Claims
- 1. A conductor composition comprising:
- 51.9% palladium powder,
- 34.7% silver powder,
- 5.5% glass powder,
- 7.8% screening agent and
- 0.2% by weight thinner.
- 2. A hybrid circuit including at least one thick film resistor, a thick film conductor runner in contact with said thick film resistor, and an interface region between said conductor and resistor formed by diffusion of conductor material into said resistor during firing of said conductor runner, said resistor and conductor having a combined temperature coefficient of resistance (TCR) parameter that varies in dependence upon TCR and resistivity parameters of said resistor, said conductor runner and said interface region, the improvement wherein:
- said conductor runner is formed of a material comprising silver and palladium in a silver-to-palladium weight ratio from about 55/45 to about 60/40 so as to minimize diffusion of silver into said resistor during firing of said conductor runner while also minimizing the TCR parameter of said conductor runner, whereby said combined TCR parameter primarily depends on the TCR parameter of said thick film resistor.
Parent Case Info
This is a division of application Ser. No. 07/806193 filed on Dec. 13, 1991 now abandoned.
US Referenced Citations (5)
Divisions (1)
|
Number |
Date |
Country |
Parent |
806193 |
Dec 1991 |
|