The invention relates generally to RFID structures and methods for forming RFID structures.
Radio-Frequency Identification (RFID) technology is directed to wireless communication between one object, typically referred to as a RFID tag, and another object, typically referred to as a RFID reader/writer. RFID technology has been adopted, and is increasingly being used, in virtually every industry, including, for example, manufacturing, transportation, retail, and waste management. As such, secure and reliable RFID systems are becoming increasingly important as the demand for RFID technology increases.
RFID tags typically include two components: a RFID antenna assembly and an RFID integrated circuit (IC).
In some applications, RFID tags are secured as adhesive labels to objects for identification purposes. Such adhesive tags can be tampered with by removing the RFID tag, and possibly affixing the tag to another object. Without a visual inspection of the object being tagged, the authenticity of objects with RFID tags that have been tampered with is suspect.
One approach to providing a tamper-proof RFID structure is to configure the RFID structure to become inoperable if it is tampered with. In one aspect, there is a RFID structure. The RFID structure includes an antenna substrate and a loop antenna assembly positioned on the antenna substrate. The loop antenna assembly includes at least two contact pads and a plurality of antenna loop windings having an average spacing between adjacent antenna loop windings of the plurality of loop windings. The plurality of antenna loop windings define one or more gap regions that separate adjacent or adjoining antenna segments of the plurality of antenna loop windings by at least twice the average spacing.
In another aspect, there is a RFID structure. The RFID structure includes an antenna assembly and an antenna substrate. The antenna assembly includes a dipole antenna track and at least two contact pads. The dipole antenna track defines one or more gap regions that separate adjacent or adjoining segments of the dipole antenna track. The antenna substrate supports the antenna assembly. The antenna substrate includes one or more perforations positioned in the one or more gap regions.
In another aspect, there is a method of manufacturing a RFID structure. The method includes providing an antenna substrate and providing a loop antenna assembly on the antenna substrate. The loop antenna assembly includes at least two contact pads and a plurality of antenna loop windings having an average spacing between adjacent antenna loop windings of the plurality of loop windings. The plurality of antenna loop windings define one or more gap regions that separate adjacent or adjoining antenna segments of the plurality of antenna loop windings by at least twice the average spacing.
In another aspect, there is a method of manufacturing a RFID structure. The method includes providing an antenna substrate and providing an antenna assembly on the antenna substrate. The antenna assembly includes a dipole antenna track and at least two contact pads. The dipole antenna track defines one or more gap regions that separate adjacent or adjoining segments of the dipole antenna track. The method also includes forming one or more perforations positioned in the one or more gap regions.
In another aspect, there is a RFID structure. The RFID structure includes a loop antenna assembly and an antenna substrate. The loop antenna assembly includes at least two contact pads and a plurality of antenna loop windings. The antenna substrate supports the loop antenna assembly. The antenna substrate includes one or more perforations. At least one of the one or more perforations overlaps an area covered by a segment of the plurality of antenna loop windings.
In other examples, any of the aspects above can include one or more of the following features. The antenna substrate can include one or more perforations positioned in the one or more gap regions. The one or more perforations can include one or more cuts, one or more holes, one or more slits, or any combination thereof. The plurality of antenna loop windings can include one or more outer antenna loop windings and one or more inner antenna loop windings. At least one of the one or more gap regions separate an antenna segment on an outermost winding of the one or more inner antenna loop windings with an adjacent antenna segment on an innermost winding of the one or more outer loop windings. The plurality of antenna loop windings can include at least one track that includes two adjoining antenna segments defining lines having an angle less than 15 degrees. At least one of the one or more gap regions can be positioned between the two adjoining antenna segments. The at least one track can include an outermost antenna loop winding of the plurality of antenna loop windings. The at least one track can include an innermost antenna loop winding of the plurality of antenna loop windings.
In some embodiments, the average spacing is between 0.05 mm and 0.5 mm. In some embodiments, the average spacing is between 0.08 mm and 0.12 mm. The one or more gap regions can separate adjacent or adjoining antenna segments of the plurality of antenna loop windings by between 0.1 mm and 1.0 mm. The antenna substrate can include a carrier foil including PET, PET-G, PP, PE, PI, PVC, ABS, LCP, PBT, PEN, glass fiber, epoxy, BT, PC or any combination thereof. The RFID structure can further include an adhesive layer on a surface of the antenna substrate opposite the loop antenna assembly. The RFID structure can further include an adhesive layer on a surface of the antenna substrate opposite the antenna assembly. The RFID structure can further include an integrated circuit coupled to the at least two contact pads. The RFID structure can further include a protective layer covering the loop antenna assembly and the integrated circuit. The RFID structure can include a RFID label.
