Fiber to the distribution point (FTTdp) is a fiber-optic based communication delivery network in which optical fibers are run in an optical distribution network from a central office to locations (i.e., distribution points) located near subscribers. Electrical cables complete the network, extending from the distribution points to the subscribers (e.g., to Optical Network Terminals or other subscriber equipment). The optical signals carried by the optical fibers are converted into electrical signals, which are carried by the electrical cables and the remaining distance to the subscribers.
Closures that hold electronic circuitry for transmitting or converting optical signals and electrical signals sometimes generate significant amounts of heat that can inhibit the operation of the electronic circuits within the closure.
Improvements are desired.
The present disclosure relates to an internal pressure regulating closure that holds electronic circuitry to convert or transmit optical signals.
One aspect of the present disclosure relates to a sealed telecommunications closure for telecommunications circuitry comprising. The closure can include a housing that has a base and a cover that cooperate to define an interior; electronic circuitry located within the housing, the optical to electrical converter can be active electronic circuitry; a cooling liquid dispersed through the interior of the housing to cool electronics therein; and an expansion structure integrated with the housing to accommodate expansion of the cooling liquid caused by temperature spikes and to prevent breakage of a seal within the closure.
In accordance with an aspect of the disclosure, a closure for circuitry is disclosed. The closure for circuitry includes a base that has a sidewall extending upwardly from a bottom. The sidewall defines at least one cable port. The closure also includes a cover that attaches to the base to close an interior of the closure. The closure also includes electronic circuitry disposed within the interior of the closure. The electronic circuitry, in one example, is active electronic circuitry. The closure includes a cooling medium that encompasses the electronic circuitry. In addition, the closure comprises an internal pressure regulating device. In some examples, the pressure regulating device can comprise one of the following: an elastic material, an air piston, and a mechanical spring. In some examples, the closure can also comprise a seal that is placed between the cover and the base, wherein the seal prevents fluids from entering the enclosure.
In some examples, the cable port or ports can pass through any portion of the closure. One example is a two passage tube, such as a double channeled tube, that can be inserted in one of the ports to facilitate filling the interior with the cooling medium and also removing any air from the interior.
In accordance with an additional aspect of the disclosure, a method for assembly of the internal pressure regulating sealed closure includes providing a closure including a cover and a base having a sidewall extending upwardly from a bottom. The sidewall defines at least one cable port. The method includes placing electronic circuitry within the interior of the closure, the electronic circuitry being active. The method further includes securing the cover to the base to close an interior of the closure.
The method can also include inserting a two passage tube into the at least one cable port. Additionally, a cooling medium is dispersed into the interior of the closure through a first passage of the tube. As an appropriate amount of cooling medium is dispersed into the cavity, air is removed from the interior of the closure through a second passage of the tube. The method can also include sealing the tube.
Various cable ports can be provided, such as one or more, for incoming and outgoing cables, including fiber cables, copper cables, and/or hybrid cables.
A variety of additional aspects will be set forth in the description that follows. The aspects can relate to individual features and to combinations of features. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the broad inventive concepts upon which the embodiments disclosed herein are based.
The following drawings are illustrative of particular embodiments of the present disclosure and therefore do not limit the scope of the present disclosure. The drawings are not to scale and are intended for use in conjunction with the explanations in the following detailed description. Embodiments of the present disclosure will hereinafter be described in conjunction with the appended drawings, wherein like numerals denote like elements.
Various embodiments will be described in detail with reference to the drawings, wherein like reference numerals represent like parts and assemblies throughout the several views. Reference to various embodiments does not limit the scope of the claims attached hereto. Additionally, any examples set forth in this specification are not intended to be limiting and merely set forth some of the many possible embodiments for the appended claims.
The closure disclosed is configured to house active electronic circuitry related to fiber optic signal transmission or conversion. The closure also is configured to environmentally seal (e.g., a water-tight seal, a vapor-tight seal, etc.) the electronic circuitry from an external environment. Additionally, the closure is configured to be corrosion resistant. The closure can also house active electronic circuitry related to copper signal transmission where no fiber optic signals are present.
The port 122 is configured to receive a cable 125. In some embodiments, the cable 125 is a fiber optic cable. In other embodiments, the cable 125 is a copper cable. The closure 100 can include a plurality of ports 122 in some embodiments. In the depicted embodiment, the ports 122 are configured to be positioned at the first end 108 of the closure 100. However, it is contemplated that the ports 122 could be positioned at a side 112, 114 or at the second end 110 of the closure 100 or other locations, or in combinations of locations. In some embodiments, the port 122 is configured to be positioned at an angle with respect to a side and an end of the closure. In the depicted embodiment, the closure can comprise a plurality of ports 122 in a line on end 108.
