System and method for supporting multi-path and/or multi-mode NVMe over fabrics devices

Information

  • Patent Grant
  • 11860808
  • Patent Number
    11,860,808
  • Date Filed
    Monday, October 5, 2020
    3 years ago
  • Date Issued
    Tuesday, January 2, 2024
    4 months ago
Abstract
A system includes a fabric switch including a motherboard, a baseboard management controller (BMC), a network switch configured to transport network signals, and a PCIe switch configured to transport PCIe signals; a midplane; and a plurality of device ports. Each of the plurality of device ports is configured to connect a storage device to the motherboard of the fabric switch over the midplane and carry the network signals and the PCIe signals over the midplane. The storage device is configurable in multiple modes based a protocol established over a fabric connection between the system and the storage device.
Description
TECHNICAL FIELD

The present disclosure relates generally to network-attached devices, more particularly, to a system and method for supporting multi-path and/or multi-mode NVMe over fabrics (NVMeoF) devices.


BACKGROUND

Non-volatile memory express (NVMe) and NVMe over fabrics (NVMeoF) (or NVMf in short) are new emerging technologies. NVMe is a standard that defines a register-level interface for host software to communicate with a non-volatile memory subsystem (e.g., a solid-state drive (SSD)) over a peripheral component interconnect express (PCIe) bus.


NVMeoF defines a common architecture that supports an NVMe block storage protocol over a wide range of storage networking fabrics such as Ethernet, Fibre Channel, InfiniBand, and other network fabrics. For an NVMeoF-based system, an X86-based central processing unit (CPU) on a motherboard is no longer required to move data between an initiator (e.g., host software) and a target device (i.e., an NVMeoF device) because the target device is capable of moving data by itself. The term, fabric, represents a network topology in which network nodes can pass data to each other through a variety of interconnecting protocols, ports, and switches. For example, Ethernet-attached SSDs may attach directly to a fabric, and in this case the fabric is the Ethernet.


The physical connection of the NVMe is based on a PCIe bus. A typical Ethernet SSD has a U.2 connector to interface with a system via a mid-plane over the PCIe bus. In the case of the four-lane PCIe bus (PCIe x4), the two Ethernet ports consume only two lanes of the four-lane PCIe signals, and the remaining two lanes of the PCIe X4 signals remain unused.


SUMMARY

According to one embodiment, a system includes a fabric switch including a motherboard, a baseboard management controller (BMC), a network switch configured to transport network signals, and a PCIe switch configured to transport PCIe signals; a midplane; and a plurality of device ports. Each of the plurality of device ports is configured to connect a storage device to the motherboard of the fabric switch over the midplane and carry the network signals and the PCIe signals over the midplane. The storage device is configurable in multiple modes based on a protocol established over a fabric connection between the system and the storage device.


According to another embodiment, an NVMeoF includes: a PCIe module; a network engine; and a connector configured to connect to a switch motherboard over a midplane and carry PCIe signals over the midplane. The PCIe module transports PCIe signals to the switch over the PCIe bus, and the network engine transport network signals to the switch over Serial Attached SCSI (SAS) pins of the connector.


According to yet another embodiment, a system includes: a switch and a plurality of NVMeoF devices. Each NVMeoF device is configured to be coupled to the switch using a connector. The connector is configured to transport the PCIe signals to the switch over a PCIe bus and transport network signals to the switch over a network bus.


The above and other preferred features, including various novel details of implementation and combination of events, will now be more particularly described with reference to the accompanying figures and pointed out in the claims. It will be understood that the particular systems and methods described herein are shown by way of illustration only and not as limitations. As will be understood by those skilled in the art, the principles and features described herein may be employed in various and numerous embodiments without departing from the scope of the present disclosure.





BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included as part of the present specification, illustrate the presently preferred embodiment and together with the general description given above and the detailed description of the preferred embodiment given below serve to explain and teach the principles described herein.



FIG. 1 illustrates a block diagram of an example NVMeoF device, according to one embodiment;



FIG. 2 illustrates a block diagram of an example switch motherboard, according to one embodiment;



FIG. 3 illustrates a block diagram of an example NVMeoF device, according to another embodiment;



FIG. 4 illustrates a block diagram of an example NVMeoF device configured as an NVMe device operating in a HA mode, according to one embodiment; and



FIG. 5 illustrates a block diagram of an example switch including two switch motherboards, according to one embodiment.





The figures are not necessarily drawn to scale and elements of similar structures or functions are generally represented by like reference numerals for illustrative purposes throughout the figures. The figures are only intended to facilitate the description of the various embodiments described herein. The figures do not describe every aspect of the teachings disclosed herein and do not limit the scope of the claims.


DETAILED DESCRIPTION

Each of the features and teachings disclosed herein can be utilized separately or in conjunction with other features and teachings to provide a system and method for supporting multi-path and/or multi-mode NVMeoF devices. Representative examples utilizing many of these additional features and teachings, both separately and in combination, are described in further detail with reference to the attached figures. This detailed description is merely intended to teach a person of skill in the art further details for practicing aspects of the present teachings and is not intended to limit the scope of the claims. Therefore, combinations of features disclosed above in the detailed description may not be necessary to practice the teachings in the broadest sense, and are instead taught merely to describe particularly representative examples of the present teachings.


In the description below, for purposes of explanation only, specific nomenclature is set forth to provide a thorough understanding of the present disclosure. However, it will be apparent to one skilled in the art that these specific details are not required to practice the teachings of the present disclosure.


Some portions of the detailed descriptions herein are presented in terms of algorithms and symbolic representations of operations on data bits within a computer memory. These algorithmic descriptions and representations are used by those skilled in the data processing arts to effectively convey the substance of their work to others skilled in the art. An algorithm is here, and generally, conceived to be a self-consistent sequence of steps leading to a desired result. The steps are those requiring physical manipulations of physical quantities. Usually, though not necessarily, these quantities take the form of electrical or magnetic signals capable of being stored, transferred, combined, compared, and otherwise manipulated. It has proven convenient at times, principally for reasons of common usage, to refer to these signals as bits, values, elements, symbols, characters, terms, numbers, or the like.


It should be borne in mind, however, that all of these and similar terms are to be associated with the appropriate physical quantities and are merely convenient labels applied to these quantities. Unless specifically stated otherwise as apparent from the below discussion, it is appreciated that throughout the description, discussions utilizing terms such as “processing,” “computing,” “calculating,” “determining,” “displaying,” or the like, refer to the action and processes of a computer system, or similar electronic computing device, that manipulates and transforms data represented as physical (electronic) quantities within the computer system's registers and memories into other data similarly represented as physical quantities within the computer system memories or registers or other such information storage, transmission or display devices.


The algorithms presented herein are not inherently related to any particular computer or other apparatus. Various general-purpose systems, computer servers, or personal computers may be used with programs in accordance with the teachings herein, or it may prove convenient to construct a more specialized apparatus to perform the required method steps. The required structure for a variety of these systems will appear from the description below. It will be appreciated that a variety of programming languages may be used to implement the teachings of the disclosure as described herein.