In some embodiments, the dipole antenna track includes at least two adjoining antenna segments that define lines having an angle less than 15 degrees. At least one of the one or more gap regions can be positioned between the two adjoining antenna segments. The one or more gap regions can separate the two adjoining antenna segments by between 0.16 mm and 1.0 mm. The method can further include forming one or more perforations in the antenna substrate, the one or more perforations positioned in the one or more gap regions. Forming the one or more perforations comprises punching the antenna substrate using a punch-press, heating the antenna substrate using a laser, or both. The plurality of antenna loop windings can include one or more outer antenna loop windings and one or more inner antenna loop windings. At least one of the one or more gap regions can separate an antenna segment on an outermost winding of the one or more inner antenna loop windings with an adjacent antenna segment on an innermost winding of the one or more outer loop windings.
In some embodiments, the plurality of antenna loop windings include at least one track that includes two adjoining antenna segments that define lines having an angle less than 15 degrees. At least one of the one or more gap regions can be positioned between the two adjoining antenna segments. The at least one track can include an outermost antenna loop winding of the plurality of antenna loop windings. The at least one track can include an innermost antenna loop winding of the plurality of antenna loop windings.
In some embodiments, the method further includes applying an adhesive layer on a surface of the antenna substrate opposite the loop antenna assembly. The method can also include coupling an integrated circuit to the at least two contact pads. The method can also include applying a protective layer covering the loop antenna assembly and the integrated circuit. The method can also include applying an adhesive layer on a surface of the antenna substrate opposite the antenna assembly.
Any of the implementations can realize one or more of the following advantages. Perforations can provide for secure and tamper-proof RFID structures (e.g., RFID labels). In some embodiments, perforations can be applied to small antenna assembly structures while minimizing the negative influence on antenna performance. Punching processes can be accurately archived. Laser cutting processes can apply perforations to smaller labels compared to standard punch pattern.
The details of one or more examples are set forth in the accompanying drawings and the description below. Further features, aspects, and advantages of the invention will become apparent from the description, the drawings, and the claims. The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention.
The foregoing and other objects, features, and advantages of the present invention, as well as the invention itself, will be more fully understood from the following description of various embodiments, when read together with the accompanying drawings.
Antenna assembly 200 also defines a plurality of gap regions (e.g., gap region 270) in which one or more perforations 260 can be positioned. Perforations 260 can include, in any combination, one or more cuts, one or more holes, and/or one or more slits made into a substrate (not shown) on which antenna assembly 200 is positioned on. Gap region 270, for example, is defined by two adjoining antenna track segments 210c and 210d that are spaced apart by a distance 261. Antenna track segments 210c and 210d are part of the outermost antenna loop winding of the plurality of antenna loop windings 210. In some embodiments, gap distance 261 is at least twice the average spacing between adjacent tracks in the plurality of antenna loop windings 210. In some embodiments, gap distances can range between at least two and fives times the average spacing (e.g., between 0.16 mm and 1.0 mm). The widened gap regions with respect to the average spacing advantageously allows perforations to be created in an antenna substrate without damaging the antenna assembly.
Perforations can be formed by punching the antenna substrate using a punch-press (e.g., rotary punch, flatbed punch, etc.), cutting, heating the antenna substrate using a laser (e.g., laser cutting and/or laser engraving), or both. Perforations in the antenna substrate can advantageously work as predetermined break point(s). For example, an adhesive RFID label including a perforated substrate can be applied to an object for tracking. As break points, the perforations on the substrate can cause the RFID antenna to break apart if someone tries to remove it from the object, thereby rendering the RFID structure inoperable.
Antenna loop windings in configuration 300b include an outer antenna loop winding 310b and a plurality of inner antenna loop windings (e.g., 311b and 312b). The inner antenna loop windings are spaced apart by, for example, distance 311. Outer antenna loop winding 310b and an outermost antenna loop winding 311b from the group of inner antenna loop windings can define one or more gap regions (e.g., gap region 370b) in which one or more perforations 360b can be positioned. Adjacent antenna track segments 310b and 311b are spaced apart by a distance 361b.
Antenna loop windings in configuration 300c include a plurality of inner antenna loop windings (e.g., 310c and 311c) and a plurality of outer antenna loop windings (e.g., 312c and 313c). Adjacent tracks within the inner and outer antenna loop windings are spaced apart by, for example, distance 311. An outermost antenna loop winding 311c from the group of inner antenna loop windings and an innermost antenna loop winding 312c from the group of outer antenna loop windings can define one or more gap regions (e.g., gap region 370c) in which one or more perforations 360c can be positioned. Adjacent antenna track segments 311c and 312c are spaced apart by a distance 361c.
