The following relates to a system and method for providing an electrical ground connection for a circuit assembly.
Automotive vehicles having high voltage (HV) batteries, such as electric vehicles (EV) and hybrid electric vehicles (HEV), may include battery monitoring systems (BMS) to monitor and/or improve performance the HV batteries. In that regard, a BMS is an electronic unit that is inserted by the automotive original equipment manufacturer (OEM) inside a housing for an EV or HEV HV battery as part of a vehicle HV battery system, which may include battery cells, a cooling system, and battery cell monitoring electronics.
The BMS of a HV battery system requires a good connection to the vehicle ground (GND), such as the chassis of the vehicle. Indeed, such a ground connection may be required by various electronic assemblies or electronic arrangements that may be used throughout any type of vehicle, which electronic assemblies or electronic arrangements may include and/or comprise circuit assemblies, printed circuit boards (PCB), fuse boxes, controllers, modules, units, systems, or any other type of electronic assembly or electronic arrangement.
In that regard, compact and/or restrictive requirements may govern the placement of a HV battery system in an EV or HEV. Such compact and/or restrictive placement requirements for a HV battery system may include and/or affect the vehicle ground connection needed by a BMS. Similar design constraints and/or requirements may likewise include and/or affect the ground connection needed by any other type of electronic assembly or electronic arrangement used in a vehicle. As a result, a need exists for an improved system and method for providing an electrical ground connection for a circuit assembly, such as may be included in a BMS for a HV battery system for an EV or HEV.
According to one non-limiting exemplary embodiment described herein, a system for providing an electrical ground connection for a circuit assembly is provided. The system may comprise a housing for the circuit assembly, the housing having an electrically conductive fixation member configured for attachment to an electrically conductive element outside the housing. The system may further comprise an electrically conductive feature having a first end and a second end, the first end configured to cooperate with the electrically conductive fixation member inside the housing and the second end configured for attachment to the circuit assembly. Attachment of the electrically conductive fixation member to the electrically conductive element outside the housing enables an electrical ground connection for the circuit assembly via the electrically conductive feature.
According to another non-limiting exemplary embodiment described herein, a system for providing an electrical ground connection for a circuit assembly is provided. The system may comprise an electrically conductive fixation member having a first portion configured to extend inside a housing for the circuit assembly and a second portion configured to extend outside the housing, the second portion further configured for attachment to an electrically conductive element. The system may further comprise an electrically conductive feature having a first end and a second end, the first end configured to cooperate with the first portion of the electrically conductive fixation member inside the housing and the second end configured for attachment to the circuit assembly. Attachment of the second portion of the electrically conductive fixation member to the electrically conductive element outside the housing enables an electrical ground connection for the circuit assembly via the electrically conductive feature.
According to yet another non-limiting exemplary embodiment described herein, a method for providing an electrical ground connection for a circuit assembly is provided. The method may comprise attaching a first end of an electrically conductive feature to a first portion of an electrically conductive fixation member, wherein the first portion of the electrically conductive fixation member is configured to extend inside a housing for the circuit assembly, and wherein the electrically conductive feature comprises (i) a conductive paint on a surface of the housing for the circuit assembly, (ii) a busbar, (iii) a wire, or (iv) a conductive mesh. The method may further comprise installing the circuit assembly into the housing, and attaching a second end of the electrically conductive feature to the circuit assembly.
A detailed description of these and other non-limiting exemplary embodiments of a system and method for providing an electrical ground connection for a circuit assembly is set forth below together with the accompanying drawings.
As required, detailed non-limiting embodiments are disclosed herein. However, it is to be understood that the disclosed embodiments are merely exemplary and may take various and alternative forms. The figures are not necessarily to scale, and features may be exaggerated or minimized to show details of particular components, elements, features, items, members, parts, portions, or the like. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art.
With reference to the Figures, a more detailed description of non-limiting exemplary embodiments of a system and method for providing an electrical ground connection for a circuit assembly will be provided. For ease of illustration and to facilitate understanding, like reference numerals may be used herein for like components and features throughout the drawings.
As previously described, compact and/or restrictive placement requirements for a HV battery system in an EV or HEV may include and/or affect the vehicle ground connection needed by a BMS. Similar design constraints and/or requirements may likewise include and/or affect the ground connection needed by any other type of electronic assembly or electronic arrangement used in a vehicle. As a result, a need exists for an improved system and method for providing an electrical ground connection for a circuit assembly, such as may be included in a BMS for a HV battery system for an EV or HEV.
