The present device generally relates to a system for cooling components in an electronic module.
In the challenge for miniaturization, small but powerful devices develop this severe cooling requirement: increasing currents in smaller electronic devices increment heat confinement (˜200 W/cm2) and affect the electronic devices' overall performances to the limit of reducing efficiency performance, damaging the device, and producing system overheating with risk of fire hazard.
Reduction of thermal resistance for a given heat power concentration is a challenging topic. There is the opportunity in the art for a more efficient heat management system either incrementing airflow (reduction of heat sink resistance) and improving heat transfer from a heat source to a heat sink, while maintaining low cost of product and process as a driving objective.
The traditional approach for cooling an electronic module is using a heat sink and a fan as shown in
According to one aspect of the present invention, a device is provided comprising: a heat conductive structure having a first surface; a rotating heat transfer structure for extracting heat from the heat conductive structure by means of a boundary layer that contacts the first surface of the heat conductive structure; a motor for rotating the heat transfer structure relative to the heat conductive structure; and a vertical fixing mechanism for allowing the rotating heat transfer structure to rotate above the heat conductive structure without making contact with the heat conductive structure so as to define a boundary layer between the heat conductive structure and rotating heat transfer structure, wherein the rotating heat transfer structure extracts heat from the heat conductive structure by means of the boundary layer, and wherein the first surface of the heat conductive structure includes turbulators to promote the instability of vorticity forming in the turbulators by resonant mechanism.
According to another aspect of the present invention, an apparatus is provided comprising: a thermal reservoir; a rotating heat transfer structure having an axially symmetrical body made of a conductive material with fins for transferring fluid from in an inlet port to an outlet port; a motor for rotating the rotating heat transfer structure relative to the heat sink; and a Belleville spring assembly bearing the inertial forces acting on the rotating heat transfer structure while allowing precise setting of the distance of the rotating heat transfer structure with respect to the thermal reservoir such that there is no contact between the rotating heat transfer structure and the thermal reservoir, the Belleville spring assembly comprising multiple sets of Belleville springs assembled on both sides of the rotating heat transfer structure to set the displacement by leverage nut displacement.
According to another aspect of the present invention, an apparatus is provided comprising: a thermal reservoir; a rotating heat transfer structure having an axially symmetrical body made of a conductive material with fins for transferring fluid from in an inlet port to an outlet port; a motor for rotating the rotating heat transfer structure relative to the heat sink; and a differential screw mechanism bearing the inertial forces acting on the rotating heat transfer structure while allowing precise setting of the distance of the rotating heat transfer structure with respect to the thermal reservoir such that there is no contact between the rotating heat transfer structure and the thermal reservoir.
The present invention will be more fully understood from the detailed description and the accompanying drawings, wherein:
For purposes of description herein the terms “upper,” “lower,” “right,” “left,” “rear,” “front,” “vertical,” “horizontal,” and derivatives thereof shall relate to the device as oriented in
Some of the embodiments described herein relate to a turbo rotating heat sink in which a fan and a heat sink are integrated in a rotating heat transfer structure such as an impeller. The turbo rotating heat sink may be used to flush fluid thereby extracting heat from integrated circuit electronics, solid state and integrated devices such as CPUs and GPUs, amplifiers, and transistors. The convective heat transfer is largely augmented by the high speed of the fluid blowing between rotating vanes of blades (fins).
Referring to the embodiment illustrated in
The mechanical system 40 sets the distance h_gap between the rotating heat transfer structure 12 of diameter D and the thermal reservoir 50 in the range of 2.5e−4 times D and 5e−3 times D. The motor 20 may be fixed to the mechanical system 40 in proximity of the inlet port 34.
A volute 30 or an encasing is provided for supporting the pressure head two fluid ports (inlet port 34 and outlet port 36) and confining the flow between different pressures. Such a volute 30 may be fixed to thermal reservoir 50. An example of the volute 30 and other components of the turbo rotating heat sink are shown in
As shown in
As noted above, the rotating heat transfer structure 12 (also referred to herein as the “impeller”) is provided with fins 14 or similar structures such that the fluid sections are provided relative to the volute 30. The fins 14 may be tapered along the stream direction h(s) (
The thickness t(r) of the body of the rotating heat transfer structure 12 reduces from the center to the maximal diameter according to the function t(r)*(1+a r{circumflex over ( )}2)<diameter*0.3, where r is the radial coordinate (r<impeller diameter/2), and is a constant in the range of 0 to 1.