Moreover, the various features of the representative examples and the dependent claims may be combined in ways that are not specifically and explicitly enumerated in order to provide additional useful embodiments of the present teachings. It is also expressly noted that all value ranges or indications of groups of entities disclose every possible intermediate value or intermediate entity for the purpose of an original disclosure, as well as for the purpose of restricting the claimed subject matter. It is also expressly noted that the dimensions and the shapes of the components shown in the figures are designed to help to understand how the present teachings are practiced, but not intended to limit the dimensions and the shapes shown in the examples.


The present disclosure describes a system that can support both the NVMe and NVMeoF protocols, and various types of fabric-attached SSDs (eSSDs). In some embodiments, an eSSD refers to an SSD that can support the NVMeoF protocols. When configured to support the NVMeoF standard, the system can support various fabrics including not only Ethernet, but also, Fibre Channel, InfiniB and, and other network fabrics. For the convenience of illustration, the following examples and embodiments can show an Ethernet-attached NVMeoF devices. However, it is noted that any other type of NVMeoF devices can be used without deviating from the scope of the present disclosure.


The present system provides a single platform and common building blocks that can support both single and dual pathing systems compatible with both NVMe and NVMeoF devices. According to one embodiment, the common building blocks that support single pathing and dual pathing NVMe and NVMeoF devices include a mid-plane, a chassis, a fan assembly. The present system can scale linearly by adding more similar devices and/or chassis. The present system may also include other building blocks including, but not limited to, a full-width and a half-width switch boards, and an X86 motherboard.


The fabric-attached SSD (eSSD) disclosed herein is a single common device that can be used in multiples systems compatible with NVMe and NVMeoF standards. In this sense, the fabric-attached SSD is also referred to as a multi-mode NVMeoF device. The present system provides a platform that can supporting various types of NVMe and NVMeoF devices in non-high availability (non-HA) mode (i.e., single-path input/output (I/O) or HA mode (i.e., multi-path I/O) with minimum hardware changes.


According to one embodiment, the multi-mode NVMeoF device can support either NVMe or NVMeoF standard by detecting product information from a known location. For example, the product information used for self-configuration is stored in the chassis is a vital product data (VPD). During the start-up, the multi-mode NVMeoF device can retrieve the VPD from the chassis and configure itself based on the VPD. However, it is noted that the multi-mode NVMeoF device can be configured in various manners without deviating from the scope of the present disclosure. For example, the multi-mode NVMeoF device can be configured by a control command over the PCIe bus issued by a BMC of the switch to which the multi-mode NVMeoF device is connected.


According to one embodiment, the multi-mode NVMeoF device can be configured in a single port NVMe mode, a dual port NVMe mode, a single port NVMeoF mode, and a dual port NVMeoF mode. Table 1 shows example use of the U.2 connector according to the configuration of the multi-mode NVMeoF device. When configured as an NVMe device, the multi-mode NVMeoF device can be configured in either the single port NVMe mode or the dual port NVMe mode. In the single port NVMe mode, the PCIe lanes 0-3 of the U.2 connector are used to carry PCIe signals. In the dual port NVMe mode, the PCIe lanes are split into 2 by 2 lanes; the PCIe lanes 0 and 1 are used for the first port, and the PCIe lanes 2 and 3 are used for the second port. When configured as an NVMeoF device, the multi-mode NVMeoF device can be configured in either the single port NVMeoF mode or the dual port NVMeoF mode. In the single port NVMeoF mode, the PCIe lanes are split into 2 by 2 lanes but only the PCIe lanes 0 and 1 are used to carry PCIe signals, and the PCIe lanes 2 and 3 are not used. The first pair of the SAS port 0 is used for the Ethernet port 0 (first port), and the SAS port 1 is not used. In the dual port NVMeoF mode, the PCIe lanes are split into 2 by 2 lanes, and the PCIe lanes 0 and 1 are used as a control plane for the first Ethernet port, and the PCIe lanes 2 and 3 are used as a control plane for the second Ethernet port. The first pair of the SAS port 0 is used for the Ethernet port 0 (first port), and the SAS port 1 is used for the Ethernet port 1 (second port).









TABLE 1







Example use of U.2 connector












PCIe lanes 0&1
PCIe lanes 2&3
PCIe lanes 0-3
SAS Port 0 and 1


Configuration
of U.2 connector
of U.2 connector
of U.2 connector
of U.2 connector





Single port


Yes
Not used


NVMe


Dual port
Yes - used as
Yes - used as
Split into 2
Not used


NVMe
first port
second port
by 2 lanes


Single port
Yes - used as
Not used
Split into 2
First pair of SAS port 0 used


NVMeoF
control plane

by 2 lanes
for Ethernet port 0 (first



for first


port)



Ethernet port


SAS port 1 is not used


Dual port
Yes - used as
Yes - used as
Split into 2
First pair of SAS port 0 used


NVMeoF
control plane
control plane
by 2 lanes
for Ethernet port 0 (first



for first
for second

port)



Ethernet port
Ethernet port

Second pair of SAS port 1






used for Ethernet port 1






(second port)









If the product information is stored in a chassis, the two lanes (in a single port mode) or four lanes (in a dual port mode) of the PCIe bus on the U.2 connector are driven by a PCIe engine. In this case, the multi-mode NVMeoF device can disable the Ethernet engine(s), and the NVMe protocols and functionalities are supported or enabled. If the product information is stored in an NVMeoF chassis, the Ethernet ports use only PCIe lanes 2 and 3, or Serial Attached SCSI (SAS) pins depending on the design of the multi-mode NVMeoF device.


The present multi-mode NVMeoF device can operate in two distinct modes, namely, an NVMe mode and an NVMeoF mode. In the NVMe mode, the multi-mode NVMeoF device behaves as an NVMe device. The PCIe pins of the U.2 connector can be connected to the PCIe x4 module 111. The PCIe bus can be shared by data and control.


In one embodiment, in the NVMeoF mode, the multi-mode NVMeoF device can be configured in a single-path mode or a dual-path mode. In the single path mode, one PCIe x2 is used for control plane and is connected to one motherboard. In the dual-path mode, two PCIe x2 are used for control plane and are connected to two motherboards.


In another embodiment, the NVMeoF device can use SAS pins for the Ethernet ports in the NVMeoF mode. In the non-HA NVMeoF mode, the two lanes of the PCIe bus are used for standard features through a control plane. In the dual-port HA mode, the four lanes of the PCIe bus are split into two X2 lanes and used for port A and port B, respectively. The existing PCIe software and driver may be used as unmodified for the multi-mode NVMeoF device.


Because the multi-mode NVMeoF device can operate both in the NVMe and NVMeoF modes, the cost for developing and deploying the devices can be reduced because the same devices can be used in the NVMe mode and the NVMeoF mode. For the similar reason, the multi-mode NVMeoF device can have a faster time to the market. The multi-mode NVMeoF device can be used in various products and chassis. The two lanes of the PCIe bus are reserved for standard features through a control plane. A CPU, a baseboard management controller (BMC), and other devices can use the two lanes of the PCIe bus as a control plane to communicate to each NVMeoF device inside the chassis at no additional cost. The NVMe mid-plane can be used as unmodified, and there is no need for a new connector on the NVMeoF device due to the additional new pins.



