Stine et al., Rapid Characterization and Modeling of Pattern-Dependent Variation in Chemical-Mechanical Polishing, IEEE Transactions on Semiconductor Manufacturing, vol. 11, No. 1, Feb. 1998, pp. 129-140. |
Tung, A Method for Die-Scale Simulation of CMP Planarization, 19 International Conference on Simulation of Semiconductor Processes and Devices, 1997, pp. 65-68. |
Takahashi et al., Modeling of Chemical Mechanical Polishing Process for Three-Dimensional Simulation, 1997 Symposium on VLSI Technology Digest of Technical Papers, 1997, pp. 25-26. |