Claims
- 1. An imaging system for use with generally planar substrates comprising:
an air flow conveyor operative to convey a planar substrate, said substrate selected from the group substrates consisting of printed circuit board, flat panel display and interconnect device substrates, at least to an imaging location, said air flow conveyor having an air flow substrate flattening functionality at least at said imaging location; and an imager acquirer located at said imaging location for imaging said planar substrate when flattened by said air flow substrate flattening functionality.
- 2. An imaging system according to claim 1 and wherein said air flow conveyor comprises an air cushion levitator.
- 3. An imaging system according to claim 1 and wherein said air flow conveyor comprises an air cushion hold down.
- 4. An imaging system according to -claim 1 and wherein said air flow substrate flattening functionality comprises an air cushion.
- 5. An imaging system according to claim 1 and wherein said air flow substrate flattening functionality comprises a suction hold down.
- 6. An imaging system according to claim 1 and wherein said air flow conveyor is also operative to convey said planar substrate away from said imaging location.
- 7. An imaging system according to claim 1 and wherein said air flow conveyor includes a displacer for displacing said planar substrate at least towards said imaging location.
- 8. An imaging system according to claim 1 and wherein said air flow conveyor includes a displacer for displacing said planar substrates away from said imaging location.
- 9. A two-sided imaging system for use with generally planar substrates comprising:
an air flow conveyor operative to convey a generally planar substrate, said planar substrate selected from the group of substrates consisting of printed circuit board, flat panel display and interconnect device substrates, in a levitated state at least to an imaging location; and an imager acquirer located at said imaging location for imaging two opposite sides of said planar substrates when levitated by said air flow conveyor.
- 10. An imaging system according to claim 9 and wherein said air flow conveyor comprises air flow substrate flattening functionality at least at said imaging location.
- 11. An imaging system according to claim 9 and wherein said air flow conveyor comprises a suction hold down.
- 12. An imaging system according to claim 10 and wherein said air flow substrate flattening functionality comprises an air cushion hold down.
- 13. An imaging system according to claim 10 and wherein said air flow substrate flattening functionality comprises a suction hold down.
- 14. An imaging system according to claim 9 and wherein said air flow conveyor is also operative to convey said planar substrates away from said imaging location.
- 15. An imaging system according to claim 9 and wherein said air flow conveyor includes a displacer for displacing said planar substrates at least towards said imaging location.
- 16. An imaging system according to claim 9 and wherein said air flow conveyor includes a displacer for displacing said planar substrates away from said imaging location.
- 17. A method for imaging generally planar substrates comprising:
conveying a planar substrate with an air flow conveyor to at least an imaging location, said planar substrate being selected from the group of substrates consisting of printed circuit board, flat panel display and interconnect device substrates; flattening said planar substrate with an a air flow substrate flattener at least at said image acquiring location; and acquiring an image of said planar substrate with an imager located at said image acquiring location, when flattened by said air flow substrate flattener.
- 18. The method according to claim 17 and wherein said air flow conveyor comprises an air flow levitator.
- 19. The method according to claim 17 and wherein said air flow conveyor comprises an air flow hold down.
- 20. The method according to claim 17 and wherein said air flow substrate flattener functionality comprises flattening with an air cushion.
- 21. The method according to claim 17 and wherein said air flow substrate flattener functionality comprises flattening with suction.
- 22. The method according to claim 17 and wherein said conveying includes conveying said planar substrates away from said image acquiring location.
- 23. The method according to claim 17 and wherein said conveying includes displacing said planar substrates in a levitated state at least towards said image acquiring location.
- 24. The method according to claim 17 and wherein said conveying includes a displacing said planar substrates in a levitated state away from said image acquiring location.
- 25. A method for two-sided imaging of generally planar substrates, comprising:
conveying a planar substrate in a levitated state to at least an image acquiring location, said planar substrate selected from the group consisting of printed circuit board, flat panel display and interconnect device substrates; and acquiring an image of two opposite sides of said planar substrates when in said levitated state.
- 26. The method according to claim 25 and wherein conveying comprises flattening said planar substrates with an air flow flattener least at said image acquiring location.
