TREA

Thermal actuator and an optical waveguide switch including the same

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Information

  • Patent Application
  • 20050031252
  • Publication Number
    20050031252
  • Date Filed
    February 05, 2004
    21 years ago
  • Date Published
    February 10, 2005
    20 years ago
Information
Abstract
A thermal actuator comprises a substantially straight beam. The beam has a beam length and a beam mid-point. The beam comprises a plurality of beam segments. Each beam segment has a beam segment width, the beam thus forming a corresponding plurality of beam segment widths. The beam segment widths vary along the beam length based on a predetermined pattern. As the beam is heated by an included heating means, the beam buckles. The buckling of the beam, in turn, causes the beam mid-point to translate or move in a predetermined direction. The beam mid-point movement, in turn, operates an included optical waveguide switch. The heating means comprises any of Joule heating, eddy current heating, conduction heating, convection heating and radiation heating.
Description
INCORPORATION BY REFERENCE OF OTHER PATENTS, PATENT APPLICATIONS AND PUBLICATIONS

The disclosures of the, following thirteen (13) U.S. patents are hereby incorporated by reference, verbatim, and with the same effect as though the same disclosures were fully and completely set forth herein:

    • Joel Kubby, U.S. Pat. No. 5,706,041, “Thermal ink-jet printhead with a suspended heating element in each ejector,” issued Jan. 6, 1998;
    • Joel Kubby, U.S. Pat. No. 5,851,412, “Thermal ink-jet printhead with a suspended heating element in each ejector,” issued Dec. 22, 1998;
    • Joel Kubby et al., U.S. Pat. No. 6,362,512, “Microelectromechanical structures defined from silicon on insulator wafers,” issued Mar. 26, 2002;
    • Joel Kubby et al., U.S. Pat. No. 6,379,989, “Process for manufacture of microoptomechanical structures,” issued Apr. 30, 2002;
    • Phillip D. Floyd et al., U.S. Pat. No. 6,002,507, “Method and apparatus for an integrated laser beam scanner,” issued Dec. 14, 1999;
    • Phillip D. Floyd et al., U.S. Pat. No. 6,014,240, “Method and apparatus for an integrated laser beam scanner using a carrier substrate,” issued Jan. 11, 2000;
    • Robert L. Wood et al., U.S. Pat. No. 5,909,078, “Thermal arched beam microelectromechanical actuators,” issued Jun. 1, 1999;
    • Vijayakumar R. Dhuler et al., U.S. Pat. No. 5,994,816, “Thermal arched beam microelectromechanical devices and associated fabrication methods,” issued Nov. 30, 1999;
    • Vijayakumar R. Dhuler et al., U.S. Pat. No. 6,023,121, “Thermal arched beam microelectromechanical structure,” issued Feb. 8, 2000;
    • Vijayakumar R. Dhuler et al., U.S. Pat. No. 6,114,794, “Thermal arched beam microelectromechanical valve,” issued Sep. 5, 2000;
    • Vijayakumar R. Dhuler et al., U.S. Pat. No. 6,255,757, “Microactuators including a metal layer on distal portions of an arched beam,” issued Jul. 3, 2001;
    • Vijayakumar R. Dhuler et al., U.S. Pat. No. 6,324,748, “Method of fabricating a microelectro mechanical structure having an arched beam,” issued Dec. 4, 2001; and
    • Edward A. Hill et al., U.S. Pat. No. 6,360,539, “Microelectromechanical actuators including driven arched beams for mechanical advantage,” issued Mar. 26, 2002.


The disclosures of the following four (4) U.S. patent applications are hereby incorporated by reference, verbatim, and with the same effect as though the same disclosures were fully and completely set forth herein:

    • Joel Kubby, U.S. patent application Ser. No. 09/683,533, “Systems and methods for thermal isolation of a silicon structure,” filed Jan. 16, 2002, now U.S. Patent Application Publication No. 20030134445, published Jul. 17, 2003, attorney docket number D/A1129;
    • Joel Kubby, U.S. Pat. Application No. 60/456,086, “MxN Cantilever Beam Optical-Waveguide Switch,” filed Mar. 19, 2003, attorney docket number D/A2415P;
    • Joel Kubby et al., U.S. patent application Ser. No. 09/986,395, “Monolithic reconfigurable optical multiplexer systems and methods,” filed Nov. 8, 2001, now U.S. Patent Application Publication No. 20030086641, published May 8, 2003, attorney docket number D/A1063; and
    • Joel Kubby et al., U.S. Pat. Application No. 60/456,063, “MEMS Optical Latching Switch,” filed Mar. 19, 2003, attorney docket number D/A2415QP.


The disclosures of the following three (3) publications are hereby incorporated by reference, verbatim, and with the same effect as though the same disclosures were fully and completely set forth herein:

    • Yogesh B. Gianchandani and Khalil Najafi, “Bent-Beam Strain Sensors,” Journal of Microelectromechanical Systems, Vol. 5, No.1, March 1996, pages 52-58;
    • Long Que, Jae-Sung Park and Yogesh B. Gianchandani, “Bent-Beam Electrothermal Actuators,” Journal of Microelectromechanical Systems, Vol. 10, No. 2, June 2001, pages 247-254; and
    • John M. Maloney, Don L. DeVoe and David S. Schreiber, “Analysis and Design of Electrothermal Actuators Fabricated from Single Crystal Silicon,” Proceedings ASME International Mechanical Engineering Conference and Exposition, Orlando, Fla., pages 233-240, 2000.


FIELD OF THE INVENTION

This application relates generally to thermal actuators and more particularly to a thermal actuator that is suitable for use in an optical waveguide switch.


BACKGROUND OF THE INVENTION

The traditional thermal actuator, the “V-beam” actuator, is widely used in microelectromechanical or “MEMS” structures. Such actuators are described in U.S. Pat. No. 5,909,078 to Robert L. Wood et al.; and in the U.S. Patents to Vijayakumar R. Dhuler et al., U.S. Pat. No. 5,994,816, No. 6,023,121, No. 6,114,794, No. 6,255,757 and No. 6,324,748; and in U.S. Pat. No. 6,360,539 to Edward A. Hill et al., all of the foregoing patents being incorporated by reference herein; and in the publication of Long Que, Jae-Sung Park and Yogesh B. Gianchandani, “Bent-Beam Electrothermal Actuators”; and in the publication of John M. Maloney, Don L. DeVoe and David S. Schreiber, “Analysis and Design of Electrothermal Actuators Fabricated from Single Crystal Silicon,” both of which publications are incorporated by reference herein.


However, these actuators are sensitive to residual stresses, especially the stress introduced by doping during fabrication of the actuator.


Indeed, the bent-beam geometry used in these actuators has been used in bent-beam strain sensors to measure residual stress as described in the publication of Yogesh B. Gianchandani and Khalil Najafi, “Bent-Beam Strain Sensors,” which publication is incorporated by reference herein.


The residual stress in the V-beam actuator acts to deflect the V-beams away from their originally-designed target locations since the beam angle gives rise to a transverse force. Moreover, when such a V-beam actuator is used in an optical waveguide switch, this residual stress results in waveguide misalignment. The amount of optical loss caused by this waveguide misalignment is substantial. As a result, currently the V-beam actuator is generally unacceptable for use in an optical waveguide switch.


Thus, there is a need for an actuator that is acceptable for use in an optical waveguide switch.


SUMMARY OF THE INVENTION

In a first aspect of the invention, a thermal actuator comprises a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a beam extending between the first support and the second support, the beam having a first side, a second side, a beam length and a beam mid-point, the beam being substantially straight along the first side; the beam comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment width orthogonal to the beam length, the beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to the beam vary along the beam length based on a predetermined pattern; so that a heating of the beam causes a beam buckling and the beam mid-point to translate in a predetermined direction generally normal to and outward from the second side.


In a second aspect of the invention, a thermal actuator comprises a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a plurality of beams extending in parallel between the first support and the second support, thus forming a beam array; each beam of the beam array having a first side, a second side, a beam length and a beam mid-point, each beam being substantially straight along its first side; each beam of the beam array comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment width orthogonal to the beam length, each beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to each beam vary along the beam length based on a predetermined pattern; an included coupling beam extending orthogonally across the beam array to couple each beam of the beam array substantially at the corresponding beam mid-point; so that a heating of the beam array causes a beam array buckling and the coupling beam to translate in a predetermined direction generally normal to and outward from the second sides of the array beams.


In a third aspect of the invention, a thermal actuator comprises a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a beam extending between the first support and the second support, the beam having a first side, a second side, a beam length and a beam mid-point, the beam being substantially straight along the second side; the beam comprised of a plurality of beam segments, each beam segment of the plurality of beam segments being having a beam segment width orthogonal to the beam length, the beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to the beam vary along the beam length based on a predetermined pattern; so that a heating of the beam causes a beam buckling and the beam mid-point to translate in a predetermined direction generally normal to and outward from the second side.


In a fourth aspect of the invention, a thermal actuator comprises a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a plurality of beams extending in parallel between the first support and the second support, thus forming a beam array; each beam of the beam array having a first side, a second side, a beam length and a beam mid-point, each beam being substantially straight along its second side; each beam of the beam array comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment width orthogonal to the beam length, each beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to each beam vary along the beam length based on a predetermined pattern; an included coupling beam extending orthogonally across the beam array to couple each beam of the beam array substantially at the corresponding beam mid-point; so that a heating of the beam array causes a beam array buckling and the coupling beam to translate in a predetermined direction generally normal to and outward from the second sides of the array beams.


In a fifth aspect of the invention, a thermal actuator comprises a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a beam extending between the first support and the second support, the beam having a first side, a second side, a beam length and a beam mid-point, the beam being substantially straight along the first side; the beam comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment average width orthogonal to the beam length, the beam thus forming a corresponding plurality of beam segment average widths; wherein the plurality of beam segment average widths corresponding to the beam vary along the beam length based on a predetermined pattern; so that a heating of the beam causes a beam buckling and the beam mid-point to translate in a predetermined direction generally normal to and outward from the second side.