Similar to aspects of antenna assembly 200, in some embodiments of antenna assembly configurations 300a-300h, the width of each antenna track can be between 0.05 mm and 0.5 min (e.g., between 0.05 mm and 0.3 mm for small antennas), and the average distance of the spacing between adjacent tracks can be between 0.05 mm and 0.5 mm). Perforations 360a-360h can include, in any combination, one or more cuts, one or more holes, and/or one or more slits made into a substrate (not shown) on which antenna assemblies 300a-300h are positioned on. In some embodiments, gap distances (e.g., 361a-361e) between adjoining and/or adjacent antenna track segments and/or cross-over track segments are at least twice the average spacing between adjacent tracks in the plurality of antenna loop windings. In some embodiments, gap distances can range between at least two and fives times the average spacing (e.g., between 0.1 mm and 1.0 mm). Adjoining antenna segments can define lines with an angle less than 15 or 45 degrees.
In addition to HF RFID antennas, the above-described techniques for defining gap regions and positioning perforations within the gap regions can be applied ultra-high frequency (UHF) RFID antennas. Typically, RFID systems that operate in the UHF range utilize a standard dipole antenna configuration for the RFID antenna assembly.
RFID structure 500b illustrates a double-sided antenna structure that includes an antenna substrate 501, a topside antenna metallization layer 530, and a backside antenna metallization layer 540. In some embodiments, the topside antenna metallization layer 530 includes the plurality of loop windings and the IC contact pads, while the backside antenna metallization layer 540 includes a cross-over track (e.g., 240 or 340). The backside antenna metallization layer 540 can be electrically coupled to the topside metallization layer 530 via one or more cross-over points (e.g., 330a and 33b) that go through the antenna substrate 501.
In some embodiments, RFID structures 500a and/or 500b can also include a cover foil layer 520 (e.g., a protective layer), and/or one or more adhesive and/or liner layers (e.g., layer 525) on the top layer, bottom layer, or both the top and bottom layers of the RFID structure. A shielding material layer (e.g., layer 525) can also be included in the structures 500a and/or 500b. Layer 525 can also represent the structure to which the RFID structures 500a and/or 500b are applied on. An adhesive layer can also be applied to any of the outmost layers on an RFID structure 500a or 500b. In some embodiments, perforations can be created in only the antenna substrate 501. In alternative or supplemental embodiments, perforations can also be made in any combination of other layers of the RFID structure (e.g., a shielding layer, an adhesive layer, a protective layer, etc.). In some embodiments, the protective or cover layer (e.g., 520) does not include perforations, advantageously hiding the perforations from visual inspection.
In another aspect, the antenna substrate of an RFID structure can be selectively removed independent of whether it overlaps with a portion of an antenna assembly.
In some embodiments, the possible de-tuning resulting from any tracks added to define perforated-gap regions can be compensated for by adding or reducing the capacitance and/or inductance of the whole transponder. For example, frequency tuning can be accomplished by adding or reducing the area of a tuning capacitors (e.g., 150). Alternatively, the width and/or spacing between the plurality of loop windings can be modified.
In alternative or supplemental embodiments, including perforations in the antenna substrate of an RFID structure can be combined with other security features such as, for example, holograms and security foils.
One skilled in the art will realize the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The foregoing embodiments are therefore to be considered in all respects illustrative rather than limiting of the invention described herein. Scope of the invention is thus indicated by the appended claims, rather than by the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
This application claims priority to and the benefit of U.S. Provisional Patent Application No. 61/378,359, filed on Aug. 30, 2010, the entire contents of which are incorporated herein by reference in their entirety.
