System for manufacturing electrosurgical seal plates

Information

  • Patent Grant
  • 10188454
  • Patent Number
    10,188,454
  • Date Filed
    Tuesday, August 29, 2017
    7 years ago
  • Date Issued
    Tuesday, January 29, 2019
    6 years ago
Abstract
A system for the manufacture of an end effector assembly which is configured for use with an electrosurgical instrument configured for performing an electrosurgical procedure is provided. The system includes a photolithography module that is configured to etch one or more pockets on a seal surface of the seal plate. A vacuum module is configured to raise, transfer and lower a spacer from a location remote from the pocket(s) on the seal plate to the pocket on the seal plate(s). An adhesive dispensing module is configured to dispense an adhesive into the pocket on the seal plate. An optical module is configured to monitor a volume of the adhesive dispensed within the pocket and monitor placement of the spacer within the pocket.
Description
BACKGROUND

Technical Field


The present disclosure relates to a method and system for manufacturing electrosurgical seal plates and, more particularly, to a method and system that employs photolithographic processes and systems operatively associated therewith to manufacture seal plates.


Background of Related Art


Electrosurgical forceps, e.g., bipolar or monopolar forceps, are commonly known in the medical art. Typically, the electrosurgical forceps are configured to, amongst other things, grasp and subsequently seal tissue. With this purpose in mind, the electrosurgical forceps, typically, include a pair of movable jaw members each having a respective seal plate operatively disposed thereon.


Typically, the seal plates disposed on the jaw members are configured to transfer electrosurgical energy having one or more frequencies to tissue to electrosurgically treat the tissue (e.g., seal tissue) and, in conjunction with a cutting element (e.g., knife blade), subsequently sever the sealed tissue. In certain instances, the seal plates may be configured to maintain a certain gap distance between the seal plates when the jaw members are in a closed position and tissue is grasped therebetween. As can be appreciated by one skilled in the art, the seal plates may be configured to perform and/or provide additional functions not described herein.


To provide the seal plates with the capability to seal, subsequently sever, and/or maintain a desired gap distance, the seal plates frequently are designed to include one or more features operatively disposed thereon or formed therewith. For example, in the instance where the seal plates are configured to subsequently sever tissue, one or both of the seal plates may include a knife slot configured to receive a knife blade. In the instance where the seal plates are configured to maintain a desired gap distance, one or both of the seal plates may include one or more stop members. In either instance, forming the seal plates during the manufacture process requires extremely high precession, which may lead to high tolerance stack-ups (e.g., knife blade to knife slot width ratios). Additionally, conventional means for positioning a stop member on a seal plate include bonding the stop member to a seal surface of the seal plate. In this instance, however, the bond and/or stop member that secures the stop member to the seal surface of the seal plate is susceptible to shear stresses associated with opening and closing the jaw members of an end effector assembly.


Conventional manufacture processes for seal plates may include stamping, punching, blanking, embossing, bending, flanging, coining, etc. In some instances, however, these manufacturing process may not be suitable for unique and/or complex jaw member and/or seal plate geometries, such as, for example, when one or both of the seal plates requires a knife slot or stop member formed thereon. Additionally, manufacture of the seal plates via the aforementioned process, in certain instances, may not be cost effective.


SUMMARY

The present disclosure provides a method of manufacture for an end effector assembly configured for use with an electrosurgical instrument configured for performing an electrosurgical procedure. The method includes providing a pair of jaw members. A step of the method includes forming one or more seal plates positionable on one of the pair of jaw members. Etching a dam along a side of the one or more seal plates is a step of the method, wherein the etched dam inhibits the flow of a plastic on the one or more seal plate such that a height of the plastic with respect to the at least one seal plate during an overmolding process may be controlled. The method includes positioning the one or more seal plates on the one of the pair of jaw members; and overmolding the seal plate to one or more of the pair of jaw members.


The present disclosure provides a method of manufacture for an end effector assembly configured for use with an electrosurgical instrument configured for performing an electrosurgical procedure. The method includes providing a pair of jaw members. A step of the method includes forming one or more seal plates positionable on one or more of a pair of jaw members associated with the end effector assembly. Etching a dam along a side of the one or more seal plates is a step of the method, wherein the etched dam inhibits the flow of a plastic on the one or more seal plates such that a height of the plastic with respect to the one or more seal plates during an overmolding process may be controlled. Etching a targeted retention feature along the side of the one or more seal plates is another step of the method. Etching one or more pockets on a seal surface of the one or more seal plates is yet another step of the method. The method includes depositing an adhesive into the one or more pockets on the one or more seal plates. A step of the method includes transferring a spacer from a location remote from the one or more pockets on the one or more seal plates to the one or more pockets on the at least one seal plate. Curing the adhesive and positioning the one or more seal plates on one of the pair of jaw members are steps of the method. Overmolding the seal plate to jaw member is still another step of the method.


The present disclosure also provides a system for the manufacture of an end effector assembly configured for use with an electrosurgical instrument configured for performing an electrosurgical procedure. The system includes a photolithography module configured to etch one or more pockets on a seal surface of the seal plate. The system includes a vacuum module configured to raise, transfer and lower a spacer from a location remote from the one or more pockets on the seal plate to the one or more pockets on the seal plate. The system includes an adhesive dispensing module configured to dispense an adhesive into the one or more pockets on the seal plate and allowing the adhesive to cure. The system may include an optical module configured to monitor a volume of adhesive dispensed within the one or more pockets and monitor placement of the spacer within the one or more pockets.


In an embodiment, the adhesive dispensing module includes a module to heat cure the adhesive after the spacer has been positioned within the at least one pocket.


In an embodiment, a retention feature is etched on the at least one seal plate and is configured to secure the at least one seal plate to at least one of a pair of jaw members of the end effector assembly.


In an embodiment, a knife slot is etched on the at least one seal plate and is configured to receive a knife blade of the electrosurgical instrument.


In an embodiment, one or both of the seal plate includes two or more materials laminated together, wherein the two or more materials is electrically conductive. In one particular embodiment, the two or more materials is selected from the group consisting of stainless steel, copper and ceramic. The copper may include etched heat sinks formed at predetermined locations on the at least one seal plate.


In an embodiment, the one or more seal plate includes a polyimide flex circuit, wherein the polyimide flex circuit is configured to provide electrical communication between the at least one seal plate and a source of electrosurgical energy. In one particular embodiment, the polyimide flex circuit includes a dialectic material having one or more etched through holes configured to create an electrical interconnection between the at least seal plate and the source of electrosurgical energy.


In an embodiment, one or both of the seal plates includes a textured surface, logo, and/or ruler etched thereon.





BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments of the present disclosure are described hereinbelow with references to the drawings, wherein:



FIG. 1 is a flowchart illustrating steps for manufacturing a seal plate in accordance with an embodiment of the present disclosure;



FIG. 2 is a side, perspective view of a seal plate according to an embodiment of the present disclosure and formed via the method of FIG. 1;



FIGS. 3A and 3B are perspective views of a seal plate according to an alternate embodiment of the present disclosure and formed via the method of FIG. 1;



FIG. 4 is a perspective view of a seal plate according to an alternate embodiment of the present disclosure and formed via the method of FIG. 1;



FIGS. 5A and 5B are respective cross-sectional views of a seal plate shown in a pre-formed and formed condition according to an alternate embodiment of the present disclosure and formed via the method of FIG. 1;



FIG. 6 is a perspective view of the seal plate of FIGS. 5A and 5B;



FIG. 7 is a perspective view of a seal plate according to an alternate embodiment of the present disclosure and formed via the method of FIG. 1;



FIG. 8 is a cross-sectional view of a laminated seal plate according to an alternate embodiment of the present disclosure and formed via the method of FIG. 1;



FIGS. 9A-9C is a seal plate including one or more points of electrical contact according to an alternate embodiment of the present disclosure and formed via the method of FIG. 1;



FIG. 10 is an area of detail of the seal plate illustrated in FIG. 1;



FIGS. 11A-11F are various configurations of spacers adapted for use with a seal plate formed via the method of FIG. 1;



FIG. 12 illustrates a block diagram of a system adapted for use with the method of FIG. 1 and configured to position one of the various spacers depicted in FIGS. 11A-11F within a seal plate formed via the method of FIG. 1; and



FIGS. 13A and 13B are functional block diagrams of a method of use of the system of FIG. 12.





DETAILED DESCRIPTION

Embodiments of the presently disclosed method and system are described in detail with reference to the drawing figures wherein like reference numerals identify similar or identical elements. As used herein, the term “distal” refers to that portion which is further from the user while the term “proximal” refers to that portion which is closer to the user.


The method and system of the present disclosure implements photolithographic processes in combination with etching processes to create specific, unique, complex geometries and/or features for seal plates used in the design of electrosurgical instruments, such as, for example, bipolar and monopolar electrosurgical devices. For example, possible features may include knife blade slots, recessed features, fine delicate features, and half etched features; all of which to be discussed in greater detail below. In addition to creating the aforementioned features, the precision of etching allows for greatly reduced tolerance stack-ups which could reduce issues with, for example, knife blade to knife slot ratios. Moreover, because the seal plates of the present disclosure are formed via suitable photolithographic and etching processes, the seal plates may be processed in lead frames that may be used in automated processes, which reduces costs associated with the aforementioned conventional manufacturing processes (e.g., stamping). Further, etch recipes associated with a given etch process, allow a user to enter practical data relating to the seal plate that may facilitate forming the seal plate during the etch process. For example, etch recipes associated with a given etch process may be tuned to have both vertical and non-vertical profiles, such as, when forming a knife slot on the seal plate.


With reference to FIG. 1, a flowchart illustrating a method of manufacture for an end effector assembly that includes a pair of jaw members each including a seal plate disposed thereon and configured for use with an electrosurgical instrument, e.g., electrosurgical forceps, in accordance with an embodiment of the present disclosure is shown designated 200.


An initial step of the method 200 includes providing a pair of jaw members (step 202) associated with an end effector adapted to connect to an electrosurgical forceps, such as, for example, a bipolar forceps. The jaw members may be formed by any suitable means, e.g., molding, casting, stamping, etc.


So as not to obscure the following disclosure with redundant information, manufacture of the seal plate is described herein as a single seal plate formed from a single sheet of material. Those skilled in the art will appreciate that a plurality of seal plates may be manufactured from a single sheet of material.


A step of method 200 includes forming a seal plate 102 (see step 204, in FIG. 1). Seal plate 102 may be formed from any suitable material, such as, for example, from a sheet of metal. A seal plate 102 formed according to method 200 is shown in FIG. 2. During formation of seal plate 102, seal plate 102 may be fully or partially etched (see step 206, in FIG. 1). For example, seal plate 102 may be etched to include one or more types of retention features 106. In the embodiment illustrated in FIG. 2, retention features 106 include a plurality etched flanges 110 that extend along one of a pair of sides 108 of the seal plate 102. In embodiments, retention features 106 may be partially etched in and/or fully etched through the seal plate 102. An example of partially etched retention features 106 is illustrated in FIG. 3A. More particularly, the partially etched retention features may be partially etched slots 112, partially etched cavities 114, and/or partially etched curved channels 116. An example of fully etched retention features 106 is illustrated in FIG. 3B. More particularly, the fully etched retention features 106 may be fully etched apertures 118. In either of the embodiments illustrated in FIGS. 2-3B, retention features 106 may be configured to securely retain the seal plate 102 to a respective jaw member of an end effector assembly associated with an electrosurgical forceps.


A step of method 200 includes positioning the seal plate 102 on a respective jaw member and subsequently overmolding the seal plate 102 to a respective jaw member (see steps 208 and 210 respectively in FIG. 1). In an embodiment, the photolithographic and etch processes in accordance with the method 200 of the present disclosure may be implemented to create partial etch dams along a side 108 of the seal plate 102. More particularly, one or more partial etch dams 116 may be disposed and/or formed along one of the sides 108 of seal plate 102, see FIG. 4. Partial etch dam 116 is configured to control the height of an overmold during the overmolding process of the seal plate 102 to a respective jaw member of the end effector assembly. More particularly, the partial dam 116 is configured to inhibit the flow of a plastic during the overmolding process ensuring that the height of the plastic does not exceed a predetermined height on the seal plate 102 and/or the respective jaw member. Controlling and/or preventing the height of the plastic from exceeding a predetermined height on the seal plate 102 and/or a respective jaw member, e.g., jaw member 110 or 120, during the overmolding process, minimizes or “tightens” distribution of thermal spread during an electrosurgical procedure, e.g., electrosurgical sealing procedure. More particularly, the partial etch dam 116 creates a seal plate 102 having a consistent height across a length of the seal plate 102, which, in turn, provides a consistent seal across tissue and minimizes thermal spread to adjacent tissue. Experimentation on urethane coating processes confirms a relationship between seal plates having consistent (or inconsistent) seal plate heights and thermal spread. More particularly, thermal spread as a result of seal plates having consistent heights across a length of the seal plate was negligible when compared to seal plates having inconsistent heights across a length of the seal plate.


In an embodiment, the photolithographic and etching processes in accordance with the method 200 of the present disclosure may be employed to create one or more textured patterns on the seal plate 102. More particularly, one type of textured pattern may include, for example, a textured pattern 134 having a plurality of raised dots with varying dimensions etched on a portion of a seal surface 102a of the seal plate 102, see FIGS. 2 and 10.


With reference to FIGS. 5A and 5B, seal plate 102 is illustrated pre-formed and formed, respectively. In an embodiment, the photolithographic and etching processes in accordance with the method 200 of the present disclosure may be implemented to facilitate forming of the seal plate 102. More particularly, selectively and/or partially etching the seal plate 102 lightens the overall structure of the seal plate 102, which, in turn, facilitates bending of the seal plate 102 during the forming process. To this end, one or more areas of the seal plate 102 may be selectively and/or partially etched. More particularly, selectively and/or partially etched areas 118 of the seal plate 102 may be located at predetermined locations on the seal plate 102, see FIGS. 5A and 6. Additionally, partial etching may be implemented to create curves 120 with small, tight radii, see FIGS. 5B and 7, which also makes forming seal plate 102 easier.