FIG. 1 illustrates a block diagram of an example NVMeoF device, according to one embodiment. The NVMeoF device 101 includes a PCIe X4 module 111 (e.g., PCIe X4 Gen3 module) and various hardware and protocol stacks including, but not limited to, an Ethernet network interface card (NIC) 112, and a TCP/IP offload engine 113, an RDMA controller 115, an NVMeoF protocol stack 116. The NVMeoF device 101 can support up to two PCIe X2 buses 151 and 152 and two Ethernet ports 153 and 154 that are connected to a switch motherboard (not shown) over the mid plane 161 depending on a mode of operation. The two PCIe X2 buses 151 and 152 and the two Ethernet ports 153 and 154 are connected to a U.2 connector 121 of the NVMeoF device 101.


According to one embodiment, the NVMeoF device 101 can be configured to as an NVMe device. In the NVMe mode, a mode selector 160 can configure the NVMeoF device 101 to use all of the four lanes (in a single port mode) or only two lanes (in a dual port mode) of the four lanes of the PCIe bus to carry PCIe signals. The PCI x4 bus is connected to a midplane, and the PCIe bus is shared between data and control signals.


According to another embodiment, the NVMeoF device 101 can be configured as an NVMeoF device. In the NVMeoF mode, the mode selector 160 can configure the NVMeoF device 101 to use the two lanes of the PCIe X2 bus 151 to carry PCIe signals. The NVMeoF device 101 can further configure the remaining two lanes of the PCIe bus to carry Ethernet signals over the two Ethernet ports 153 and 154. In the NVMeoF mode, the two PCIe X2 lanes are directly transported to the PCIe X4 module 111, and signals over the remaining two PCIe X2 lanes are carried over the Ethernet ports 153 and 154 and buffered in the buffer 122 to be transported to the Ethernet NIC 112 of the NVMeoF device 101. The operational mode of the NVMeoF device 101 can be self-configured or externally set. For example, the NVMeoF device 101 can self-configure its operational mode using a physical pin (e.g., a presence pin on the chassis of the switch motherboard) or by an in-band command from a BMC (e.g., BMC 201 of FIG. 2) of the switch motherboard. The manageability information retrieved through Ethernet is referred to as “in-band” information whereas the manageability information retrieved through the PCIe bus is referred to as “out-of-band” information.


The NVMeoF device 101 can push various signals and perform various services over the PCIe ports 151 and 152 using the unused PCI X2 bus over the U.2 connector. Examples of the signals that can be pushed include, but are not limited to, health status information, field-replaceable unit (FRU) information, and sensor information of the NVMEOF device 101. Examples of the services that can be pushed over the PCIe ports include, but are not limited to, discovery services to a BMC or a CPU that is local to the switchboard and download services for a new NVMeoF device firmware for performing a firmware upgrade.


The NVMeoF device 101 can push some device-specific information directly to a BMC of the switch motherboard over the PCI X2 bus 151 over a control plane established between the switch motherboard and the NVMeoF device 101. Examples of such device-specific information that can be carried over the control plane include, but are not limited to, discovery information and FRU information of the NVMEOF device 101. This can reduce the burden of the BMC for polling the status of the NVMeoF device 101. The device-specific information may be communicated between the NVMeoF device 101 and the BMC using a new device command. The NVMeoF device 101 can support high availability (HA) multipath I/O with only the two PCIe lanes 151 and 152 of the PCIe X2 bus.



FIG. 2 illustrates a block diagram of an example switch motherboard, according to one embodiment. The switch motherboard 201 has an uplink Ethernet ports 211, downlink Ethernet ports 212, a local CPU 202, a BMC 203, an Ethernet switch 204, and a PCIe switch 205. A number of eSSDs can be connected to the switch motherboard 201. According to one embodiment, the eSSD is an NVMeoF device that can be configured to work as an NVMe device or an NVMeoF device depending on the mode of operation. Each of the eSSDs can be connected to the switch motherboard 201 via a U.2 connector as shown in FIG. 1 and configured to connect to the switch motherboard 201 via several high-speed Molex connectors that collectively carrying all PCIe X2 bus 213 and the downlink Ethernet ports 212 and other non-high speed control signals such as SMBus, reset, clock, etc. The switch motherboard 201 can push various signals to each of the eSSDs and perform various services on each of the eSSDs over the PCIe X2 bus 213 and/or the downlink Ethernet ports 212 over the midplane 261. For example, the switch motherboard 201 can receive device-specific information from each of the eSSDs over the Ethernet ports 212, including, but not limited to, health status information, field-replaceable unit (FRU) information, and sensor information of the eSSD. The switch motherboard 201 can also perform various services over the Ethernet ports 212 including, but not limited to, discovery services to a BMC or a local host CPU and download services for a new eSSD firmware for performing a firmware upgrade.



FIG. 3 illustrates a block diagram of an example NVMeoF device, according to another embodiment. The NVMeoF device 301 includes a PCIe X4 module 311 (e.g., PCIe X4 Gen3 module) and various hardware and protocol stacks including, but not limited to, an Ethernet network interface card (NIC) 312, and a TCP/IP offload engine 313, an RDMA controller 315, an NVMeoF protocol stack 316. The NVMeoF device 301 can support two PCIe X2 buses 351 and 352 and two Ethernet ports 353 and 354 that are connected to a switch motherboard (not shown) over the mid plane 361. The PCIe X2 buses 351 and 352 and the two Ethernet ports 353 and 354 are connected to a U.2 connector 321 of the NVMeoF device 301.


According to one embodiment, the NVMeoF device 301 can use the unused SAS pins of the U.2 connector 321 for Ethernet signals instead of using the PCIe lanes 153 and 154 as shown in FIG. 1. Because the NVMeoF device 301 uses the SAS pins for the Ethernet ports 353 and 354, the NVMeoF device 301 can support multi-path I/Os and multiple protocols without suffering from a bandwidth issue.



FIG. 4 illustrates a block diagram of an example NVMeoF device configured as an NVMe device operating in a HA mode, according to one embodiment. In this example, the NVMeoF device 401 is configured as an NVMe device and can support multi-path I/Os using a U.2 connector 421. A two half-width switch includes two switch controllers 460A and 460B is contained in one 2U chassis. The NVMeoF device 401 is connected to both the switch controllers 460A and 460B via the U.2 connector over the midplane 461. The switch controller 460A can support two lanes of the PCIe bus and an Ethernet port A while the switch controller 460B can support the remaining two lanes of the PCIe bus and an Ethernet port B. The NVMeoF device 401 can connect to the switch controller 460A over the two-lane PCIe bus 451 and the Ethernet port A 453. In addition, the NVMeoF device 401 can connect to the switch controller 460B over the two-lane PCIe bus 452 and the Ethernet port B 454.



FIG. 5 illustrates a block diagram of an example switch including two switch motherboards, according to one embodiment. The switch 500 includes two switch motherboards 501A and 501B to support multi I/O in a dual port configuration (in a HA mode). The switch motherboard 501A includes an Ethernet switch 504A and a PCIe switch 505A, and the switch motherboard 501B includes an Ethernet switch 504B and a PCIe switch 505B. Each of the switch motherboards 501A and 501B can include other components and modules, for example, a local CPU, a BMC, uplink Ethernet ports, downlink Ethernet ports, etc. as shown in the example switch motherboard 201 shown in FIG. 2.


