Claims
- 1. A temperature sensor comprising:
- a ceramic layered body having a multilayer structure formed of a plurality of ceramic sheets having respective major surfaces;
- a plurality of resistive patterns containing nickel, formed respectively on first major surfaces of said plurality of ceramic sheets;
- conductive means series-connecting said plurality of resistive patterns with each other;
- a pair of terminals connected respectively to both ends of said series-connected plurality of resistive patterns; and
- said ceramic sheets containing an unreducible ceramic material consisting essentially of TiO.sub.2.BaO.CaO.ZrO.sub.2.
- 2. A temperature sensor in accordance with claim 1, wherein said conductive means forms a conductive path passing through said ceramic sheets between respective pairs of resistive patterns.
- 3. A temperature sensor in accordance with claim 2, wherein each of said ceramic sheets has at least one means for providing a conductive through-hole conducively connected to the corresponding resistive pattern of that ceramic sheet, for connecting that resistive pattern to a resistive pattern on an adjacent ceramic sheet in said ceramic layered body.
- 4. A temperature sensor in accordance with claim 1, wherein said ceramic material is sinterable at approximately 1330.degree.-1350.degree. C.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2-153620 |
Jun 1990 |
JPX |
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Parent Case Info
This is a division of application Ser. No. 07/713,163, filed Jun. 11, 1991, now U.S. Pat. No. 5,199,791.
US Referenced Citations (9)
Foreign Referenced Citations (5)
Number |
Date |
Country |
57-37081 |
Aug 1982 |
JPX |
57-42588 |
Sep 1982 |
JPX |
57-49515 |
Oct 1982 |
JPX |
1147134 |
Jul 1986 |
JPX |
0033903 |
Feb 1990 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
713163 |
Jun 1991 |
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