With reference again to FIG. 2, in an embodiment, the photolithographic and etching processes in accordance with the method 200 of the present disclosure may be implemented to create a knife slot 104 on the seal plate 102. More particularly, a knife slot 104 may be fully etched through the seal plate 102. The high precision that is associated with known photolithographic and etching processes, allows a manufacturer to form a fully etched knife slot 104 with various geometries. More particularly, in embodiments, the fully etched knife slot 104 may be defined by a pair of inner facing walls 104a and 104b. Inner facing walls 104a and 104b may be etched to have any suitable configuration. The precise configuration of the inner facing walls 104a and 104b may be determined by a manufacturer and subsequently entered into an etch recipe for a given etch process. In the embodiment illustrated in FIG. 2, inner facing walls 104a and 104b are illustrated perpendicular with respect to the seal surface 102b of the seal plate 102. In the embodiment illustrated in FIGS. 5A and 5B, inner facing walls 104a and 104b are illustrated slanted or angled with respect to the seal surface 102b of the seal plate 102.


With reference to FIGS. 8-9B, in an embodiment, the photolithographic and etching processes in accordance with the method 200 of the present disclosure may be implemented to create selectively and/or partially etched areas on the seal plate 102 that are configured to provide one or more electrical points of contact on the seal plate 102 such that electrosurgical energy may be provided to the seal plate 102 and/or other electrical components associated therewith. More particularly, one or more materials may be laminated together and, subsequently, selectively and/or partially etched. The materials laminated together may be conductive, partially-conductive, or non-conductive. Suitable materials may include but are not limited to stainless steel, copper, silver, and the like.


In the embodiment illustrated in FIG. 8, a portion of the seal plate 102 includes layers of stainless steel 122 and copper 124 laminated together. In this embodiment, the layer of copper 124 is selectively etched. Etching the copper 124 in this manner may be used to create one or more etched areas 126 configured to receive one or more types of electrical interfaces. More particularly, an etched area 126 may be configured to receive integrated flex, e.g., a polyimide flex circuit 128 that is configured to provide electrosurgical energy to the seal plate 102, see FIG. 9A. In this instance, one or more through holes 130 may be fully etched to create electrical interconnections through dialectic material located on the polyimide flex (FIG. 9B). Additionally, seal plate 102 may include one or more partially or fully etched areas configured to receive a bead of solder 132 to create one or more electrical interconnections on the seal plate 102 which may result in electrical wiring being an integral component of the seal plate 102. In addition to the foregoing, laminating layers of material together and, subsequently, etching (e.g., partially or fully) one of the layers of material may be used to create heat sinks (not explicitly shown) at specific locations on the seal plate 102.


As noted above, in certain instances the seal plates are configured to maintain a desired gap distance. With reference to FIGS. 11A-11F, in an embodiment, the photolithographic and etching processes in accordance with the method 200 of the present disclosure may be implemented to create one or more different types of insulation barriers, e.g., stop members, between seal plates associated with an end effector assembly. More particularly, photolithographic and etching processes of the present disclosure may be implemented to create one or more partially or fully etched recesses or pockets 136a on seal surface 102a of the seal plate 102 (see FIG. 11A, for example), wherein the pockets 136a is configured to receive one or more types of corresponding spacers 136b (FIG. 11A). An etched recess 136a may include an etch depth of 0.002 inches. Spacer 136b may be any suitable type of spacer known in the art. Spacer 136 may extend from seal surface 102a a distance that ranges from about 0.005 inches to about 0.01 inches. In an embodiment, spacer 136b may be a ceramic spacer made from aluminum titanium carbide, commonly referred to in the art and hereinafter referred to as AlTiC).


Etched recesses 136a and corresponding spacers 136b may have any suitable geometric configuration and may be dimension to fit within a 0.030×0.030 inch area (FIG. 11B). For example, FIG. 11A illustrates an etched recess 136a and corresponding spacer 136b each including a hemispherical configuration. FIG. 11B illustrates an etched recess 138a and corresponding spacer 138b each including a cylindrical configuration. FIG. 11C illustrates an etched recess 140a and corresponding spacer 140b each including a square configuration. FIG. 11D illustrates an etched recess 142a and corresponding spacer 142b each including a triangular configuration. FIG. 11E illustrates a plurality of etched recesses 144a and corresponding spacers 144b in an intermittent or staggered configuration. In embodiments, any of the aforementioned etched recesses and corresponding spacers may be arranged in a grid like configuration, see FIG. 11F for example. The combination of any of the aforementioned etched recesses, e.g., recess 138a and spacers, e.g., spacer 138b provides a user with the ability to manipulate how the jaw members 110 and 120 come together. For example, cylindrical shaped recess 138a and corresponding spacer 138b may be configured to force one of the jaw members, e.g., a upper jaw member 110 to roll along an axis of the spacer 138b when the upper jaw member 110 and a bottom jaw member 120 of an end effector assembly are moved toward each other, which, in turn, results in a more precise alignment of the upper and lower jaw members 110 and 120, respectively.


Moreover, the combination of any of the aforementioned etched recesses, e.g., recess 136a and spacers, e.g., spacer 136b increases the integrity of a bond between the seal surface 102a and spacer 136b in that the spacer 136b is encased within a recess 136b, as opposed to only being bonded to the seal surface 102a of the seal plate 102. The photolithographic and etching processes in accordance with the method 200 of the present disclosure allows a manufacturer to position any of the aforementioned spacers, e.g., spacer 136b within a corresponding pocket 136a to within a 0.0005 inch tolerance.


With reference now to FIGS. 12-13B, in an embodiment, a step of the method 200 may include etching one or more recesses, e.g., 136a on the seal surface 102a of the seal plate 102 and positioning a spacer, e.g., spacer 136b in the recess 136a. In this instance, an automated system 300 is provided and includes a plurality of modules 400 that includes a vacuum module 600, an adhesive dispensing module 700, and an optional optical module 800. Each of the foregoing modules is fully automated and in operative communication with a photolithography module 500 (configured to provide functions previously described herein) that is also fully automated.


Photolithography module 500 is configured to fully, partially, and/or selectively etch one or more pockets 136b on the seal surface 102a of the seal plate 102. After the pockets 136b have been etched into the seal surface 102a of the seal plate 102, the seal plate 102 is transferred to adhesive dispensing module 700 where a bead of adhesive 702 will be dispensed into the pocket 136b such that a spacer 136a may be positioned into the pocket 136b and bonded therein.


Vacuum module 600 is configured to raise and transfer a spacer, e.g., spacer 136b from a loading module 900 (a loading table 900, for example) to the one or more pockets 136a on the seal plate 102 and lower the spacer 136b within the pocket 136a on the seal plate 102. With this purpose mind, the vacuum module 600 includes one or more vacuum transfer devices 602 operatively connected to a vacuum source 604. Vacuum transfer device 602 may be any suitable device that is capable of raising, transferring and lowering a spacer 136b. For example, vacuum devices typically associated with the manufacture process of disk drives, auto slider bond, SMT automated assembly and PCB assembly may be utilized in combination with vacuum module 600. In an embodiment, the vacuum transfer device 602 (e.g., vacuum device typically utilized in the manufacture process PCB assembly) includes a distal end 606 configured to raise a spacer 136b (FIG. 13) from loading table 900, transfer the spacer 136b to the recess 136a, and, subsequently, lower the spacer 136b within the recess 136a.


Adhesive dispensing module 700 is configured to dispense a bead of suitable adhesive 702 into the one or more pockets 136a on the seal plate 102. In an embodiment, the adhesive dispensing module includes a device 704 configured to heat cure the adhesive 702 after the spacer 136b has been positioned within the pocket 136a.


In an embodiment, an optical module 800 is provided and is configured to monitor the volume of adhesive 702 dispensed within the pocket 136a, monitor alignment of the spacer 136b with respect to pocket 136a and/or monitor placement of the spacer 136b within the pocket 136a. To this end, optical module 800 may include one or more types of camera 802 located at or near the adhesive dispensing module 700.


System 300 includes one or more microprocessors 1100 including one or more algorithms 1200 configured to control and monitor each of the above-referenced modules during transferring and positioning of the spacers 136b within the pockets 136a. System 300 employs an x-y coordinate axis system to facilitate properly aligning a spacer 136b and pocket 136a (FIG. 13A).


In use, the vacuum transfer device 602 of vacuum module 600 is used to raise one of a plurality of spacers 136b from a loading table 900 to an adhesive station 1000 where the seal plate 102 is located. At a time prior to the spacer 136b arriving at the adhesive station 1000, adhesive dispensing module 700 dispenses a bead of adhesive 702 (FIG. 13B) within a pocket 136a. The time the bead of adhesive 702 is dispensed will depend on such parameters as type of adhesive, cure time of adhesive, volume of adhesive, etc. Camera 802 of optical module 800 may be employed to ensure that the spacer 136b and pocket 136a are properly aligned. Once it is determined that the spacer 136a and pocket 136b are properly aligned, the vacuum transfer device 602 may be employed to lower the spacer 136b into pocket 136a. Camera 802 of optical module 800 may again be employed to ensure that the spacer 136b seats at a proper height above pocket 136a (FIG. 13B). In accordance with the present disclosure spacer 136b seats at a height above the pocket 136a that ranges from about 0.001 inches to about 0.006 inches. Once it is determined that the spacer 136b seats at a proper height above pocket 136a, ultra violet heat may be applied to facilitate the curing process.


From the foregoing and with reference to the various figure drawings, those skilled in the art will appreciate that certain modifications can also be made to the present disclosure without departing from the scope of the same.


While several embodiments of the disclosure have been shown in the drawings, it is not intended that the disclosure be limited thereto, as it is intended that the disclosure be as broad in scope as the art will allow and that the specification be read likewise. Therefore, the above description should not be construed as limiting, but merely as exemplifications of particular embodiments. Those skilled in the art will envision other modifications within the scope and spirit of the claims appended hereto.

Claims
  • 1. An end effector configured for use with an electrosurgical forceps device, the end effector comprising: a first jaw member comprising a first sealing surface including a plurality of flanges configured to secure the sealing surface to an overmolding material; anda second jaw member operably coupled to the first jaw member such that at least one of the first jaw member or the second jaw member is movable relative to the other between an open condition and a closed condition, the second jaw member including: a second sealing surface having a recess defined therein; anda spacer extending from the recess and configured to maintain a gap distance between the first and second sealing surfaces when the first and second jaw members are in the closed condition.
  • 2. The end effector according to claim 1, further comprising an adhesive disposed within the recess and configured to retain the spacer within the recess.
  • 3. The end effector according to claim 1, wherein the first jaw member is movable relative to the second jaw member.
  • 4. The end effector according to claim 1, wherein the second jaw member is movable relative to the first jaw member.
  • 5. The end effector according to claim 1, wherein the spacer extends above the second sealing surface a distance in a range from about 0.001 inches to about 0.005 inches.
  • 6. The end effector according to claim 1, wherein the spacer includes a hemispherical configuration.
  • 7. The end effector according to claim 1, wherein the spacer includes a cylindrical configuration.
  • 8. The end effector according to claim 1, wherein the spacer includes a square configuration.
  • 9. The end effector according to claim 1, wherein the spacer includes a triangular configuration.
  • 10. The end effector according to claim 1, wherein a plurality of spacers is disposed within the recess defined by the second sealing surface.
  • 11. The end effector according to claim 10, wherein the plurality of spacers is arranged in a grid-like configuration.
  • 12. The end effector according to claim 1, wherein at least one of the first sealing surface or the second sealing surface includes a knife slot defined therein.
  • 13. The end effector according to claim 1, wherein the second sealing surface includes a knife slot defined therein and a first spacer is disposed within the recess on a first side of the knife slot and a second spacer is disposed in a second recess defined within the second sealing surface on a second side of the knife slot.
  • 14. The end effector according to claim 1, wherein each flange of the plurality of flanges extends from a side of the first sealing surface.
CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation application of U.S. patent application Ser. No. 15/049,632, filed on Feb. 22, 2016, which is a continuation application of U.S. patent application Ser. No. 14/557,767, filed on Dec. 2, 2014, now U.S. Pat. No. 9,265,552, which is a continuation application of U.S. patent application Ser. No. 13/358,657, filed on Jan. 26, 2012, now U.S. Pat. No. 8,898,888, which is a divisional application of U.S. patent application Ser. No. 12/568,282, filed on Sep. 28, 2009, now U.S. Pat. No. 8,112,871, the entire contents of each of which being incorporated herein by reference.