In a sixth aspect of the invention, a thermal actuator comprises a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a plurality of beams extending in parallel between the first support and the second support, thus forming a beam array; each beam of the beam array having a first side, a second side, a beam length and a beam mid-point, each beam being substantially straight along its first side; each beam of the beam array comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment average width orthogonal to the beam length, each beam thus forming a corresponding plurality of beam segment average widths; wherein the plurality of beam segment average widths corresponding to each beam vary along the beam length based on a predetermined pattern; an included coupling beam extending orthogonally across the beam array to couple each beam of the beam array substantially at the corresponding beam mid-point; so that a heating of the beam array causes a beam array buckling and the coupling beam to translate in a predetermined direction generally normal to and outward from the second sides of the array beams.


In a seventh aspect of the invention, an optical waveguide switch comprises a thermal actuator, the thermal actuator comprising a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a beam extending between the first support and the second support, the beam having a first side, a second side, a beam length and a beam mid-point, the beam being substantially straight along the first side; the beam comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment width orthogonal to the beam length, the beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to the beam vary along the beam length based on a predetermined pattern; so that a heating of the beam causes a beam buckling and the beam mid-point to translate in a predetermined direction generally normal to and outward from the second side.


In an eighth aspect of the invention, an optical waveguide switch comprises a thermal actuator, the thermal actuator comprising a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a plurality of beams extending in parallel between the first support and the second support, thus forming a beam array; each beam of the beam array having a first side, a second side, a beam length and a beam mid-point, each beam being substantially straight along its first side; each beam of the beam array comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment width orthogonal to the beam length, each beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to each beam vary along the beam length based on a predetermined pattern; an included coupling beam extending orthogonally across the beam array to couple each beam of the beam array substantially at the corresponding beam mid-point; so that a heating of the beam array causes a beam array buckling and the coupling beam to translate in a predetermined direction generally normal to and outward from the second sides of the array beams.


In a ninth aspect of the invention, an optical waveguide switch comprises a thermal actuator, the thermal actuator comprising a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a beam extending between the first support and the second support, the beam having a first side, a second side, a beam length and a beam mid-point, the beam being substantially straight along the second side; the beam comprised of a plurality of beam segments, each beam segment of the plurality of beam segments being having a beam segment width orthogonal to the beam length, the beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to the beam vary along the beam length based on a predetermined pattern; so that a heating of the beam causes a beam buckling and the beam mid-point to translate in a predetermined direction generally normal to and outward from the second side.


In a tenth aspect of the invention, an optical waveguide switch comprises a thermal actuator, the thermal actuator comprising a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a plurality of beams extending in parallel between the first support and the second support, thus forming a beam array; each beam of the beam array having a first side, a second side, a beam length and a beam mid-point, each beam being substantially straight along its second side; each beam of the beam array comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment width orthogonal to the beam length, each beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to each beam vary along the beam length based on a predetermined pattern; an included coupling beam extending orthogonally across the beam array to couple each beam of the beam array substantially at the corresponding beam mid-point; so that a heating of the beam array causes a beam array buckling and the coupling beam to translate in a predetermined direction generally normal to and outward from the second sides of the array beams.


In an eleventh aspect of the invention, an optical waveguide switch comprises a thermal actuator, the thermal actuator comprising a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a beam extending between the first support and the second support, the beam having a first side, a second side, a beam length and a beam mid-point, the beam being substantially straight along the first side; the beam comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment average width orthogonal to the beam length, the beam thus forming a corresponding plurality of beam segment average widths; wherein the plurality of beam segment average widths corresponding to the beam vary along the beam length based on a predetermined pattern; so that a heating of the beam causes a beam buckling and the beam mid-point to translate in a predetermined direction generally normal to and outward from the second side.


In a twelfth aspect of the invention, an optical waveguide switch comprises a thermal actuator, the thermal actuator comprising a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a plurality of beams extending in parallel between the first support and the second support, thus forming a beam array; each beam of the beam array having a first side, a second side, a beam length and a beam mid-point, each beam being substantially straight along its first side; each beam of the beam array comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment average width orthogonal to the beam length, each beam thus forming a corresponding plurality of beam segment average widths; wherein the plurality of beam segment average widths corresponding to each beam vary along the beam length based on a predetermined pattern; an included coupling beam extending orthogonally across the beam array to couple each beam of the beam array substantially at the corresponding beam mid-point; so that a heating of the beam array causes a beam array buckling and the coupling beam to translate in a predetermined direction generally normal to and outward from the second sides of the array beams.




BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING


FIG. 1 is a block diagram of an optical waveguide switch 100a comprising a first embodiment 200 of a thermal actuator.



FIG. 2 is a block diagram of an optical waveguide switch 100b comprising a second embodiment 300 of thermal actuator.



FIG. 3 is a block diagram of an optical waveguide switch 100c comprising a third embodiment 400 of a thermal actuator.



FIGS. 4-6 depict the first embodiment 200 of the thermal actuator as follows:



FIG. 4 is an elevated top-down “birds-eye” view of the thermal actuator 200, including a first reference line 5 and a second reference line 6.



FIG. 5 is a first “cut-away” side or profile view of the thermal actuator 200 along the FIG. 4 first reference line 5.



FIG. 6 is a second “cut-away” side or profile view of the thermal actuator 200 along the FIG. 4 second reference line 6.



FIGS. 7-9 depict the second embodiment 300 of the thermal actuator as follows:



FIG. 7 is an elevated top-down “birds-eye” view of the thermal actuator 300, including a first reference line 8 and a second reference line 9.



FIG. 8 is a first “cut-away” side or profile view of the thermal actuator 300 along the FIG. 7 first reference line 8.



FIG. 9 is a second “cut-away” side or profile view of the thermal actuator 300 along the FIG. 7 second reference line 9.



FIGS. 10-12 depict the third embodiment 400 of the thermal actuator as follows:



FIG. 10 is an elevated top-down “birds-eye” view of the thermal actuator 400, including a first reference line 11 and a second reference line 12.



FIG. 11 is a first “cut-away” side or profile view of the thermal actuator 400 along the FIG. 10 first reference line 11.



FIG. 12 is a second “cut-away” side or profile view of the thermal actuator 400 along the FIG. 10 second reference line 12.



FIG. 13 is a block diagram of an optical waveguide switch 100d comprising a fourth embodiment 500 of a thermal actuator.



FIG. 14 is a block diagram of an optical waveguide switch 100e comprising a fifth embodiment 600 of thermal actuator.



FIG. 15 is a block diagram of an optical waveguide switch 100f comprising a sixth embodiment 700 of a thermal actuator.



FIG. 16 is a block diagram of an optical waveguide switch 100g comprising a seventh embodiment 800 of a thermal actuator.



FIG. 17 is a block diagram of an optical waveguide switch 100h comprising an eighth embodiment 900 of thermal actuator.



FIG. 18 is a block diagram of an optical waveguide switch 100i comprising a ninth embodiment 1000 of a thermal actuator.



FIG. 19 is an elevated top-down “birds-eye” view of the fourth embodiment 500 of the thermal actuator, including reference lines 20-24.



FIG. 20 is a “cut-away” side or profile view of the thermal actuator 500 along the reference line 20.



FIG. 21 is a “cut-away” side or profile view of the thermal actuator 500 along the reference line 21.



FIG. 22 is a “cut-away” side or profile view of the thermal actuator 500 along the reference line 22.



FIG. 23 is a “cut-away” side or profile view of the thermal actuator 500 along the reference line 23.



FIG. 24 is a “cut-away” side or profile view of the thermal actuator 500 along the reference line 24.



FIG. 25 is an elevated top-down “birds-eye” view of the fifth embodiment 600 of the thermal actuator, including reference lines 26-30.



FIG. 26 is a “cut-away” side or profile view of the thermal actuator 600 along the reference line 26.



FIG. 27 is a “cut-away” side or profile view of the thermal actuator 600 along the reference line 27.



FIG. 28 is a “cut-away” side or profile view of the thermal actuator 600 along the reference line 28.



FIG. 29 is a “cut-away” side or profile view of the thermal actuator 600 along the reference line 29.



FIG. 30 is a “cut-away” side or profile view of the thermal actuator 600 along the reference line 30.



FIG. 31 is an elevated top-down “birds-eye” view of the sixth embodiment 700 of the thermal actuator, including reference lines 32-36.



FIG. 32 is a “cut-away” side or profile view of the thermal actuator 700 along the reference line 32.



FIG. 33 is a “cut-away” side or profile view of the thermal actuator 700 along the reference line 33.



FIG. 34 is a “cut-away” side or profile view of the thermal actuator 700 along the reference line 34.



FIG. 35 is a “cut-away” side or profile view of the thermal actuator 700 along the reference line 35.



FIG. 36 is a “cut-away” side or profile view of the thermal actuator 700 along the reference line 36.



FIG. 37 is an elevated top-down “birds-eye” view of the seventh embodiment 800 of the thermal actuator, including reference lines 38-42.



FIG. 38 is a “cut-away” side or profile view of the thermal actuator 800 along the reference line 38.



FIG. 39 is a “cut-away” side or profile view of the thermal actuator 800 along the reference line 39.



FIG. 40 is a “cut-away” side or profile view of the thermal actuator 800 along the reference line 40.



FIG. 41 is a “cut-away” side or profile view of the thermal actuator 800 along the reference line 41.



FIG. 42 is a “cut-away” side or profile view of the thermal actuator 800 along the reference line 42.



FIG. 43 is an elevated top-down “birds-eye” view of then eighth embodiment 900 of the thermal actuator, including reference lines 44-48.



FIG. 44 is a “cut-away” side or profile view of the thermal actuator 900 along the reference line 44.



