Grounding of printed circuits by connection to external grounding means

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CPC
H05K1/0215

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/0215Grounding of printed circuits by connection to external grounding means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heatsink based power delivery for CPUs
- Patent number 12,160,945
- Issue date Dec 3, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module
- Patent number 12,160,947
- Issue date Dec 3, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic compatibility contact between metal castings and pr...
- Patent number 12,150,251
- Issue date Nov 19, 2024
- Harman International Industries, Incorporated
- Jianing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic compatibility contact between metal castings and pr...
- Patent number 12,150,252
- Issue date Nov 19, 2024
- Harman International Industries, Incorporated
- Jianing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate and memory system
- Patent number 12,127,346
- Issue date Oct 22, 2024
- Kioxia Corporation
- Kazuyuki Niitsuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing thereof
- Patent number 12,120,812
- Issue date Oct 15, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Hao-Yi Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and electronic device
- Patent number 12,114,418
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Yongyao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shield printed wiring board with ground member and ground member
- Patent number 12,101,872
- Issue date Sep 24, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Yuusuke Haruna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device
- Patent number 12,069,797
- Issue date Aug 20, 2024
- Meidensha Corporation
- Shota Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin multilayer substrate
- Patent number 12,052,818
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded electronic component package
- Patent number 12,040,305
- Issue date Jul 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Base stations for unmanned aerial vehicles (UAVs)
- Patent number 12,030,399
- Issue date Jul 9, 2024
- Skydio, Inc.
- Christopher C. Berthelet
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Base stations for unmanned aerial vehicles (UAVs)
- Patent number 12,017,553
- Issue date Jun 25, 2024
- Skydio, Inc.
- Patrick Allen Lowe
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device and grounding structure thereof
- Patent number 11,991,818
- Issue date May 21, 2024
- Delta Electronics, Inc.
- Jui-Ching Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monolithic Pstages and methods for voltage regulators
- Patent number 11,979,978
- Issue date May 7, 2024
- Dell Products L.P.
- Merle Wood
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and grounding assembly thereof
- Patent number 11,956,888
- Issue date Apr 9, 2024
- Delta Electronics, Inc.
- Chia-Hsien Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module
- Patent number 11,956,891
- Issue date Apr 9, 2024
- Chicony Electronics Co., Ltd.
- Sheng-Sung Chou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electrostatic discharge protection for sensors in wound therapy
- Patent number 11,931,165
- Issue date Mar 19, 2024
- Smith & Nephew PLC
- Ben Alan Askem
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Heatsink based power delivery for CPUs
- Patent number 11,924,959
- Issue date Mar 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor storage device
- Patent number 11,887,911
- Issue date Jan 30, 2024
- Kioxia Corporation
- Daigo Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a computer device
- Patent number 11,889,615
- Issue date Jan 30, 2024
- Graphcore Limited
- Stephen Felix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount pads for next generation speeds
- Patent number 11,882,655
- Issue date Jan 23, 2024
- Dell Products L.P.
- Umesh Chandra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Balun comprising stepped transitions between balance and unbalance...
- Patent number 11,876,278
- Issue date Jan 16, 2024
- Raytheon Company
- Angelo M. Puzella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave shielding film
- Patent number 11,812,543
- Issue date Nov 7, 2023
- Tatsuta Electric Wire & Cable Co., Ltd.
- Akio Takahashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronics board mounting system
- Patent number 11,782,484
- Issue date Oct 10, 2023
- FUJIFILM SonoSite, Inc.
- Ken Dickenson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lighting device for a motor vehicle
- Patent number 11,781,740
- Issue date Oct 10, 2023
- Valeo Vision
- Franck Dinant
- F21 - LIGHTING
Information Patent Grant
Printed circuit board and printing apparatus
- Patent number 11,758,643
- Issue date Sep 12, 2023
- Canon Kabushiki Kaisha
- Yo Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for medical device and medical device
- Patent number 11,751,325
- Issue date Sep 5, 2023
- Sony Olympus Medical Solutions Inc.
- Kiyotaka Kanno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automation field device
- Patent number 11,751,320
- Issue date Sep 5, 2023
- ENDRESS+HAUSER SE+CO.KG
- Christian Strittmatter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEATSINK BASED POWER DELIVERY FOR CPUS
- Publication number 20240414836