US Referenced Citations (1176)
Number Name Date Kind
371664 Brannan et al. Oct 1887 A
702472 Pignolet Jun 1902 A
728883 Downes May 1903 A
1586645 Bierman Jun 1926 A
1813902 Bovie Jul 1931 A
1822330 Ainslie Sep 1931 A
1852542 Sovatkin Apr 1932 A
1908201 Welch et al. May 1933 A
1918889 Bacon Jul 1933 A
2002594 Wappler et al. May 1935 A
2011169 Wappler et al. Aug 1935 A
2031682 Wappler et al. Feb 1936 A
2054149 Wappler Sep 1936 A
2113246 Wappler Apr 1938 A
2141936 Schmitt Dec 1938 A
2176479 Willis Oct 1939 A
2245030 Gottesfeld et al. Jun 1941 A
2305156 Grubel Dec 1942 A
5282799 Rydell Feb 1994 A
5313027 Inoue et al. May 1994 A
5476479 Green et al. Dec 1995 A
5478351 Meade et al. Dec 1995 A
5480406 Nolan et al. Jan 1996 A
5480409 Riza Jan 1996 A
5482054 Slater et al. Jan 1996 A
5484436 Eggers et al. Jan 1996 A
5493899 Beck et al. Feb 1996 A
5496312 Klicek Mar 1996 A
5496317 Goble et al. Mar 1996 A
5496347 Hashiguchi et al. Mar 1996 A
5499997 Sharpe et al. Mar 1996 A
5501654 Failla et al. Mar 1996 A
5509922 Aranyi et al. Apr 1996 A
5512721 Young et al. Apr 1996 A
5514134 Rydell et al. May 1996 A
5520702 Sauer et al. May 1996 A
5527313 Scott et al. Jun 1996 A
5528833 Sakuma Jun 1996 A
5529067 Larsen et al. Jun 1996 A
5531744 Nardella et al. Jul 1996 A
5536251 Evard et al. Jul 1996 A
5540684 Hassler, Jr. Jul 1996 A
5540685 Parins et al. Jul 1996 A
5540706 Aust et al. Jul 1996 A
5540715 Katsaros et al. Jul 1996 A
5542945 Fritzsch Aug 1996 A
5549604 Sutcu et al. Aug 1996 A
5554172 Horner et al. Sep 1996 A
5558671 Yates Sep 1996 A
5558672 Edwards et al. Sep 1996 A
5562619 Mirarchi et al. Oct 1996 A
5562699 Heimberger et al. Oct 1996 A
5562720 Stern et al. Oct 1996 A
5564615 Bishop et al. Oct 1996 A
5568859 Levy et al. Oct 1996 A
5569241 Edwards Oct 1996 A
5569243 Kortenbach et al. Oct 1996 A
5571100 Goble et al. Nov 1996 A
5573424 Poppe Nov 1996 A
5573534 Stone Nov 1996 A
5573535 Viklund Nov 1996 A
5575799 Bolanos et al. Nov 1996 A
5575805 Li Nov 1996 A
5578052 Koros et al. Nov 1996 A
5579781 Cooke Dec 1996 A
5582611 Tsuruta et al. Dec 1996 A
5582617 Klieman et al. Dec 1996 A
5585896 Yamazaki et al. Dec 1996 A
5590570 LeMaire, III et al. Jan 1997 A
5591181 Stone et al. Jan 1997 A
5597107 Knodel et al. Jan 1997 A
5599350 Schulze et al. Feb 1997 A
5601224 Bishop et al. Feb 1997 A
5601601 Tal et al. Feb 1997 A
5601641 Stephens Feb 1997 A
5603711 Parins et al. Feb 1997 A
5603723 Aranyi et al. Feb 1997 A
5607436 Pratt et al. Mar 1997 A
5611798 Eggers Mar 1997 A
5611808 Hossain et al. Mar 1997 A
5611813 Lichtman Mar 1997 A
5618294 Aust et al. Apr 1997 A
5618307 Donlon et al. Apr 1997 A
5620415 Lucey et al. Apr 1997 A
5620453 Nallakrishnan Apr 1997 A
5620459 Lichtman Apr 1997 A
5624452 Yates Apr 1997 A
5626578 Tihon May 1997 A
5626607 Malecki et al. May 1997 A
5626609 Zvenyatsky et al. May 1997 A
5630833 Katsaros et al. May 1997 A
5637110 Pennybacker et al. Jun 1997 A
5637111 Sutcu et al. Jun 1997 A
5638003 Hall Jun 1997 A
5638827 Palmer et al. Jun 1997 A
5639403 Ida et al. Jun 1997 A
5643294 Tovey et al. Jul 1997 A
5647869 Goble et al. Jul 1997 A
5647871 Levine et al. Jul 1997 A
5649959 Hannam et al. Jul 1997 A
5655650 Naitou Aug 1997 A
5658281 Heard Aug 1997 A
D384413 Zlock et al. Sep 1997 S
5662667 Knodel Sep 1997 A
5665100 Yoon Sep 1997 A
5667526 Levin Sep 1997 A
5673841 Schulze et al. Oct 1997 A
5674220 Fox et al. Oct 1997 A
5674229 Tovey et al. Oct 1997 A
5681282 Eggers et al. Oct 1997 A
5688270 Yates et al. Nov 1997 A
5690652 Wurster et al. Nov 1997 A
5690653 Richardson et al. Nov 1997 A
5693051 Schulze et al. Dec 1997 A
5693920 Maeda Dec 1997 A
5695522 LeMaire, III et al. Dec 1997 A
5700261 Brinkerhoff Dec 1997 A
5700270 Peyser et al. Dec 1997 A
5702390 Austin et al. Dec 1997 A
5707369 Vaitekunas et al. Jan 1998 A
5709680 Yates et al. Jan 1998 A
5713895 Lontine et al. Feb 1998 A
5716366 Yates Feb 1998 A
5720742 Zacharias Feb 1998 A
5720744 Eggleston et al. Feb 1998 A
5722421 Francese et al. Mar 1998 A
5725536 Oberlin et al. Mar 1998 A
5727428 LeMaire, III et al. Mar 1998 A
5735848 Yates et al. Apr 1998 A
5735849 Baden et al. Apr 1998 A
5743906 Parins et al. Apr 1998 A
5752973 Kieturakis May 1998 A
5755717 Yates et al. May 1998 A
5759188 Yoon Jun 1998 A
5762255 Chrisman et al. Jun 1998 A
5762609 Benaron et al. Jun 1998 A
5766130 Selmonosky Jun 1998 A
5766166 Hooven Jun 1998 A
5766170 Eggers Jun 1998 A
5766196 Griffiths Jun 1998 A
5769849 Eggers Jun 1998 A
5772655 Bauer et al. Jun 1998 A
5772670 Brosa Jun 1998 A
5776128 Eggers Jul 1998 A
5776130 Buysse et al. Jul 1998 A
5776156 Shikhman Jul 1998 A
5779646 Koblish et al. Jul 1998 A
5779701 McBrayer et al. Jul 1998 A
5779727 Orejola Jul 1998 A
5781048 Nakao et al. Jul 1998 A
H001745 Paraschac Aug 1998 H
5791231 Cohn et al. Aug 1998 A
5792137 Carr et al. Aug 1998 A
5792165 Klieman et al. Aug 1998 A
5792177 Kaseda Aug 1998 A
5797537 Oberlin et al. Aug 1998 A
5797927 Yoon Aug 1998 A
5797938 Paraschac et al. Aug 1998 A
5797941 Schulze et al. Aug 1998 A
5797958 Yoon Aug 1998 A
5797959 Castro et al. Aug 1998 A
5800448 Banko Sep 1998 A
5800449 Wales Sep 1998 A
5807393 Williamson, IV et al. Sep 1998 A
5810764 Eggers et al. Sep 1998 A
5810805 Sutcu et al. Sep 1998 A
5810808 Eggers Sep 1998 A
5810811 Yates et al. Sep 1998 A
5810877 Roth et al. Sep 1998 A
5814043 Shapeton Sep 1998 A
5814054 Kortenbach et al. Sep 1998 A
5817083 Shemesh et al. Oct 1998 A
5817119 Klieman et al. Oct 1998 A
5820630 Lind Oct 1998 A
5824978 Karasik et al. Oct 1998 A
5827271 Buysse et al. Oct 1998 A
5827274 Bonnet et al. Oct 1998 A
5827279 Hughett et al. Oct 1998 A
5827281 Levin Oct 1998 A
5827323 Klieman et al. Oct 1998 A
5827548 Lavallee et al. Oct 1998 A
5830212 Cartmell et al. Nov 1998 A
5833690 Yates et al. Nov 1998 A
5833695 Yoon Nov 1998 A
5836072 Sullivan et al. Nov 1998 A
D402028 Grimm et al. Dec 1998 S
5843080 Fleenor et al. Dec 1998 A
5849020 Long et al. Dec 1998 A
5849022 Sakashita et al. Dec 1998 A
5851214 Larsen et al. Dec 1998 A
5853412 Mayenberger Dec 1998 A
5859527 Cook Jan 1999 A
5860976 Billings et al. Jan 1999 A
5865361 Milliman et al. Feb 1999 A
5876401 Schulze et al. Mar 1999 A
5876410 Petillo Mar 1999 A
5876412 Piraka Mar 1999 A
5882567 Cavallaro et al. Mar 1999 A
D408018 McNaughton Apr 1999 S
5891141 Rydell Apr 1999 A
5891142 Eggers et al. Apr 1999 A
5893846 Bales et al. Apr 1999 A
5893848 Negus et al. Apr 1999 A
5893863 Yoon Apr 1999 A
5893875 O'Connor et al. Apr 1999 A
5893877 Gampp, Jr. et al. Apr 1999 A
5897563 Yoon et al. Apr 1999 A
5902301 Olig May 1999 A
5906630 Anderhub et al. May 1999 A
5907140 Smith May 1999 A
5908420 Parins Jun 1999 A
5908432 Pan Jun 1999 A
5911719 Eggers Jun 1999 A
5913874 Berns et al. Jun 1999 A
5921916 Aeikens et al. Jul 1999 A
5921984 Sutcu et al. Jul 1999 A
5925043 Kumar et al. Jul 1999 A
5928136 Barry Jul 1999 A
5935126 Riza Aug 1999 A
5938589 Wako et al. Aug 1999 A
5941869 Patterson et al. Aug 1999 A
5944718 Austin et al. Aug 1999 A
5951545 Schilling et al. Sep 1999 A
5951546 Lorentzen Sep 1999 A
5951549 Richardson et al. Sep 1999 A
5954720 Wilson et al. Sep 1999 A
5954731 Yoon Sep 1999 A
5954733 Yoon Sep 1999 A
5957923 Hahnen et al. Sep 1999 A
5957937 Yoon Sep 1999 A
5960544 Beyers Oct 1999 A
5961514 Long et al. Oct 1999 A
5964758 Dresden Oct 1999 A
5967997 Turturro et al. Oct 1999 A
D416089 Barton et al. Nov 1999 S
5976132 Morris Nov 1999 A
5984932 Yoon Nov 1999 A
5984938 Yoon Nov 1999 A
5984939 Yoon Nov 1999 A
5989277 LeMaire, III et al. Nov 1999 A
5993466 Yoon Nov 1999 A
5993467 Yoon Nov 1999 A
5993474 Ouchi Nov 1999 A
5997565 Inoue Dec 1999 A
6003517 Sheffield et al. Dec 1999 A
6004332 Yoon et al. Dec 1999 A
6004335 Vaitekunas et al. Dec 1999 A
6010516 Hulka Jan 2000 A
6010519 Mawhirt et al. Jan 2000 A
6017354 Culp et al. Jan 2000 A
6017358 Yoon et al. Jan 2000 A
6021693 Feng-Sing Feb 2000 A
6024741 Williamson, IV et al. Feb 2000 A
6024743 Edwards Feb 2000 A
6024744 Kese et al. Feb 2000 A
6027522 Palmer Feb 2000 A
6030384 Nezhat Feb 2000 A
6033399 Gines Mar 2000 A
6039733 Buysse et al. Mar 2000 A
6041679 Slater et al. Mar 2000 A
6050995 Durgin Apr 2000 A
6050996 Schmaltz et al. Apr 2000 A
6053914 Eggers et al. Apr 2000 A
6053933 Balazs et al. Apr 2000 A
D424694 Tetzlaff et al. May 2000 S
D425201 Tetzlaff et al. May 2000 S
6059782 Novak et al. May 2000 A
6063103 Hashiguchi May 2000 A
6066139 Ryan et al. May 2000 A
6071283 Nardella et al. Jun 2000 A
6074386 Goble et al. Jun 2000 A
6077287 Taylor et al. Jun 2000 A
6080180 Yoon et al. Jun 2000 A
RE36795 Rydell Jul 2000 E
6083150 Aznoian et al. Jul 2000 A
6083223 Baker Jul 2000 A
6086586 Hooven Jul 2000 A
6086601 Yoon Jul 2000 A
6090107 Borgmeier et al. Jul 2000 A
6090123 Culp et al. Jul 2000 A
6096037 Mulier et al. Aug 2000 A
6099537 Sugai et al. Aug 2000 A
6099550 Yoon Aug 2000 A
6102909 Chen et al. Aug 2000 A
6106542 Toybin et al. Aug 2000 A
6110171 Rydell Aug 2000 A
6113596 Hooven et al. Sep 2000 A
6113598 Baker Sep 2000 A
6117158 Measamer et al. Sep 2000 A
6122549 Sharkey et al. Sep 2000 A
6123701 Nezhat Sep 2000 A
H001904 Yates et al. Oct 2000 H
6126658 Baker Oct 2000 A
6126665 Yoon Oct 2000 A
6139563 Cosgrove, III et al. Oct 2000 A
6143005 Yoon et al. Nov 2000 A
6152923 Ryan Nov 2000 A
6152924 Parins Nov 2000 A
6159217 Robie et al. Dec 2000 A
6162220 Nezhat Dec 2000 A
6171316 Kovac et al. Jan 2001 B1
6174309 Wrublewski et al. Jan 2001 B1
6174310 Kirwan, Jr. Jan 2001 B1
6178628 Clemens et al. Jan 2001 B1
6179834 Buysse et al. Jan 2001 B1
6179837 Hooven Jan 2001 B1
6183467 Shapeton et al. Feb 2001 B1