Several eSSDs can be plugged into device ports of the switch. For example, each of the eSSDs is connected to the switch using a U.2 connector. Each eSSD can connect to both the switch motherboard 501A and the switch motherboard 501B. In the present example, the eSSDs plugged into the switch 500 are configured as an NVMeoF device requiring connectivity to the switch 500 over the midplane 561 via the PCIe bus and Ethernet ports.


According to one embodiment, the Ethernet signals between the switch 500 and the eSSDs can use SAS pins S2, S3, S5, and S6 for the primary Ethernet port 553 to the switch motherboard 501A. The Ethernet signals can also use S9, S10, S12, and S13 for the secondary Ethernet port 554 to the switch motherboard 501B. E25 pin of each U.2 connector can be used to enable the dual port configuration. PCIe signals can be carried over to PCIe buses 551 and 552 between the respective switch motherboards 501A and 501B and each of the eSSDs. The eSSD can self-configure its operational mode using a physical pin (e.g., a presence pin on the chassis of the switch) or by an in-band command from a BMC of the switch motherboard.


According to one embodiment, the switch 500 can support 10G Ethernet, and the midplane 561 is a common midplane that can support both a HA mode and a non-HA mode. Depending on the system configuration, signal integrity may need to be tested to ensure that the common midplane 561 can support for both configurations. If the signal integrity is not sufficient, the system can have two midplanes including the first midplane for the HA mode and the second midplane for the non-HA mode.


According to one embodiment, a system includes a fabric switch including a motherboard, a baseboard management controller (BMC), a network switch configured to transport network signals, and a PCIe switch configured to transport PCIe signals; a midplane; and a plurality of device ports. Each of the plurality of device ports is configured to connect a storage device to the motherboard of the fabric switch over the midplane and carry the network signals and the PCIe signals over the midplane. The storage device is configurable in multiple modes based on a protocol established over a fabric connection between the system and the storage device.


The storage device may have a U.2 connector.


The storage device may support both NVMe and NVMeoF protocols.


The midplane may support both a high availability (HA) mode and a non-HA mode.


The network signals may be carried over unused pins of the connector.


The network signals may provide discovery services or download services for a new firmware of the storage device.


The network signals may include device-specific information including one or more of health status information, field-replaceable unit (FRU) information, and sensor information of the storage device, and the device-specific information may be transported to the BMC over the midplane via PCIe lanes.


The storage device may be configured to operate in a HA mode or a non-HA mode.


According to another embodiment, an NVMeoF includes: a PCIe module; a network engine; and a connector configured to connect to a switch motherboard over a midplane and carry PCIe signals over the midplane. The PCIe module transports PCIe signals to the switch over the PCIe bus, and the network engine transport network signals to the switch over Serial Attached SCSI (SAS) pins of the connector.


The connector may be a U.2 connector.


The network signals may include device-specific information including one or more of health status information, FRU information, and sensor information of the NVMeoF device.


The device-specific information may be carried to a BMC of the switch over the midplane.


The network signals may provide discovery services or download services for a new firmware of the NVMeoF device.


The switch may include two switch boards including a primary Ethernet port and a secondary Ethernet port.


SAS pins S2, S3, S5, and S6 may be used for the primary Ethernet port, and SAS pins S9, S10, S12, and S13 may be used for the secondary Ethernet port.


The NVMeoF device may be configured to operate in a HA mode or a non-HA mode.


According to yet another embodiment, a system includes: a switch and a plurality of NVMeoF devices. Each NVMeoF device is configured to be coupled to the switch using a connector. The connector is configured to transport the PCIe signals to the switch over a PCIe bus and transport network signals to the switch over a network bus.


The connector may be a U.2 connector.


The PCIe signals may be transported over two PCIe lanes of the PCIe bus, and the network signals may be transported over the remaining two PCIe lanes of the PCIe bus.


The network signals may be transported over SAS pins.


The network signals may include device-specific information including one or more of health status information, FRU information, and sensor information of each NVMeoF device.


The network signals may provide discovery services or download services for a new firmware of each NVMeoF device.


Each NVMeoF device of the NVMeoF devices may be configured to operate in a HA mode or a non-HA mode.


The above example embodiments have been described hereinabove to illustrate various embodiments of implementing a system and method for supporting multi-path and/or multi-mode NVMeoF devices. Various modifications and departures from the disclosed example embodiments will occur to those having ordinary skill in the art. The subject matter that is intended to be within the scope of the invention is set forth in the following claims.

Claims
  • 1. A device comprising: a peripheral component interconnect express (PCIe) component configured to receive PCIe instructions using one or more PCIe signals;a U.2 connector configured to carry the one or more PCIe signals; anda network engine configured to transport one or more Ethernet signals using one or more pins of the U.2 connector;wherein the device is configured to operate in a first mode or a second mode;wherein the second mode is different from the first mode;wherein the first mode comprises an NVMeoF mode; andwherein the device is configured to use at least one of the one or more Ethernet signals for the NVMeoF mode.
  • 2. A device comprising: a peripheral component interconnect express (PCIe) component configured to receive PCIe instructions using one or more PCIe signals;a U.2 connector configured to carry the one or more PCIe signals; anda network engine configured to transport one or more Ethernet signals using one or more pins of the U.2 connector;wherein the device is configured to operate in a first mode or a second mode;wherein the second mode is different from the first mode; andwherein the device is configurable in the first mode based on a protocol established with a system using a fabric connection.
  • 3. A system comprising: a first device including a controller; anda second device comprising: a peripheral component interconnect express (PCIe) component configured to receive PCIe instructions from the first device using one or more PCIe signals;a U.2 connector configured to carry the one or more PCIe signals; anda network engine to transport one or more Ethernet signals to the first device using one or more pins of the U.2 connector;wherein the second device operates in a first mode or a second mode;wherein the second mode is different from the first mode;wherein the first mode comprises an NVMeoF mode; andwherein the second device is configured to use at least one of the one or more Ethernet signals for the NVMeoF mode.
  • 4. The device of claim 1 wherein the one or more pins of the U.2 connector comprise Serial Attached SCSI (SAS) pins.
  • 5. The device of claim 4, wherein the one or more Ethernet signals provide discovery services or download services for a new firmware of the first device.
  • 6. The device of claim 1, wherein the device is a first device, the first device is configured to receive the one or more PCIe signals from a second device, and the second device includes an Ethernet port that uses the one or more pins of the U.2 connector.
  • 7. The device of claim 2, wherein the device is operable in a high availability (HA) mode or a non-HA mode according to the protocol.
  • 8. The system of claim 3 further comprising a switch motherboard, the U.2 connector connecting the second device to the switch motherboard.
  • 9. The system of claim 8, wherein the one or more pins of the U.2 connector comprise Serial Attached SCSI (SAS) pins.
  • 10. The system of claim 9, wherein the Ethernet signals provide discovery services or download services for a new firmware of the second device.
  • 11. The system of claim 3, wherein the first device includes an Ethernet port that uses the one or more of the pins of the U.2 connector.
  • 12. The system of claim 3, wherein the controller of the first device is a baseboard management controller (BMC).
  • 13. The system of claim 3, wherein the second device is configurable in the first mode based on a protocol established with the system using a fabric connection.
  • 14. The system of claim 13, wherein the second device is operable in a high availability (HA) mode or a non-HA mode according to the protocol.
  • 15. The device of claim 1, wherein: the second mode comprises an NVMe mode; andthe device is configured to use at least one of the one or more PCIe signals for the NVMe mode.
  • 16. The system of claim 3, wherein: the second mode comprises an NVMe mode; andthe second device is configured to use at least one of the one or more PCIe signals for the NVMe mode.
CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation application of U.S. patent application Ser. No. 16/692,997 filed Nov. 22, 2019, which is a divisional application of U.S. patent application Ser. No. 16/211,923 filed Dec. 6, 2018, now issued to U.S. Pat. No. 10,540,311, which is a continuation application of U.S. patent application Ser. No. 15/403,088 filed Jan. 10, 2017, now issued to U.S. Pat. No. 10,210,123, which claims the benefits of and priority to U.S. Provisional Patent Application Ser. No. 62/366,622 filed Jul. 26, 2016 and entitled “SELF-CONFIGURING SSD MULTI-PROTOCOL SUPPORT IN HOST-LESS ENVIRONMENT,” and 62/420,355 filed Nov. 10, 2016 and entitled “MODULAR SYSTEM ARCHITECTURE FOR SUPPORTING MULTI-PATH AND/OR MULTI-MODE NMVE OVER FABRICS DEVICES,” and the disclosures of which are incorporated herein by reference in their entirety.