In the example shown, the base 128 includes a sidewall 134 extending upward from the bottom 118. The cover 126 attaches to the sidewall 134 opposite the bottom 118. The base 128 and/or cover 126 can be configured to disperse heat generated by the electronic circuitry 132 within the interior 130 of the closure 100. In transferring the heat generated, the closure can facilitate transferring heat away from the electronic circuitry 132 to the environment surround the closure 100. For example, the base 128 and/or cover 126 can be formed of a thermally conductive material (e.g., a metal). In an example, the base 128 and/or cover 126 can be formed of die cast aluminum. In other examples, the base 128 and/or cover 126 can be formed of thermally conductive plastics.
In one embodiment, the closure 100 can further comprise a seal 120. When securing the closure, the seal 120 can be placed between the cover 126 and the base 128 such that seal 120 provides an additional measure of protection against outside elements. In a particular embodiment, the seal 120 can aid in providing an air tight and water tight barrier. The seal can be comprised of plastic, rubber, or silicone material that can prevent liquids from entering the closure and exiting the closure.
The electronic circuitry 132 can be disposed within the interior 130. The electronic circuitry 132 is active (i.e., powered) and produces heat during normal operation. The electronic circuitry 132 is configured to radiate heat in the interior 130 of the closure 100. In some embodiments, the electronic circuitry 132 includes a circuit board with components mounted thereto.
During operation, the cooling medium 138 is subjected to temperature changes that cause pressure to increase and decrease inside the closure 100. Heat generated by the internal components is transported through the cooling medium 138 to the inside of housing 112 of the closure 100. Subsequently, the generated heat is transferred from the closure 100 to the external environment. The cooling medium 138 creates an even surface temperature on the closure body. This even surface temperature reduces the thermal hot-spots and reduces overall temperature of the closure, improving thermal exchange. In example embodiments, the cooling medium 138 can be made out of natural oil, petrochemical oil, or other synthetic materials. In addition, the cooling medium 138 can possess other characteristics that make it viable for use with electric components such as being non-corrosive, non-electrically conductive and nonreactive with the structure and function of the internal components.
When the cooling medium 138 possesses the physical characteristic of low compressibility, an increase in internal pressure occurs when the cooling medium is heated. As stated earlier, the heat is generated from the activity of the enclosed electronic circuitry 132. To counteract the increase in internal pressure, a pressure regulating device 136 can be used. A purpose of the pressure regulating device 136 is to ensure that the pressure inside the closure 100 does not exceed the maximum allowable internal operating pressure. The pressure regulating device 136 can be any device that stores potential energy generated by the pressure of the cooling medium. In addition, the pressure regulating device 136 can release the stored potential energy when the cooling system no longer exerts pressure on the pressure regulating device 136. Examples of the pressure regulating device 136 can include any pressure storing system internal to the closure 100 such as an elastic material, air piston, or mechanical springs.
In certain implementations, the electronic circuitry 132 is configured to convert between optical signals and electrical signals. In such implementations, optical signals carried over an optical fiber cable can be converted to electrical signals by the electronic circuitry 132, and the electrical signals can be carried over the electrical conductor(s). Accordingly, signals carried between a central office and a subscriber can be carried over optical fibers along a majority of the network to closure 100 and carried over electrical conductors only over short distances between the closure 100 and the subscriber.
Moving to operation 515, the cover 126 is secured to the base 128. The cover can be attached to the base by an attachment device such as screw, bolt, adhesive, etc. Reducing the encroachment of environmental factors into the interior 130 can be aided by including a sealing mechanism. The seal 120 can be placed between cover 126 and base 128 which can decrease air and fluid permeability between the joints of the cover 126 and base 128. Transitioning to operation 520, a tube 124 can be placed into a port 122. The port 122 can be defined by an aperture in a wall of the closure. In one embodiment, the tube 124 can be double sided where the tube has two parallel channels. Accordingly, both channels can serve a purpose. For example, in moving to operation 525, a cooling medium 138 can be introduced to the interior 130 through one channel of the double sided tube, and air can be evacuated from the other channel.
While the appropriate amount of cooling medium 138 has been dispersed into the interior 130, the process can include operation 530 where the second channel can be used to remove air from the interior 130. Removing the air decreases the environmental factors that can interact with the electronic circuitry 132 during operation and allows the interior 130 to fill with the cooling medium 138. Operation 535 illustrates sealing the tube 124 after the cooling medium has been dispersed and the air has been removed from the interior. In other embodiments the tube can be mechanically sealed or hermetically sealed using heat. At operation 540, telecommunications signals are processed by the interior components in closure 100.
One aspect of the closure 100 includes: a closure for regulating internal heat generation including an internal pressure regulating device 136.
Another aspect of the closure 100 includes: a base 128 having a sidewall 134 extending upwardly from a bottom 118, such that the closure defines an interior 130; and a cover 126 that attaches to the base 128, and a pressure regulating device 136 located in the interior 130.
A further aspect of the closure 100 includes: at least one cable port 122; a cooling medium 138 dispersed through the interior 130; and a pressure regulating device 136 located in the interior 130, wherein the device is configured to react to a pressure changes in the housing, wherein the pressure change is exerted by the cooling medium 138.
A further aspect of the closure 100 includes: electronic circuitry 132, such that electronic circuitry 132 is orientated in the interior 130 and encompassed by the cooling medium 138.
In one example, one port 122 includes a fill plug 123, one port 122 includes a fiber cable, and one port 122 includes a copper cable.
Connector devices 129 connect cables 125 to closure 100. Connector devices can provide sealing and pull protection. Cables 125 extend into closure 100 and connect to the electronic circuitry 132 and/or to other cables.
Another aspect of the present disclosure relates to one or more environmentally sealed closures adapted for housing equipment (switching circuitry, optical-to-electrical conversion circuitry, etc.) used in systems for readily facilitating making telecommunications service upgrades or other changes in service in the field. In certain examples, system upgrades can include switching from an electrical feed line coupled to a service provider's central office to a fiber optic feed line coupled to the service provider's central office.
Referring to
The closure 200 can hold electronic circuitry 204 (e.g., opto-electrical conversion electronics) (see
Referring to
The example closure 200 and the switching and termination enclosure 212 can each include environmentally sealed protective housings. The closure 200 can be factory assembled with the protective housing and all cable entrance locations sealed. In certain examples, the protective housing of the closure 200 is not intended or configured to be opened in the field. The switching and termination enclosure can have a protective housing designed to be re-enterable in the field. Example configurations for the closure 200 are disclosed by U.S. Provisional Patent Application Nos. 61/135,478; 62/155,944; 62/186,915; and 62/057,540, which are all hereby incorporated by reference in their entireties. Example switching circuit and power routing configurations for the system 202a are disclosed by U.S. Provisional Patent Application No. 62/194,140 which is hereby incorporated by reference in its entirety. Examples of ruggedized and sealed connectors and adapters that can be incorporated on stub cables of the closures or onto the housings of the closures or elsewhere in the system are disclosed by U.S. Pat. Nos. 7,744,288; 7,686,519 and U.S. patent application Ser. No. 14/360,383 which are all hereby incorporated by reference in their entireties.
Referring to
The base 228 and/or cover 230 can be configured to disperse heat generated by the electronic circuitry 204. For example, closure 200 can be a rigid container where the base 228 and/or cover 230 can be formed of a thermally conductive material (e.g., a metal). In an example, the base 228 and/or cover 230 can be formed of Al Die cast. In other examples, the base 228 and/or cover 230 can be formed of thermally conductive plastics (e.g., polypropylene). The closure 200 may be thin so that it can still radiate heat as aluminum. However, a system 202 including an upgraded, faster, service with extended fiber optic connectivity may need a closure design that can handle increased heat loads of a G. fast chipset.
The closure 200 in accordance with the present disclosure can be filled with cooling liquid 210 (e.g., cooling medium) to help dissipate heat generated by the electronic circuitry 204 and to help prevent arching. The cooling liquid 210 can help to eliminate localized hot spots in the closure 200.
As used herein, the term, “liquid,” is defined as including cooling oils, hydraulic fluids, or other liquids having heat transfer properties suitable for cooling.
The cooling liquid 210 can be an incompressible fluid, for example, oil. In one example, the cooling liquid 210 can be a natural oil, petrochemical oil, and/or a synthetic material, although alternatives are possible. Rather than have a closure filled with air, which acts as an insulator, oil can be used to help eliminate air voids. No air voids means that there would be no pressure differential. Thus, the closure 200 can be submerged and there would be no force that exists to drive water into the closure 200. Such a design can allow the closure 200 to be made with alternate materials that are not bulky, rigid, or complex, but rather lighter and easy to manufacture. The oil can be supplied to the closure 200 through an injection port (e.g., one way valve; fill plug), although alternatives are possible. The closure 200 can further include a bleed valve (not shown) that can be used to bleed air out of the closure 200.
The cooling liquid 210 can also be compatible with both a plastic closure and the electronics housed therein. The cooling liquid 210 (i.e., oil, a better conductor of heat than air) can help provide better thermal management and heat dissipation compared to typical thermal conduction methods of using clay. By eliminating the thermal bottleneck of the interior air space by including the cooling liquid 210, the closure 200 can still radiate enough heat to keep peak temperatures lower despite being made of a poor conductor, such as plastic.
In certain examples, the closure 200 can include a pump P (see
In one example, the circuit board 234 can include one or more transformer relays 240 that can each have heat transfer fins 242 that are exposed to the cooling liquid 210 to help dissipate heat to the cooling liquid 210. Other heat generating elements (e.g., chips, optical/electrical converter, etc.) on the circuit board 234 can also include heat transfer fins 242 to help dissipate heat. In other examples, chips or active components may have integrated temperature sensors within the closure 200 for measuring temperature spikes.
In certain examples, the closure 200 can include an integral expansion structure 244 (e.g., rubber membrane, disc, circular corrugating member, ribs, etc.)(see
The integral expansion structure 244 can allow the rigid closure 200 to expand and contract due to the cooling liquid 210 heating within the sealed closure 200. The integral expansion structure 244 can expand to accommodate expansion of the cooling liquid 210 caused by temperature rises or spikes, which can help to prevent the breakage of a seal 238 located within the closure 200 as the cooling liquid 210 heats up. The integral expansion structure 244 can be made of an elastic material such that once the temperature is reduced, the integral expansion structure 244 can contract back to its original state.
In other examples a piezo-electric fan (not shown) may be used to management temperature spikes in the example of an air filled DPU. The piezo-electric fan would power on when internal temperatures hit a predetermined threshold limit, but remain off at all other times. In other examples, a fluid paddle (not shown) can be used to increase internal convection in the example of a liquid filled/cooled DPU.
When securing the closure 200, the seal 238 can be placed between the cover 230 and the base 228 such that seal 238 provides an additional measure of protection against outside elements. In a particular embodiment, the seal 238 can aid in providing an air tight and water tight barrier. The seal can be comprised of plastic, rubber, or silicone material that can prevent liquids from entering the closure and exiting the closure.
The optical fiber line 206 can be routed into the closure 200 through a first port 246 and the upgrade line(s) 208 can be routed out of the closure 200 through a second port 248. The first and second ports 246, 248 can each include a sealing arrangement 250. In certain examples, the sealing arrangement 250 can be a fluid seal arranged and configured about the optical fiber line 206 and the upgrade lines 208.
In certain examples, the closure 200 can include: 1) a fiber optic stub 252 (see
In certain examples, the optical fiber signals pass through the switching and termination closure 212 before being routed to the closure 200. In certain examples, the upgrade line(s) 208 and the optical fiber are routed between the closure 200 and the switching and termination closure 212 by a hybrid fiber optic/electrical cable (not shown). In other examples, separate cables route the optical fiber and the upgrade line(s) 208 between the closures 200, 212.
The upgrade line(s) can carry electrical power from the switching and termination closure 212 to the closure 200 for use in powering the optical-to electrical circuitry 204. Power can be provided to the switching and termination enclosure 212 from the subscriber locations via the subscriber lines 216.
In certain examples, the switching and termination enclosure 212 includes: 1) a fiber optic stub having a ruggedized single or multi-fiber connection port or connector for connecting to the optical fiber line 206 (not shown); or 2) a ruggedized fiber optic adapter (not shown) mounted to the switching and termination enclosure 212 for receiving a ruggedized connector (not shown) of the optical fiber line 206 and the non-ruggedized connector (not shown) of the optical fiber stub (not shown); or 3) a fiber optic stub terminated by a non-ruggedized single or multi-fiber connector (not shown); or 4) a non-connectorized stub that is spliced to the optical fiber line (not shown).
In certain examples, the switching and termination enclosure 212 and the closure 200 are positioned together within a further environmentally sealed housing (not shown).
In one example, one or more remote copper switches 256 (RCS)(see
From the forgoing detailed description, it will be evident that modifications and variations can be made without departing from the spirit and scope of the disclosure.
The various embodiments described above are provided by way of illustration only and should not be construed to limit the claims attached hereto. Those skilled in the art will readily recognize various modifications and changes that may be made without following the example embodiments and applications illustrated and described herein, and without departing from the true spirit and scope of the following claims.
This application claims the benefit of U.S. Patent Application Ser. No. 62/186,915, filed on Jun. 30, 2015, the disclosure of which is incorporated herein by reference in its entirety.
Filing Document | Filing Date | Country | Kind |
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PCT/EP2016/065345 | 6/30/2016 | WO | 00 |
Number | Date | Country | |
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62186915 | Jun 2015 | US |