FIG. 45 is a “cut-away” side or profile view of the thermal actuator 900 along the reference line 45.



FIG. 46 is a “cut-away” side or profile view of the thermal actuator 900 along the reference line 46.



FIG. 47 is a “cut-away” side or profile view of the thermal actuator 900 along the reference line 47.



FIG. 48 is a “cut-away” side or profile view of the thermal actuator 900 along the reference line 48.



FIG. 49 is an elevated top-down “birds-eye” view of the ninth embodiment 1000 of the thermal actuator 1000, including reference lines 50-54.



FIG. 50 is a “cut-away” side or profile view of the thermal actuator 1000 along the reference line 50.



FIG. 51 is a “cut-away” side or profile view of the thermal actuator 1000 along the reference line 51.



FIG. 52 is a “cut-away” side or profile view of the thermal actuator 1000 along the reference line 52.



FIG. 53 is a “cut-away” side or profile view of the thermal actuator 1000 along the reference line 53.



FIG. 54 is a “cut-away” side or profile view of the thermal actuator 1000 along the reference line 54.




DETAILED DESCRIPTION OF THE INVENTION

Referring now to the optical waveguide switches 100a, 100b, 100c and their corresponding thermal actuators 200, 300, 400 described below in connection with FIGS. 1-12, in brief, a thermal actuator 200, 300 or 400 comprises a plurality of substantially straight and parallel beams arranged to form a beam array. The mid-point of each beam is attached or coupled to an orthogonal coupling beam. Each array beam has a beam heating parameter with a corresponding beam heating parameter value. The beam heating parameter values vary across the beam array based on a predetermined pattern. As the beams are heated by an included heating means, the distribution of beam temperatures in the beam array becomes asymmetric, thus causing the beam array to buckle. The buckling of the beams in the beam array, in turn, causes the attached coupling beam to translate or move in a predetermined direction. The coupling beam movement, in turn, operates an included optical waveguide switch 100a, 100b or 100c. The beams in the beam array are heated by any of Joule heating, eddy current heating, conduction heating, convection heating and radiation heating.


Referring now to the optical waveguide switches 100d and 100f and their corresponding thermal actuators 500 and 700 described below in connection with FIGS. 13, 15, 19-24 and 31-36, in brief, a thermal actuator 500 or 700 comprises a substantially straight beam 510 or 710. The beam has a beam length 518 or 718 and a beam mid-point 519 or 719. The beam comprises a plurality of beam segments 520, 522, 524 or 720, 722, 724 with corresponding beam segment widths 525, 526, 527 or 725, 726, 727. The beam segment widths vary along the beam length based on a predetermined pattern. As the beam is heated by an included heating means, the beam buckles. The buckling of the beam, in turn, causes the beam mid-point to translate or move in a predetermined direction 548 or 748. The beam mid-point movement, in turn, operates an included optical waveguide switch 100d or 100f. The heating means comprises any of Joule heating, eddy current heating, conduction heating, convection heating and radiation heating.


Referring now to the optical waveguide switches 100e and 100g and their corresponding thermal actuators 600 and 800 described below in connection with FIGS. 14, 16, 25-30 and 37-42, in brief, a thermal actuator 600 or 800 comprises a plurality of beams 610a, 610b, 610c or 810a, 810b, 810c, each beam substantially similar to the beam 510 or 710 described above, the plurality of beams arranged to form a beam array 613 or 813. The mid-point of each beam is attached or coupled to an orthogonal coupling beam 614 or 814. As the plurality of beams are heated by an included heating means, the beam array buckles. The buckling of the beams in the beam array, in turn, causes the attached coupling beam to more in a predetermined direction 648 or 848. The coupling beam movement, in turn, operates an included optical waveguide switch 100e or 100g. The heating means comprises any of Joule heating, eddy current heating, conduction heating, convection heating and radiation heating.


Referring now to the optical waveguide switch 100h and its corresponding thermal actuator 900 described below in connection with FIGS. 17 and 43-48, in brief, a thermal actuator 900 comprises a substantially straight beam 910. The beam has a beam length 918 and a beam mid-point 919. The beam comprises a plurality of beam segments 920, 921, 922, 923, 924 with beam segment lengths. Each beam segment has a beam segment average width, thus forming a corresponding plurality of beam segment average widths 925, 931, 926, 933, 927. The beam segment average widths vary along the beam length based on a predetermined pattern. As the beam is heated by an included heating means, the beam buckles. The buckling of the beam, in turn, causes the beam mid-point to translate or move in a predetermined direction 948. The beam mid-point movement, in turn, operates an included optical waveguide switch 100h. The heating means comprises any of Joule heating, eddy current heating, conduction heating, convection heating and radiation heating.


Referring now to the optical waveguide switch 100i and its corresponding thermal actuator 1000 described below in connection with FIGS. 18 and 49-54, in brief, a thermal actuator 1000 comprises a plurality of beams 1010a, 1010b, 1010c, the plurality of beams arranged to form a beam array 1009. Each beam comprises a plurality of beam segments 1020, 1021, 1022, 1023, 1024. Each beam segment has a beam segment average width, the plurality of beams thus forming a corresponding plurality of beam segment average widths 1025a, 1031a, 1026a, 1033a, 1027a; 1025b, 1031b, 1026b, 1033b, 1027b; 1025c, 1031c, 1026c, 1033c, 1027c. The plurality of beam segment average widths corresponding to each beam vary along the beam length based on a predetermined pattern. The mid-point 1019 of each beam is attached or coupled to an orthogonal coupling beam 1005. As the plurality of beams are heated by an included heating means, the beam array buckles. The buckling of the beams in the beam array, in turn, causes the attached coupling beam to more in a predetermined direction 1048. The coupling beam movement, in turn, operates an included optical waveguide switch 100i. The heating means comprises any of Joule heating, eddy current heating, conduction heating, convection heating and radiation heating.


Referring now to FIG. 1, there is shown a block diagram of an optical waveguide switch 100a comprising a first embodiment 200 of a thermal actuator. The thermal actuator 200 is described in greater detail in connection with FIGS. 4-6 below.


Referring now to FIG. 2, there is shown a block diagram of an optical waveguide switch 100b comprising a second embodiment 300 of thermal actuator. The thermal actuator 300 is described in greater detail in connection with FIGS. 7-9 below.


Referring now to FIG. 3, there is shown a block diagram of an optical waveguide switch 100c comprising a third embodiment 400 of a thermal actuator. The thermal actuator 400 is described in greater detail in connection with FIGS. 10-12 below.


Examples of optical waveguide switches that incorporate thermal actuators have been described in the application of Joel Kubby, U.S. Pat. Application No. 60/456,086, filed Mar. 19, 2003; and in the applications of Joel Kubby et al., U.S. patent application Ser. No. 09/986,395, filed Nov. 8, 2001, now U.S. patent application Publication No. 20030086641, published May 8, 2003; and U.S. Pat. Application No. 60/456,063, filed Mar. 19, 2003, all of the foregoing patent applications being incorporated by reference herein.



FIGS. 4-6 depict the thermal actuator 200 in greater detail.


Referring now to FIG. 4, there is shown an elevated top-down “birds-eye” view of the thermal actuator 200, including a first reference line 5 and a second reference line 6. As shown, the thermal actuator 200 comprises a substrate 202 having a surface 204; a first support 206 and a second support 208 disposed on the surface and extending orthogonally therefrom, a plurality of beams 212a-212d extending in parallel between the first support and the second support, thus forming a beam array 214, each beam being agonic and substantially straight; each beam of the beam array having a beam width 226 with a corresponding beam width value, the beams in the beam array having beam width values that vary based on a predetermined pattern; and an included coupling beam 220 extending orthogonally across the beam array to couple each array beam substantially at its mid-point.


The predetermined pattern is characterized in that, across the beam array 214 from one side 250 of the beam array to the opposite side 252 of the beam array, successive beam width values do not decrease and at least sometimes increase.


Each pair 222 of adjacent beams in the beam array 214 has a beam spacing 224 with a corresponding beam spacing value, with all such pairs of adjacent beams in the beam array having substantially the same beam spacing value.


As shown in FIG. 4, with cross-reference to FIGS. 5-6, in one embodiment, the thermal actuator 200 includes a heater layer 228 disposed on the surface facing the plurality of beams and arranged to heat the plurality of beams. The heater layer is coupled to a heater layer input 238 and a heater layer output 240 and arranged to cause or form a heating of the plurality of beams.


The heater layer 228 can be thermally isolated from the substrate as described in U.S. Pat. No. 5,706,041 and No. 5,851,412 to Joel Kubby, both of which patents are incorporated by reference herein.


Further, in one embodiment, each beam of the plurality of beams is arranged to be heated by a beam heater current 246 supplied by an included beam input 242 and beam output 244, thus resulting in a heating of the plurality of beams.


The plurality of beams can be thermally isolated from the substrate as described in the application of Joel Kubby, U.S. patent application Ser. No. 09/683,533, filed Jan. 16, 2002, now U.S. Patent Application Publication No. 20030134445, published Jul. 17, 2003, which patent application is incorporated by reference herein.


As shown, the plurality of beams is arranged so that the heating of the plurality of beams causes a beam buckling and the coupling beam to translate in a predetermined direction 248. In one embodiment, the heating of the plurality of beams is supplied by the heater layer 228. In another embodiment, the heating of the plurality of beams is supplied by the beam heater current 246. In still another embodiment, the heating of the plurality of beams is supplied by a combination of the heater layer 228 and the beam heater current 246.


Referring generally to FIGS. 4-6, in one embodiment, each beam of the plurality of beams is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.


In one embodiment, each beam of the plurality of beams is fabricated in a device layer 230 of a silicon-on-insulator wafer 232.