As a turbo-machine, the profile and the height of the fins is designed to avoid recirculation in the presence of an adverse pressure head. The height H(r) of the fins 14 may be h(r(s))*r<diameter{circumflex over ( )}2*0.2).
The encasing or volute 30 is configured such that the volute is hydraulically connected with the volume confined between given rotating heat transfer structure 12 and thermal reservoir 50.
The embodiments now described below provide a benefit of an absence of any gap control mechanism. Two embodiments described herein adjust the gap height or distance between the rotating heat transfer structure 12 and the fixed thermal reservoir 50 during the assembly procedure.
The mechanical system 40 may precisely allow for the assembly of the mating surfaces while allowing for relative rotation of the rotating heat transfer structure 12. Both gap adjustment solutions share the objective of zeroing the stack-up uncertainty due to parts' tolerances, while bearing the pressure and inertial forces acting on the rotating heat transfer structure 12. The gap height adjustment reduces gap height to a design value reducing the risk of galling during high temperature and thermal load conditions.
The method of assembling the turbo rotating heat sink 10 is described below with reference to
Different factors interact in these embodiments to provide various benefits. These factors include: encumbrance (i.e. impeller diameter); precise machining and assembly of mating surfaces with a flatness variance of 0.02 mm or less over 100 mm of diameter; gap height exceeding the planarity and roughness of mating surfaces; given air properties, the gap thermal resistance is reduced below 3.75E−05 m2/μm K/W: i.e. for a gap of 40 μm (corresponding to a flatness of 0.02 mm) for a surface of 1E−2 m2, Rthermo=3.75E−05 m2/μm K/W*40 μm/1E−2 m2=0.15 K/W; convective transfer between air and the rotating heat transfer structure 12 increases with rotation speed; pressure in the air gap increases with rotation speed; for passive controlled gap controls, the gap height increment with pressure and rotation speed results in an increment of thermal resistance in the gap; air bearing creation (by hydrodynamic features) and control (preloaded spring or counter air bearing) affect thermal performance; and in case of passive control of gap height (preload counter spring), the take-off speed and the rotation speed for minimal overall thermal resistance are linked.
As mentioned above, there are two solutions described below pertaining to the mechanical system 40. Both solutions share the objective of zeroing stack-up uncertainty due to parts' tolerances, while bearing the pressure and inertial forces acting on the rotating heat transfer structure 12.
The first solution is shown in
Belleville springs 142 and 144 provide the support force against the weight of the rotating heat transfer structure 12 and the air bearing forces. The Belleville springs 142 and 144 preload exceeds by far the weight of the rotating heat transfer structure 12. The assembly of softening Belleville springs 142 and 144 (decreasing spring stiffness) allows for precise setting of the relative position of the rotating heat transfer structure 12. As described above with respect to
Once assembled, the preload of the Belleville springs 142 and 144 firmly holds the rotating heat transfer structure 12 against the inertial forces to prevent solid contact between the rotating heat transfer structure 12 and thermal reservoir 50 (baseplate) at any rotation speed.
The second solution is shown in
The rotating heat transfer structure 12 and the thermal reservoir 50 are not in contact after assembly. A retaining nut 242 allows for differential control of the gap height. The gap height is not affected by rotation speed and the differential screw 240 corrects the tolerances reducing the gap height to the minimum value (i.e., 2.5E−4 times D, the diameter of rotating heat transfer structure).
Benefits of the embodiments shown in
Another embodiment is described below with reference to
In consequence of the rotation of the rotating heat transfer structure 312, the surrounding air enters the air gap with a spiraling motion (see
The turbulators 356 are added to a heat transfer enhanced surface 354 of heat conductive structure 350 to improve the convective heat transfer within the air gap; these turbulators 356 are based on a geometry to promote transition from laminar to turbulent flow, analogous to dimples on golf balls. Specifically the grooves/dimples forming the turbulators 356 are designed to generate blown away vortex structures resonating within the spiraling flow in the air gap due to the rotating heat transfer structure 312 (see
As shown in
The advantages of the system include, but are not limited to, the ultra low profile, the high heat dissipation performance related to the form factor, and a low noise level. The introduction of an ultra low profile rotating cooler has the potential to simplify the problem of encumbrance, cooling air ducting and air blowing. The forced convection, and heat transfer enhancement is a consequence of correct design of the fluid dynamics of the cooling air within the air gap.