- Publication date Dec 12, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB, PCB MOUNTING BOX, CASE ASSEMBLY, AND CASE
- Publication number 20240407078
- Publication date Dec 5, 2024
- ZTE CORPORATION
- Shoulong WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC DEVICE
- Publication number 20240392778
- Publication date Nov 28, 2024
- Mikuni Corporation
- Kei YASUGAHIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMORY MODULE NOTCH AND CONNECTOR-TO-MOTHERBOARD PINS FO...
- Publication number 20240397628
- Publication date Nov 28, 2024
- Intel Corporation
- Landon HANKS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CABLE ASSEMBLY WITH CROSSTALK BARRIER
- Publication number 20240373609
- Publication date Nov 7, 2024
- 3M Innovative Properties Company
- Alexander W. Barr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE
- Publication number 20240314922
- Publication date Sep 19, 2024
- LG Innotek Co., Ltd.
- Sang Yeal HAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240306288
- Publication date Sep 12, 2024
- Hitachi Astemo, Ltd.
- Takashi OGURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS MODULE IMMERSION SEALING WITH ELECTROMAGNETIC COMPATIBI...
- Publication number 20240284588
- Publication date Aug 22, 2024
- HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
- Alexander TZINARES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY MODULE AND DISPLAY APPARATUS
- Publication number 20240284589
- Publication date Aug 22, 2024
- Xiamen Tianma Optoelectronics Co., Ltd.
- Ningyang ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOUSING INCLUDING CONDUCTIVE PORTION AND ELECTRONIC DEVICE INCLUDIN...
- Publication number 20240283173
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Munhyun OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION CABLE STRUCTURE
- Publication number 20240276644
- Publication date Aug 15, 2024
- ELKA INTERNATIONAL LTD.
- YI-CHIEH CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR IMPLEMENTING MULTIPURPOSE SCREW H...
- Publication number 20240251499
- Publication date Jul 25, 2024
- Meta Platforms Technologies, LLC
- Qiuming Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GROUND POINT FIXING DEVICE FOR POWER SUPPLY MODULE
- Publication number 20240244740
- Publication date Jul 18, 2024
- ACBEL POLYTECH INC.
- Yu-Heng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER INCLUDING STRUCTURE FO...
- Publication number 20240224410
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Jeongseok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION FOR SENSORS IN WOUND THERAPY
- Publication number 20240215906
- Publication date Jul 4, 2024
- Smith & Nephew PLC
- Ben Alan Askem
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240224409
- Publication date Jul 4, 2024
- FUJIFILM CORPORATION
- Yusuke FUJII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240196519
- Publication date Jun 13, 2024
- FUJIFILM CORPORATION
- Yusuke FUJII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD GROUNDING
- Publication number 20240196516
- Publication date Jun 13, 2024
- AES Global Holdings PTE Ltd.
- Yihong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240188245
- Publication date Jun 6, 2024
- Sony Interactive Entertainment Inc.
- Katsushi Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA THROUGHPUT USING A METAL BRACKET
- Publication number 20240172398
- Publication date May 23, 2024
- Micron Technology, Inc.
- Deepu Narasimiah Subhash
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
NON-UNIFORM SURFACE MOUNT PADS
- Publication number 20240164018
- Publication date May 16, 2024
- Dell Products L.P.
- Umesh CHANDRA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240130035
- Publication date Apr 18, 2024
- FUJIFILM CORPORATION
- Yota AKASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK BASED POWER DELIVERY FOR CPUS
- Publication number 20240130033
- Publication date Apr 18, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICE
- Publication number 20240098881
- Publication date Mar 21, 2024
- MEIDENSHA CORPORATION
- Shota SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS
- Publication number 20240080979
- Publication date Mar 7, 2024
- Hitachi, Ltd
- Goro HAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION ARRANGEMENT FOR FREQUENCY CONVERTER
- Publication number 20240074128
- Publication date Feb 29, 2024
- Zhejiang Holip Electronic Technology Co., Ltd.
- Yuedong LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND PRINTING APPARATUS
- Publication number 20240023226
- Publication date Jan 18, 2024
- Canon Kabushiki Kaisha
- Yo Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY SUBSTRATE AND DISPLAY DEVICE
- Publication number 20240015939
- Publication date Jan 11, 2024
- BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Yaya QI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERMOLDED PRINTED CIRCUIT BOARD AND CONNECTOR WITH INTEGRATED STAN...
- Publication number 20230397346
- Publication date Dec 7, 2023
- Vitesco Technologies USA, LLC
- David Poot Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY
- Publication number 20230397356
- Publication date Dec 7, 2023
- Japan Aviation Electronics Industry, Ltd.
- Kenta OONISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Grounding of printed circuits by connection to external grounding means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heatsink based power delivery for CPUs