6187003 Buysse et al. Feb 2001 B1
6190386 Rydell Feb 2001 B1
6190399 Palmer et al. Feb 2001 B1
6190400 Van De Moer et al. Feb 2001 B1
6193709 Miyawaki et al. Feb 2001 B1
6193718 Kortenbach et al. Feb 2001 B1
6206876 Levine et al. Mar 2001 B1
6206877 Kese et al. Mar 2001 B1
6206893 Klein et al. Mar 2001 B1
6214028 Yoon et al. Apr 2001 B1
6217602 Redmon Apr 2001 B1
6217615 Sioshansi et al. Apr 2001 B1
6221039 Durgin et al. Apr 2001 B1
6223100 Green Apr 2001 B1
6224593 Ryan et al. May 2001 B1
6224614 Yoon May 2001 B1
6228080 Gines May 2001 B1
6228083 Lands et al. May 2001 B1
6248124 Pedros et al. Jun 2001 B1
6248944 Ito Jun 2001 B1
6261307 Yoon et al. Jul 2001 B1
6267758 Daw et al. Jul 2001 B1
6267761 Ryan Jul 2001 B1
6270497 Sekino et al. Aug 2001 B1
6270508 Klieman et al. Aug 2001 B1
6273887 Yamauchi et al. Aug 2001 B1
6277117 Tetzlaff et al. Aug 2001 B1
6280458 Boche et al. Aug 2001 B1
6283961 Underwood et al. Sep 2001 B1
D449886 Tetzlaff et al. Oct 2001 S
6298550 Kirwan, Jr. Oct 2001 B1
6302424 Gisinger et al. Oct 2001 B1
6309404 Krzyzanowski Oct 2001 B1
6319262 Bates et al. Nov 2001 B1
6319451 Brune Nov 2001 B1
6322561 Eggers et al. Nov 2001 B1
6322580 Kanner Nov 2001 B1
6325795 Lindemann et al. Dec 2001 B1
6325811 Messerly Dec 2001 B1
6329778 Culp et al. Dec 2001 B1
6334860 Dorn Jan 2002 B1
6334861 Chandler et al. Jan 2002 B1
D453923 Olson Feb 2002 S
6345532 Coudray et al. Feb 2002 B1
6350264 Hooven Feb 2002 B1
D454951 Bon Mar 2002 S
6352536 Buysse et al. Mar 2002 B1
6358249 Chen et al. Mar 2002 B1
6358259 Swain et al. Mar 2002 B1
6358268 Hunt et al. Mar 2002 B1
6361534 Chen et al. Mar 2002 B1
6364876 Erb et al. Apr 2002 B1
6364879 Chen et al. Apr 2002 B1
D457958 Dycus et al. May 2002 S
D457959 Tetzlaff et al. May 2002 S
6385265 Duffy et al. May 2002 B1
6387094 Eitenmuller May 2002 B1
6391035 Appleby et al. May 2002 B1
6398779 Buysse et al. Jun 2002 B1
6402747 Lindemann et al. Jun 2002 B1
6409728 Ehr et al. Jun 2002 B1
H002037 Yates et al. Jul 2002 H
6419675 Gallo, Sr. Jul 2002 B1
6425896 Baltschun et al. Jul 2002 B1
6432112 Brock et al. Aug 2002 B2
6440130 Mulier et al. Aug 2002 B1
6440144 Bacher Aug 2002 B1
6443952 Mulier et al. Sep 2002 B1
6443970 Schulze et al. Sep 2002 B1
6451018 Lands et al. Sep 2002 B1
6458125 Cosmescu Oct 2002 B1
6458128 Schulze Oct 2002 B1
6458129 Scarfi Oct 2002 B2
6458130 Frazier et al. Oct 2002 B1
6461352 Morgan et al. Oct 2002 B2
6461368 Fogarty et al. Oct 2002 B2
6464701 Hooven et al. Oct 2002 B1
6464702 Schulze et al. Oct 2002 B2
6464704 Schmaltz et al. Oct 2002 B2
6471696 Berube et al. Oct 2002 B1
D465281 Lang Nov 2002 S
D466209 Bon Nov 2002 S
6485489 Teirstein et al. Nov 2002 B2
6488680 Francischelli et al. Dec 2002 B1
6494888 Laufer et al. Dec 2002 B1
6500176 Truckai et al. Dec 2002 B1
6506196 Laufer Jan 2003 B1
6508815 Strul et al. Jan 2003 B1
6511480 Tetzlaff et al. Jan 2003 B1
6514215 Ouchi Feb 2003 B1
6514252 Nezhat et al. Feb 2003 B2
6517536 Hooven et al. Feb 2003 B2
6517539 Smith et al. Feb 2003 B1
6527771 Weadock et al. Mar 2003 B1
6533784 Truckai et al. Mar 2003 B2
6537272 Christopherson et al. Mar 2003 B2
6540745 Fairbourn et al. Apr 2003 B1
6545239 Spedale et al. Apr 2003 B2
6554844 Lee et al. Apr 2003 B2
6558385 McClurken et al. May 2003 B1
6562037 Paton et al. May 2003 B2
6569105 Kortenbach et al. May 2003 B1
6582450 Ouchi Jun 2003 B2
6585735 Frazier et al. Jul 2003 B1
6602252 Mollenauer Aug 2003 B2
6605790 Yoshida Aug 2003 B2
6610060 Mulier et al. Aug 2003 B2
6613048 Mulier et al. Sep 2003 B2
6616654 Mollenauer Sep 2003 B2
6616658 Ineson Sep 2003 B2
6616661 Wellman et al. Sep 2003 B2
6620161 Schulze et al. Sep 2003 B2
6620184 de Laforcade et al. Sep 2003 B2
6623482 Pendekanti et al. Sep 2003 B2
6626901 Treat et al. Sep 2003 B1
6629534 St. Goar et al. Oct 2003 B1
6638287 Danitz et al. Oct 2003 B2
6641595 Moran et al. Nov 2003 B1
6652514 Ellman et al. Nov 2003 B2
6652518 Wellman et al. Nov 2003 B2
6652521 Schulze Nov 2003 B2
6656173 Palermo Dec 2003 B1
6656175 Francischelli et al. Dec 2003 B2
6656177 Truckai et al. Dec 2003 B2
6660072 Chatterjee Dec 2003 B2
6663639 Laufer et al. Dec 2003 B1
6663641 Kovac et al. Dec 2003 B1
6666854 Lange Dec 2003 B1
6669696 Bacher et al. Dec 2003 B2
6673092 Bacher Jan 2004 B1
6676660 Wampler et al. Jan 2004 B2
6676676 Danitz et al. Jan 2004 B2
6679882 Kornerup Jan 2004 B1
6682527 Strul Jan 2004 B2
6682528 Frazier et al. Jan 2004 B2
6685704 Greep Feb 2004 B2
6685724 Haluck Feb 2004 B1
6689131 McClurken Feb 2004 B2
6692445 Roberts et al. Feb 2004 B2
6693246 Rudolph et al. Feb 2004 B1
6695840 Schulze Feb 2004 B2
6702810 McClurken et al. Mar 2004 B2
6723092 Brown et al. Apr 2004 B2
6726068 Miller Apr 2004 B2
6726686 Buysse et al. Apr 2004 B2
6726694 Blatter et al. Apr 2004 B2
6733498 Paton et al. May 2004 B2
6733501 Levine May 2004 B2
6736813 Yamauchi et al. May 2004 B2
6743229 Buysse et al. Jun 2004 B2
6743230 Lutze et al. Jun 2004 B2
6743239 Kuehn et al. Jun 2004 B1
6743240 Smith et al. Jun 2004 B2
6755338 Hahnen et al. Jun 2004 B2
6755824 Jain et al. Jun 2004 B2
6755843 Chung et al. Jun 2004 B2
6756553 Yamaguchi et al. Jun 2004 B1
6757977 Dambal et al. Jul 2004 B2
D493888 Reschke Aug 2004 S
6770072 Truckai et al. Aug 2004 B1
6773409 Truckai et al. Aug 2004 B2
6773432 Clayman et al. Aug 2004 B1
6773434 Ciarrocca Aug 2004 B2
6773435 Schulze et al. Aug 2004 B2
6773441 Laufer et al. Aug 2004 B1
6775575 Bommannan et al. Aug 2004 B2
6776780 Mulier et al. Aug 2004 B2
6784405 Flugstad et al. Aug 2004 B2
6786905 Swanson et al. Sep 2004 B2
6790217 Schulze et al. Sep 2004 B2
6796981 Wham et al. Sep 2004 B2
D496997 Dycus et al. Oct 2004 S
6800825 Sasaki et al. Oct 2004 B1
6802843 Truckai et al. Oct 2004 B2
6808525 Latterell et al. Oct 2004 B2
D499181 Dycus et al. Nov 2004 S
6818000 Muller et al. Nov 2004 B2
6818007 Dampney et al. Nov 2004 B1
6821273 Mollenauer Nov 2004 B2
6821285 Laufer et al. Nov 2004 B2
6824547 Wilson, Jr. et al. Nov 2004 B2
6830174 Hillstead et al. Dec 2004 B2
6835200 Laufer et al. Dec 2004 B2
6843789 Goble Jan 2005 B2
6857357 Fujii Feb 2005 B2
6858028 Mulier et al. Feb 2005 B2
D502994 Blake, III Mar 2005 S
6860880 Treat et al. Mar 2005 B2
6878147 Prakash et al. Apr 2005 B2
6887240 Lands et al. May 2005 B1
6889116 Jinno May 2005 B2
6905497 Truckai et al. Jun 2005 B2
6908463 Treat et al. Jun 2005 B2
6914201 Van Vooren et al. Jul 2005 B2
6926716 Baker et al. Aug 2005 B2
6929644 Truckai et al. Aug 2005 B2
6932810 Ryan Aug 2005 B2
6932816 Phan Aug 2005 B2
6934134 Mori et al. Aug 2005 B2
6936061 Sasaki Aug 2005 B2
D509297 Wells Sep 2005 S
6942662 Goble et al. Sep 2005 B2
6943311 Miyako Sep 2005 B2
6951559 Greep Oct 2005 B1
6953430 Kidooka Oct 2005 B2
6953461 McClurken et al. Oct 2005 B2
6958070 Witt et al. Oct 2005 B2
6960210 Lands et al. Nov 2005 B2
6964662 Kidooka Nov 2005 B2
6966907 Goble Nov 2005 B2
6972017 Smith et al. Dec 2005 B2
6974452 Gille et al. Dec 2005 B1
6976492 Ingle et al. Dec 2005 B2
6977495 Donofrio Dec 2005 B2
6979786 Aukland et al. Dec 2005 B2
6981628 Wales Jan 2006 B2
6987244 Bauer Jan 2006 B2
6989017 Howell et al. Jan 2006 B2
6994707 Ellman et al. Feb 2006 B2
6994709 Iida Feb 2006 B2
6997931 Sauer et al. Feb 2006 B2
7001381 Harano et al. Feb 2006 B2
7001408 Knodel et al. Feb 2006 B2
7011657 Truckai et al. Mar 2006 B2
7025763 Karasawa et al. Apr 2006 B2
7033354 Keppel Apr 2006 B2
7033356 Latterell et al. Apr 2006 B2
7041102 Truckai et al. May 2006 B2
7044948 Keppel May 2006 B2
7052489 Griego et al. May 2006 B2
7052496 Yamauchi May 2006 B2
7063699 Hess et al. Jun 2006 B2
7063715 Onuki et al. Jun 2006 B2
D525361 Hushka Jul 2006 S
7070597 Truckai et al. Jul 2006 B2
7083618 Couture et al. Aug 2006 B2
7083619 Truckai et al. Aug 2006 B2
7083620 Jahns et al. Aug 2006 B2
7087051 Bourne et al. Aug 2006 B2
7087054 Truckai et al. Aug 2006 B2
7090673 Dycus et al. Aug 2006 B2
7090689 Nagase et al. Aug 2006 B2
7101371 Dycus et al. Sep 2006 B2
7101372 Dycus et al. Sep 2006 B2
7101373 Dycus et al. Sep 2006 B2
7103947 Sartor et al. Sep 2006 B2
7107124 Green Sep 2006 B2
7108694 Miura et al. Sep 2006 B2
7112199 Cosmescu Sep 2006 B2
7112201 Truckai et al. Sep 2006 B2
D531311 Guerra et al. Oct 2006 S
7115123 Knowlton et al. Oct 2006 B2
7115139 McClurken et al. Oct 2006 B2
7118570 Tetzlaff et al. Oct 2006 B2
7118587 Dycus et al. Oct 2006 B2
7131860 Sartor et al. Nov 2006 B2
7131970 Moses et al. Nov 2006 B2
7131971 Dycus et al. Nov 2006 B2
7135018 Ryan et al. Nov 2006 B2
7135020 Lawes et al. Nov 2006 B2
7137980 Buysse et al. Nov 2006 B2
D533274 Visconti et al. Dec 2006 S
D533942 Kerr et al. Dec 2006 S
7145757 Shea et al. Dec 2006 B2
7147632 Prakash et al. Dec 2006 B2
7147638 Chapman et al. Dec 2006 B2
7150097 Sremcich et al. Dec 2006 B2
7150749 Dycus et al. Dec 2006 B2
7153314 Laufer et al. Dec 2006 B2
D535027 James et al. Jan 2007 S
7156842 Sartor et al. Jan 2007 B2
7156846 Dycus et al. Jan 2007 B2
7160298 Lawes et al. Jan 2007 B2
7160299 Baily Jan 2007 B2
7166106 Bartel et al. Jan 2007 B2
7169145 Isaacson et al. Jan 2007 B2
7169146 Truckai et al. Jan 2007 B2
7179255 Lettice et al. Feb 2007 B2
7179258 Buysse et al. Feb 2007 B2
7184820 Jersey-Willuhn et al. Feb 2007 B2
D538932 Malik Mar 2007 S
7189233 Truckai et al. Mar 2007 B2
7195631 Dumbauld Mar 2007 B2
D541418 Schechter et al. Apr 2007 S
7204835 Latterell et al. Apr 2007 B2
7207990 Lands et al. Apr 2007 B2
7208005 Frecker et al. Apr 2007 B2
D541611 Aglassinger May 2007 S
D541938 Kerr et al. May 2007 S
7211084 Goble et al. May 2007 B2