- 27. The method according to claim 25 and wherein said conveying comprises holding down said planar substrates with an cushion hold down.
- 28. The method according to claim 25 and wherein said flattening comprises flattening with suction.
- 29. The method according to claim 25 and wherein said flattening comprises flattening with an air cushion.
- 30. The method according to claim 25 and wherein said conveying also comprises conveying said planar substrates away from said imaging location.
- 31. The method according to claim 25 and wherein said conveying includes displacing said planar substrates in a levitated state at least towards said imaging location.
- 32. The method according to claim 25 and wherein said conveying includes displacing said planar substrates in a levitated state away from said imaging location..
- 33. A method for scanning generally planar substrates, comprising:
conveying a generally planar substrate to be scanned with an air flow conveyor, to at least a scanning location, said planar substrate being selected from the group consisting of printed circuit board, flat panel display and interconnect device substrates; flattening said planar substrate with an air flow substrate flattener at least at said scanning location; and scanning said planar substrate with a scanner located at said scanning location, when flattened by said air flow substrate flattener, to acquire an image.
- 34. A scanning methodology according to claim 33 and wherein said air flow conveyor comprises an air flow levitator.
- 35. A scanning methodology according to claim 33 and wherein said air flow conveyor comprises an air flow hold down.
- 36. A scanning methodology according to claim 33 and wherein said air flow substrate flattening functionality comprises a suction hold down.
- 37. A scanning methodology according to claim 33 and wherein said air flow substrate flattening functionality comprises an air cushion hold down.
- 38. A scanning methodology according to claim 33 and wherein said conveying also comprises conveying said planar substrates away from said imaging location.
- 39. A scanning methodology according to claim 33 and wherein said air flow conveyor includes a displacer for displacing said planar substrates at least towards said imaging location.
- 40. A scanning methodology according to claim 33 and wherein said air flow conveyor includes a displacer for displacing said planar substrates away from said imaging location.
- 41. A levitating methodology suitable for conveying printed circuit board, flat panel display and interconnect device substrates comprising:
levitating planar substrates with respect to a surface, employing a levitator, said planar substrate selected from the group consisting of printed circuit board, flat panel display and interconnect device substrates; displacing said planar substrates generally parallel to said surface employing a displacer; and flattening said planar substrates when in a levitated state, employing a substrate flattener.
- 42. A levitating methodology according to claim 41 and wherein said levitating employing a levitator comprises using an air cushion levitator.
- 43. A levitating methodology according to claim 41 and wherein said flattening employing a substrate flattener comprises a flattening employing a positive pressure device.
- 44. A levitating methodology according to claim 41 and wherein said flattening employing a substrate flattener comprises a flattening employing a suction device.
- 45. A method for manufacturing a printed circuit board comprising:
conveying a photosensitized printed circuit board substrate with an air flow conveyor to at least an imaging location; flattening said photosensitized printed circuit board substrate with an air flow substrate flattener at least at said imaging location; and forming an image of a portion of an electrical circuit on said printed circuit board substrate with an imager located at said imaging location, when flattened by said air flow substrate flattener.
- 46. The method according to claim 45 and wherein said conveying comprises conveying with an air flow levitator.
- 47. The method according to claim 45 and wherein said conveying comprises holding down said substrate with an cushion hold down.
- 48. The method according to claim 45 and wherein said flattening comprises flattening with an air cushion.
- 49. The method according to claim 45 and wherein said flattening comprises flattening with suction.
- 50. The method according to claim 45 and wherein said conveying also comprises conveying said substrate away from said imaging location.
- 51. The method according to claim 45 and wherein said conveying includes displacing said substrate in a levitated state at least towards said imaging location.
- 52. The method according to claim 45 and wherein said conveying includes displacing said substrate in a levitated state away from said imaging location.
- 53. The method according to claim 45 and wherein said forming an image comprises exposing a desired pattern on said photosensitized printed circuit board substrate, employing a modulated laser beam device.