US Referenced Citations (241)
Number Name Date Kind
6295567 Bassman et al. Sep 2001 B1
6345303 Knauerhase et al. Feb 2002 B1
6427198 Berglund et al. Jul 2002 B1
6611863 Banginwar Aug 2003 B1
6662119 Mitchell Dec 2003 B1
7107253 Sumner et al. Sep 2006 B1
7120759 Chiu et al. Oct 2006 B2
7143153 Black et al. Nov 2006 B1
7249173 Nicolson Jul 2007 B2
7512585 Agarwal et al. Mar 2009 B2
7536486 Sadovsky et al. May 2009 B2
7620854 Kuttan et al. Nov 2009 B2
7873700 Pawlowski et al. Jan 2011 B2
7882393 Grimes et al. Feb 2011 B2
7944812 Carlson et al. May 2011 B2
8065347 Demeyer et al. Nov 2011 B1
8180862 Baker et al. May 2012 B2
8396981 Lee et al. Mar 2013 B1
8599863 Davis Dec 2013 B2
8667224 Yu et al. Mar 2014 B1
8754681 Zhu et al. Jun 2014 B2
8832327 Lin Sep 2014 B1
8943234 Voorhees et al. Jan 2015 B1
8949517 Cohen et al. Feb 2015 B2
8953644 Chandra et al. Feb 2015 B2
8998636 Gomez et al. Apr 2015 B2
9037786 Asnaashari et al. May 2015 B2
9047222 Chandra et al. Jun 2015 B2
9092321 Salessi Jul 2015 B2
9244865 Hutchison et al. Jan 2016 B2
9244877 Yang et al. Jan 2016 B2
9253275 Bhogal et al. Feb 2016 B2
9280357 Shaver et al. Mar 2016 B2
9280504 Ben-Michael et al. Mar 2016 B2
9389805 Cohen et al. Jul 2016 B2
9400749 Kuzmin et al. Jul 2016 B1
9460042 Iskandar et al. Oct 2016 B2
9465756 Bennett Oct 2016 B2
9648148 Rimmer et al. May 2017 B2
9653124 Heyd et al. May 2017 B2
9734093 Khemani et al. Aug 2017 B2
9734106 Kotzur Aug 2017 B2
9785346 Yost Oct 2017 B2
9785355 Huang Oct 2017 B2
9785356 Huang Oct 2017 B2
9811481 Bhatia et al. Nov 2017 B2
9830082 Srinivasan et al. Nov 2017 B1
9842084 Friedman et al. Dec 2017 B2
9904330 Schuette Feb 2018 B2
9906596 Sikdar Feb 2018 B2
9934173 Sakalley et al. Apr 2018 B1
9934183 Brassac et al. Apr 2018 B2
9959240 Mundt May 2018 B2
9965367 Shih May 2018 B2
9990313 Monji et al. Jun 2018 B2
10019388 Long et al. Jul 2018 B2
10063638 Huang Aug 2018 B2
10108450 Pinto et al. Oct 2018 B2
10114778 Worley Oct 2018 B2
10162784 Bassett et al. Dec 2018 B2
10206297 Breakstone et al. Feb 2019 B2
10223313 Shih Mar 2019 B2
10223316 Mataya Mar 2019 B2
10235313 Lee et al. Mar 2019 B2
10255215 Breakstone et al. Apr 2019 B2
10275356 Chou et al. Apr 2019 B2
10289517 Beerens May 2019 B2
10289588 Chu May 2019 B2
10318443 Su Jun 2019 B2
10346041 Olarig et al. Jul 2019 B2
10372648 Qiu Aug 2019 B2
10372659 Olarig et al. Aug 2019 B2
10394723 Yang Aug 2019 B2
10452576 Stuhlsatz Oct 2019 B2
10467163 Malwankar Nov 2019 B1
10467170 McKnight Nov 2019 B2
10474589 Raskin Nov 2019 B1
10560550 Xue et al. Feb 2020 B1
10592144 Roberts et al. Mar 2020 B2
10733137 Kachare et al. Aug 2020 B2
10866911 Qiu et al. Dec 2020 B2
10901927 Fischer et al. Jan 2021 B2
10929327 Schrempp Feb 2021 B1
10942666 Pydipaty et al. Mar 2021 B2
11113046 Bowen et al. Sep 2021 B1
11126352 Olarig et al. Sep 2021 B2
11347740 Moshe et al. May 2022 B2
20020087887 Busam et al. Jul 2002 A1
20020095491 Edmonds et al. Jul 2002 A1
20020123365 Thorson et al. Sep 2002 A1
20030058818 Wilkes et al. Mar 2003 A1
20040073912 Meza Apr 2004 A1
20040111590 Klein Jun 2004 A1
20040147281 Holcombe et al. Jul 2004 A1
20040153844 Ghose et al. Aug 2004 A1
20050025125 Kwan Feb 2005 A1
20050060442 Beverly et al. Mar 2005 A1
20050120157 Chen et al. Jun 2005 A1
20060059287 Rivard et al. Mar 2006 A1
20060095625 Wootten et al. May 2006 A1
20060098681 Cafiero et al. May 2006 A1
20060136621 Tung et al. Jun 2006 A1
20060202950 Lee et al. Sep 2006 A1
20070077553 Bentwich Apr 2007 A1
20080003845 Hong et al. Jan 2008 A1
20080288708 Hsueh Nov 2008 A1
20090073896 Gillingham et al. Mar 2009 A1
20090077478 Gillingham et al. Mar 2009 A1
20090217188 Alexander et al. Aug 2009 A1
20090222733 Basham et al. Sep 2009 A1
20090259364 Vollmer et al. Oct 2009 A1
20100077067 Strole Mar 2010 A1
20100100858 Schipper Apr 2010 A1
20100106836 Schreyer et al. Apr 2010 A1
20100169512 Matton et al. Jul 2010 A1
20110131380 Rallens et al. Jun 2011 A1
20110151858 Lai Jun 2011 A1
20120056728 Erdmann et al. Mar 2012 A1
20120102580 Bealkowski Apr 2012 A1
20120207156 Srinivasan et al. Aug 2012 A1
20120311654 Dougherty, III et al. Dec 2012 A1
20120319750 Zhu et al. Dec 2012 A1
20130117503 Nellans et al. May 2013 A1
20130117766 Bax et al. May 2013 A1
20130179624 Lambert et al. Jul 2013 A1
20130198311 Tamir et al. Aug 2013 A1
20130198312 Tamir et al. Aug 2013 A1
20130242991 Basso et al. Sep 2013 A1
20130282953 Orme et al. Oct 2013 A1
20130304979 Zimmer et al. Nov 2013 A1
20130311795 Cong et al. Nov 2013 A1
20130318371 Hormuth Nov 2013 A1
20130325998 Hormuth et al. Dec 2013 A1
20140032641 Du Jan 2014 A1
20140052928 Shimoi Feb 2014 A1
20140122746 Shaver et al. May 2014 A1
20140195634 Kishore et al. Jul 2014 A1
20140195711 Bhatia et al. Jul 2014 A1
20140258679 McGee Sep 2014 A1
20140281458 Ravimohan et al. Sep 2014 A1
20140317206 Lomelino et al. Oct 2014 A1
20140330995 Levy et al. Nov 2014 A1
20140344431 Hsu et al. Nov 2014 A1
20150006758 Holtman et al. Jan 2015 A1
20150039815 Klein Feb 2015 A1
20150067188 Chakhaiyar Mar 2015 A1
20150086017 Taylor et al. Mar 2015 A1
20150106660 Chumbalkar et al. Apr 2015 A1
20150120874 Kim et al. Apr 2015 A1
20150120971 Bae et al. Apr 2015 A1
20150138900 Choi May 2015 A1
