implant, for example hydroxyapitite, a material that is considered to improve the bonding of the implant to bone because the hydroxyapitite is chemically related to bone. In a related approach, titanium particles have been sprayed onto a titanium implant to roughen the surface. Anodization to add titanium oxides to the surface has also been proposed. Roughening also can be done by removing some of the surface. Grit blasting with fine particles has been proposed to create dents and to abrade away some of the surface. Another method is the use of acid etching to create a roughened surface. At least one supplier of dental implants has proposed grit blasting to create a coarse roughened surface, followed by acid etching to form a superimposed fine roughening.
Etching the surface of titanium with acids has been included in many processes proposed for manufacturing dental implants. In many cases, only general reference to selecting from a list of mineral acids, in other instances specific acids are used. For example, Toho Titanium Co. disclosed in Japanese Published Patent Application JP3146679A1 a two step treatment in which aqueous hydrofluoric acid was used to etch the surface, followed by a second treatment with a solution hydrofluoric acid and hydrogen peroxide. Another example is found in U.S. Published Application 2003/0135282A1, in which an implant is treated with a sequence of three acids—hydrofluoric, sulfuric and hydrochloric acid. The etched surface is coated with plasma before use to improve integration with bone.
In a series of U.S. patents, including U.S. Pat. Nos. 5,603,338; 5,876,453; 5,863,201; and 6,652,765 assigned to Implant Innovations Inc., a unique two-step acid treatment was disclosed, which is used on dental implants to produce an Osseotite® surface. The first acid treatment uses aqueous hydrofluoric acid to remove the “native oxide”, that is, the titanium oxide found on titanium metal surfaces. Removing the native oxide makes the metal surface more accessible to etching by other acids, assuring uniform etching of the titanium surface. Other methods of removing the native oxide could be used, such as plasma treatment, but the initial treatment with aqueous hydrofluoric acid was preferred. The second acid treatment preferably used a mixture of hydrochloric and sulfuric acids to etch the exposed titanium surface. A relatively fine etching was achieved, having peak-to-valley heights of 10 μm or less. The peak-to-peak distance typically is about 1-3 μm. This Osseotite® surface has achieved commercial success, having reduced the time required for osseointegration of the titanium implant with bone.
Previous U.S. patents have shown the titanium surface obtained by scanning electron microscopy (SEM). Another method of describing the surface is surface mapping microscopy (SMM), which produces a computer-generated three-dimensional picture of the region being examined, and several calculated measures of the roughness of the surface. It will be understood by those skilled in the art that acid treatment produces a surface that appears very uniform to the naked eye, but contains variations that become evident only when greatly magnified, as in the photomicrographs. Each region will not be precisely the same as the others, but nevertheless, the variations are small and fall within the general limits discussed above. By carefully controlling the treatment process, each implant has substantially the same surface.
It has more recently been found that, while a consistent response to the two-step acid treatment is obtained on commercially pure titanium, the same treatment process produces non-uniform results on titanium alloys. Because titanium alloys have some benefits over commercially pure titanium, it would be desirable if the topography of the Osseotite® surface were to be duplicated on a titanium alloy surface. To achieve this goal, the inventors found that the process used for commercially pure titanium required unexpected revisions to achieve the desired surface on titanium alloys. Their new process will be described in detail below.
A process for producing on a titanium alloy a desired surface topography similar to the Osseotite® surface removes the native oxide on the titanium alloy and thereafter, and before the titanium alloy reoxidizes significantly, the surface is etched in an aqueous solution of hydrofluoric and hydrochloric acids to produce the desired surface. The native oxide maybe removed by immersing for about 40 to 60 seconds in an aqueous solution of hydrofluoric acid containing about 7.9 to 9.0 wt % hydrofluoric acid. In a preferred embodiment, the surface is etched for about 19-21 minutes at room temperature in an acid mixture containing from about 0.053 to about 0.105 wt % hydrofluoric (HF) acid and from about 19 to about 21 wt % hydrochloric (HCl) acid. The conditions for both acid treatments are chosen to provide the desired surface topography, while minimizing the loss of titanium metal.
In one specific embodiment, the native oxide is removed by immersing the implant in an 8.45 wt % HF solution at ambient temperature for 45 seconds. After rinsing to remove the residual acid, the implant is immersed for 19.5 minutes at ambient temperature in a 20 wt % HCl solution containing 0.0845 wt % HF.