- 54. A method for manufacturing an electrical circuit comprising:
forming a portion of an electrical circuit pattern on a substrate, said substrate selected from the group consisting of printed circuit board, flat panel display and interconnect device substrates; conveying said substrate with an air flow conveyor to at least an imaging location; acquiring an image of said pattern while said substrate is flattened with an air flow substrate flattener; and analyzing said image to detect defects in said portion of an electrical circuit pattern.
- 55. The method according to claim 54 and wherein said conveying comprises conveying with an air flow levitator.
- 56. The method according to claim 55 and wherein said acquiring an image comprises conveying said substrate while at least partially flattened with an cushion.
- 57. The method according to claim 55 and wherein said acquiring an image comprises conveying said substrate while at least partially flattened by suction.
- 58. The method according to claim 54 and wherein said conveying also comprises conveying said substrate away from said imaging location.
- 59. The method according to claim 54 and wherein said conveying includes displacing said substrate in a levitated state at least towards said imaging location.
- 60. The method according to claim 54 and wherein said conveying includes displacing said substrate in a levitated state away from said imaging location.
- 61. The method according to claim 54 and wherein said acquiring an image comprises operating an optical inspection sensor.
- 62. The method according to claim 61 and wherein said optical inspection sensor comprises at least one staring array camera.
- 63. The method according to claim 60 and wherein said optical inspection sensor comprises a scanning camera.
- 64. The method according to claim 47 and wherein said analyzing comprises sensing a desired physical attribute of said substrate.
- 65. The method according to claim 47 and wherein said analyzing comprises transmitting said image to an image processing computer.
- 66. The method according to claim 47 and wherein said analyzing comprises acquiring at least one additional image of an area of said pattern suspected of having a defect.
- 67. An imaging system for use with generally planar substrates comprising:
an air flow conveyor operative to convey a printed circuit board substrates, at least to an imaging location, said air flow conveyor having an air flow substrate flattening functionality at least at said imaging location; and an imager creator located at said imaging location for imaging said planar substrate when flattened by said air flow substrate flattening functionality.
- 68. An imaging system according to claim 67 and wherein said air flow conveyor comprises an air cushion levitator.
- 69. An imaging system according to claim 67 and wherein said air flow conveyor comprises an air cushion hold down.
- 70. An imaging system according to -claim 67 and wherein said air flow substrate flattening functionality comprises an air cushion.
- 71. An imaging system according to claim 67 and wherein said air flow substrate flattening functionality comprises a suction hold down.
- 72. An imaging system according to claim 67 and wherein said air flow conveyor is also operative to convey said planar substrate away from said imaging location.
- 73. An imaging system according to claim 67 and wherein said air flow conveyor includes a displacer for displacing said planar substrate at least towards said imaging location.
- 74. An imaging system according to claim 67 and wherein said air flow conveyor includes a displacer for displacing said planar substrates away from said imaging location.
- 75. A two-sided imaging system for use with generally planar substrates comprising:
an air flow conveyor operative to convey printed circuit board substrate, in a levitated state at least to an imaging location; and an imager creator located at said imaging location for imaging two opposite sides of said planar substrates when levitated by said air flow conveyor.
- 76. An imaging system according to claim 75 and wherein said air flow conveyor comprises air flow substrate flattening functionality at least at said imaging location.
- 77. An imaging system according to claim 75 and wherein said air flow conveyor comprises a suction hold down.
- 78. An imaging system according to claim 76 and wherein said air flow substrate flattening functionality comprises an air cushion hold down.
- 79. An imaging system according to claim 76 and wherein said air flow substrate flattening functionality comprises a suction hold down.
- 80. An imaging system according to claim 75 and wherein said air flow conveyor is also operative to convey said planar substrates away from said imaging location.
- 81. An imaging system according to claim 75 and wherein said air flow conveyor includes a displacer for displacing said planar substrates at least towards said imaging location.
- 82. An imaging system according to claim 75 and wherein said air flow conveyor includes a displacer for displacing said planar substrates away from said imaging location.
- 83. A flat bed scanner system comprising:
an air flow conveyor operative to convey printed circuit board substrate to be scanned at least to a scanning location, said air flow conveyor having an air flow substrate flattening functionality at least at said scanning location; and a scanner located at said scanning location for scanning said printed circuit board substrate when flattened by said air flow substrate flattening functionality.