20150178095 Balakrishnan et al. Jun 2015 A1
20150181760 Stephens Jun 2015 A1
20150205541 Nishtala et al. Jul 2015 A1
20150234815 Slik Aug 2015 A1
20150254088 Chou et al. Sep 2015 A1
20150255130 Lee et al. Sep 2015 A1
20150261434 Kagan et al. Sep 2015 A1
20150286599 Hershberger Oct 2015 A1
20150301757 Iwata et al. Oct 2015 A1
20150301964 Brinicombe et al. Oct 2015 A1
20150304423 Satoyama et al. Oct 2015 A1
20150324312 Jacobson et al. Nov 2015 A1
20150331473 Jreji et al. Nov 2015 A1
20150350096 Dine et al. Dec 2015 A1
20150370661 Swanson et al. Dec 2015 A1
20150370665 Cannata et al. Dec 2015 A1
20150376840 Shih Dec 2015 A1
20150381734 Ebihara et al. Dec 2015 A1
20160004879 Fisher et al. Jan 2016 A1
20160062936 Brassac et al. Mar 2016 A1
20160077841 Lambert et al. Mar 2016 A1
20160085718 Huang Mar 2016 A1
20160092390 Grothen et al. Mar 2016 A1
20160094619 Khan et al. Mar 2016 A1
20160127468 Malwankar et al. May 2016 A1
20160127492 Malwankar et al. May 2016 A1
20160146754 Prasad et al. May 2016 A1
20160147446 Ghosh May 2016 A1
20160188313 Dubal et al. Jun 2016 A1
20160246754 Rao et al. Aug 2016 A1
20160259597 Worley Sep 2016 A1
20160261375 Roethig et al. Sep 2016 A1
20160283428 Guddeti Sep 2016 A1
20160306723 Lu Oct 2016 A1
20160306768 Mataya Oct 2016 A1
20160328344 Jose et al. Nov 2016 A1
20160328347 Worley et al. Nov 2016 A1
20160337272 Berman Nov 2016 A1
20160366071 Chandran et al. Dec 2016 A1
20170018149 Shih Jan 2017 A1
20170038804 Shows et al. Feb 2017 A1
20170063965 Grenader Mar 2017 A1
20170068268 Giriyappa et al. Mar 2017 A1
20170068628 Calciu et al. Mar 2017 A1
20170068630 Iskandar et al. Mar 2017 A1
20170168943 Chou Jun 2017 A1
20170185554 Fricker Jun 2017 A1
20170187629 Shalev et al. Jun 2017 A1
20170206034 Fetik Jul 2017 A1
20170262029 Nelson et al. Sep 2017 A1
20170269871 Khan et al. Sep 2017 A1
20170270001 Suryanarayana et al. Sep 2017 A1
20170270060 Gupta et al. Sep 2017 A1
20170286305 Kalwitz Oct 2017 A1
20170317901 Agrawal et al. Nov 2017 A1
20170344259 Freyensee et al. Nov 2017 A1
20170344294 Mishra et al. Nov 2017 A1
20170357299 Shabbir et al. Dec 2017 A1
20170357515 Bower, III et al. Dec 2017 A1
20180004695 Chu et al. Jan 2018 A1
20180019896 Paquet et al. Jan 2018 A1
20180032463 Olarig et al. Feb 2018 A1
20180032469 Olarig et al. Feb 2018 A1
20180032471 Olarig Feb 2018 A1
20180052745 Marripudi et al. Feb 2018 A1
20180074717 Olarig et al. Mar 2018 A1
20180074984 Olarig et al. Mar 2018 A1
20180095904 Bunker et al. Apr 2018 A1
20180101492 Cho et al. Apr 2018 A1
20180131633 Li May 2018 A1
20180173652 Olarig et al. Jun 2018 A1
20180210517 Yun Jul 2018 A1
20180227369 DuCray et al. Aug 2018 A1
20180267925 Rees Sep 2018 A1
20180275919 Chirumamilla et al. Sep 2018 A1
20180307650 Kachare et al. Oct 2018 A1
20180335958 Wu et al. Nov 2018 A1
20180365185 Risinger et al. Dec 2018 A1
20180373609 Beerens Dec 2018 A1
20190042424 Nair Feb 2019 A1
20190087268 Koltsidas et al. Mar 2019 A1
20190104632 Nelson et al. Apr 2019 A1
20190286584 Olarig et al. Sep 2019 A1
20190339888 Sasidharan et al. Nov 2019 A1
20200042217 Roberts et al. Feb 2020 A1
20200117663 Moshe et al. Apr 2020 A1
20200293916 Li Sep 2020 A1
20210342281 Olarig et al. Nov 2021 A1
20220188002 Olarig Jun 2022 A1
20220206693 Jung et al. Jun 2022 A1
Foreign Referenced Citations (38)
Number Date Country
1641568 Jul 2005 CN
101847429 May 2012 CN
103946824 Jul 2014 CN
104025063 Sep 2014 CN
104202197 Dec 2014 CN
104572516 Apr 2015 CN
104615577 May 2015 CN
105260275 Jan 2016 CN
105912275 Aug 2016 CN
103412769 Nov 2017 CN
2290497 Feb 2011 EP
2843557 Apr 2015 EP
H04257050 Sep 1992 JP
2001290752 Oct 2001 JP
2010146525 Jul 2010 JP
2011048534 Mar 2011 JP
2012506184 Mar 2012 JP
2013041390 Feb 2013 JP
2014241545 Dec 2014 JP
2015049742 Mar 2015 JP
2015191649 Nov 2015 JP
2015194005 Nov 2015 JP
20158532985 Nov 2015 JP
2016037501 Mar 2016 JP
2016045968 Apr 2016 JP
2015194005 Apr 2017 JP
20090106469 Oct 2009 KR
20120135205 Dec 2012 KR
20150047785 May 2015 KR
20150071898 Jun 2015 KR
20160074659 Jun 2016 KR
201445325 Dec 2014 TW
2013077867 May 2013 WO
2014209764 Dec 2014 WO
2015049742 Sep 2015 WO
2015191649 Dec 2015 WO
2016037501 Mar 2016 WO
WO-2016085016 Jun 2016 WO
Non-Patent Literature Citations (143)
Entry
“What is the New U.2 SSD Connection?” OC3D News, Jul. 2016, https://www.overstsock3d.nrt/news/storage/what_is_the_u_2_ssd_connection/1.
SATA Express—Wikipedia.
U.2—Wikipedia.
Advisory Action for U.S. Appl. No. 15/256,495, dated Feb. 1, 2019.
Corrected Notice of Allowability for U.S. Appl. No. 15/256,495, dated Mar. 18, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 15/256,495, dated May 13, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 15/345,509, dated Aug. 11, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 15/345,509, dated Aug. 30, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 15/345,509, dated Dec. 10, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 15/345,509, dated Jun. 15, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 15/345,509, dated Oct. 27, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 16/202,079, dated Jul. 12, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 16/202,079, dated Jul. 22, 2020.