A method for fabricating the plurality of beams in a device layer of a silicon-on-insulator wafer is described in the U.S. Patents to Phillip D. Floyd et al., U.S. Pat. No. 6,002,507 and No. 6,014,240; and in the U.S. Patents to Joel Kubby et al., U.S. Pat. No. 6,362,512 and No. 6,379,989, all of the foregoing patents being incorporated by reference herein.


In one embodiment, the first support 206 and second support 208 are fabricated in a buried oxide layer 234 of a silicon-on-insulator wafer 232.



FIGS. 7-9 depict the thermal actuator 300 in greater detail.


Referring now to FIG. 7, there is shown an elevated top-down “birds-eye” view of the thermal actuator 300, including a first reference line 8 and a second reference line 9. As shown, the thermal actuator 300 comprises a substrate 302 having a surface 304; a first support 306 and a second support 308 disposed on the surface and extending orthogonally therefrom, a plurality of beams extending in parallel between the first support and the second support, thus forming a beam array 314, each beam being agonic and substantially straight; each pair 322 of adjacent beams in the beam array defining a beam spacing with a corresponding beam spacing value, the pairs of adjacent beams in the beam array having beam spacing values that vary based on a predetermined pattern; and an included coupling beam 320 extending orthogonally across the beam array to couple each array beam substantially at its mid-point.


The predetermined pattern is characterized in that, across the beam array 314 from one side 350 of the beam array to the opposite side 352 of the beam array, successive beam spacing values do not decrease and at least sometimes increase.


Each beam of the beam array 314 has a beam width 326 with a corresponding beam width value, with all beams of the beam array having substantially the same beam width value.


As shown in FIG. 7, with cross-reference to FIGS. 8-9, in one embodiment, the thermal actuator 300 includes a heater layer 328 disposed on the surface facing the plurality of beams and arranged to heat the plurality of beams. The heater layer is coupled to a heater layer input 338 and a heater layer output 340, and is arranged to cause or form a heating of the plurality of beams.


Further, in one embodiment, each beam of the plurality of beams is arranged to be heated by a beam heater current 346 supplied by an included beam input 342 and beam output 344, thus resulting in a heating of the plurality of beams.


As shown, the plurality of beams is arranged so that the heating of the plurality of beams causes a beam buckling and the coupling beam to translate in a predetermined direction 348. In one embodiment, the heating of the plurality of beams is supplied by the heater layer 328. In another embodiment, the heating of the plurality of beams is supplied by the beam heater current 346. In still another embodiment, the heating of the plurality of beams is supplied by a combination of the heater layer 328 and the beam heater current 346.


Referring generally to FIGS. 7-9, in one embodiment, each beam of the plurality of beams is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.


In one embodiment, each beam of the plurality of beams is fabricated in a device layer 330 of a silicon-on-insulator wafer 332.


In one embodiment, the first support 306 and the second support 308 are fabricated in a buried oxide layer 334 of a silicon-on-insulator wafer 332.



FIGS. 10-12 depict the thermal actuator 400 in greater detail.


Referring now to FIG. 10, there is shown an elevated top-down “birds-eye” view of the thermal actuator 400, including a first reference line 11 and a second reference line 12. As shown, the thermal actuator 400 comprises a substrate 402 having a surface 404; a first support 406 and a second support 408 disposed on the surface and extending orthogonally therefrom, a plurality of beams 412a-412e extending in parallel between the first support and the second support, thus forming a beam array 414, each beam being agonic and substantially straight; each beam of the beam array having a beam resistance 436 with a corresponding beam resistance value, the beams in the beam array having beam resistance values that vary based on a predetermined pattern; and an included coupling beam 420 extending orthogonally across the beam array to couple each array beam substantially at its mid-point.


The predetermined pattern is characterized in that, across the beam array 414 from one side 450 of the beam array to the opposite side 452 of the beam array, successive beam resistance values do not increase and at least sometimes decrease.


Each beam of the beam array 414 has a beam width 426 with a corresponding beam width value, with all beams of the beam array having substantially the same beam width value.


Each pair 422 of adjacent beams in the beam array 414 defines a beam spacing 424 with a corresponding beam spacing value, with all such pairs of adjacent beams in the beam array having substantially the same beam spacing value.


As shown in FIG. 10, with cross-reference to FIGS. 11-12, in one embodiment, each beam of the plurality of beams is arranged to be heated by a beam heater current 446 supplied by an included beam input 442 and beam output 444, thus causing or forming a heating of the plurality of beams.


As shown, the plurality of beams is arranged so that the heating of the plurality of beams causes a beam buckling and the coupling beam to translate in a predetermined direction 448.


Referring generally to FIGS. 10-12, in one embodiment, the thermal actuator 400 comprises a microelectromechanical or “MEMS” structure that is fabricated by any of surface and bulk micromachining.


In one embodiment, each beam of the plurality of beams is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.


In one embodiment, each beam of the plurality of beams is fabricated in a device layer 430 of a silicon-on-insulator wafer 432.


In one embodiment, the first support 406 and the second support 408 are fabricated in a buried oxide layer 434 of a silicon-on-insulator wafer 432.


Referring again to FIGS. 4-6, there is described below a further aspect of the thermal actuator 200.


In FIGS. 4-6 there is shown the thermal actuator 200 comprising a substrate 202 having a surface 204; a first support 206 and a second support 208 disposed on the surface and extending orthogonally therefrom, a plurality of beams 212a-212d extending in parallel between the first support and the second support, thus forming a beam array 214, each beam being agonic and substantially straight; each beam of the beam array having a beam heating parameter 254 with a corresponding beam heating parameter value, the beams in the beam array having beam heating parameter values that vary based on a predetermined pattern; and an included coupling beam 220 extending orthogonally across the beam array to couple each array beam substantially at its mid-point.


An example of a beam heating parameter 254 is the beam width 226. The beam width w will effect the heat flow ∂Q/∂t through the beam under a temperature gradient ∂T/∂x as determined by Fourier's law of heat conduction in one dimension;

∂Q/∂t=λ(T)A∂T/∂x;

    • where the beam cross-section area A is given by the product of the beam width w and the beam thickness t;

      A=(w)(t);
    • and λ(T) is the temperature-dependent thermal conductivity of the beam. The beam width w will also effect the heat capacity of the beam, and thus the temperature of the beam as a function of time for a given heat input Q as given in one dimension by the heat equation;

      ρC∂T/∂t−λ(T)∂T2/∂x2=Q+h(text−T)
    • where ρ is the density of the beam, C is the heat capacity of the beam, h is the convective heat transfer coefficient, and Text is the external temperature. For a given beam thickness t, a wider beam width w will increase the heat capacity of the beam, and thus decrease the temperature the beam will reach after a certain amount of time for a given heat input Q.


A further example of a beam heating parameter 254 is the beam spacing 224. Heat can be transferred between beams by conduction, convection and radiation. The smaller the beam spacing, the greater the heat transfer between beams. Heat lost by one beam can be transferred to a nearby beam, and vice-versa. Heat can also be lost from beams by conduction, convection and radiation to the surrounding environment. The larger the beam spacing, the greater the heat loss from a beam to the surrounding environment.


A final example of a beam heating parameter 254 is the beam electrical resistance R. The beam resistance R will effect the amount of heat Q generated by a current I flowing through a beam with a resistance R for a time t by;

Q=I2Rt

    • as given by Joule's law.


Each beam of the beam array 214 is characterized by an average beam temperature 236a-236d, the average beam temperatures of the array beams thus forming an average beam temperature distribution 256. Further, there is provided heating means to heat each beam of the plurality of beams, thus causing or forming a heating of the plurality of beams. The heating means includes any of direct current Joule heating, by passing a beam heater current such as, for example, the beam current 246 through each beam, and indirect heating by conduction, convection or radiation from a heater layer such as, for example, the heater layer 228 disposed on the substrate, by passing a heater current through the heater layer. Further, in embodiments using a heater layer, the heater layer can be thermally isolated from the substrate as described in U.S. Pat. No. 5,706,041 and No. 5,851,412 to Joel Kubby, and in U.S. Pat. No. 6,362,512 to Joel Kubby et al., all of which patents are incorporated by reference herein.


The predetermined pattern is characterized in that, across the beam array 214 from one side 250 of the beam array to the opposite side 252 of the beam array, successive beam heating parameter values are arranged so that the beam temperature distribution becomes asymmetric based on the heating of the plurality of beams.


As shown, the plurality of beams is arranged so that the heating of the plurality of beams causes a beam buckling and the coupling beam 220 to translate in a predetermined direction 248.


Further heating of the plurality of the beams causes further expansion of the beams, thus causing the coupling beam to further translate in the predetermined direction 248.


In one embodiment, the heating of the plurality of beams comprises any of Joule heating, eddy current heating, conduction heating, convection heating and radiation heating.


Referring again to FIGS. 7-9, there is described below a further aspect of the thermal actuator 300.


In FIGS. 7-9 there is shown the thermal actuator 300 comprising a substrate 302 having a surface 304; a first support 306 and a second support 308 disposed on the surface and extending orthogonally therefrom, a plurality of beams 312a-312e extending in parallel between the first support and the second support, thus forming a beam array 314, each beam being agonic and substantially straight; each beam of the beam array having a beam heating parameter 354 with a corresponding beam heating parameter value, the beams in the beam array having beam heating parameter values that vary based on a predetermined pattern; and an included coupling beam 320 extending orthogonally across the beam array to couple each array beam substantially at its mid-point.


Each beam of the beam array 314 is characterized by an average beam temperature, the average beam temperatures of the array beams thus forming an average beam temperature distribution. Further, there is provided heating means to heat each beam of the plurality of beams, thus causing or forming a heating of the plurality of beams. The heating means includes any of direct current Joule heating, by passing a beam heater current such as, for example, the beam current 346 through each beam, and indirect heating by conduction, convection or radiation from a heater layer such as, for example, the heater layer 328 disposed on the substrate, by passing a heater current through the heater layer. Further, in embodiments using a heater layer, the heater layer can be thermally isolated from the substrate as described in U.S. Pat. No. 5,706,041 and No. 5,851,412 to Joel Kubby, and in U.S. Pat. No. 6,362,512 to Joel Kubby et al., all of which patents are incorporated by reference herein.


The predetermined pattern is characterized in that, across the beam array 314 from one side 350 of the beam array to the opposite side 352 of the beam array, successive beam heating parameter values are arranged so that the beam temperature distribution becomes asymmetric based on the heating of the plurality of beams.


As shown, the plurality of beams is arranged so that the heating of the plurality of beams causes a beam buckling and the coupling beam 320 to translate in a predetermined direction 348.


In one embodiment, the heating of the plurality of beams comprises any of Joule heating, eddy current heating, conduction heating, convection heating and radiation heating.


Referring again to FIGS. 10-12, there is described below a further aspect of the thermal actuator 400.


In FIGS. 10-12 there is shown the thermal actuator 400 comprising a substrate 402 having a surface 404; a first support 406 and a second support 408 disposed on the surface and extending orthogonally therefrom, a plurality of beams 412a-412e extending in parallel between the first support and the second support, thus forming a beam array 414, each beam being agonic and substantially straight; each beam of the beam array having a beam heating parameter 454 with a corresponding beam heating parameter value, the beams in the beam array having beam heating parameter values that vary based on a predetermined pattern; and an included coupling beam 420 extending orthogonally across the beam array to couple each array beam substantially at its mid-point.


Each beam of the beam array 414 is characterized by an average beam temperature, the average beam temperatures of the array beams thus forming an average beam temperature distribution. Further, there is provided heating means to heat each beam of the plurality of beams, thus causing or forming a heating of the plurality of beams. The heating means includes any of direct current Joule heating, by passing a beam heater current such as, for example, the beam current 446 through each beam, and indirect heating by conduction, convection or radiation from a heater layer such as, for example, the heater layer 428 disposed on the substrate, by passing a heater current through the heater layer. Further, in embodiments using a heater layer, the heater layer can be thermally isolated from the substrate as described in U.S. Pat. No. 5,706,041 and No. 5,851,412 to Joel Kubby, and in U.S. Pat. No. 6,362,512 to Joel Kubby et al., all of which patents are incorporated by reference herein.


The predetermined pattern is characterized in that, across the beam array 414 from one side 450 of the beam array to the opposite side 452 of the beam array, successive beam heating parameter values are arranged so that the beam temperature distribution becomes asymmetric based on the heating of the plurality of beams.


As shown, the plurality of beams is arranged so that the heating of the plurality of beams causes a beam buckling and the coupling beam 420 to translate in a predetermined direction 448.


In one embodiment, the heating of the plurality of beams comprises any of Joule heating, eddy current heating, conduction heating, convection heating and radiation heating.


Referring now to FIG. 13, there is shown a block diagram of an optical waveguide switch 100d comprising a fourth embodiment 500 of a thermal actuator. The thermal actuator 500 is described in greater detail in connection with FIGS. 19-24 below.


Referring now to FIG. 14, there is shown a block diagram of an optical waveguide switch 100e comprising a fifth embodiment 600 of a thermal actuator. The thermal actuator 600 is described in greater detail in connection with FIGS. 25-30 below.


Referring now to FIG. 15, there is shown a block diagram of an optical waveguide switch 100f comprising a sixth embodiment 700 of a thermal actuator. The thermal actuator 700 is described in greater detail in connection with FIGS. 31-36 below.


Referring now to FIG. 16, there is shown a block diagram of an optical waveguide switch 100g comprising a seventh embodiment 800 of a thermal actuator. The thermal actuator 800 is described in greater detail in connection with FIGS. 37-42 below.


Referring now to FIG. 17, there is shown a block diagram of an optical waveguide switch 100h comprising an eighth embodiment 900 of a thermal actuator. The thermal actuator 900 is described in greater detail in connection with FIGS. 43-48 below.


Referring now to FIG. 18, there is shown a block diagram of an optical waveguide switch 100i comprising a ninth embodiment 1000 of a thermal actuator. The thermal actuator 1000 is described in greater detail in connection with FIGS. 49-54 below.



FIGS. 19-24 depict the thermal actuator 500 in greater detail.


Referring now to FIG. 19, there is shown an elevated top-down “birds-eye” view of the thermal actuator 500, including five (5) reference lines numbered 20-24.


As shown in FIGS. 19-24, the thermal actuator 500 comprises a substrate 502 having a surface 504; a first support 506 and a second support 508 disposed on the surface 504 and extending orthogonally therefrom; a beam 510 extending between the first support 506 and the second support 508, the beam 510 having a first side 511, a second side 512, a beam length 518 and a beam mid-point 519, the beam 510 being substantially straight along the first side 511; the beam comprised of a plurality of beam segments 520, 522, 524, each beam segment of the plurality of beam segments having a beam segment width 525, 526, 527 orthogonal to the beam length 518, the beam 510 thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths 525, 526, 527 corresponding to the beam 510 vary along the beam length 518 based on a predetermined pattern; so that a heating of the beam 510 causes a beam buckling and the beam mid-point 519 to translate in a predetermined direction 548 generally normal to and outward from the second side 512.


As shown in FIG. 19, in one embodiment, the predetermined pattern is characterized in that, along the beam length 518 from the first support 506 to the beam mid-point 519, beam segment widths 525, 526 corresponding to successive beam segments 520, 522 do not decrease and at least sometimes increase, and along the beam length 518 from the beam mid-point 519 to the second support 508, beam segment widths 526, 527 corresponding to successive beam segments 522, 524 do not increase and at least sometimes decrease.


In one embodiment, the heating of the beam 510 is provided by an included heater layer 528 disposed on the surface 504, the heater layer coupled to a heater layer input 538 and a heater layer output 540.


In another embodiment, the heating of the beam 510 is provided by a beam heater current 546 supplied by an included beam input 542 and beam output 544.


In one embodiment, the beam is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.


In another embodiment, the beam is fabricated in a device layer of a silicon-on-insulator wafer.


As shown in FIG. 19, in one embodiment, the beam 510 comprises exactly three (3) beam segments 520, 522, 524.


In another embodiment, the beam 510 comprises a plurality (n) of beam segments, where n does not equal 3. In this embodiment, for example, n equals 2, 4, 5, 12, 15, 32, 82, 109, 188, 519, 1003, etc.


As shown in FIG. 19, in one embodiment, the beam 510 comprises exclusively beam segments 520, 522, 524 having substantially parallel sides.


As further shown in FIG. 19, in one embodiment, the beam 510 comprises exactly two (2) beam segments 520, 524 that are substantially equal with respect to their corresponding beam segment lengths and beam segment widths 525, 527.



FIGS. 25-30 depict the thermal actuator 600 in greater detail.


Referring now to FIG. 25, there is shown an elevated top-down “birds-eye” view of the thermal actuator 600, including five (5) reference lines numbered 26-30.


As shown in FIGS. 25-30, the thermal actuator 600 comprises a substrate 602 having a surface 604; a first support 606 and a second support 608 disposed on the surface 604 and extending orthogonally therefrom; a plurality of beams 610a, 610b, 610c extending in parallel between the first support 606 and the second support 608, thus forming a beam array 613; each beam 610a, 610b, 610c of the beam array 613 having a first side 611a, 611b, 611c, a second side 612a, 612b, 612c, a beam length 618 and a beam mid-point 619, each beam being substantially straight along its first side 611a, 611b, 611c; each beam 610a, 610b, 610c of the beam array 613 comprised of a plurality of beam segments 620, 622, 624, each beam segment of the plurality of beam segments having a beam segment width 625a, 626a, 627a; 625b, 626b, 627b; 625c, 626c, 627c orthogonal to the beam length 618, each beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths 625a, 626a, 627a; 625b, 626b, 627b; 625c, 626c, 627c corresponding to each beam 610a, 610b, 610c vary along the beam length 618 based on a predetermined pattern; an included coupling beam 614 extending orthogonally across the beam array 613 to couple each beam 610a, 610b, 610c of the beam array 613 substantially at the corresponding beam mid-point 619; so that a heating of the beam array causes a beam array buckling and the coupling beam 614 to translate in a predetermined direction 648 generally normal to and outward from the second sides 612a, 612b, 612c of the array beams 610a, 610b, 610c.


In one embodiment, the predetermined pattern is characterized in that, along the beam length 618 from the first support 606 to the beam mid-point 619, beam segment widths 625a, 626a, 627a; 625b, 626b, 627b corresponding to successive beam segments 620, 622 do not decrease and at least sometimes increase, and along the beam length 618 from the beam mid-point 619 to the second support 608, beam segment widths 625b, 626b, 627b; 625c, 626c, 627c corresponding to successive beam segments 622, 624 do not increase and at least sometimes decrease.


In one embodiment, the heating of the beam array is provided by an included heater layer 628 disposed on the surface 604, the heater layer coupled to a heater layer input 638 and a heater layer output 640.


In another embodiment, each beam of the beam array is heated by a beam heater current 646a, 646b, 646c supplied by an included beam input 642 and beam output 644, thus forming the heating of the beam array.


In one embodiment, each beam of the beam array is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.


In another embodiment, each beam of the beam array is fabricated in a device layer of a silicon-on-insulator wafer.


As shown in FIG. 25, in one embodiment, each beam 610a, 610b, 610c of the beam array 613 comprises exactly three (3) beam segments 620, 622, 624.


In another embodiment, each beam of the beam array 613 comprises a plurality (n) of beam segments, where n does not equal 3. In this embodiment, for example, n equals 2, 4, 5, 12, 15, 32, 82, 109, 188, 519, 1003, etc.


As shown in FIG. 25, in one embodiment, the beam array 613 comprises exactly three (3) beams.