Electronic module

Electromagnetic compatibility contact between metal castings and pr...

Electromagnetic compatibility contact between metal castings and pr...

Substrate and memory system

Circuit board and method of manufacturing thereof

Electronic module and electronic device

Shield printed wiring board with ground member and ground member

Electrical device

Devices and methods related to metallization of ceramic substrates...

Resin multilayer substrate

Shielded electronic component package

Base stations for unmanned aerial vehicles (UAVs)

Base stations for unmanned aerial vehicles (UAVs)

Electronic device and grounding structure thereof

Monolithic Pstages and methods for voltage regulators

Electronic device and grounding assembly thereof

Electronic module

Electrostatic discharge protection for sensors in wound therapy

Heatsink based power delivery for CPUs

Semiconductor storage device

Method of manufacturing a computer device

Surface mount pads for next generation speeds

Balun comprising stepped transitions between balance and unbalance...

Electromagnetic wave shielding film

Electronics board mounting system

Lighting device for a motor vehicle

Printed circuit board and printing apparatus

Substrate for medical device and medical device

Automation field device

Patents Applicationslast 30 patents

HEATSINK BASED POWER DELIVERY FOR CPUS

PCB, PCB MOUNTING BOX, CASE ASSEMBLY, AND CASE

ELECTRIC DEVICE

CONDUCTIVE MEMORY MODULE NOTCH AND CONNECTOR-TO-MOTHERBOARD PINS FO...

CABLE ASSEMBLY WITH CROSSTALK BARRIER

CAMERA MODULE

ELECTRONIC DEVICE

ELECTRONICS MODULE IMMERSION SEALING WITH ELECTROMAGNETIC COMPATIBI...

DISPLAY MODULE AND DISPLAY APPARATUS

HOUSING INCLUDING CONDUCTIVE PORTION AND ELECTRONIC DEVICE INCLUDIN...

TRANSMISSION CABLE STRUCTURE

APPARATUS, SYSTEM, AND METHOD FOR IMPLEMENTING MULTIPURPOSE SCREW H...

GROUND POINT FIXING DEVICE FOR POWER SUPPLY MODULE

ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER INCLUDING STRUCTURE FO...

ELECTROSTATIC DISCHARGE PROTECTION FOR SENSORS IN WOUND THERAPY

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD GROUNDING

ELECTRONIC APPARATUS

DATA THROUGHPUT USING A METAL BRACKET

NON-UNIFORM SURFACE MOUNT PADS

ELECTRONIC APPARATUS

HEATSINK BASED POWER DELIVERY FOR CPUS

ELECTRICAL DEVICE

PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS

ELECTROSTATIC DISCHARGE PROTECTION ARRANGEMENT FOR FREQUENCY CONVERTER

PRINTED CIRCUIT BOARD AND PRINTING APPARATUS

DISPLAY SUBSTRATE AND DISPLAY DEVICE

OVERMOLDED PRINTED CIRCUIT BOARD AND CONNECTOR WITH INTEGRATED STAN...

DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY