Claims
- 1. A system comprising:
- a chassis 1108 having a first circuit board 1112 mounted thereon, said first circuit board 1112 having a set of components 1116;
- an integrated circuit package 1102 mounted on a back surface 1106 of said chassis 1108;
- a set of flexible electrical connections 1110 establishing a communications network 1100 using a point-to-point network bus protocol between said first circuit board 1112 and said integrated circuit package 1102, said first circuit board 1112 and said integrated circuit package 1102 also include a network signal driver and a receiver to send and receive, respectively, signals for said point-to-point network bus protocol;
- where said integrated circuit package 1102 is thermally coupled to said back surface 1106 of said chassis 1108.
- 2. A system according to claim 1, where said chassis 1108 is constructed with a thermally conductive material.
- 3. A system according to claim 1, further comprising a heat dissipation device coupled to said integrated circuit package 1120.
- 4. A system according to claim 3, where said heat dissipation device is a heat sink 1130.
- 5. A system according to claim 3, where said heat dissipation device is a fan.
- 6. A system according to claim 1, further comprising a thermally conductive material 1132 disposed between said integrated circuit package 1102 and said back surface 1106 of said chassis 1108.
- 7. A system according to claim 6, where said thermally conductive material 1132 is a thermally conductive gel.
- 8. A system according to claim 1, where said integrated circuit package 1102 is a microprocessor.
- 9. A system according to claim 1, where said set of flexible electrical connections 1110 comprises:
- a first connector 1114 coupled to said integrated circuit package 1102;
- a second connector 1114 coupled to said set of components 1116; and,
- a first ribbon cable 1110 coupled to said first connector 1114 and said second connector 1114 to provide a first data path between said first connector 1114 and said second connector 1114.
- 10. A system according to claim 9, where said set of flexible electrical connections 1110 further comprises:
- a third connector 1114 coupled to said integrated circuit package 1102;
- a fourth connector 1114 coupled to said set of components 1116; and,
- a second ribbon cable 1110 coupled to said third connector 1114 and said fourth connector 1114 to provide a second data path between said third connector 1114 and said fourth connector 1114.
RELATED APPLICATIONS
The present application is related to the following patent and co-pending applications: U.S. patent entitled "Daisy Chained Clock Distribution Scheme," by Borkar, et al., U.S. Pat. No. 5,546,023, issued Aug. 13, 1996 and filed Jun. 26, 1995; U.S. patent Application entitled "Point-To-Point Phase-Tolerant Communication," by Self et al., application Ser. No. 08/296,019, now U.S. Pat. No. 5,623,644, filed Aug. 25, 1994; U.S. patent Application entitled "Microprocessor Point-To-Point Communication," by Self et al., application Ser. No. 08/295,556, now U.S. Pat. No. 5,634,043, filed Aug. 25, 1994; U.S. Application entitled "Power-Pod Power Delivery System," by McCutchan et al., application Ser. No. 08/672,864, now U.S. Pat. No. 5,864,478, filed on Jun. 28, 1996; U.S. patent Application entitled "Method and Apparatus for Mounting a Very Large Scale Integration (VLSI) Chip Package to a Computer Chassis for Cooling," by Borkar et al., application Ser. No. 08/777,601, now abandoned, filed Dec. 31, 1996; U.S. patent Application entitled "Method and Apparatus for Retrofit Mounting a VLSI Chip to a Computer Chassis for Cooling," by Borkar et al., Application No. 08/777,251, filed Dec. 31, 1996; U.S. patent Application entitled "Method and Apparatus for Mounting a Very Large Scale Integration (VLSI) Chip Package to a Computer Chassis for Current Supply," by Borkar et al., Application No. 08/777,604, now U.S. Pat. No. 5,978,228, filed Dec. 31, 1996; U.S. patent Application entitled "Method and Apparatus for Retrofit Mounting a VLSI Chip to a Computer Chassis for Current Supply," by Borkar et al., Application Ser. No. 08/775,784, filed Dec. 31, 1996; and U.S. patent Application entitled "Method and Apparatus for Mounting a Power Supply to a Computer Chassis for Cooling," by Borkar et al., application Ser. No. 08/775,782, filed Dec. 31, 1996, now abandoned.
US Referenced Citations (8)
Foreign Referenced Citations (1)
Number |
Date |
Country |
412115 |
Nov 1966 |
CHX |