In another embodiment, the beam array 613 comprises a plurality (n) of beams, where n does not equal 3. In this embodiment, for example, n equals 2, 4, 5, 12, 15, 32, 82, 109, 188, 519, 1003, etc.



FIGS. 31-36 depict the thermal actuator 700 in greater detail.


Referring now to FIG. 31, there is shown an elevated top-down “birds-eye” view of the thermal actuator 700, including five (5) reference lines numbered 32-36.


As shown in FIGS. 31-36, the thermal actuator 700 comprises a substrate 702 having a surface 704; a first support 706 and a second support 708 disposed on the surface 704 and extending orthogonally therefrom; a beam 710 extending between the first support 706 and the second support 708, the beam 710 having a first side 711, a second side 712, a beam length 718 and a beam mid-point 719, the beam 710 being substantially straight along the second side 712; the beam comprised of a plurality of beam segments 720, 722, 724, each beam segment of the plurality of beam segments being having a beam segment width 725, 726, 727 orthogonal to the beam length 718, the beam 710 thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths 725, 726, 727 corresponding to the beam 710 vary along the beam length 718 based on a predetermined pattern; so that a heating of the beam 710 causes a beam buckling and the beam mid-point 719 to translate in a predetermined direction 748 generally normal to and outward from the second side 712.


As shown in FIG. 31, in one embodiment, the predetermined pattern is characterized in that, along the beam length 718 from the first support 706 to the beam mid-point 719, beam segment widths 725, 726 corresponding to successive beam segments 720, 722 do not increase and at least sometimes decrease, and along the beam length 718 from the beam mid-point 719 to the second support 708, beam segment widths 726, 727 corresponding to successive beam segments 722, 724 do not decrease and at least sometimes increase.


In one embodiment, the heating of the beam 710 is provided by an included heater layer 728 disposed on the surface 704, the heater layer coupled to a heater layer input 738 and a heater layer output 740.


In another embodiment, the heating of the beam 710 is provided by a beam heater current 746 supplied by an included beam input 742 and beam output 744.


In one embodiment, the beam is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.


In another embodiment, the beam is fabricated in a device layer of a silicon-on-insulator wafer.


As shown in FIG. 31, in one embodiment, the beam 710 comprises exactly three (3) beam segments 720, 722, 724.


In another embodiment, the beam 710 comprises a plurality (n) of beam segments, where n does not equal 3. In this embodiment, for example, n equals 2, 4, 5, 12, 15, 32, 82, 109, 188, 519, 1003, etc.


As shown, in one embodiment, the beam 710 comprises exclusively beam segments 720, 722, 724 having substantially parallel sides.


As shown, in one embodiment, the beam 710 comprises exactly two (2) beam segments 720, 724 that are substantially equal with respect to their corresponding beam segment lengths and beam segment widths 725, 727.



FIGS. 37-42 depict the thermal actuator 800 in greater detail.


Referring now to FIG. 37, there is shown an elevated top-down “birds-eye” view of the thermal actuator 800, including five (5) reference lines numbered 38-42.


As shown in FIGS. 37-42, the thermal actuator 800 comprises a substrate 802 having a surface 804; a first support 806 and a second support 808 disposed on the surface 804 and extending orthogonally therefrom; a plurality of beams 810a, 810b, 810c extending in parallel between the first support 806 and the second support 808, thus forming a beam array 813; each beam 810a, 810b, 810c of the beam array 813 having a first side 811a, 811b, 811c, a second side 812a, 812b, 812c, a beam length 818 and a beam mid-point 819, each beam being substantially straight along its second side 812a, 812b, 812c; each beam 810a, 810b, 810c of the beam array 813 comprised of a plurality of beam segments 820, 822, 824, each beam segment of the plurality of beam segments having a beam segment width 825a, 826a, 827a; 825b, 826b, 827b; 825c, 826c, 827c orthogonal to the beam length 818, each beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths 825a, 826a, 827a; 825b, 826b, 827b; 825c, 826c, 827c corresponding to each beam 810a, 810b, 810c vary along the beam length 818 based on a predetermined pattern; an included coupling beam 814 extending orthogonally across the beam array 813 to couple each beam 810a, 810b, 810c of the beam array 813 substantially at the corresponding beam mid-point 819; so that a heating of the beam array causes a beam array buckling and the coupling beam 814 to translate in a predetermined direction 848 generally normal to and outward from the second sides 812a, 812b, 812c of the array beams 810a, 810b, 810c.


As shown in FIG. 37, in one embodiment, the predetermined pattern is characterized in that, along the beam length 818 from the first support 806 to the beam mid-point 819, beam segment widths 825a, 826a, 827a; 825b, 826b, 827b corresponding to successive beam segments 820, 822 do not increase and at least sometimes decrease, and along the beam length 818 from the beam mid-point 819 to the second support 808, beam segment widths 825b, 826b, 827b; 825c, 826c, 827c corresponding to successive beam segments 822, 824 do not decrease and at least sometimes increase.


In one embodiment, the heating of the beam array is provided by an included heater layer 828 disposed on the surface 804, the heater layer coupled to a heater layer input 838 and a heater layer output 840.


In another embodiment, each beam of the beam array is heated by a beam heater current 846a, 846b, 846c supplied by an included beam input 842 and beam output 844, thus forming the heating of the beam array.


In one embodiment, each beam of the beam array is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.


In another embodiment, each beam of the beam array is fabricated in a device layer of a silicon-on-insulator wafer.


As shown in FIG. 37, in one embodiment, each beam 810a, 810b, 810c of the beam array 813 comprises exactly three (3) beam segments 820, 822, 824.


In another embodiment, each beam of the beam array 813 comprises a plurality (n) of beam segments, where n does not equal 3. In this embodiment, for example, n equals 2, 4, 5, 12, 15, 32, 82, 109, 188, 519, 1003, etc.


As shown in FIG. 37, in one embodiment, the beam array 813 comprises exactly three (3) beams.


In another embodiment, the beam array 813 comprises a plurality (n) of beams, where n does not equal 3. In this embodiment, for example, n equals 2, 4, 5, 12, 15, 32, 82, 109, 188, 519, 1003, etc.



FIGS. 43-48 depict the thermal actuator 900 in greater detail.


Referring now to FIG. 43, there is shown an elevated top-down “birds-eye” view of the thermal actuator 900, including five (5) reference lines numbered 44-48.


As shown in FIGS. 43-48, the thermal actuator 900 comprises a substrate 902 having a surface 904; a first support 906 and a second support 908 disposed on the surface 904 and extending orthogonally therefrom; a beam 910 extending between the first support 906 and the second support 908, the beam 910 having a first side 911, a second side 912, a beam length 918 and a beam mid-point 919, the beam 910 being substantially straight along the first side 911; the beam comprised of a plurality of beam segments 920, 921, 922, 923, 924, each beam segment of the plurality of beam segments having a beam segment average width 925, 931, 926, 933, 927 orthogonal to the beam length 918, the beam 910 thus forming a corresponding plurality of beam segment average widths; wherein the plurality of beam segment average widths 925, 931, 926, 933, 927 corresponding to the beam 910 vary along the beam length 918 based on a predetermined pattern; so that a heating of the beam 910 causes a beam buckling and the beam mid-point 919 to translate in a predetermined direction 948 generally normal to and outward from the second side 912.


As shown in FIG. 43, in one embodiment, the predetermined pattern is characterized in that, along the beam length 918 from the first support 906 to the beam mid-point 919, beam segment average widths 925, 931, 926 corresponding to successive beam segments 920, 921, 922 do not decrease and at least sometimes increase, and along the beam length 918 from the beam mid-point 919 to the second support 908, beam segment average widths 926, 933, 927 corresponding to successive beam segments 922, 923, 924 do not increase and at least sometimes decrease.


Still referring to FIG. 43, it will be understood that the predetermined pattern of beam segment average widths 925, 931, 926, 933, 927 depicted therein corresponds to a first beam moment 956 and a second beam moment 958, as shown.


In one embodiment, the heating of the beam 910 is provided by an included heater layer 928 disposed on the surface 904, the heater layer coupled to a heater layer input 938 and a heater layer output 940.


In another embodiment, the heating of the beam 910 is provided by a beam heater current 946 supplied by an included beam input 942 and beam output 944.


In one embodiment, the beam is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.


In another embodiment, the beam is fabricated in a device layer of a silicon-on-insulator wafer.


As shown in FIG. 43, in one embodiment, the beam 910 comprises exactly five (5) beam segments 920, 921, 922, 923, 924.


In another embodiment, the beam 910 comprises a plurality (n) of beam segments, where n does not equal 5. In this embodiment, for example, n equals 2, 3, 4, 6, 12, 15, 32, 82, 109, 188, 519, 1003, etc.


As shown, in one embodiment, the beam 910 comprises exactly three (3) beam segments 920, 922, 924 having substantially parallel sides.


As shown, in one embodiment, the beam 910 comprises exactly two (2) beam segments 920, 924 that are substantially equal with respect to their corresponding beam segment lengths and beam segment widths 925, 927.



FIGS. 49-54 depict the thermal actuator 1000 in greater detail.


Referring now to FIG. 49, there is shown an elevated top-down “birds-eye” view of the thermal actuator 1000, including five (5) reference lines numbered 50-54.