- 84. A flat bed scanner system according to claim 83 and wherein said scanner forms part of an image acquirer.
- 85. A flat bed scanner system according to claim 83 and wherein said scanner forms part of an image creator.
- 86. A flat bed scanner system according to claim 85 and wherein said planar substrates include a photosensitive layer.
- 87. A flat bed scanner system according to claim 86 and wherein said image creator comprises a modulated laser beam device operative to expose a desired pattern on said photosensitive layer.
- 88. A flat bed scanner system according to claim 83 and wherein said air flow conveyor comprises an air flow levitator.
- 89. A flat bed scanner system according to claim 83 and wherein said air flow conveyor comprises an air flow hold down.
- 90. A flat bed scanner system according to claim 83 and wherein said air flow substrate flattening functionality comprises an air cushion.
- 91. A flat bed scanner system according to claim 83 and wherein said air flow substrate flattening functionality comprises a suction hold down.
- 92. A flat bed scanner system according to claim 83 and wherein said air flow conveyor is also operative to convey said planar substrates away from said imaging location.
- 93. A flat bed scanner system according to claim 83 and wherein said air flow conveyor includes a displacer for displacing said planar substrates at least towards said imaging location.
- 94. A flat bed scanner system according to claim 83 and wherein said air flow conveyor includes a displacer for displacing said planar substrates away from said imaging location.
- 95. A method for imaging generally planar substrates comprising:
conveying a printed circuit board substrate with an air flow conveyor to at least an image creating location; flattening said printed circuit board substrate with an a air flow substrate flattener at least at said image creating location; and creating an image of a portion of an electrical circuit on said printed circuit board substrate with an imager located at said image acquiring location, when flattened by said air flow substrate flattener.
- 96. The method according to claim 95 and wherein said air flow conveyor comprises an air flow levitator.
- 97. The method according to claim 95 and wherein said air flow conveyor comprises an air flow hold down.
- 98. The method according to claim 95 and wherein said air flow substrate flattener functionality comprises flattening with an air cushion.
- 99. The method according to claim 95 and wherein said air flow substrate flattener functionality comprises flattening with suction hold down.
- 100. The method according to claim 95 and wherein said conveying includes conveying said printed circuit board substrates away from said image creating location.
- 101. The method according to claim 95 and wherein said conveying includes displacing said printed circuit board substrates in a levitated state at least towards said image creating location.
- 102. The method according to claim 95 and wherein said conveying includes a displacing said printed circuit board substrates in a levitated state away from said image creating location.
- 103. A method for two-sided imaging of generally planar substrates, comprising:
conveying a printed circuit board substrate in a levitated state to at least an image creating location; and creating an image on two opposite sides of said printed circuit board substrate when in said levitated state.
- 104. The method according to claim 103 and wherein conveying comprises flattening said printed circuit board substrate with an air flow flattener at least at said image creating location.
- 105. The method according to claim 103 and wherein said conveying comprises holding down said printed circuit board substrates with an cushion hold down.
- 106. The method according to claim 103 and wherein said flattening comprises flattening with suction.
- 107. The method according to claim 103 and wherein said flattening comprises flattening with an air cushion.
- 108. The method according to claim 103 and wherein said conveying also comprises conveying said printed circuit board substrates away from said imaging location.
- 109. The method according to claim 103 and wherein said conveying includes displacing said printed circuit board substrates in a levitated state at least towards said imaging location.
- 110. The method according to claim 103 and wherein said conveying includes displacing said printed circuit board substrates in a levitated state away from said imaging location..
- 111. A method for scanning printed circuit board substrates, comprising:
conveying a printed circuit board substrate to be scanned with an air flow conveyor, to at least a scanning location; flattening said printed circuit board substrate with an air flow substrate flattener at least at said scanning location; and scanning said planar substrate with a scanner located at said scanning location, when flattened by said air flow substrate flattener, to create an image of a portion of an electrical circuit.