Corrected Notice of Allowability for U.S. Appl. No. 16/202,079, dated Sep. 15, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 16/424,474, dated Aug. 18, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 16/424,474, dated Feb. 22, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 16/424,474, dated Mar. 29, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 16/692,997, dated Jun. 18, 2020.
Corrected Notice of Allowability for U.S. Appl. No. 16/844,995, dated Dec. 9, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 16/857,172, dated Aug. 20, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 16/921,923, dated Apr. 1, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 16/921,923, dated Aug. 24, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 16/921,923, dated Jul. 14, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 16/921,923, dated May 26, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 16/950,624, dated Jul. 16, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 16/950,624, dated Jun. 10, 2021.
Fang, Chin, “Using NVMe Gen3 PCIe SSD Cards in High-density Servers for High-performance Big Data Transfer Over Multiple Network Channels”, SLAC National Accelerator Laboratory, Stanford University, Stanford, California, Feb. 7, 2015, 17 pages.
NVM Express over Fabrics specification Revision 1.0; NVM Express Inc.; Jun. 5, 2016. (Year: 2016).
OC3d, “What is the New U.2 SSD Connection?,” (https://www.overclock3d.net/news/storage/what_is_the_new_u_2_ssd_connection/1), Jul. 2016, retrieved Apr. 12, 2021, 5 pages.
SSD Form Factor Work Group, “Enterprise SSD Form Factor 1.0a”, 2012, SSD Form Factor Work Group, pp. 1-55. (Year: 2012).
Wikipedia, “SATA Express,” (https://en.wikipedia.org/wiki/SATA_Express), retrieved Apr. 12, 2021, 6 pages.
Wikipedia, “U.2,” (https://en.wikipedia.org/wiki/U.2), retrieved Apr. 12, 2021, 2 pages.
Corrected Notice of Allowability for U.S. Appl. No. 15/345,509, dated Jun. 10, 2022.
Final Office Action for U.S. Appl. No. 17/022,075, dated May 25, 2022.
Notice of Allowance for U.S. Appl. No. 17/063,501, dated Jun. 2, 2022.
Supplemental Notice of Allowability for U.S. Appl. No. 17/099,776, dated May 16, 2022.
Notice of Allowance for U.S. Appl. No. 15/345,509, dated Feb. 8, 2022.
Notice of Allowance for U.S. Appl. No. 16/202,079, dated Mar. 17, 2022.
Notice of Allowance for U.S. Appl. No. 17/099,776, dated Feb. 15, 2022.
Office Action for U.S. Appl. No. 16/844,995, dated Feb. 22, 2022.
Office Action for U.S. Appl. No. 17/063,501, dated Feb. 24, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 15/345,509, dated Aug. 8, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 16/202,079, dated Aug. 17, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 17/063,501, dated Jul. 27, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 17/099,776, dated Jul. 21, 2022.
Office Action for U.S. Appl. No. 17/408,365, dated Aug. 2, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 15/345,509, dated Jun. 27, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 16/202,079, dated Jul. 7, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 17/063,501, dated Jul. 7, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 17/063,501, dated Jun. 23, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 17/099,776, dated Jun. 20, 2022.
Final Office Action for U.S. Appl. No. 15/256,495, dated Dec. 4, 2019.
Final Office Action for U.S. Appl. No. 15/256,495, dated Oct. 19, 2018.
Final Office Action for U.S. Appl. No. 15/345,509, dated Feb. 21, 2019.
Final Office Action for U.S. Appl. No. 15/411,962, dated Dec. 20, 2018.
Final Office Action for U.S. Appl. No. 16/211,923, dated Aug. 19, 2019.
Final Office Action for U.S. Appl. No. 16/424,474, dated May 1, 2020.
Final Office Action for U.S. Appl. No. 16/692,997, dated Mar. 26, 2020.
Final Office Action for U.S. Appl. No. 16/844,995, dated Mar. 29, 2021.
Final Office Action for U.S. Appl. No. 17/063,501, dated Nov. 2, 2021.
Notice of Allowance for U.S. Appl. No. 15/256,495, dated Mar. 5, 2020.
Notice of Allowance for U.S. Appl. No. 15/345,507, dated Feb. 19, 2019.
Notice of Allowance for U.S. Appl. No. 15/345,509, dated May 13, 2021.
Notice of Allowance for U.S. Appl. No. 15/403,088, dated Oct. 22, 2018.
Notice of Allowance for U.S. Appl. No. 15/411,962, dated Mar. 18, 2019.
Notice of Allowance for U.S. Appl. No. 16/202,079, dated Jan. 27, 2021.
Notice of Allowance for U.S. Appl. No. 16/202,079, dated Jun. 1, 2020.
Notice of Allowance for U.S. Appl. No. 16/202,079, dated May 14, 2021.
Notice of Allowance for U.S. Appl. No. 16/211,923, dated Sep. 13, 2019.
Notice of Allowance for U.S. Appl. No. 16/421,458, dated Apr. 15, 2020.
Notice of Allowance for U.S. Appl. No. 16/424,474, dated Apr. 30, 2021.
Notice of Allowance for U.S. Appl. No. 16/424,474, dated Jul. 15, 2020.
Notice of Allowance for U.S. Appl. No. 16/692,997, dated Jun. 1, 2020.
Notice of Allowance for U.S. Appl. No. 16/844,995, dated Sep. 29, 2021.
Notice of Allowance for U.S. Appl. No. 16/857,172, dated May 3, 2021.
Notice of Allowance for U.S. Appl. No. 16/921,923, dated Feb. 18, 2021.
Notice of Allowance for U.S. Appl. No. 16/950,624, dated May 10, 2021.
Office Action for U.S. Appl. No. 15/256,495, dated Jun. 14, 2019.