As shown in FIGS. 49-54, the thermal actuator 1000 comprises a substrate 1002 having a surface 1004; a first support 1006 and a second support 1008 disposed on the surface 1004 and extending orthogonally therefrom; a plurality of beams 1010a, 1010b, 1010c extending in parallel between the first support 1006 and the second support 1008, thus forming a beam array 1009; each beam 1010a, 1010b, 1010c of the beam array 1009 having a first side 1011a, 1011b, 1011c, a second side 1012a, 1012b, 1012c, a beam length 1018 and a beam mid-point 1019, each beam being substantially straight along its first side 1011a, 1011b, 1011c; each beam 1010a, 1010b, 1010c of the beam array 1009 comprised of a plurality of beam segments 1020, 1021, 1022, 1023, 1024, each beam segment of the plurality of beam segments having a beam segment average width 1025a, 1031a, 1026a, 1033a, 1027a; 1025b, 1031b, 1026b, 1033b, 1027b; 1025c, 1031c, 1026c, 1033c, 1027c orthogonal to the beam length 1018, each beam thus forming a corresponding plurality of beam segment average widths; wherein the plurality of beam segment average widths 1025a, 1031a, 1026a, 1033a, 1027a; 1025b, 1031b, 1026b, 1033b, 1027b; 1025c, 1031c, 1026c, 1033c, 1027c corresponding to each beam 1010a, 1010b, 1010c vary along the beam length 1018 based on a predetermined pattern; an included coupling beam 1005 extending orthogonally across the beam array 1009 to couple each beam 1010a, 1010b, 1010c of the beam array 1009 substantially at the corresponding beam mid-point 1019; so that a heating of the beam array causes a beam array buckling and the coupling beam 1014 to translate in a predetermined direction 1048 generally normal to and outward from the second sides 1012a, 1012b, 1012c of the array beams 1010a, 1010b, 1010c.


As shown in FIG. 49, in one embodiment, the predetermined pattern is characterized in that, along the beam length 1018 from the first support 1006 to the beam mid-point 1019, beam segment average widths 1025a, 1031a, 1026a; 1025b, 1031b, 1026b; 1025c, 1031c, 1026c corresponding to successive beam segments 1020, 1021, 1022 do not decrease and at least sometimes increase, and along the beam length 1018 from the beam mid-point 1019 to the second support 1008, beam segment widths 1026a, 1033a, 1027a; 1026b, 1033b, 1027b; 1026c, 1033c, 1027c corresponding to successive beam segments 1022, 1023, 1024 do not increase and at least sometimes decrease.


Still referring to FIG. 49, it will be understood that the predetermined pattern of beam segment average widths 1025a, 1031a, 1026a, 1033a, 1027a; 1025b, 1031b, 1026b, 1033b, 1027b; 1025c, 1031c, 1026c, 1033c, 1027c depicted therein corresponds to a plurality of first beam moments 1056a, 1056b, 1056c and second beam moments 1058a, 1058b, 1058c, as shown.


In one embodiment, the heating of the beam array 1009 is provided by an included heater layer 1028 disposed on the surface 1004, the heater layer coupled to a heater layer input 1038 and a heater layer output 1040.


In another embodiment, each beam of the beam array 1009 is heated by a beam heater current 1046a, 1046b, 1046c supplied by an included beam input 1042 and beam output 1044, thus forming the heating of the beam array.


In one embodiment, each beam of the beam array is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.


In another embodiment, each beam of the beam array is fabricated in a device layer of a silicon-on-insulator wafer.


As shown in FIG. 49, in one embodiment, beam 1010a, 1010b, 1010c of the beam array 1009 comprises exactly five (5) beam segments 1020, 1021, 1022, 1023, 1024.


In another embodiment, each beam of the beam array 1009 comprises a plurality (n) of beam segments, where n does not equal 5. In this embodiment, for example, n equals 2, 3, 4, 6, 12, 15, 32, 82, 109, 188, 519, 1003, etc.


As shown in FIG. 49, in one embodiment, the beam array 1009 comprises exactly three (3) beams.


In another embodiment, the beam array 1009 comprises a plurality (n) of beams, where n does not equal 3. In this embodiment, for example, n equals 2, 4, 5, 12, 15, 32, 82, 109, 188, 519, 1003, etc.


The table below lists the drawing element reference numbers together with their corresponding written description:

Number:Description: 100aoptical waveguide switch comprising the thermalactuator 200 100boptical waveguide switch comprising the thermalactuator 300 100coptical waveguide switch comprising the thermalactuator 400 100doptical waveguide switch comprising the thermalactuator 500 100eoptical waveguide switch comprising the thermalactuator 600 100foptical waveguide switch comprising the thermalactuator 700 100goptical waveguide switch comprising the thermalactuator 800 100hoptical waveguide switch comprising the thermalactuator 900 100ioptical waveguide switch comprising the thermalactuator 1000 200first embodiment of a thermalactuator 202substrate 204surface of the substrate 202 206first support 208second support 210support spacing 212a-212dplurality of beams 214beam array 216first beam of the beam array 214 218last beam of the beam array 214 220coupling beam 222pair of adjacent beams in the beam array 214 224beam spacing 226beam width 228heater layer 230device layer 232silicon-on-insulator wafer 234buried oxide layer 236beam temperature 238heater layer input 240heater layer output 242beam input 244beam output 246beam heater current 248predetermined direction 250one side of the beam array 214 252opposite side of the beam array 214 254beam heating parameter 256beam temperature distribution of the beam array 214 300second embodiment of a thermal actuator 302substrate 304surface of the substrate 302 306first support 308second support 310support spacing 312a-312eplurality of beams 314beam array 316first beam of the beam array 314 318last beam of the beam array 314 320coupling beam 322pair of adjacent beams in the beam array 314 324beam spacing 326beam width 328heater layer 330device layer 332silicon-on-insulator wafer 334buried oxide layer 336beam resistance 338heater layer input 340heater layer output 342beam input 344beam output 346beam heater current 348predetermined direction 350one side of the beam array 314 352opposite side of the beam array 314 354beam heating parameter 400third embodiment of a thermal actuator 402substrate 404surface of the substrate 402 406first support 408second support 410support spacing 412a-412eplurality of beams 414beam array 416first beam of the beam array 414 418last beam of the beam array 414 420coupling beam 422pair of adjacent beams in the beam array 414 424beam spacing 426beam width 428heater layer 430device layer 432silicon-on-insulator wafer 434buried oxide layer 436beam resistance 438heater layer input 440heater layer output 442beam input 444beam output 446beam heater current 448predetermined direction 450one side of the beam array 414 452opposite side of the beam array 414 454beam heating parameter 500fourth embodiment of a thermal actuator 502substrate 504surface 506first support 508second support 510beam 511first beam side 512second beam side 515first beam segment neutral axis 516second beam segment neutral axis 517third beam segment neutral axis 518beam length 519beam mid-point 520first beam segment 522second beam segment 524third beam segment 525first beam segment width 526second beam segment width 527third beam segment width 528heater layer 530device layer 532handle wafer 534buried oxide layer 538substrate heater electrical input 540substrate heater electrical output 542beam heater electrical input 544beam heater electrical output 546beam heater current 548predetermined direction 554offset between first beam segment neutral axis 515 andsecond beam segment neutral axis 516 556first beam moment 557offset between second beam segment neutral axis 516 andthird beam segment neutral axis 517 558second beam moment 600fifth embodiment of a thermal actuator 602substrate 604surface 606first support 608second support 610a-610cplurality of beams 611a-611cfirst beam side 612a-612csecond beam side 613beam array 614coupling beam 615a-615cfirst beam segment neutral axis 616a-616csecond beam segment neutral axis 617a-617cthird beam segment neutral axis 618beam length 619beam mid-point 620first beam segment 622second beam segment 624third beam segment 625a-625cfirst beam segment width 626a-626csecond beam segment width 627a-627cthird beam segment width 628heater layer 630device layer 632handle wafer 634buried oxide layer 638substrate heater electrical input 640substrate heater electrical output 642beam heater electrical input 644beam heater electrical output 646a-646cbeam heater current 648predetermined direction 654a-654coffset between first beam segment neutral axis 615a-615cand second beam segment neutral axis 616a-616c 656a-656cfirst beam moment 657a-657coffset between second beam segment neutral axis 616a-616c and third beam segment neutral axis 617a-617c 658a-658csecond beam moment 700sixth embodiment of a thermal actuator 702substrate 704surface 706first support 708second support 710beam 711first beam side 712second beam side 715first beam segment neutral axis 716second beam segment neutral axis 717third beam segment neutral axis 718beam length 719beam mid-point 720first beam segment 722second beam segment 724third beam segment 725first beam segment width 726second beam segment width 727third beam segment width 728heater layer 730device layer 732handle wafer 734buried oxide layer 738substrate heater electrical input 740substrate heater electrical output 742beam heater electrical input 744beam heater electrical output 746beam heater current 748predetermined direction 754offset between first beam segment neutral axis 715 andsecond beam segment neutral axis 716 756first beam moment 757offset between second beam segment neutral axis 716 andthird beam segment neutral axis 717 758second beam moment 800seventh embodiment of a thermal actuator 802substrate 804surface 806first support 808second support 810a-810cplurality of beams 811a-811cfirst beam side 812a-812csecond beam side 813beam array 814coupling beam 815a-815cfirst beam segment neutral axis 816a-816csecond beam segment neutral axis 817a-817cthird beam segment neutral axis 818beam length 819beam mid-point 820first beam segment 822second beam segment 824third beam segment 825a-825cfirst beam segment width 826a-826csecond beam segment width 827a-827cthird beam segment width 828heater layer 830device layer 832handle wafer 834buried oxide layer 838substrate heater electrical input 840substrate heater electrical output 842beam heater electrical input 844beam heater electrical output 846a-846cbeam heater current 848predetermined direction 854a-854coffset between first beam segment neutral axis 815a-815cand second beam segment neutral axis 816a-816c 856a-856cfirst beam moment 857a-857coffset between second beam segment neutral axis 816a-816c and third beam segment neutral axis 817a-817c 858a-858csecond beam moment 900eighth embodiment of a thermal actuator 902substrate 904surface 906first support 908second support 910beam 911first beam side 912second beam side 913first beam segment neutral axis 914second beam segment neutral axis 915third beam segment neutral axis 916fourth beam segment neutral axis 917fifth beam segment neutral axis 918beam length 919beam mid-point 920first beam segment 921second beam segment 922third beam segment 923fourth beam segment 924fifth beam segment 925first beam segment average width 926third beam segment average width 927fifth beam segment average width 928heater layer 930device layer 931second beam segment average width 932substrate 933fourth beam segment average width 934buried oxide layer 938substrate heater electrical input 940substrate heater electrical output 942beam heater electrical input 944beam heater electrical output 946beam heater current 948predetermined direction 954offset between first beam segment neutral axis 913 andthird beam segment neutral axis 915 956first beam moment 957offset between third beam segment neutral axis 915 andfifth beam segment neutral axis 917 958second beam moment1000ninth embodiment of a thermal actuator1002substrate1004surface1005coupling beam1006first support1008second support1009beam array1010a-1010cplurality of beams1011a-1011cfirst beam side1012a-1012csecond beam side1013a-1013cfirst beam segment neutral axis1014a-1014csecond beam segment neutral axis1015a-1015cthird beam segment neutral axis1016a-1016cfourth beam segment neutral axis1017a-1017cfifth beam segment neutral axis1018beam length1019beam mid-point1020first beam segment1021second beam segment1022third beam segment1023fourth beam segment1024fifth beam segment1025a-1025cfirst beam segment average width1026a-1026cthird beam segment average width1027a-1027cfifth beam segment average width1028heater layer1030device layer1031a-1031csecond beam segment average width1032substrate1033a-1033cfourth beam segment average width1034buried oxide layer1038substrate heater electrical input1040substrate heater electrical output1042beam heater electrical input1044beam heater electrical output1046a-1046cbeam heater current1048predetermined direction1054a-1054coffset between first beam segment neutral axis 1013a-1013c and third beam segment neutral axis 1015a-1015c1056a-1056cfirst beam moment1057a-1057coffset between third beam segment neutral axis 1015a-1015c and fifth beam segment neutral axis 1017a-1017c1058a-1058csecond beam moment