- 112. A scanning methodology according to claim 111 and wherein said air flow conveyor comprises an air flow levitator.
- 113. A scanning methodology according to claim 111 and wherein said air flow conveyor comprises an air flow hold down.
- 114. A scanning methodology according to claim 111 and wherein said air flow substrate flattening functionality comprises a suction hold down.
- 115. A scanning methodology according to claim 111 and wherein said air flow substrate flattening functionality comprises an air cushion hold down.
- 116. A scanning methodology according to claim 111 and wherein said conveying also comprises conveying said printed circuit board substrate away from said imaging location.
- 117. A scanning methodology according to claim 111 and wherein said air flow conveyor includes a displacer for displacing said printed circuit board substrate at least towards said imaging location.
- 118. A scanning methodology according to claim 111 and wherein said air flow conveyor includes a displacer for displacing said printed circuit board substrate away from said imaging location.
- 119. An imaging system for use with generally planar substrates comprising:
an air flow conveyor operative to convey planar substrates at least to an imaging location, said air flow conveyor having an air flow substrate flattening functionality at least at said imaging location; and an imager located at said imaging location for imaging said planar substrate when flattened by said air flow substrate flattening functionality.
- 120. An imaging system according to claim 119 and wherein said imager is an image acquirer.
- 121. An imaging system according to claim 119 and wherein said imager is an image creator.
- 122. An imaging system according to claim 119 and wherein said air flow conveyor comprises an air flow levitator.
- 123. An imaging system according to claim 119 and wherein said air flow conveyor comprises an air flow hold down.
- 124. An imaging system according to -claim 119 and wherein said air flow substrate flattening functionality comprises an air flow levitator.
- 125. An imaging system according to claim 119 and wherein said air flow substrate flattening functionality comprises an air flow hold down.
- 126. An imaging system according to claim 119 and wherein said air flow conveyor is also operative to convey said planar substrate away from said imaging location.
- 127. An imaging system according to claim 119 and wherein said air flow conveyor includes a displacer for displacing said planar substrate at least towards said imaging location.
- 128. An imaging system according to claim 119 and wherein said air flow conveyor includes a displacer for displacing said planar substrates away from said imaging location.
- 129. A two-sided imaging system for use with generally planar substrates comprising:
an air flow conveyor operative to convey planar substrates in a levitated state at least to an imaging location; and an imager located at said imaging location for imaging two opposite sides of said planar substrates when levitated by said air flow conveyor.
- 130. An imaging system according to claim 129 and wherein said imager is an image acquirer.
- 131. An imaging system according to claim 129 and wherein said imager is an image creator.
- 132. An imaging system according to claim 129 and wherein said air flow conveyor comprises air flow substrate flattening functionality at least at said imaging location.
- 133. An imaging system according to claim 129 and wherein said air flow conveyor comprises an air flow hold down.
- 134. An imaging system according to claim 132 and wherein said air flow substrate flattening functionality comprises an air flow levitator.
- 135. An imaging system according to claim 132 and wherein said air flow substrate flattening functionality comprises an air flow hold down.
- 136. An imaging system according to claim 129 and wherein said air flow conveyor is also operative to convey said planar substrates away from said imaging location.
- 137. An imaging system according to claim 129 and wherein said air flow conveyor includes a displacer for displacing said planar substrates at least towards said imaging location.
- 138. An imaging system according to claim 129 and wherein said air flow conveyor includes a displacer for displacing said planar substrates away from said imaging location.
- 139. A flat bed scanner system comprising:
an air flow conveyor operative to convey planar substrates to be scanned at least to a scanning location, said air flow conveyor having an air flow substrate flattening functionality at least at said scanning location; and a scanner located at said scanning location for scanning said planar substrates when flattened by said air flow substrate flattening functionality.
- 140. A flat bed scanner system according to claim 139 and wherein said scanner forms part of an image acquirer.
- 141. A flat bed scanner system according to claim 139 and wherein said scanner forms part of an image creator.
- 142. A flat bed scanner system according to claim 141 and wherein said planar substrates include a photosensitive layer.