In that regard,
Referring now to
As also seen in
Thus, the BMS module 10 shown in
In contrast, the BMS module 10′ shown in
The BMS module 10′ may also include or comprise an electrically conductive feature which may comprise one or more busbars 28.
In that regard,
Referring still to
According to the system and method of the present disclosure, the busbar(s) 28 may be used to establish, enable, create, provide, or complete a ground connection from a vehicle chassis (not shown) to an electrical ground of the PCB 20′ through the electrically conductive fixation members 24. In that regard, still referring to
The top portion or cover of the HV battery housing 12′ may have an aperture formed therein configured to receive the vertically oriented electrical connector 16′ of the BMS module 10′. The cover of the HV battery housing 12′ may also have apertures 56 formed therein configured to receive the second portion 46 of the fixation members 24, which second portion 46 may be configured to extend outside the housing of the BMS module 10′. The electrically conductive fixation members 24 may also be provided with a surface or shoulder configured to contact the electrically conductive HV battery housing 12′ and thereby ensure robust electrical contact and conductivity between the fixation member 24 and the HV battery housing 12′.
As previously described, the fixation members 24 may comprise a bolt or screw having a threaded portion 48. One or more threaded nuts (not shown) may be provided and/or configured for mechanical (e.g., screwed) and/or electrical fixation or attachment of the HV battery housing 12′ to the fixation members 24. The electrical ground connection path established (see
It should also be noted that the fixation members 24 may also be provided or configured with an extension 52 which may serve or act as an aid for centering the apertures 56 formed in the HV battery housing 12′ with the fixation members 24. As previously described, the electrically conductive fixation member 24 may be overmolded in the housing of the BMS module 10′. In that regard, the electrically conductive fixation member 24 may comprises an anti-rotation feature 54 configured to resist rotation of the electrically conductive fixation member 24 in the housing of the BMS module 10′ during rotation of the nut (not shown) on the threaded shaft 48 of the electrically conductive fixation member 24. As seen in
The system and method of the present disclosure thus provide attachment of the second portion 46 of the electrically conductive fixation member 24 to the electrically conductive element 12′ outside the housing of the BMS module 10′, thereby enabling an electrical ground connection for the circuit assembly 20′ via the electrically conductive feature comprising the busbar 28. The system and method of the present disclosure thus provide direct connection of an electronic circuit to a vehicle chassis (GND) in an efficient fashion, thereby simplifying installation, assembly, and/or manufacturing as well as minimizing cost.
Thus, the present disclosure provides a system and method for providing an electrical ground connection for a circuit assembly. According to the system and method of the present disclosure, the first tab 30 of the electrically conductive feature 28 may be attached to the first portion 34 of the electrically conductive fixation member 24. In that regard, the electrically conductive feature 28 may comprise a busbar extending in a plurality of planes and the first portion 34 of the electrically conductive fixation member 24 may be configured to extend inside the housing of the BMS module 10′ for the circuit assembly or PCB 20′. According to the system and method of the present disclosure, the circuit assembly or PCB 20′ may be installed into the housing of the BMS module 10′, and the second tab 32 of the electrically conductive feature comprising the busbar 28 may be attached to the circuit assembly or PCB 20′. The PCB 20′ may then be enclosed with a bottom portion of the housing of the BMS module 10′.
As previously described, the electrically conductive fixation member 24 may comprise a second portion 46 configured to extend outside the housing of the BMS module 10′ for attachment to the electrically conductive element 12′. In that regard, the second portion 46 of the electrically conductive fixation member 24 may be attached to the electrically conductive element 12′ outside the housing of the BMS module 10′ to provide an electrical ground connection for the circuit assembly or PCB 20′ via the electrically conductive feature comprising the busbar 28.