Unlike prior designs, the heat transfer from the heat conductive structure 350 is directly solved by the vortex flow (flow spiralling) inside the air gap formed by the rotating heat transfer structure 312. The rotating heat transfer structure 312 or “impeller” can be free from fins, blades or vanes. Nevertheless, the rotating heat transfer structure 312 may have a construction such as shown above in the first embodiment. In this proposed apparatus, the air gap is used as the main mechanism to promote the thermal exchange.
Two variations of this embodiment are disclosed, with the first variation shown in
The air gap (mentioned as region sandwiched between said fixed heat conducting structure and said rotating heat transfer structure) provides the heat transfer a true fluid media (with relative thermal resistance) between the heat conductive structure 350 and the rotating heat transfer structure 312. For correct operation of the system, the air gap is maintained within design specifications. Specifically, as mentioned above, the turbulator 356 geometry is based on a groove/dimple geometric nondimensional parameter δ, as a function of the gap height h, disk diameter ϕ and the volume/wet surface of dimple d. The design parameters being:
Two nondimensional groups are defined:
The design constrains herein disclosed are:
Different kinds of turbulators 356 (grooves/dimples) are proposed to promote thermal extraction from the heat conductive structure 350 and are shown in
The indicative dimension of dimples in δ*1E2 at different Reh and λ that allows for resonant mechanism is shown in the graph of
The ultra low profile rotating cooler shown in
It will be understood by one having ordinary skill in the art that construction of the described device and other components is not limited to any specific material. Other exemplary embodiments of the device disclosed herein may be formed from a wide variety of materials, unless described otherwise herein.
For purposes of this disclosure, the term “coupled” (in all of its forms, couple, coupling, coupled, etc.) generally means the joining of two components (electrical or mechanical) directly or indirectly to one another. Such joining may be stationary in nature or movable in nature. Such joining may be achieved with the two components (electrical or mechanical) and any additional intermediate members being integrally formed as a single unitary body with one another or with the two components. Such joining may be permanent in nature or may be removable or releasable in nature unless otherwise stated.
It is also important to note that the construction and arrangement of the elements of the device as shown in the exemplary embodiments is illustrative only. Although only a few embodiments of the present innovations have been described in detail in this disclosure, those skilled in the art who review this disclosure will readily appreciate that many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters, mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter recited. For example, elements shown as integrally formed may be constructed of multiple parts or elements shown as multiple parts may be integrally formed, the operation of the interfaces may be reversed or otherwise varied, the length or width of the structures and/or members or connector or other elements of the system may be varied, the nature or number of adjustment positions provided between the elements may be varied. It should be noted that the elements and/or assemblies of the system may be constructed from any of a wide variety of materials that provide sufficient strength or durability, in any of a wide variety of colors, textures, and combinations. Accordingly, all such modifications are intended to be included within the scope of the present innovations. Other substitutions, modifications, changes, and omissions may be made in the design, operating conditions, and arrangement of the desired and other exemplary embodiments without departing from the spirit of the present innovations.
It will be understood that any described processes or steps within described processes may be combined with other disclosed processes or steps to form structures within the scope of the present device. The exemplary structures and processes disclosed herein are for illustrative purposes and are not to be construed as limiting.
It is also to be understood that variations and modifications can be made on the aforementioned structures and methods without departing from the concepts of the present device, and further it is to be understood that such concepts are intended to be covered by the following claims unless these claims by their language expressly state otherwise.
The above description is considered that of the illustrated embodiments only. Modifications of the device will occur to those skilled in the art and to those who make or use the device. Therefore, it is understood that the embodiments shown in the drawings and described above is merely for illustrative purposes and not intended to limit the scope of the device, which is defined by the following claims as interpreted according to the principles of patent law, including the Doctrine of Equivalents.
This application is a divisional application of U.S. patent application Ser. No. 16/309,214, filed on Dec. 12, 2018, entitled “SYSTEM FOR COOLING COMPONENTS IN AN ELECTRONIC MODULE,” which is a 371 national stage of PCT/US 2017/063884, filed on Nov. 30, 2017, which claims priority to and the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Patent Application No. 62/428,012, filed on Nov. 30, 2016, entitled “SYSTEM FOR COOLING COMPONENTS IN AN ELECTRONIC MODULE,” the entire disclosures of which are hereby incorporated herein by reference.
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Child | 17878949 | US |