- 143. A flat bed scanner system according to claim 142 and wherein said image creator comprises a modulated laser beam device operative to expose a desired pattern on said photosensitive layer.
- 144. A flat bed scanner system according to claim 139 and wherein said air flow conveyor comprises an air flow levitator.
- 145. A flat bed scanner system according to claim 139 and wherein said air flow conveyor comprises an air flow hold down.
- 146. A flat bed scanner system according to claim 139 and wherein said air flow substrate flattening functionality comprises an air flow levitator.
- 147. A flat bed scanner system according to claim 139 and wherein said air flow substrate flattening functionality comprises an air flow hold down.
- 148. A flat bed scanner system according to claim 139 and wherein said air flow conveyor is also operative to convey said planar substrates away from said imaging location.
- 149. A flat bed scanner system according to claim 139 and wherein said air flow conveyor includes a displacer for displacing said planar substrates at least towards said imaging location.
- 150. A flat bed scanner system according to claim 139 and wherein said air flow conveyor includes a displacer for displacing said planar substrates away from said imaging location.
- 151. A method for imaging generally planar substrates comprising:
conveying said planar substrates with an air flow conveyor to at least an imaging location; flattening said planar substrates with an a air flow substrate flattener at least at said imaging location; and imaging said planar substrates with an imager located at said imaging location, when flattened by said air flow substrate flattener.
- 152. The method according to claim 151 and wherein said imaging comprises acquiring an image.
- 153. The method according to claim 151 and wherein said imaging comprises creating an image.
- 154. The method according to claim 151 and wherein said air flow conveyor comprises an air flow levitator.
- 155. The method according to claim 151 and wherein said air flow conveyor comprises an air flow hold down.
- 156. The method according to claim 151 and wherein said air flow substrate flattener functionality comprises an air flow levitator.
- 157. The method according to claim 151 and wherein said air flow substrate flattener comprises an air flow hold down.
- 158. The method according to claim 151 and wherein said conveying includes conveying said planar substrates away from said imaging location.
- 159. The method according to claim 151 and wherein said conveying includes displacing said planar substrates in a levitated state at least towards said imaging location.
- 160. The method according to claim 151 and wherein said conveying includes a displacing said planar substrates in a levitated state away from said imaging location.
- 161. A method for two-sided imaging of generally planar substrates, comprising:
conveying said planar substrates in a levitated state to at least an imaging location; and imaging two opposite sides of said planar substrates when in said levitated state.
- 162. The method according to claim 161 and wherein said imaging comprises image acquisition.
- 163. The method according to claim 161 and wherein said imaging comprises image creation.
- 164. The method according to claim 161 and wherein conveying comprises flattening said planar substrates with an air flow flattener least at said imaging location.
- 165. The method according to claim 161 and wherein conveying holding down said planar substrates with an air flow hold down.
- 166. The method according to claim 161 and wherein flattening comprises flattening with an air flow levitator.
- 167. The method according to claim 161 and wherein said air flattening comprises flattening with an air flow hold down.
- 168. The method according to claim 161 and wherein said conveying also comprises conveying said planar substrates away from said imaging location.
- 169. The method according to claim 161 and wherein said conveying includes displacing said planar substrates in a levitated state at least towards said imaging location.
- 170. The method according to claim 161 and wherein said conveying includes displacing said planar substrates in a levitated state away from said imaging location..
- 171. A method for scanning generally planar substrates, comprising:
conveying planar substrates to be scanned with an air flow conveyor, to at least a scanning location; flattening said planar substrates with an air flow substrate flattener at least at said scanning location; and scanning said planar substrates with a scanner located at said scanning location, when flattened by said air flow substrate flattener.
- 172. A scanning methodology according to claim 171 and wherein said scanning comprises, in part, image acquisition.
- 173. A scanning methodology according to claim 171 and wherein said scanning comprises, in part, image creation.
- 174. A scanning methodology according to claim 173 and wherein said planar substrates include a photosensitive layer.
- 175. A scanning methodology according to claim 174 and wherein said image creation comprises exposing a desired pattern on said photosensitive layer, employing a modulated laser beam device.