As also previously described, the first portion 34 of the electrically conductive fixation member 24 may have a threaded recess 36 formed therein configured to receive a screw 38 and the first tab 30 of the busbar 28 may have an opening 40 formed therein configured to receive the screw 38. Attaching the first tab 30 of the electrically conductive feature comprising the busbar 28 to the first portion 34 of the electrically conductive fixation member 24 may therefore comprise screwing the first tab 30 of the busbar 28 to the first portion 34 of the electrically conductive fixation member 24. Moreover, the electrically conductive fixation member 24 may be overmolded in the housing of the BMS module 10′. It should also be noted that, as an alternative to the connection of the busbar 28 to the fixation member 24 described previously, the busbar 28 may also be overmolded into the housing of the BMS module 10′. In such an embodiment, because robustness may be provided by the housing plastic, instead of a busbar, the electrically conductive feature 28 may alternatively comprise a thinner connection element, such as a wire, a conductive mesh, or a conductive painted (or the like) path. It should also be noted that the busbar 28 may take the form of a member extending from (and which may be integral with) the fixation member 24. Thus, the first end 30 of the busbar 28 may be configured to cooperate with the first portion 34 of the fixation member 24, such as by integrally extending from the first portion 34 of the fixation member 24 or by being configured to be attached, connected, or joined to or with the first portion 34 of the fixation member 24 as previously described herein. The busbar 28 may also have an extension (not shown) at the second end 32, which may be rod-like, which extends downward and is configured to fit into or otherwise cooperate with a hole formed in the PCB 20′ to provide for attachment of the busbar 28 to the PCB 20′, such as by a screw or by a soldered or press-fit connection.
Once assembled, the BMS module 10′ may be inserted into and fixed to the bottom portion or base of the HV battery housing 12′, such as by fixation features 22. The top portion or cover of the HV battery housing 12′ may be attached to the BMS module 10′ in a closure operation using the fixation members 24 formed in and extending outside the housing of the BMS module 10′. The fixation members 24 may be received by cooperating apertures 56 formed in the cover of the HV battery housing 12′, which may be secured to the BMS module 10′ using nut(s) (not shown). A ground connection to the circuit assembly may be completed, created, established, enabled, or provided by integration of the HV battery housing 12′ into a vehicle, such as an EV or HEV.
The present disclosure thus describes an improved system and method for providing an electrical ground connection for a circuit assembly, such as may be included in a BMS for a HV battery system for an EV or HEV. In that regard, the HV battery system environment or application described in connection with the system and method for providing an electrical ground connection for a circuit assembly of the present disclosure is exemplary only and the system and method of the present disclosure may be used in other environments or applications. The system and method for providing an electrical ground connection for a circuit assembly described herein overcome, address, solve, or mitigate compact and/or restrictive placement requirements for a HV battery system in an EV or HEV that may include and/or affect the vehicle ground connection needed by a BMS. The system and method for providing an electrical ground connection for a circuit assembly described herein also overcome, address, solve, or mitigate similar design constraints and/or requirements that may likewise include and/or affect the ground connection needed by any other type of electronic assembly or electronic arrangement used in a vehicle.