7223264 Daniel et al. May 2007 B2
7223265 Keppel May 2007 B2
D545432 Watanabe Jun 2007 S
7232440 Dumbauld et al. Jun 2007 B2
D547154 Lee Jul 2007 S
7238184 Megerman et al. Jul 2007 B2
7241288 Braun Jul 2007 B2
7241296 Buysse et al. Jul 2007 B2
7244257 Podhajsky et al. Jul 2007 B2
7246734 Shelton, IV Jul 2007 B2
7248944 Green Jul 2007 B2
7252667 Moses et al. Aug 2007 B2
7254433 Diab et al. Aug 2007 B2
7255697 Dycus et al. Aug 2007 B2
7267677 Johnson et al. Sep 2007 B2
7270660 Ryan Sep 2007 B2
7270664 Johnson et al. Sep 2007 B2
7276068 Johnson et al. Oct 2007 B2
7288103 Suzuki Oct 2007 B2
7291161 Hooven Nov 2007 B2
7300435 Wham et al. Nov 2007 B2
7303557 Wham et al. Dec 2007 B2
7311709 Truckai et al. Dec 2007 B2
7314471 Holman Jan 2008 B2
7318823 Sharps et al. Jan 2008 B2
7326202 McGaffigan Feb 2008 B2
7329256 Johnson et al. Feb 2008 B2
7329257 Kanehira et al. Feb 2008 B2
D564662 Moses et al. Mar 2008 S
7338526 Steinberg Mar 2008 B2
7342754 Fitzgerald et al. Mar 2008 B2
7344268 Jigamian Mar 2008 B2
7347864 Vargas Mar 2008 B2
D567943 Moses et al. Apr 2008 S
7354440 Truckal et al. Apr 2008 B2
7367976 Lawes et al. May 2008 B2
7377920 Buysse et al. May 2008 B2
7384420 Dycus et al. Jun 2008 B2
7384421 Hushka Jun 2008 B2
7396265 Darley et al. Jul 2008 B2
7396336 Orszulak et al. Jul 2008 B2
7396356 Mollenauer Jul 2008 B2
D575395 Hushka Aug 2008 S
D575401 Hixson et al. Aug 2008 S
7422592 Morley et al. Sep 2008 B2
7425835 Eisele Sep 2008 B2
7431721 Paton et al. Oct 2008 B2
7435249 Buysse et al. Oct 2008 B2
7438714 Phan Oct 2008 B2
7442193 Shields et al. Oct 2008 B2
7442194 Dumbauld et al. Oct 2008 B2
7445621 Dumbauld et al. Nov 2008 B2
D582038 Swoyer et al. Dec 2008 S
7458972 Keppel Dec 2008 B2
7473253 Dycus et al. Jan 2009 B2
7481810 Dumbauld et al. Jan 2009 B2
7487780 Hooven Feb 2009 B2
7491201 Shields et al. Feb 2009 B2
7491202 Odom et al. Feb 2009 B2
7500975 Cunningham et al. Mar 2009 B2
7503474 Hillstead et al. Mar 2009 B2
7510556 Nguyen et al. Mar 2009 B2
7513898 Johnson et al. Apr 2009 B2
7517351 Culp et al. Apr 2009 B2
7540872 Schechter et al. Jun 2009 B2
7549995 Schultz Jun 2009 B2
7553312 Tetzlaff et al. Jun 2009 B2
7553686 George et al. Jun 2009 B2
7569626 Truckai Aug 2009 B2
7582087 Tetzlaff et al. Sep 2009 B2
7588565 Marchitto et al. Sep 2009 B2
7594313 Prakash et al. Sep 2009 B2
7594916 Weinberg Sep 2009 B2
7597693 Garrison Oct 2009 B2
7621910 Sugi Nov 2009 B2
7624186 Tanida Nov 2009 B2
7625370 Hart et al. Dec 2009 B2
7628791 Garrison et al. Dec 2009 B2
7628792 Guerra Dec 2009 B2
7637409 Marczyk Dec 2009 B2
7641653 Dalla Betta et al. Jan 2010 B2
7651493 Arts et al. Jan 2010 B2
7651494 McClurken et al. Jan 2010 B2
7655004 Long Feb 2010 B2
7655007 Baily Feb 2010 B2
7668597 Engmark et al. Feb 2010 B2
7678111 Mulier et al. Mar 2010 B2
7686804 Johnson et al. Mar 2010 B2
7686827 Hushka Mar 2010 B2
7708735 Chapman et al. May 2010 B2
7717115 Barrett et al. May 2010 B2
7717904 Suzuki et al. May 2010 B2
7717914 Kimura May 2010 B2
7717915 Miyazawa May 2010 B2
7722607 Dumbauld et al. May 2010 B2
D617900 Kingsley et al. Jun 2010 S
D617901 Unger et al. Jun 2010 S
D617902 Twomey et al. Jun 2010 S
D617903 Unger et al. Jun 2010 S
D618798 Olson et al. Jun 2010 S
7727231 Swanson Jun 2010 B2
7731717 Odom et al. Jun 2010 B2
7736374 Vaughan et al. Jun 2010 B2
7744615 Couture Jun 2010 B2
7749217 Podhajsky Jul 2010 B2
7753908 Swanson Jul 2010 B2
7753909 Chapman et al. Jul 2010 B2
D621503 Otten et al. Aug 2010 S
7766910 Hixson et al. Aug 2010 B2
7771425 Dycus et al. Aug 2010 B2
7776036 Schechter et al. Aug 2010 B2
7776037 Odom Aug 2010 B2
7780662 Bahney Aug 2010 B2
7780663 Yates et al. Aug 2010 B2
7789878 Dumbauld et al. Sep 2010 B2
7799026 Schechter et al. Sep 2010 B2
7799028 Schechter et al. Sep 2010 B2
7811283 Moses et al. Oct 2010 B2
7819872 Johnson et al. Oct 2010 B2
D627462 Kingsley Nov 2010 S
D628289 Romero Nov 2010 S
D628290 Romero Nov 2010 S
7828798 Buysse et al. Nov 2010 B2
7832408 Shelton, IV et al. Nov 2010 B2
7837685 Weinberg et al. Nov 2010 B2
7839674 Lowrey et al. Nov 2010 B2
7842033 Isaacson et al. Nov 2010 B2
7846158 Podhajsky Dec 2010 B2
7846161 Dumbauld et al. Dec 2010 B2
7857812 Dycus et al. Dec 2010 B2
D630324 Reschke Jan 2011 S
7877852 Unger et al. Feb 2011 B2
7877853 Unger Feb 2011 B2
7879035 Garrison et al. Feb 2011 B2
7887535 Lands et al. Feb 2011 B2
7887536 Johnson et al. Feb 2011 B2
7896878 Johnson et al. Mar 2011 B2
7898288 Wong Mar 2011 B2
7900805 Shelton, IV et al. Mar 2011 B2
7901400 Wham et al. Mar 2011 B2
7905380 Shelton, IV et al. Mar 2011 B2
7905881 Masuda et al. Mar 2011 B2
7909820 Lipson et al. Mar 2011 B2
7909823 Moses et al. Mar 2011 B2
7909824 Masuda et al. Mar 2011 B2
7918848 Lau et al. Apr 2011 B2
7922718 Moses et al. Apr 2011 B2
7922742 Hillstead et al. Apr 2011 B2
7922953 Guerra Apr 2011 B2
7931649 Couture et al. Apr 2011 B2
7935052 Dumbauld May 2011 B2
7945332 Schechter May 2011 B2
7947041 Tetzlaff et al. May 2011 B2
7949407 Kaplan et al. May 2011 B2
7951149 Carlton May 2011 B2
7951150 Johnson et al. May 2011 B2
7955326 Paul et al. Jun 2011 B2
7955327 Sartor et al. Jun 2011 B2
7955331 Truckai et al. Jun 2011 B2
7955332 Arts et al. Jun 2011 B2
7963965 Buysse et al. Jun 2011 B2
7967839 Flock et al. Jun 2011 B2
7972328 Wham et al. Jul 2011 B2
7972331 Hafner Jul 2011 B2
7976544 McClurken et al. Jul 2011 B2
7981113 Truckai et al. Jul 2011 B2
7988507 Darley et al. Aug 2011 B2
7998095 McAuley Aug 2011 B2
8012150 Wham et al. Sep 2011 B2
8016827 Chojin Sep 2011 B2
8034049 Odom et al. Oct 2011 B2
D649249 Guerra Nov 2011 S
D649643 Allen, IV et al. Nov 2011 S
8048074 Masuda Nov 2011 B2
8070746 Orton et al. Dec 2011 B2
8070748 Hixson et al. Dec 2011 B2
8075580 Makower Dec 2011 B2
8089417 Popovic et al. Jan 2012 B2
8092451 Schechter et al. Jan 2012 B2
8104956 Blaha Jan 2012 B2
8112871 Brandt et al. Feb 2012 B2
8114122 Nau, Jr. Feb 2012 B2
8123743 Arts et al. Feb 2012 B2
8128624 Couture et al. Mar 2012 B2
8128625 Odom Mar 2012 B2
8133224 Geiselhart Mar 2012 B2
8133254 Dumbauld et al. Mar 2012 B2
8147489 Moses et al. Apr 2012 B2
8469716 Fedotov et al. Jun 2013 B2
8568408 Townsend et al. Oct 2013 B2
8591510 Allen, IV et al. Nov 2013 B2
8628557 Collings et al. Jan 2014 B2
8679098 Hart Mar 2014 B2
8685009 Chernov et al. Apr 2014 B2
8685021 Chernov et al. Apr 2014 B2
8685056 Evans et al. Apr 2014 B2
8702737 Chojin et al. Apr 2014 B2
8702749 Twomey Apr 2014 B2
8745840 Hempstead et al. Jun 2014 B2
8747434 Larson et al. Jun 2014 B2
8756785 Allen, IV et al. Jun 2014 B2
8784418 Romero Jul 2014 B2
8840639 Gerhardt, Jr. et al. Sep 2014 B2
8845636 Allen, IV et al. Sep 2014 B2
8852185 Twomey Oct 2014 B2
8852228 Nau, Jr. Oct 2014 B2
8864753 Nau, Jr. et al. Oct 2014 B2
8864795 Kerr et al. Oct 2014 B2
8887373 Brandt et al. Nov 2014 B2
8888771 Twomey Nov 2014 B2
8898888 Brandt et al. Dec 2014 B2
8900232 Ourada Dec 2014 B2
8920421 Rupp Dec 2014 B2
8932293 Chernov et al. Jan 2015 B2
8936614 Allen, IV Jan 2015 B2
8939972 Twomey Jan 2015 B2
8945175 Twomey Feb 2015 B2
8961513 Allen, IV et al. Feb 2015 B2
8961515 Twomey et al. Feb 2015 B2
8968283 Kharin Mar 2015 B2
8968305 Dumbauld et al. Mar 2015 B2
8968306 Unger Mar 2015 B2
8968307 Evans et al. Mar 2015 B2
8968308 Horner et al. Mar 2015 B2
8968309 Roy et al. Mar 2015 B2
8968310 Twomey et al. Mar 2015 B2
8968316 Roy et al. Mar 2015 B2
8968317 Evans et al. Mar 2015 B2
8968360 Garrison et al. Mar 2015 B2
9011435 Brandt et al. Apr 2015 B2
9023035 Allen, IV et al. May 2015 B2
9028484 Craig May 2015 B2
9028492 Kerr et al. May 2015 B2
9039704 Joseph May 2015 B2
9039732 Sims et al. May 2015 B2
9060780 Twomey et al. Jun 2015 B2
9113882 Twomey et al. Aug 2015 B2
9113899 Garrison et al. Aug 2015 B2
9113909 Twomey et al. Aug 2015 B2
9113933 Chernova et al. Aug 2015 B2
9113934 Chernov et al. Aug 2015 B2
9113938 Kerr Aug 2015 B2
9113940 Twomey Aug 2015 B2
9161807 Garrison Oct 2015 B2
9259268 Behnke, II et al. Feb 2016 B2
9265552 Brandt et al. Feb 2016 B2
9265565 Kerr Feb 2016 B2
9265568 Chernov et al. Feb 2016 B2
9314295 Garrison Apr 2016 B2
9333002 Garrison May 2016 B2
9381059 Garrison Jul 2016 B2
9456870 Chernov et al. Oct 2016 B2
9486220 Twomey et al. Nov 2016 B2
9492221 Garrison Nov 2016 B2
9615877 Tyrrell et al. Apr 2017 B2
9636169 Allen, IV et al. May 2017 B2
9668806 Unger et al. Jun 2017 B2
9693816 Orszulak Jul 2017 B2
9750561 Brandt et al. Sep 2017 B2
20020107517 Witt et al. Aug 2002 A1
20020111624 Witt et al. Aug 2002 A1
20020165469 Murakami Nov 2002 A1
20030014052 Buysse et al. Jan 2003 A1
20030014053 Nguyen et al. Jan 2003 A1
20030018332 Schmaltz et al. Jan 2003 A1
20030069570 Witzel et al. Apr 2003 A1
20030109875 Tetzlaff et al. Jun 2003 A1
20030114851 Truckai et al. Jun 2003 A1
20030130653 Sixto et al. Jul 2003 A1
20030139741 Goble et al. Jul 2003 A1
20030158548 Phan et al. Aug 2003 A1
20030171747 Kanehira et al. Sep 2003 A1
20030181910 Dycus et al. Sep 2003 A1
20030191396 Sanghvi et al. Oct 2003 A1
20030216732 Truckai et al. Nov 2003 A1
20030229344 Dycus et al. Dec 2003 A1
20030236325 Bonora Dec 2003 A1
20040064151 Mollenauer Apr 2004 A1
20040073238 Makower Apr 2004 A1
20040073256 Marchitto et al. Apr 2004 A1
20040115296 Duffin Jun 2004 A1
20040176762 Lawes et al. Sep 2004 A1
20040176779 Casutt et al. Sep 2004 A1
20040199181 Knodel et al. Oct 2004 A1
20040224590 Rawa et al. Nov 2004 A1
20040236326 Schulze et al. Nov 2004 A1
20040249371 Dycus et al. Dec 2004 A1
20040249374 Tetzlaff et al. Dec 2004 A1
20040260281 Baxter et al. Dec 2004 A1
20050004564 Wham et al. Jan 2005 A1
