IBM Technical Disclosure Bulletin, vol. 27, No. 7B, Dec. 1984 "Burn-In Fixture for Modules" by R. Brzyski, E. Grenchus, Sr., M. Rathod and R. J. Stutzman. |
"Cooling of a Multichip Electronic Module by Means of Confined Two-Dimensional Jets of Dielectric Liquid", The American Society of Mechanical Engineers; D. C. Wadsworth and I. Mudawart, pp. 79-87. |
"Experimental Investigation of Single Phase Multi-Jet Impingement Cooling of an Array of Microelectronic Heat Sources" by L. M. Jiji and Z. Dagan, pp. 265-283. |