The conditions for both acid treatments are chosen to provide the desired surface topography, while minimizing the loss of titanium metal.
In one aspect, the invention is a dental implant that has been treated according to the process described above to provide the desired surface topography in predetermined regions of the implant.
Although other metals, and ceramics have been proposed for use in dental implants, titanium has been generally used. Particularly commercially pure titanium, which contains trace amounts of carbon, iron, oxygen, hydrogen, and nitrogen. Titanium alloys have also been used since they are stronger than the commercially pure grades of titanium. One commonly used titanium alloy, Ti/6A1/4V, contains 6 wt % aluminum and 4 wt % vanadium, hereafter referred to as Ti 6/4.
A characteristic of titanium and its alloys is the rapid formation of tenacious titanium oxide films on the surface, a feature which contributes to titanium's resistance to corrosion. This oxide film is considered to be a combination of various oxides of titanium, including TiO, TiO2, Ti2O3, and Ti3O4. It has been referred to the “native oxide” film. Measurement of the native oxide film by Auger spectrometer indicates that it typically has a depth of 70 to 150 Angstroms.
As previously disclosed, removing the native oxide is important if a uniformly roughened surface is to be produced by acid etching. Experience has shown that most acids are not capable of removing the native oxide sufficiently so that a uniform roughness can be produced. Titanium surfaces are often pickled in mixtures of hydrofluoric acid and nitric acids to clean the surface. Aqueous solutions of hydrofluoric acid alone, without the addition of oxidizing acids such as nitric acid, are very aggressive toward titanium and its native oxide film. A relatively brief exposure to a dilute solution of hydrofluoric acid will remove the native oxide. Since after removing the native oxide, the hydrofluoric acid will begin to consume the metal as well, an undesirable result, the titanium implant is removed from the acid and rinsed to stop further attack. However, as is well known, the titanium metal surface will begin to oxidize quickly. Consequently, the exposed metal surface should be protected against oxygen exposure until the titanium implant is immersed in an acid bath to uniformly etch the surface, creating the desired surface topography. Other methods of removing the native oxide could be used, such as plasma treatment, but the use of hydrofluoric acid is preferred.
The rate at which titanium is etched depends on the concentration of the hydrofluoric acid. A hydrofluoric acid solution containing about 15 vol. % of 49 wt % hydrofluoric acid was found to permit complete removal of the native oxide within about one-half minute, but with minimal consumption of the metal. This is illustrated in
In
Other etching solutions were tested. In some instances, a surface similar to the Osseotite® surface was obtained, but in other cases, acid etching was ineffective. It was found also that the effect on Ti 6/4 alloy varied from batch to batch, so that each batch had to be tested to determine its suitability. After further investigation of this problem, the inventors found that certain acid etching solutions were capable of consistently producing the desired surface on Ti 6/4 alloy.
Acid Etching of Ti 6/4 Alloy
Experiments were carried out with a series of acid compositions, the results being shown in Figures. The acid compositions and treatment conditions are summarized in the following table.
(1)wt % acid, remainder water
The above table generally follows the progress of experiments carried out to determine the acid etching needed to produce the desired surface topography on Ti 6/4 alloy. To produce the surface of
In the presently preferred process, Ti 6/4 alloy is immersed in an aqueous solution of hydrofluoric acid for the length of time required to remove the native oxide while not removing a significant amount of metal. A preferred solution, suitable for commercial application would contain about 7.9 to 9.0 wt % HF. However, more or less concentrated solutions could be used, with appropriate adjustment of the exposure time, provided that the native oxide was removed to prepare the surface for subsequent etching needed to create the desired surface topography.
The etching step immerses the Ti 6/4 alloy, from which the native oxide had been removed, in an aqueous solution at room temperature containing about 0.053 to 0.105 wt % HF and 19-21 wt % HCl. Such solutions have been found to produce the desired surface topography on Ti 6/4 alloy within about 20 minutes and using only ambient temperatures. Again, some adjustment of the acid concentrations, temperature, and exposure time is believed to be possible, while still obtaining the desired surface. It is believed that equivalent results may be obtained within the broader range of 0.005 to 1.0 wt % HF and 10-30 wt % HCl.
Dental Implants
The etching process of the invention may be used to prepare the surface of various styles of dental implants. A typical example is illustrated in
This application claims priority of provisional patent application 60/471,463, filed May 16, 2003.