20050004569 Witt et al. Jan 2005 A1
20050021025 Buysse et al. Jan 2005 A1
20050059858 Frith et al. Mar 2005 A1
20050059934 Wenchell et al. Mar 2005 A1
20050090817 Phan Apr 2005 A1
20050096645 Wellman et al. May 2005 A1
20050149017 Dycus Jul 2005 A1
20050254081 Ryu et al. Nov 2005 A1
20050283148 Janssen et al. Dec 2005 A1
20060052779 Hammill Mar 2006 A1
20060064086 Odom Mar 2006 A1
20060079933 Hushka et al. Apr 2006 A1
20060084973 Hushka Apr 2006 A1
20060111711 Goble May 2006 A1
20060173452 Buysse et al. Aug 2006 A1
20060190035 Hushka et al. Aug 2006 A1
20060217709 Couture et al. Sep 2006 A1
20060224053 Black et al. Oct 2006 A1
20060253126 Bjerken et al. Nov 2006 A1
20060259036 Tetzlaff et al. Nov 2006 A1
20060264922 Sartor et al. Nov 2006 A1
20060271030 Francis et al. Nov 2006 A1
20060271038 Johnson et al. Nov 2006 A1
20060287641 Perlin Dec 2006 A1
20070027447 Theroux et al. Feb 2007 A1
20070043337 McAuley Feb 2007 A1
20070043353 Dycus et al. Feb 2007 A1
20070062017 Dycus et al. Mar 2007 A1
20070118115 Artale et al. May 2007 A1
20070173811 Couture et al. Jul 2007 A1
20070173813 Odom Jul 2007 A1
20070198011 Sugita Aug 2007 A1
20070225695 Mayer et al. Sep 2007 A1
20070255279 Buysse et al. Nov 2007 A1
20070260238 Guerra Nov 2007 A1
20070260242 Dycus et al. Nov 2007 A1
20070265616 Couture et al. Nov 2007 A1
20070265620 Kraas et al. Nov 2007 A1
20080004616 Patrick Jan 2008 A1
20080015575 Odom et al. Jan 2008 A1
20080033428 Artale et al. Feb 2008 A1
20080039831 Odom et al. Feb 2008 A1
20080039835 Johnson et al. Feb 2008 A1
20080045947 Johnson et al. Feb 2008 A1
20080046122 Manzo et al. Feb 2008 A1
20080058802 Couture et al. Mar 2008 A1
20080082100 Orton et al. Apr 2008 A1
20080125767 Blaha May 2008 A1
20080125797 Kelleher May 2008 A1
20080171938 Masuda et al. Jul 2008 A1
20080172051 Masuda et al. Jul 2008 A1
20080195093 Couture et al. Aug 2008 A1
20080208289 Darley et al. Aug 2008 A1
20080215050 Bakos Sep 2008 A1
20080234701 Morales et al. Sep 2008 A1
20080243106 Coe et al. Oct 2008 A1
20080243120 Lawes et al. Oct 2008 A1
20080243158 Morgan Oct 2008 A1
20080249523 McPherson et al. Oct 2008 A1
20080249527 Couture Oct 2008 A1
20080271360 Barfield Nov 2008 A1
20080281311 Dunning et al. Nov 2008 A1
20080300580 Shelton, IV et al. Dec 2008 A1
20080312653 Arts et al. Dec 2008 A1
20080319292 Say et al. Dec 2008 A1
20080319442 Unger et al. Dec 2008 A1
20090012556 Boudreaux et al. Jan 2009 A1
20090015832 Popovic et al. Jan 2009 A1
20090024126 Artale et al. Jan 2009 A1
20090036881 Artale et al. Feb 2009 A1
20090036899 Carlton et al. Feb 2009 A1
20090043304 Tetzlaff et al. Feb 2009 A1
20090048596 Shields et al. Feb 2009 A1
20090054894 Yachi Feb 2009 A1
20090062794 Buysse et al. Mar 2009 A1
20090065565 Cao Mar 2009 A1
20090076506 Baker Mar 2009 A1
20090076534 Shelton, IV et al. Mar 2009 A1
20090082766 Unger et al. Mar 2009 A1
20090082767 Unger Mar 2009 A1
20090082769 Unger Mar 2009 A1
20090088738 Guerra et al. Apr 2009 A1
20090088739 Hushka et al. Apr 2009 A1
20090088740 Guerra et al. Apr 2009 A1
20090088741 Hushka et al. Apr 2009 A1
20090088744 Townsend Apr 2009 A1
20090088745 Hushka et al. Apr 2009 A1
20090088746 Hushka et al. Apr 2009 A1
20090088747 Hushka et al. Apr 2009 A1
20090088748 Guerra et al. Apr 2009 A1
20090088749 Hushka et al. Apr 2009 A1
20090088750 Hushka et al. Apr 2009 A1
20090105750 Price et al. Apr 2009 A1
20090112200 Eggers Apr 2009 A1
20090112206 Dumbauld et al. Apr 2009 A1
20090112229 Omori et al. Apr 2009 A1
20090131934 Odom et al. May 2009 A1
20090138006 Bales et al. May 2009 A1
20090149853 Shields et al. Jun 2009 A1
20090149854 Cunningham et al. Jun 2009 A1
20090157071 Wham et al. Jun 2009 A1
20090157072 Wham et al. Jun 2009 A1
20090157075 Wham et al. Jun 2009 A1
20090171350 Dycus et al. Jul 2009 A1
20090171354 Deville et al. Jul 2009 A1
20090177094 Brown et al. Jul 2009 A1
20090182327 Unger Jul 2009 A1
20090182329 Dycus Jul 2009 A1
20090187188 Guerra et al. Jul 2009 A1
20090198233 Chojin Aug 2009 A1
20090204114 Odom Aug 2009 A1
20090204137 Maxwell Aug 2009 A1
20090206126 Huitema et al. Aug 2009 A1
20090209957 Schmaltz et al. Aug 2009 A1
20090209960 Chojin Aug 2009 A1
20090234354 Johnson et al. Sep 2009 A1
20090248007 Falkenstein et al. Oct 2009 A1
20090248013 Falkenstein et al. Oct 2009 A1
20090248019 Falkenstein et al. Oct 2009 A1
20090248020 Falkenstein et al. Oct 2009 A1
20090248021 McKenna Oct 2009 A1
20090248022 Falkenstein et al. Oct 2009 A1
20090248050 Hirai Oct 2009 A1
20090248051 Masuda Oct 2009 A1
20090254080 Honda Oct 2009 A1
20090254081 Allison et al. Oct 2009 A1
20090261804 McKenna et al. Oct 2009 A1
20090270771 Takahashi Oct 2009 A1
20090292282 Dycus Nov 2009 A9
20090318912 Mayer et al. Dec 2009 A1
20100016857 McKenna et al. Jan 2010 A1
20100023009 Moses et al. Jan 2010 A1
20100030028 Cabrera et al. Feb 2010 A1
20100036375 Regadas Feb 2010 A1
20100042140 Cunningham Feb 2010 A1
20100042142 Cunningham Feb 2010 A1
20100042143 Cunningham Feb 2010 A1
20100049187 Carlton et al. Feb 2010 A1
20100049194 Hart et al. Feb 2010 A1
20100057078 Arts et al. Mar 2010 A1
20100057081 Hanna Mar 2010 A1
20100057082 Hanna Mar 2010 A1
20100057083 Hanna Mar 2010 A1
20100057084 Hanna Mar 2010 A1
20100063500 Muszala Mar 2010 A1
20100069903 Allen, IV et al. Mar 2010 A1
20100069904 Cunningham Mar 2010 A1
20100069953 Cunningham et al. Mar 2010 A1
20100076427 Heard Mar 2010 A1
20100076430 Romero Mar 2010 A1
20100076431 Allen, IV Mar 2010 A1
20100076432 Horner Mar 2010 A1
20100087816 Roy Apr 2010 A1
20100087818 Cunningham Apr 2010 A1
20100094271 Ward et al. Apr 2010 A1
20100094286 Chojin Apr 2010 A1
20100094287 Cunningham et al. Apr 2010 A1
20100094289 Taylor et al. Apr 2010 A1
20100100122 Hinton Apr 2010 A1
20100130971 Baily May 2010 A1
20100130977 Garrison et al. May 2010 A1
20100145334 Olson et al. Jun 2010 A1
20100179539 Nau, Jr. Jul 2010 A1
20100179543 Johnson et al. Jul 2010 A1
20100179545 Twomey et al. Jul 2010 A1
20100179546 Cunningham Jul 2010 A1
20100179547 Cunningham et al. Jul 2010 A1
20100198215 Julian et al. Aug 2010 A1
20100198218 Manzo Aug 2010 A1
20100198248 Vakharia Aug 2010 A1
20100204697 Dumbauld et al. Aug 2010 A1
20100204698 Chapman et al. Aug 2010 A1
20100217258 Floume et al. Aug 2010 A1
20100217264 Odom et al. Aug 2010 A1
20100228249 Mohr et al. Sep 2010 A1
20100228250 Brogna Sep 2010 A1
20100249769 Nau, Jr. et al. Sep 2010 A1
20100249776 Kerr Sep 2010 A1
20100256635 McKenna et al. Oct 2010 A1
20100274160 Yachi et al. Oct 2010 A1
20100274244 Heard Oct 2010 A1
20100274265 Wingardner et al. Oct 2010 A1
20100280511 Rachlin et al. Nov 2010 A1
20100280515 Hixson et al. Nov 2010 A1
20100286691 Kerr et al. Nov 2010 A1
20100292691 Brogna Nov 2010 A1
20100307934 Chowaniec et al. Dec 2010 A1
20100312235 Bahney Dec 2010 A1
20100312238 Schechter et al. Dec 2010 A1
20100312242 Odom Dec 2010 A1
20100331742 Masuda Dec 2010 A1
20100331839 Schechter et al. Dec 2010 A1
20110004209 Lawes et al. Jan 2011 A1
20110004210 Johnson et al. Jan 2011 A1
20110009864 Bucciaglia et al. Jan 2011 A1
20110015632 Artale Jan 2011 A1
20110018164 Sartor et al. Jan 2011 A1
20110034918 Reschke Feb 2011 A1
20110036183 Artale et al. Feb 2011 A1
20110046623 Reschke Feb 2011 A1
20110054467 Mueller et al. Mar 2011 A1
20110054468 Dycus Mar 2011 A1
20110054469 Kappus et al. Mar 2011 A1
20110054471 Gerhardt et al. Mar 2011 A1
20110054472 Romero Mar 2011 A1
20110060333 Mueller Mar 2011 A1
20110060334 Brandt et al. Mar 2011 A1
20110060335 Harper et al. Mar 2011 A1
20110060356 Reschke et al. Mar 2011 A1
20110066174 Gilbert Mar 2011 A1
20110071522 Dumbauld et al. Mar 2011 A1
20110071523 Dickhans Mar 2011 A1
20110071525 Dumbauld et al. Mar 2011 A1
20110072638 Brandt et al. Mar 2011 A1
20110073246 Brandt et al. Mar 2011 A1
20110073594 Bonn Mar 2011 A1
20110077648 Lee et al. Mar 2011 A1
20110077649 Kingsley Mar 2011 A1
20110082457 Kerr et al. Apr 2011 A1
20110082494 Kerr et al. Apr 2011 A1
20110087221 Siebrecht et al. Apr 2011 A1
20110098689 Nau, Jr. et al. Apr 2011 A1
20110106079 Garrison et al. May 2011 A1
20110118736 Harper et al. May 2011 A1
20110162796 Guerra Jul 2011 A1
20110178519 Couture et al. Jul 2011 A1
20110184405 Mueller Jul 2011 A1
20110190653 Harper et al. Aug 2011 A1
20110190765 Chojin Aug 2011 A1
20110193608 Krapohl Aug 2011 A1
20110218530 Reschke Sep 2011 A1
20110230880 Chojin et al. Sep 2011 A1
20110238066 Olson Sep 2011 A1
20110238067 Moses et al. Sep 2011 A1
20110251605 Hoarau et al. Oct 2011 A1
20110251606 Kerr Oct 2011 A1
20110251611 Horner et al. Oct 2011 A1
20110270245 Horner et al. Nov 2011 A1
20110270250 Horner et al. Nov 2011 A1
20110270251 Horner et al. Nov 2011 A1
20110270252 Horner et al. Nov 2011 A1
20110276048 Kerr et al. Nov 2011 A1
20110276049 Gerhardt Nov 2011 A1
20110295251 Garrison Dec 2011 A1
20110295313 Kerr Dec 2011 A1
20110301592 Kerr et al. Dec 2011 A1
20110301599 Roy et al. Dec 2011 A1
20110301600 Garrison et al. Dec 2011 A1
20110301601 Garrison et al. Dec 2011 A1
20110301602 Roy et al. Dec 2011 A1
20110301603 Kerr et al. Dec 2011 A1
20110301604 Horner et al. Dec 2011 A1
20110301605 Horner Dec 2011 A1
20110301606 Kerr Dec 2011 A1
20110301637 Kerr et al. Dec 2011 A1
20110319886 Chojin et al. Dec 2011 A1
20110319888 Mueller et al. Dec 2011 A1
20120004658 Chojin Jan 2012 A1
20120010614 Couture Jan 2012 A1
20120022532 Garrison Jan 2012 A1
20120029515 Couture Feb 2012 A1
20120041438 Nau, Jr. et al. Feb 2012 A1
20120046659 Mueller Feb 2012 A1
20120046660 Nau, Jr. Feb 2012 A1
20120046662 Gilbert Feb 2012 A1