- 176. A scanning methodology according to claim 171 and wherein said air flow conveyor comprises an air flow levitator.
- 177. A scanning methodology according to claim 171 and wherein said air flow conveyor comprises an air flow hold down.
- 178. A scanning methodology according to claim 171 and wherein said air flow substrate flattening functionality comprises an air flow levitator.
- 179. A scanning methodology according to claim 171 and wherein said air flow substrate flattening functionality comprises an air flow hold down.
- 180. A scanning methodology according to claim 171 and wherein said conveying also comprises conveying said planar substrates away from said imaging location.
- 181. A scanning methodology according to claim 171 and wherein said air flow conveyor includes a displacer for displacing said planar substrates at least towards said imaging location.
- 182. A scanning methodology according to claim 171 and wherein said air flow conveyor includes a displacer for displacing said planar substrates away from said imaging location.
- 183. A levitating methodology suitable for conveying generally planar substrates comprising:
levitating planar substrates with respect to a surface, employing a levitator; displacing said planar substrates generally parallel to said surface employing a displacer; and flattening said planar substrates when in a levitated state, employing a substrate flattener.
- 184. A levitating methodology according to claim 183 and wherein said levitating employing a levitator comprises a levitating employing a vacuum levitator.
- 185. A levitating methodology according to claim 183 and wherein said flattening employing a substrate flattener comprises a flattening employing a positive pressure device.
- 186. A levitating methodology according to claim 183 and wherein said flattening employing a substrate flattener comprises a flattening employing a suction device.
- 187. An air flow conveyor system comprising:
an air flow generator; and an air flow levitating conveyor operative to convey planar substrates in a levitated state, said air flow conveyor comprising:
an air flow table employing an air cushion functionality to levitate said planar substrates a displacer for displacing said planar substrates; and an air flow substrate flattener operative at at least one region of said levitating conveyor to flatten said planar substrate when in a levitated state.
- 188. An air flow conveyor system according to claim 187 and wherein said air flow conveyor comprises an air cushion hold down.
- 189. An air flow conveyor system according to claim 187 and wherein said air flow substrate flattening functionality comprises an air cushion hold down.
- 190. An air flow conveyor system according to claim 187 and wherein said air flow substrate flattener comprises a suction hold down.
- 191. An air flow conveyor according to claim 190 and wherein said suction hold down is disposed on the same side of said planar substrates as said air flow table.
- 192. A levitated conveyor system comprising:
a levitator operative to levitate planar substrates with respect to a surface; a displacer for displacing said planar substrates generally parallel to said surface when in a levitated state; and a substrate flattener operative to flatten said planar substrate when in a levitated state.
- 193. A levitated conveyor system according to claim 192 and wherein said levitator comprises an air cushion generator.
- 194. A levitated conveyor system according to claim 192 and wherein said substrate flattener comprises a positive pressure device.
- 195. A levitated conveyor system according claim 193 and wherein said substrate flattener comprises a positive pressure device.
- 196. A levitated conveyor system according to claim 192 and wherein said substrate flattener comprises a suction hold down.
- 197. A levitated conveyor system according to claim 193 and wherein said substrate flattener comprises a suction hold down.
- 198. An air flow conveying method comprising:
generating an air flow with an air flow generator; and conveying planar substrates with an air flow levitating conveyor, said conveying comprising:
levitating said planar substrates with an air flow table employing an air float functionality; displacing said planar substrates with a displacer; and flattening said planar substrates when in a levitated state with an air flow substrate flattener at least at one region of said levitating conveyor.
- 199. The method according to claim 198 and wherein said conveying comprises conveying said planar substrates while being held down by an air cushion hold down.
- 200. The method according to claim 198 and wherein said flattening comprises flattening with a suction flattener.
- 201. The method according to claim 198 and wherein said flattening comprises flattening with an air cushion hold down.
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of U.S. Provisional Patent Application No. 60/342,374, filed Dec. 27, 2001, the disclosure of which is incorporated by reference in its entirety.
Provisional Applications (1)
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Number |
Date |
Country |
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60342374 |
Dec 2001 |
US |