Number | Name | Date | Kind |
---|---|---|---|
3022783 | Tucker, Jr. | Feb 1962 | A |
3605123 | Hahn | Sep 1971 | A |
3767437 | Cruz, Jr. | Oct 1973 | A |
3790507 | Hodosh | Feb 1974 | A |
3855638 | Pilliar | Dec 1974 | A |
3919723 | Heimke et al. | Nov 1975 | A |
3986212 | Sauer | Oct 1976 | A |
3987499 | Scharbach et al. | Oct 1976 | A |
4011602 | Rybicki et al. | Mar 1977 | A |
4051598 | Sneer | Oct 1977 | A |
4145764 | Suzuki et al. | Mar 1979 | A |
4146936 | Aoyage et al. | Apr 1979 | A |
4180910 | Straumann et al. | Jan 1980 | A |
4195409 | Child | Apr 1980 | A |
4199864 | Ashman | Apr 1980 | A |
4223412 | Aoyagi et al. | Sep 1980 | A |
4261350 | Branemark et al. | Apr 1981 | A |
4330891 | Branemark et al. | May 1982 | A |
4336618 | Raab | Jun 1982 | A |
4366183 | Ghommidh et al. | Dec 1982 | A |
4406761 | Shimogori et al. | Sep 1983 | A |
4530116 | Frey | Jul 1985 | A |
4547157 | Driskell | Oct 1985 | A |
4547327 | Bruins et al. | Oct 1985 | A |
4608052 | Van Kampen et al. | Aug 1986 | A |
4629464 | Takata et al. | Dec 1986 | A |
4654314 | Takagi et al. | Mar 1987 | A |
4687675 | Nakano et al. | Aug 1987 | A |
4693986 | Vit et al. | Sep 1987 | A |
4702930 | Heide et al. | Oct 1987 | A |
4704126 | Baswell et al. | Nov 1987 | A |
4722688 | Lonca | Feb 1988 | A |
4746532 | Suzuki et al. | May 1988 | A |
4818559 | Hama et al. | Apr 1989 | A |
4826434 | Krueger | May 1989 | A |
4839215 | Starling | Jun 1989 | A |
4861733 | White | Aug 1989 | A |
4865603 | Noiles | Sep 1989 | A |
4871578 | Adam et al. | Oct 1989 | A |
4874434 | Riggs, Jr. | Oct 1989 | A |
4878914 | Miwa et al. | Nov 1989 | A |
4882196 | Shimamune et al. | Nov 1989 | A |
4908030 | Linkow et al. | Mar 1990 | A |
4911953 | Hosonuma et al. | Mar 1990 | A |
4919751 | Sumita et al. | Apr 1990 | A |
4932868 | Linkow et al. | Jun 1990 | A |
4938938 | Ewers et al. | Jul 1990 | A |
4944754 | Linkow et al. | Jul 1990 | A |
4960646 | Shimamune et al. | Oct 1990 | A |
4963145 | Takagi et al. | Oct 1990 | A |
4969906 | Kronman | Nov 1990 | A |
4988299 | Branemark | Jan 1991 | A |
5000685 | Brajnovic | Mar 1991 | A |
5030096 | Hurson et al. | Jul 1991 | A |
5032552 | Nonami et al. | Jul 1991 | A |
5034352 | Vit et al. | Jul 1991 | A |
5039546 | Chung et al. | Aug 1991 | A |
5071351 | Green et al. | Dec 1991 | A |
5108399 | Eitenmuller et al. | Apr 1992 | A |
5141576 | Shimamune et al. | Aug 1992 | A |
5180564 | Wahl et al. | Jan 1993 | A |
5188800 | Green et al. | Feb 1993 | A |
5190795 | Culler | Mar 1993 | A |
5195891 | Sulc | Mar 1993 | A |
5199873 | Schulte et al. | Apr 1993 | A |
5205745 | Kamiya | Apr 1993 | A |
5205921 | Shirkanzadeh | Apr 1993 | A |
5219361 | von Recum et al. | Jun 1993 | A |
5222983 | Schmitz et al. | Jun 1993 | A |
5242706 | Cotell et al. | Sep 1993 | A |
5258030 | Wolfarth et al. | Nov 1993 | A |
5263986 | Noiles et al. | Nov 1993 | A |