20120059371 Anderson et al. Mar 2012 A1
20120059372 Johnson Mar 2012 A1
20120059374 Johnson et al. Mar 2012 A1
20120059375 Couture et al. Mar 2012 A1
20120059408 Mueller Mar 2012 A1
20120059409 Reschke et al. Mar 2012 A1
20120078250 Orton et al. Mar 2012 A1
20120083785 Roy et al. Apr 2012 A1
20120083786 Artale et al. Apr 2012 A1
20120083827 Artale et al. Apr 2012 A1
20120095456 Schechter et al. Apr 2012 A1
20120095460 Rooks et al. Apr 2012 A1
20120123404 Craig May 2012 A1
20120172868 Twomey et al. Jul 2012 A1
20120209263 Sharp et al. Aug 2012 A1
20120239034 Horner et al. Sep 2012 A1
20120265241 Hart et al. Oct 2012 A1
20120296205 Chernov et al. Nov 2012 A1
20120296238 Chernov et al. Nov 2012 A1
20120330308 Joseph Dec 2012 A1
20130018364 Chernov et al. Jan 2013 A1
20130022495 Allen, IV et al. Jan 2013 A1
20130071282 Fry Mar 2013 A1
20130079774 Whitney et al. Mar 2013 A1
Foreign Referenced Citations (219)
Number Date Country
518230 Dec 1992 EP
0306123 Aug 1993 EP
0572131 Dec 1993 EP
584787 Mar 1994 EP
0589555 Mar 1994 EP
0589453 Apr 1994 EP
0648475 Apr 1995 EP
0624348 Jun 1995 EP
0517243 Sep 1997 EP
0541930 Mar 1998 EP
853922 Jul 1998 EP
878169 Nov 1998 EP
0623316 Mar 1999 EP
0650701 Mar 1999 EP
0923907 Jun 1999 EP
0640317 Sep 1999 EP
0950378 Oct 1999 EP
0986990 Mar 2000 EP
1034747 Sep 2000 EP
1034748 Sep 2000 EP
0694290 Nov 2000 EP
1050278 Nov 2000 EP
1053719 Nov 2000 EP
1053720 Nov 2000 EP
1055399 Nov 2000 EP
1055400 Nov 2000 EP
1080694 Mar 2001 EP
1082944 Mar 2001 EP
1177771 Feb 2002 EP
1186274 Mar 2002 EP
1201192 May 2002 EP
1278007 Jan 2003 EP
0717966 Apr 2003 EP
1301135 Apr 2003 EP
0887046 Jul 2003 EP
1330991 Jul 2003 EP
0913126 Oct 2004 EP
1472984 Nov 2004 EP
0754437 Dec 2004 EP
0888747 Dec 2004 EP
1025807 Dec 2004 EP
1486177 Dec 2004 EP
0774232 Jan 2005 EP
1527744 May 2005 EP
1527747 May 2005 EP
1530952 May 2005 EP
1532932 May 2005 EP
1535581 Jun 2005 EP
1545360 Jun 2005 EP
1609430 Dec 2005 EP
1034746 Mar 2006 EP
1628586 Mar 2006 EP
1632192 Mar 2006 EP
1642543 Apr 2006 EP
1645238 Apr 2006 EP
1645240 Apr 2006 EP
1649821 Apr 2006 EP
0875209 May 2006 EP
1683496 Jul 2006 EP
1707143 Oct 2006 EP
1767163 Mar 2007 EP
1769765 Apr 2007 EP
1769766 Apr 2007 EP
1772109 Apr 2007 EP
1785097 May 2007 EP
1785098 May 2007 EP
1785101 May 2007 EP
1787597 May 2007 EP
1810625 Jul 2007 EP
1810628 Jul 2007 EP
1842500 Oct 2007 EP
1878400 Jan 2008 EP
1894535 Mar 2008 EP
1920725 May 2008 EP
1929970 Jun 2008 EP
1946715 Jul 2008 EP
1958583 Aug 2008 EP
1990019 Nov 2008 EP
1997438 Dec 2008 EP
1997439 Dec 2008 EP
2103268 Sep 2009 EP
2105104 Sep 2009 EP
2147649 Jan 2010 EP
2153791 Feb 2010 EP
2206474 Jul 2010 EP
2243439 Oct 2010 EP
2294998 Mar 2011 EP
2301467 Mar 2011 EP
1024051 Jan 1989 JP
6502328 Mar 1992 JP
6121797 May 1994 JP
6285078 Oct 1994 JP
6511401 Dec 1994 JP
856955 May 1996 JP
8289895 Nov 1996 JP
8317934 Dec 1996 JP
8317936 Dec 1996 JP
910223 Jan 1997 JP
9122138 May 1997 JP
10155798 Jun 1998 JP
1147150 Feb 1999 JP
11070124 Mar 1999 JP
11169381 Jun 1999 JP
11192238 Jul 1999 JP
2000102545 Apr 2000 JP
20018944 Jan 2001 JP
200129356 Feb 2001 JP
2001190564 Jul 2001 JP
20013400 Nov 2001 JP
2002528166 Sep 2002 JP
2003245285 Sep 2003 JP
2004517668 Jun 2004 JP
2004528869 Sep 2004 JP
2011125195 Jun 2011 JP
0006030945 Nov 2016 JP
8900757 Jan 1989 WO
9204873 Apr 1992 WO
9206642 Apr 1992 WO
9319681 Oct 1993 WO
9321845 Nov 1993 WO
9400059 Jan 1994 WO
9408524 Apr 1994 WO
9420025 Sep 1994 WO
9502369 Jan 1995 WO
9507662 Mar 1995 WO
9515124 Jun 1995 WO
9520360 Aug 1995 WO
9520921 Aug 1995 WO
9605776 Feb 1996 WO
96011635 Apr 1996 WO
9613218 May 1996 WO
9622056 Jul 1996 WO
9700646 Jan 1997 WO
9700647 Jan 1997 WO
9710764 Mar 1997 WO
9718768 May 1997 WO
9724073 Jul 1997 WO
9724993 Jul 1997 WO
9814124 Apr 1998 WO
9827880 Jul 1998 WO
9831290 Jul 1998 WO
9843264 Oct 1998 WO
9903407 Jan 1999 WO
9903408 Jan 1999 WO
9903409 Jan 1999 WO
9903414 Jan 1999 WO
9912488 Mar 1999 WO
9923933 May 1999 WO
9923959 May 1999 WO
9925261 May 1999 WO
9940857 Aug 1999 WO
99040861 Aug 1999 WO
9951158 Oct 1999 WO
9966850 Dec 1999 WO
0024322 May 2000 WO
0024330 May 2000 WO
0024331 May 2000 WO
0033753 Jun 2000 WO
0036986 Jun 2000 WO
0041638 Jul 2000 WO
0047124 Aug 2000 WO
0053112 Sep 2000 WO
0059392 Oct 2000 WO
0101847 Jan 2001 WO
0115614 Mar 2001 WO
0117448 Mar 2001 WO
0154604 Aug 2001 WO
0166025 Sep 2001 WO
0207627 Jan 2002 WO
02058544 Aug 2002 WO
02067798 Sep 2002 WO
02080783 Oct 2002 WO
02080784 Oct 2002 WO
02080785 Oct 2002 WO
02080786 Oct 2002 WO
02080793 Oct 2002 WO
02080794 Oct 2002 WO
02080795 Oct 2002 WO
02080796 Oct 2002 WO
02080797 Oct 2002 WO
02080798 Oct 2002 WO
02080799 Oct 2002 WO
02081170 Oct 2002 WO
02085218 Oct 2002 WO
03061500 Jul 2003 WO
03068046 Aug 2003 WO
03096880 Nov 2003 WO
2003090630 Nov 2003 WO
03101311 Dec 2003 WO
2004-028585 Apr 2004 WO
2004032777 Apr 2004 WO
2004032776 Apr 2004 WO
2004052221 Jun 2004 WO
2004073490 Sep 2004 WO
2004073488 Sep 2004 WO
2004073753 Sep 2004 WO
2004082495 Sep 2004 WO
2004098383 Nov 2004 WO
2004103156 Dec 2004 WO
2005004734 Jan 2005 WO
2005004735 Jan 2005 WO
2005009255 Feb 2005 WO
2005011049 Feb 2005 WO
2005030071 Apr 2005 WO
2005048809 Jun 2005 WO
2005050151 Jun 2005 WO
2006021269 Mar 2006 WO
05110264 Apr 2006 WO
2008008457 Jan 2008 WO
2008040483 Apr 2008 WO
2008045348 Apr 2008 WO
2008045350 Apr 2008 WO
20080112147 Sep 2008 WO
20090005850 Jan 2009 WO
2009032623 Mar 2009 WO
2009039179 Mar 2009 WO
20090039510 Mar 2009 WO
2009124097 Oct 2009 WO
2010104753 Sep 2010 WO
Non-Patent Literature Citations (181)
Entry
E. David Crawford “Use of a Novel Vessel Sealing Technology in Management of the Dorsal Veinous Complex” Sales/ Product Literature 2000.
Jarrett et al., “Use of the LigaSure Vessel Sealing System for Peri-Hilar Vessels in Laparoscopic Nephrectomy” Sales/ Product Literature 2000.
Crouch et al. “A Velocity-Dependent Model for Needle Insertion in Soft Tissue” MICCAI 2005; LNCS 3750 pp. 624-632, Dated: 2005.
McLellan et al. “Vessel Sealing for Hemostasis During Pelvic Surgery” Int'l Federation of Gynecology and Obstetrics FIGO World Congress 2000, Washington, D.C.
McLellan et al. “Vessel Sealing for Hemostasis During Gynecologic Surgery” Sales/Product Literature 1999.
Int'l Search Report EP 98944778.4 dated Oct. 31, 2000.
Int'l Search Report EP 98957771 dated Aug. 9, 2001.
Int'l Search Report EP 98958575.7 dated Sep. 20, 2002.
Int'l Search Report EP 04013772.1 dated Apr. 1, 2005.
Int'l Search Report EP 04027314.6 dated Mar. 10, 2005.
Int'l Search Report EP 04027479.7 dated Mar. 8, 2005.
Int'l Search Report EP 04027705.5 dated Feb. 3, 2005.
Int'l Search Report EP 04752343.6 dated Jul. 20, 2007.
Int'l Search Report EP 05002671.5 dated Dec. 22, 2008.
Int'l Search Report EP 05002674.9 dated Jan. 16, 2009.
Int'l Search Report EP 05013463.4 dated Oct. 7, 2005.
Int'l Search Report EP 05013895.7 dated Oct. 21, 2005.
Int'l Search Report EP 05016399.7 dated Jan. 13, 2006.
Int'l Search Report EP 05017281.6 dated Nov. 24, 2005.
Int'l Search Report EP 05019130.3 dated Oct. 27, 2005.
Int'l Search Report EP 05019429.9 dated May 6, 2008.
Int'l Search Report EP 05020665.5 dated Feb. 27, 2006.
Int'l Search Report EP 05020666.3 dated Feb. 27, 2006.
Int'l Search Report EP 05021197.8 dated Feb. 20, 2006.
Int'l Search Report EP 05021779.3 dated Feb. 2, 2006.
Int'l Search Report EP 05021780.1 dated Feb. 23, 2006.
Int'l Search Report EP 05021937.7 dated Jan. 23, 2006.
Int'l Search Report—extended—EP 05021937.7 dated Mar. 15, 2006.
Int'l Search Report EP 05023017.6 dated Feb. 24, 2006.
Int'l Search Report EP 06002279.5 dated Mar. 30, 2006.
Int'l Search Report EP 06005185.1 dated May 10, 2006.
Int'l Search Report EP 06006716.2 dated Aug. 4, 2006.
Int'l Search Report EP 06008515.6 dated Jan. 8, 2009.
Int'l Search Report EP 06008779.8 dated Jul. 13, 2006.
Int'l Search Report EP 06014461.5 dated Oct. 31, 2006.
Int'l Search Report EP 06020574.7 dated Oct. 2, 2007.
Int'l Search Report EP 06020583.8 dated Feb. 7, 2007.
Int'l Search Report EP 06020584.6 dated Feb. 1, 2007.
Int'l Search Report EP 06020756.0 dated Feb. 16, 2007.
Int'l Search Report EP 06 024122.1 dated Apr. 16, 2007.
Int'l Search Report EP 06024123.9 dated Mar. 6, 2007.
Int'l Search Report EP 07 001480.8 dated Apr. 19, 2007.
Int'l Search Report EP 07 001488.1 dated Jun. 5, 2007.
Int'l Search Report EP 07 009026.1 dated Oct. 8, 2007.
Int'l Search Report Extended—EP 07 009029.5 dated Jul. 20, 2007.
Int'l Search Report EP 07 009321.6 dated Aug. 28, 2007.
Int'l Search Report EP 07 010672.9 dated Oct. 16, 2007.
Int'l Search Report EP 07 013779.9 dated Oct. 26, 2007.
Int'l Search Report EP 07 014016 dated Jan. 28, 2008.
Int'l Search Report EP 07 015191.5 dated Jan. 23, 2008.
U.S. Appl. No. 15/049,632, filed Feb. 22, 2016, Patented, U.S. Pat. No. 9,750,561.
U.S. Appl. No. 14/557,767, filed Dec. 2, 2014, Patented, U.S. Pat. No. 9,265,552.
U.S. Appl. No. 13/358,657, filed Jan. 26, 2012, Patented, U.S. Pat. No. 8,898,888.
U.S. Appl. No. 12/568,282, filed Sep. 28, 2009, Patented, U.S. Pat. No. 8,112,871.
Tinkcler L.F., “Combined Diathermy and Suction Forceps”, Feb. 6, 1967 (Feb. 6, 1965), British Medical Journal Feb. 6, 1976, vol. 1, nr. 5431 p. 361, ISSN: 0007-1447.
Burdette et al. “In Vivo Probe Measurement Technique for Determining Dielectric Properties at VHF Through Microwave Frequencies”, IEEE Transactions on Microwave Theory and Techniques, vol. MTT-28, No. 4, Apr. 1980 pp. 414-427.
LigaSure Vessel Sealing System, the Seal of Confidence in General, Gynecologic, Urologic, and Laparaoscopic Surgery; Sales/Product Literature; Apr. 2002.