Number | Name | Date | Kind |
---|---|---|---|
5574470 | de Vall | Nov 1996 | A |
6206292 | Robertz et al. | Mar 2001 | B1 |
6794000 | Adams et al. | Sep 2004 | B2 |
6888502 | Beigel et al. | May 2005 | B2 |
7017822 | Aisenbrey | Mar 2006 | B2 |
7049962 | Atherton et al. | May 2006 | B2 |
7093767 | Faenza, Jr. et al. | Aug 2006 | B2 |
7095324 | Conwell et al. | Aug 2006 | B2 |
7098764 | Schaumburg et al. | Aug 2006 | B2 |
7152040 | Hawthorne et al. | Dec 2006 | B1 |
7168626 | Lerch et al. | Jan 2007 | B2 |
7187293 | White et al. | Mar 2007 | B2 |
7202790 | Copeland et al. | Apr 2007 | B2 |
7369048 | Freund | May 2008 | B2 |
7387233 | Masuta | Jun 2008 | B2 |
7411498 | Forster | Aug 2008 | B2 |
7436305 | Clare et al. | Oct 2008 | B2 |
7546671 | Finn | Jun 2009 | B2 |
7557715 | Noakes et al. | Jul 2009 | B1 |
7561114 | Maezawa et al. | Jul 2009 | B2 |
7564354 | Eren et al. | Jul 2009 | B2 |
7564359 | Koh et al. | Jul 2009 | B2 |
7581308 | Finn | Sep 2009 | B2 |
7586415 | Lee | Sep 2009 | B2 |
7623034 | Ferguson et al. | Nov 2009 | B2 |
7675464 | Cleeves | Mar 2010 | B2 |
7688206 | Carrender | Mar 2010 | B2 |
7701346 | Lindsay et al. | Apr 2010 | B2 |
7714727 | White et al. | May 2010 | B2 |
7728726 | Berson | Jun 2010 | B2 |
7740179 | Mattlin et al. | Jun 2010 | B2 |
7744004 | Kato et al. | Jun 2010 | B2 |
7744005 | Yin | Jun 2010 | B2 |
20020036237 | Atherton et al. | Mar 2002 | A1 |
20040256469 | Faenza, Jr. et al. | Dec 2004 | A1 |
20050012616 | Forster et al. | Jan 2005 | A1 |
20050023359 | Saunders | Feb 2005 | A1 |
20060092028 | Lerch et al. | May 2006 | A1 |
20060109130 | Hattick et al. | May 2006 | A1 |
20060202829 | Girvin et al. | Sep 2006 | A1 |
20070029384 | Atherton | Feb 2007 | A1 |
20070159339 | Matsuura et al. | Jul 2007 | A1 |
20070164867 | Kawai | Jul 2007 | A1 |
20070244657 | Drago et al. | Oct 2007 | A1 |
20070257802 | Koh et al. | Nov 2007 | A1 |
20080117058 | Oberle | May 2008 | A1 |
20080131669 | Michalk | Jun 2008 | A1 |
20080142154 | Green et al. | Jun 2008 | A1 |
20080149584 | Martinelli | Jun 2008 | A1 |
20080157975 | White et al. | Jul 2008 | A1 |
20080202300 | Steidinger et al. | Aug 2008 | A1 |
20080211676 | Commagnac et al. | Sep 2008 | A1 |
20080266108 | Teeter | Oct 2008 | A1 |
20080272885 | Atherton | Nov 2008 | A1 |
20080308641 | Finn | Dec 2008 | A1 |
20080309497 | Bryant | Dec 2008 | A1 |
20090021377 | Launiainen | Jan 2009 | A1 |
20090045963 | Vigneron et al. | Feb 2009 | A1 |
20090058599 | Calvarese | Mar 2009 | A1 |
20090101281 | Sacherer | Apr 2009 | A1 |
20090128340 | Masin | May 2009 | A1 |
20090199966 | Coleman et al. | Aug 2009 | A1 |
20090229109 | Finn | Sep 2009 | A1 |
20090237215 | Dunlap et al. | Sep 2009 | A1 |
20090237249 | Bielas | Sep 2009 | A1 |
20090291271 | Michalk et al. | Nov 2009 | A1 |
20090315320 | Finn | Dec 2009 | A1 |
20100065647 | Ritamaki et al. | Mar 2010 | A1 |
20100065648 | Warther | Mar 2010 | A1 |
20100126000 | Forster | May 2010 | A1 |
20100156642 | Lindsay et al. | Jun 2010 | A1 |
20100181381 | Carrender | Jul 2010 | A1 |
20100182149 | Marino | Jul 2010 | A1 |
Number | Date | Country |
---|---|---|
2005106782 | Nov 2005 | WO |
Entry |
---|
Partial International Search Report from corresponding foreign application No. PCT/EP2011/004290 dated Dec. 19, 2011, 5 pgs. |
Tamper Evident Technology. Falken Secure Networks Application Brochure 0838 (10 pages); accessed on Aug. 25, 2011 at http://www.falkensecurenetworks.com/PDFs/0838—Tamper-Evident—RFID—Labels—and —Seals.pdf. |
Number | Date | Country | |
---|---|---|---|
20120145794 A1 | Jun 2012 | US |
Number | Date | Country | |
---|---|---|---|
61378359 | Aug 2010 | US |