5279831 | Constantz et al. | Jan 1994 | A |
5297963 | Dafatry | Mar 1994 | A |
5306305 | Lee | Apr 1994 | A |
5310464 | Redepenning | May 1994 | A |
5316476 | Krauser | May 1994 | A |
5316477 | Calderon | May 1994 | A |
5324199 | Branemark | Jun 1994 | A |
5344425 | Sawyer | Sep 1994 | A |
5344457 | Pilliar et al. | Sep 1994 | A |
5360448 | Thramann | Nov 1994 | A |
5362237 | Chalifoux | Nov 1994 | A |
5366374 | Vlassis | Nov 1994 | A |
5368480 | Balfour et al. | Nov 1994 | A |
5368483 | Sutter et al. | Nov 1994 | A |
5399090 | Padros-Fradera | Mar 1995 | A |
5405436 | Maurer et al. | Apr 1995 | A |
5427754 | Nagata et al. | Jun 1995 | A |
5433606 | Niznick et al. | Jul 1995 | A |
5441536 | Aoki et al. | Aug 1995 | A |
5456723 | Steinemann et al. | Oct 1995 | A |
5472734 | Perrotta et al. | Dec 1995 | A |
5478237 | Ishizawa | Dec 1995 | A |
5484286 | Hansson | Jan 1996 | A |
5489210 | Hanosh | Feb 1996 | A |
5496399 | Ison et al. | Mar 1996 | A |
5503558 | Clokie | Apr 1996 | A |
5543019 | Lee et al. | Aug 1996 | A |
5564923 | Grassi et al. | Oct 1996 | A |
5571017 | Niznick | Nov 1996 | A |
5571188 | Ellingsen et al. | Nov 1996 | A |
5573401 | Davidson et al. | Nov 1996 | A |
5588838 | Hansson et al. | Dec 1996 | A |
5591029 | Zuest | Jan 1997 | A |
5603338 | Beaty | Feb 1997 | A |
5607480 | Beaty | Mar 1997 | A |
5639237 | Fontenot | Jun 1997 | A |
5816811 | Beaty | Oct 1998 | A |
5863201 | Lazzara et al. | Jan 1999 | A |
5873725 | Perler et al. | Feb 1999 | A |
5876453 | Beaty | Mar 1999 | A |
5989027 | Wagner et al. | Nov 1999 | A |
6069295 | Leitao | May 2000 | A |
6491723 | Beaty | Dec 2002 | B1 |
6527554 | Hurson et al. | Mar 2003 | B2 |
6652765 | Beaty | Nov 2003 | B1 |
6702855 | Steinemann et al. | Mar 2004 | B1 |
6969474 | Beaty | Nov 2005 | B2 |
20010004711 | Lazzara et al. | Jun 2001 | A1 |
20030065401 | Amrich et al. | Apr 2003 | A1 |
20050064007 | Steinemann et al. | Mar 2005 | A1 |
20050171615 | Georgette et al. | Aug 2005 | A1 |
Number | Date | Country |
---|---|---|
328 067 | May 1975 | AT |
926552 | May 1973 | CA |
679117 | Dec 1991 | CH |
2 313 678 | Oct 1972 | DE |
27 17 615 | Oct 1978 | DE |
202 031 | Nov 1986 | EP |
212 929 | Mar 1987 | EP |
0 213 836 | Nov 1987 | EP |
0 409 810 | Jan 1991 | EP |
455 929 | Jan 1991 | EP |
606 566 | Jul 1994 | EP |
0806211 | Oct 2002 | EP |
0987031 | Apr 2003 | EP |
1150620 | Nov 2003 | EP |
2 289 160 | Oct 1974 | FR |
2 421 595 | Jul 1979 | FR |
834256 | May 1960 | GB |
2 045 083 | Jan 1984 | GB |
2252501 | Aug 1992 | GB |
1148254 | Jun 1989 | JP |
3146679 | Jun 1991 | JP |
332 486 | Nov 1971 | SE |
WO 9205745 | Apr 1992 | WO |
WO 9413334 | Jun 1994 | WO |
WO 9616611 | Jun 1996 | WO |
WO 0156628 | Aug 2001 | WO |
Number | Date | Country | |
---|---|---|---|
20040265780 A1 | Dec 2004 | US |
Number | Date | Country | |
---|---|---|---|
60471463 | May 2003 | US |