Office Action for U.S. Appl. No. 15/256,495, dated Mar. 29, 2018.
Office Action for U.S. Appl. No. 15/345,507, dated Dec. 3, 2018.
Office Action for U.S. Appl. No. 15/345,509, dated Apr. 29, 2020.
Office Action for U.S. Appl. No. 15/345,509, dated Nov. 29, 2019.
Office Action for U.S. Appl. No. 15/345,509, dated Sep. 10, 2018.
Office Action for U.S. Appl. No. 15/345,509, dated Sep. 28, 2020.
Office Action for U.S. Appl. No. 15/403,088, dated Jun. 7, 2018.
Office Action for U.S. Appl. No. 15/411,962, dated Aug. 10, 2018.
Office Action for U.S. Appl. No. 16/202,079, dated Aug. 22, 2019.
Office Action for U.S. Appl. No. 16/202,079, dated Dec. 9, 2021.
Office Action for U.S. Appl. No. 16/202,079, dated Mar. 4, 2020.
Office Action for U.S. Appl. No. 16/211,923, dated May 6, 2019.
Office Action for U.S. Appl. No. 16/421,458, dated Dec. 30, 2019.
Office Action for U.S. Appl. No. 16/424,474, dated Feb. 3, 2020.
Office Action for U.S. Appl. No. 16/424,474, dated Oct. 15, 2019.
Office Action for U.S. Appl. No. 16/692,997, dated Dec. 19, 2019.
Office Action for U.S. Appl. No. 16/844,995, dated Sep. 4, 2020.
Office Action for U.S. Appl. No. 16/857,172, dated Oct. 8, 2020.
Office Action for U.S. Appl. No. 16/921,923, dated Oct. 28, 2020.
Office Action for U.S. Appl. No. 16/950,624, dated Jan. 25, 2021.
Office Action for U.S. Appl. No. 17/022,075, dated Oct. 15, 2021.
Office Action for U.S. Appl. No. 17/063,501, dated Jul. 15, 2021.
Office Action for U.S. Appl. No. 17/099,776, dated Sep. 24, 2021.
Corrected Notice of Allowability for U.S. Appl. No. 15/345,509, dated Sep. 7, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 16/202,079, dated Aug. 31, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 16/844,995, dated Oct. 20, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 17/022,075, dated Sep. 6, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 17/063,501, dated Aug. 24, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 17/063,501, dated Oct. 13, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 17/099,776, dated Aug. 24, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 17/099,776, dated Oct. 19, 2022.
Notice of Allowance for U.S. Appl. No. 16/844,995, dated Aug. 26, 2022.
Notice of Allowance for U.S. Appl. No. 17/022,075, dated Aug. 23, 2022.
Office Action for U.S. Appl. No. 17/230,989, dated Oct. 31, 2022.
Office Action for U.S. Appl. No. 17/376,145, dated Sep. 30, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 17/022,075, dated Dec. 5, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 17/063,501, dated Nov. 21, 2022.
Corrected Notice of Allowability for U.S. Appl. No. 17/099,776, dated Nov. 30, 2022.
Final Office Action for U.S. Appl. No. 17/408,365, dated Dec. 27, 2022.
Corrected Notice of Allowabilty for U.S. Appl. No. 16/844,995, dated Jan. 19, 2023.
Office Action for U.S. Appl. No. 16/202,079, dated Feb. 2, 2023.
Office Action for U.S. Appl. No. 17/868,734, dated Feb. 14, 2023.
Corrected Notice of Allowability for U.S. Appl. No. 16/844,995, dated Mar. 15, 2023.
Corrected Notice of Allowability for U.S. Appl. No. 16/844,995, dated Mar. 22, 2023.
Corrected Notice of Allowability for U.S. Appl. No. 16/844,995, dated May 5, 2023.
Final Office Action for U.S. Appl. No. 17/408,365, dated Apr. 18, 2023.
Office Action for U.S. Appl. No. 17/022,075, dated May 11, 2023.
Office Action for U.S. Appl. No. 17/099,776, dated Apr. 17, 2023.
Corrected Notice of Allowability for U.S. Appl. No. 16/844,995, dated Jun. 30, 2023.
Corrected Notice of Allowability for U.S. Appl. No. 16/844,995, dated Jun. 7, 2023.
Final Office Action for U.S. Appl. No. 17/230,989, dated Jun. 28, 2023.
Notice of Allowance for U.S. Appl. No. 17/376,145, dated Jun. 20, 2023.
Notice of Allowance for U.S. Appl. No. 17/868,734, dated Jul. 6, 2023.
Corrected Notice of Allowability for U.S. Appl. No. 16/844,995, dated Sep. 5, 2023.
Corrected Notice of Allowability for U.S. Appl. No. 17/376,145, dated Aug. 28, 2023.
Notice of Allowance for U.S. Appl. No. 17/099,776, dated Aug. 8, 2023.
Supplemental Notice of Allowability for U.S. Appl. No. 17/099,776, dated Aug. 17, 2023.
Supplemental Notice of Allowability for U.S. Appl. No. 17/868,734, dated Aug. 14, 2023.
Corrected Notice of Allowability for U.S. Appl. No. 16/844,995, dated Oct. 12, 2023.
Corrected Notice of Allowability for U.S. Appl. No. 17/376,145, dated Oct. 12, 2023.
Final Office Action for U.S. Appl. No. 17/230,989, dated Sep. 26, 2023.
Notice of Allowance for U.S. Appl. No. 17/408,365, dated Sep. 19, 2023.
Supplemental Notice of Allowability for U.S. Appl. No. 17/099,776, dated Sep. 27, 2023.
Supplemental Notice of Allowability for U.S. Appl. No. 17/408,365, dated Sep. 28, 2023.
Supplemental Notice of Allowability for U.S. Appl. No. 17/868,734, dated Sep. 25, 2023.
Related Publications (1)
Number Date Country
20210019273 A1 Jan 2021 US
Provisional Applications (2)
Number Date Country
62420355 Nov 2016 US
62366622 Jul 2016 US
Divisions (1)
Number Date Country
Parent 16211923 Dec 2018 US
Child 16692997 US
Continuations (2)
Number Date Country
Parent 16692997 Nov 2019 US
Child 17063507 US
Parent 15403088 Jan 2017 US
Child 16211923 US