Benaron et al., “Optical Time-Of-Flight and Absorbance Imaging of Biologic Media”, Science, American Association for the Advancement of Science, Washington, DC, vol. 259, Mar. 5, 1993, pp. 1463-1466.
Int'l Search Report EP 98957773 dated Aug. 1, 2001.
Int'l Search Report EP 04709033.7 dated Dec. 8, 2010.
Int'l Search Report EP 05013894 dated Feb. 3, 2006.
Int'l Search Report EP 05020532 dated Jan. 10, 2006.
Int'l Search Report EP 07 004429.2 dated Nov. 2, 2010.
Int'l Search Report EP 07 016911 dated May 28, 2010.
Int'l Search Report EP 07 016911.5 extended dated Mar. 2, 2011.
Int'l Search Report EP 07 021646.0 dated Mar. 20, 2008.
Int'l Search Report EP 08 020807.7 dated Apr. 24, 2009.
Int'l Search Report PCT/US08/61498 dated Sep. 22, 2008.
Int'l Search Report PCT/US09/032690 dated Jun. 16, 2009.
U.S. Appl. No. 08/926,869, filed Sep. 10, 1997, James G. Chandler.
U.S. Appl. No. 09/177,950, filed Oct. 23, 1998, Randel A. Frazier.
U.S. Appl. No. 09/387,883, filed Sep. 1, 1999, Dale F. Schmaltz.
U.S. Appl. No. 09/591,328, filed Jun. 9, 2000, Thomas P. Ryan.
Int'l Search Report EP 11 180182.5 dated Nov. 15, 2011.
Int'l Search Report PCT/US03/08146 dated Aug. 8, 2003.
Int'l Search Report PCT/US03/18674 dated Sep. 18, 2003.
Int'l Search Report PCT/US03/18676 dated Sep. 19, 2003.
Int'l Search Report PCT/US03/28539 dated Jan. 6, 2004.
Int'l Search Report PCT/USO4/03436 dated Mar. 3, 2005.
Int'l Search Report PCT/USO4/13273 dated Dec. 15, 2004.
Int'l Search Report PCT/US08/52460 dated Apr. 24, 2008.
Koyle et al., “Laparoscopic Palomo Varicocele Ligation in Children and Adolescents” Pediatric Endosurgery & Innovative Techniques, vol. 6, No. 1, 2002.
W. Scott Helton, “LigaSure Vessel Sealing System: Revolutionary Hemostasis Product for General Surgery”; Sales/ Product Literature 1999.
LigaSure Vessel Sealing System, the Seal of Confidence in General, Gynecologic, Urologic, and Laparabscopic Surgery; Sales/Product Literature; Apr. 2002.
Joseph Ortenberg “LigaSure System Used in Laparoscopic 1st and 2nd Stage Orchiopexy” Innovations That Work, Nov. 2002.
Sigel et al. “The Mechanism of Blood Vessel Closure by High Frequency Electrocoagulation” Surgery Gynecology & Obstetrics, Oct. 1965 pp. 823-831.
Sampayan et al, “Multilayer Ultra-High Gradient Insulator Technology” Discharges and Electrical Insulation in Vacuum, 1998. Netherlands Aug. 17-21, 1998; vol. 2, pp. 740-743.
Paul G. Horgan, “A Novel Technique for Parenchymal Division During Hepatectomy” The American Journal of Surgery, vol. 181, No. 3, Apr. 2001 pp. 236-237.
Olsson et al. “Radical Cystectomy in Females” Current Surgical Techniques in Urology, vol. 14, Issue 3, 2001.
Palazzo et al. “Randomized clinical trial of Ligasure versus open haemorrhoidectomy” British Journal of Surgery 2002, 89, 154-157.
Levy et al. “Randomized Trial of Suture Versus Electrosurgical Bipolar Vessel Sealing in Vaginal Hysterectomy” Obstetrics & Gynecology, vol. 102, No. 1, Jul. 2003.
“Reducing Needlestick Injuries in the Operating Room” Sales/Product Literature 2001.
Bergdahl et al. “Studies on Coagulation and the Development of an Automatic Computerized Bipolar Coagulator” J. Neurosurg, vol. 75, Jul. 1991, pp. 148-151.
Strasberg et al. “A Phase I Study of the LigaSure Vessel Sealing System in Hepatic Surgery” Section of HPB Surger, Washington University School of Medicine, St. Louis MO, Presented at AHPBA, Feb. 2001.
Sayfan et al. “Sutureless Closed Hemorrhoidectomy: A New Technique” Annals of Surgery vol. 234 No. 1 Jul. 2001; pp. 21-24.
Levy et al., “Update on Hysterectomy—New Technologies and Techniques” OBG Management, Feb. 2003.
Dulemba et al. “Use of a Bipolar Electrothermal Vessel Sealer in Laparoscopically Assisted Vaginal Hysterectomy” Sales/Product Literature; Jan. 2004.
Strasberg et al., “Use of a Bipolar Vessel-Sealing Device for Parenchymal Transection During Liver Surgery” Journal of Gastrointestinal Surgery, vol. 6, No. 4, Jul./Aug. 2002 pp. 569-574.
Sengupta et al., “Use of a Computer-Controlled Bipolar Diathermy System in Radical Prostatectomies and Other Open Urological Surgery” ANZ Journal of Surgery (2001) 71.9 pp. 538-540.
Rothenberg et al. “Use of the LigaSure Vessel Sealing System in Minimally Invasive Surgery in Children” Int'l Pediatric Endosurgery Group (IPEG) 2000.
Crawford et al. “Use of the LigaSure Vessel Sealing System in Urologic Cancer Surge” Grand Rounds in Urology 1999 vol. 1 Issue 4 pp. 10-17.
Craig Johnson, “Use of the LigaSure Vessel Sealing System in Bloodless Hemorrhoidectomy” Innovations That Work, Mar. 2000.
Levy et al. “Use of a New Energy-based Vessel Ligation Device During Vaginal Hysterectomy” Int'l Federation of Gynecology and Obstetrics (FIGO) World Congress 1999.
Barbara Levy, “Use of a New Vessel Ligation Device During Vaginal Hysterectomy” FIGO 2000, Washington, D.C.
Int'l Search Report EP 07 015601.3. dated Jan. 4, 2008.
Int'l Search Report EP 07 020283.3 dated Feb. 5, 2008.
Int'l Search Report EP 07 021646.0 dated Jul. 9, 2008.
Int'l Search Report EP 07 021647.8 dated May 2, 2008.
Int'l Search Report EP 08 002692.5 dated Dec. 12, 2008.
Int'l Search Report EP 08 004655.0 dated Jun. 24, 2008.
Int'l Search Report EP 08 006732.5.dated Jul. 29, 2008.
Int'l Search Report EP 08 006917.2 dated Jul. 3, 2008.
Int'l Search Report EP 08 016539.2 dated Jan. 8, 2009.
Int'l Search Report EP 09 152267.2 dated Jun. 15, 2009.
Int'l Search Report EP 09 152898.4 dated Jun. 10, 2009.
Int'l Search Report PCT/US98/18640 dated Jan. 29, 1999.
Int'l Search Report PCT/US98/23950 dated Jan. 14, 1999.
Int'l Search Report PCT/US98/24281 dated Feb. 22, 1999.
Int'l Search Report PCT/US99/24869 dated Feb. 3, 2000.
Int'l Search Report PCT/US01/11218 dated Aug. 14, 2001.
Int'l Search Report PCT/US01/11224 dated Nov. 13, 2001.
Int'l Search Report PCT/US01/11340 dated Aug. 16, 2001.
Int'l Search Report PCT/US01/11420 dated Oct. 16, 2001.
Int'l Search Report PCT/US02/01890 dated Jul. 25, 2002.
Int'l Search Report PCT/US02/11100 dated Jul. 16, 2002.
Int'l Search Report PCT/US03/28534 dated Dec. 19, 2003.
Int'l Search Report PCT/US04/03436 dated Mar. 3, 2005.
Int'l Search Report PCT/US04/13273 dated Dec. 15, 2004.
Int'l Search Report PCT/US04/15311 dated Jan. 12, 2005.
Int'l Search Report PCT/US07/021438 dated Apr. 1, 2008.
Int'l Search Report PCT/US07/021440 dated Apr. 8, 2008.
Int'l Search Report EP 09 003677.3 dated May 4, 2009.
Int'l Search Report EP 09 003813.4 dated Aug. 3, 2009.
Int'l Search Report EP 09 004491.8 dated Sep. 9, 2009.
Int'l Search Report EP 09 005051.9 dated Jul. 6, 2009.
Int'l Search Report EP 09 005575.7 dated Sep. 9, 2009.
Int'l Search Report EP 09 010521.4 dated Dec. 16, 2009.
Int'l Search Report EP 09 011745.8 dated Jan. 5, 2010.
Int'l Search Report EP 09 012629.3 dated Dec. 8, 2009.
Int'l Search Report EP 09 012687.1 dated Dec. 23, 2009.
Int'l Search Report EP 09 012688.9 dated Dec. 28, 2009.
Int'l Search Report EP 09 154850.3 dated Jul. 20, 2009.
Int'l Search Report EP 09 160476.9 dated Aug. 4, 2009.
Int'l Search Report EP 09 164903.8 dated Aug. 21, 2009.
Int'l Search Report EP 09 165753.6 dated Nov. 11, 2009.
Int'l Search Report EP 09 168153.6 dated Jan. 14, 2010.
Int'l Search Report EP 09 168810.1 dated Feb. 2, 2010.
Int'l Search Report EP 09 172749.5 dated Dec. 4, 2009.
Int'l Search Report EP 10 000259.1 dated Jun. 30, 2010.
Int'l Search Report EP 10 011750.6 dated Feb. 1, 2011.
Int'l Search Report EP 10 157500.9 dated Jul. 30, 2010.
Int'l Search Report EP 10 159205.3 dated Jul. 7, 2010.
Int'l Search Report EP 10 160870.1 dated Aug. 9, 2010.
Int'l Search Report EP 10 161596.1 dated Jul. 28, 2010.
Int'l Search Report EP 10 167655.9 dated Aug. 31, 2011.
Int'l Search Report EP 10 168705.1 dated Oct. 4, 2010.
Int'l Search Report EP 10 169647.4 dated Oct. 29, 2010.
Int'l Search Report EP 10 172005.0 dated Sep. 30, 2010.
Int'l Search Report EP 10 175956.1 dated Nov. 12, 2010.
Int'l Search Report EP 10 181034.9 dated Jan. 26, 2011.
Int'l Search Report EP 10 181575.1 dated Apr. 5, 2011.
Int'l Search Report EP 10 181969.6 dated Feb. 4, 2011.
Int'l Search Report EP 10 182019 dated Aug. 4, 2011.
Int'l Search Report EP 10 182022.3 dated Mar. 11, 2011.
Int'l Search Report EP 10 185386.9 dated Jan. 10, 2011.
Int'l Search Report EP 10 185405.7 dated Jan. 5, 2011.
Int'l Search Report EP 10 186527.7 dated Jun. 17, 2011.
Int'l Search Report EP 10 189206.5 dated Mar. 17, 2011.
Int'l Search Report EP 10 191320.0 dated Feb. 15, 2011.
Int'l Search Report EP 11 151509.4 dated Jun. 6, 2011.
Int'l Search Report EP 11 152220.7 dated May 19, 2011.
Int'l Search Report EP 11 152360.1 dated Jun. 6, 2011.
Int'l Search Report EP 11 159771.2 dated May 28, 2010.
Int'l Search Report EP 11 161117.4 dated Jun. 30, 2011.
Int'l Search Report EP 11 161118.2 dated Oct. 12, 2011.
Int'l Search Report EP 11 164274.0 dated Aug. 3, 2011.
Int'l Search Report EP 11 164275.7 dated Aug. 25, 2011.
Int'l Search Report EP 11 167437.0 dated Aug. 8, 2011.
Int'l Search Report EP 11 168458.5 dated Jul. 29, 2011.
Int'l Search Report EP 11 173008.1 dated Nov. 4, 2011.
Int'l Search Report EP 11 179514 dated Nov. 4, 2011.
Related Publications (1)
Number Date Country
20170354459 A1 Dec 2017 US
Divisions (1)
Number Date Country
Parent 12568282 Sep 2009 US
Child 13358657 US
Continuations (3)
Number Date Country
Parent 15049632 Feb 2016 US
Child 15689808 US
Parent 14557767 Dec 2014 US
Child 15049632 US
Parent 13358657 Jan 2012 US
Child 14557767 US