As is readily apparent from the foregoing, various non-limiting embodiments of a system and method for providing an electrical ground connection for a circuit assembly have been described. While various embodiments have been illustrated and described herein, they are exemplary only and it is not intended that these embodiments illustrate and describe all those possible. Instead, the words used herein are words of description rather than limitation, and it is understood that various changes may be made to these embodiments without departing from the spirit and scope of the following claims.
Number | Name | Date | Kind |
---|---|---|---|
3097032 | Hochheiser | Jul 1963 | A |
3218606 | Schultz | Nov 1965 | A |
3270251 | Evans | Aug 1966 | A |
3836935 | Johnson | Sep 1974 | A |
3932934 | Lynch et al. | Jan 1976 | A |
4050621 | Bouley | Sep 1977 | A |
4662691 | Derdzinski | May 1987 | A |
4663815 | Hartman et al. | May 1987 | A |
4884335 | McCoy et al. | Dec 1989 | A |
4890199 | Beutler | Dec 1989 | A |
5131853 | Meyer | Jul 1992 | A |
5199887 | Tacono | Apr 1993 | A |
5218760 | Colton et al. | Jun 1993 | A |
5599208 | Ward | Feb 1997 | A |
5688130 | Huang | Nov 1997 | A |
5704752 | Logerot | Jan 1998 | A |
5802699 | Fjelstad et al. | Sep 1998 | A |
5816835 | Meszaros | Oct 1998 | A |
5997367 | Nowak et al. | Dec 1999 | A |
6062919 | Trafton | May 2000 | A |
6067236 | White | May 2000 | A |
6206728 | Krehbiel et al. | Mar 2001 | B1 |
6413119 | Gabrisko, Jr. et al. | Jul 2002 | B1 |
6493233 | De Lorenzo et al. | Dec 2002 | B1 |
6783376 | Will et al. | Aug 2004 | B2 |
6790051 | Secall et al. | Sep 2004 | B1 |
6799980 | Bloomfield et al. | Oct 2004 | B2 |
6824403 | Hall et al. | Nov 2004 | B2 |
6837730 | Poh et al. | Jan 2005 | B2 |
6980017 | Farnworth et al. | Dec 2005 | B1 |
7044755 | Hatakeyama | May 2006 | B2 |
7149089 | Blasko et al. | Dec 2006 | B2 |
7297026 | Toda et al. | Nov 2007 | B2 |
7347698 | Dittmann | Mar 2008 | B2 |
7351091 | Zhang | Apr 2008 | B1 |
7354276 | Dittmann | Apr 2008 | B2 |
7361055 | Fuerst | Apr 2008 | B2 |
7364442 | Bang et al. | Apr 2008 | B2 |
7396254 | Harmelink et al. | Jul 2008 | B2 |
7510407 | Blasko et al. | Mar 2009 | B1 |
7581965 | Upasani et al. | Sep 2009 | B1 |
7943859 | Ambo et al. | May 2011 | B2 |
7976319 | Nguyen et al. | Jul 2011 | B2 |
8038465 | Pavlovic | Oct 2011 | B2 |
8294043 | Munoz et al. | Oct 2012 | B2 |
8696367 | Daughtry, Jr. et al. | Apr 2014 | B2 |
8790122 | Malehorn, II et al. | Jul 2014 | B2 |
8854835 | Feldstein et al. | Oct 2014 | B2 |
8979452 | Ikuno | Mar 2015 | B2 |
9167698 | Konda et al. | Oct 2015 | B2 |
9257778 | Buck et al. | Feb 2016 | B2 |
9320165 | Gruber | Apr 2016 | B2 |
9437974 | Glick et al. | Sep 2016 | B2 |
9496632 | Schmalbuch et al. | Nov 2016 | B2 |
9543703 | Horchler et al. | Jan 2017 | B2 |
9680247 | Glick et al. | Jun 2017 | B1 |
9705214 | Tramet et al. | Jul 2017 | B2 |
9705259 | Feldner | Jul 2017 | B2 |
9711876 | Feye-Hohmann | Jul 2017 | B2 |
9711926 | Belanger, Jr. | Jul 2017 | B2 |
9774117 | Jackson et al. | Sep 2017 | B1 |
9873392 | Matsumura et al. | Jan 2018 | B2 |
10050358 | Muller et al. | Aug 2018 | B2 |
10122044 | De Souza et al. | Nov 2018 | B2 |
10348029 | Flender et al. | Jul 2019 | B2 |
10418728 | Fu et al. | Sep 2019 | B2 |
10573983 | Webber et al. | Feb 2020 | B2 |
10673160 | Baier et al. | Jun 2020 | B2 |
10707598 | Fu et al. | Jul 2020 | B2 |
20030024734 | Ineson et al. | Feb 2003 | A1 |
20040209498 | Hatakeyama | Oct 2004 | A1 |
20100040431 | Suzuki | Feb 2010 | A1 |
20100112859 | Olawsky et al. | May 2010 | A1 |
20100311255 | Reisinger et al. | Dec 2010 | A1 |
20110059633 | Chen et al. | Mar 2011 | A1 |
20200112108 | Yoshida | Apr 2020 | A1 |
20200136325 | Yoshida | Apr 2020 | A1 |
20200176902 | Fu et al. | Jun 2020 | A1 |
20200370733 | Hatano | Nov 2020 | A1 |
20210313737 | Scharnreithner | Oct 2021 | A1 |
20210399501 | Balana Avila et al. | Dec 2021 | A1 |
20220045444 | Blanco et al. | Feb 2022 | A1 |
Number | Date | Country |
---|---|---|
1538559 | Oct 2004 | CN |
104218419 | Dec 2014 | CN |
105514626 | Apr 2016 | CN |
107069340 | Aug 2017 | CN |
1983811 | Oct 2008 | EP |
3001508 | Mar 2016 | EP |
3039329 | Jan 2017 | FR |
H10189316 | Jul 1998 | JP |
Entry |
---|
Balana Avila, Joan, et al., Amendment Under 37 C.F.R. § 1.111 for U.S. Appl. No. 16/906,692, filed with the U.S. Patent and Trademark Office dated Mar. 2, 2022 (8 Pages). |
Number | Date | Country | |
---|---|---|---|
20220240371 A1 | Jul 2022 | US |