While various embodiments of a thermal actuator and an optical waveguide switch including the same, in accordance with the present invention, have been described hereinabove, the scope of the invention is defined by the following claims.

Claims
  • 1. A thermal actuator comprising: a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a beam extending between the first support and the second support, the beam having a first side, a second side, a beam length and a beam mid-point, the beam being substantially straight along the first side; the beam comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment width orthogonal to the beam length, the beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to the beam vary along the beam length based on a predetermined pattern; so that a heating of the beam causes a beam buckling and the beam mid-point to translate in a predetermined direction generally normal to and outward from the second side.
  • 2. The thermal actuator of claim 1, the predetermined pattern characterized in that, along the beam length from the first support to the beam mid-point, beam segment widths corresponding to successive beam segments do not decrease and at least sometimes increase, and along the beam length from the beam mid-point to the second support, beam segment widths corresponding to successive beam segments do not increase and at least sometimes decrease.
  • 3. The thermal actuator of claim 2, the heating of the beam provided by an included heater layer disposed on the surface, the heater layer coupled to a heater layer input and a heater layer output.
  • 4. The thermal actuator of claim 2, the heating of the beam provided by a beam heater current supplied by an included beam input and beam output.
  • 5. The thermal actuator of claim 2, wherein the beam is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.
  • 6. The thermal actuator of claim 2, wherein the beam is fabricated in a device layer of a silicon-on-insulator wafer.
  • 7. The thermal actuator of claim 2, wherein the beam comprises exactly three (3) beam segments.
  • 8. The thermal actuator of claim 2, wherein the beam comprises a plurality (n) of beam segments, where n does not equal 3.
  • 9. The thermal actuator of claim 2, wherein the beam comprises exclusively beam segments having substantially parallel sides.
  • 10. The thermal actuator of claim 2, wherein the beam comprises exactly two (2) beam segments that are substantially equal with respect to their corresponding beam segment lengths and beam segment widths.
  • 11. A thermal actuator comprising: a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a plurality of beams extending in parallel between the first support and the second support, thus forming a beam array; each beam of the beam array having a first side, a second side, a beam length and a beam mid-point, each beam being substantially straight along its first side; each beam of the beam array comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment width orthogonal to the beam length, each beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to each beam vary along the beam length based on a predetermined pattern; an included coupling beam extending orthogonally across the beam array to couple each beam of the beam array substantially at the corresponding beam mid-point; so that a heating of the beam array causes a beam array buckling and the coupling beam to translate in a predetermined direction generally normal to and outward from the second sides of the array beams.
  • 12. The thermal actuator of claim 11, the predetermined pattern characterized in that, along the beam length from the first support to the beam mid-point, beam segment widths corresponding to successive beam segments do not decrease and at least sometimes increase, and along the beam length from the beam mid-point to the second support, beam segment widths corresponding to successive beam segments do not increase and at least sometimes decrease.
  • 13. The thermal actuator of claim 12, the heating of the beam array provided by an included heater layer disposed on the surface, the heater layer coupled to a heater layer input and a heater layer output.
  • 14. The thermal actuator of claim 12, wherein each beam of the beam array is heated by a beam heater current supplied by an included beam input and beam output, thus forming the heating of the beam array.
  • 15. The thermal actuator of claim 12, wherein each beam of the beam array is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.
  • 16. The thermal actuator of claim 12, wherein each beam of the beam array is fabricated in a device layer of a silicon-on-insulator wafer.
  • 17. The thermal actuator of claim 12, wherein each beam of the beam array comprises exactly three (3) beam segments.
  • 18. The thermal actuator of claim 12, wherein each beam of the beam array comprises a plurality (n) of beam segments, where n does not equal 3.
  • 19. The thermal actuator of claim 12, wherein the beam array comprises exactly three (3) beams.
  • 20. The thermal actuator of claim 12, wherein the beam array comprises a plurality (n) of beams, where n does not equal 3.
  • 21. A thermal actuator comprising: a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a beam extending between the first support and the second support, the beam having a first side, a second side, a beam length and a beam mid-point, the beam being substantially straight along the second side; the beam comprised of a plurality of beam segments, each beam segment of the plurality of beam segments being having a beam segment width orthogonal to the beam length, the beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to the beam vary along the beam length based on a predetermined pattern; so that a heating of the beam causes a beam buckling and the beam mid-point to translate in a predetermined direction generally normal to and outward from the second side.
  • 22. The thermal actuator of claim 21, the predetermined pattern characterized in that, along the beam length from the first support to the beam mid-point, beam segment widths corresponding to successive beam segments do not increase and at least sometimes decrease, and along the beam length from the beam mid-point to the second support, beam segment widths corresponding to successive beam segments do not decrease and at least sometimes increase.
  • 23. The thermal actuator of claim 22, the heating of the beam provided by an included heater layer disposed on the surface, the heater layer coupled to a heater layer input and a heater layer output.
  • 24. The thermal actuator of claim 22, the heating of the beam provided by a beam heater current supplied by an included beam input and beam output.
  • 25. The thermal actuator of claim 22, wherein the beam is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.
  • 26. The thermal actuator of claim 22, wherein the beam is fabricated in a device layer of a silicon-on-insulator wafer.
  • 27. The thermal actuator of claim 22, wherein the beam comprises exactly three (3) beam segments.
  • 28. The thermal actuator of claim 22, wherein the beam comprises a plurality (n) of beam segments, where n does not equal 3.
  • 29. The thermal actuator of claim 22, wherein the beam comprises exclusively beam segments having substantially parallel sides.
  • 30. The thermal actuator of claim 22, wherein the beam comprises exactly two (2) beam segments that are substantially equal with respect to their corresponding beam segment lengths and beam segment widths.
  • 31. A thermal actuator comprising: a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a plurality of beams extending in parallel between the first support and the second support, thus forming a beam array; each beam of the beam array having a first side, a second side, a beam length and a beam mid-point, each beam being substantially straight along its second side; each beam of the beam array comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment width orthogonal to the beam length, each beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to each beam vary along the beam length based on a predetermined pattern; an included coupling beam extending orthogonally across the beam array to couple each beam of the beam array substantially at the corresponding beam mid-point; so that a heating of the beam array causes a beam array buckling and the coupling beam to translate in a predetermined direction generally normal to and outward from the second sides of the array beams.
  • 32. The thermal actuator of claim 31, the predetermined pattern characterized in that, along the beam length from the first support to the beam mid-point, beam segment widths corresponding to successive beam segments do not increase and at least sometimes decrease, and along the beam length from the beam mid-point to the second support, beam segment widths corresponding to successive beam segments do not decrease and at least sometimes increase.
  • 33. The thermal actuator of claim 32, the heating of the beam array provided by an included heater layer disposed on the surface, the heater layer coupled to a heater layer input and a heater layer output.
  • 34. The thermal actuator of claim 32, wherein each beam of the beam array is heated by a beam heater current supplied by an included beam input and beam output, thus forming the heating of the beam array.
  • 35. The thermal actuator of claim 32, wherein each beam of the beam array is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.
  • 36. The thermal actuator of claim 32, wherein each beam of the beam array is fabricated in a device layer of a silicon-on-insulator wafer.
  • 37. The thermal actuator of claim 32, wherein each beam of the beam array comprises exactly three (3) beam segments.
  • 38. The thermal actuator of claim 32, wherein each beam of the beam array comprises a plurality (n) of beam segments, where n does not equal 3.
  • 39. The thermal actuator of claim 32, wherein the beam array comprises exactly three (3) beams.
  • 40. The thermal actuator of claim 32, wherein the beam array 813 comprises a plurality (n) of beams, where n does not equal 3.
  • 41. A thermal actuator comprising: a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a beam extending between the first support and the second support, the beam having a first side, a second side, a beam length and a beam mid-point, the beam being substantially straight along the first side; the beam comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment average width orthogonal to the beam length, the beam thus forming a corresponding plurality of beam segment average widths; wherein the plurality of beam segment average widths corresponding to the beam vary along the beam length based on a predetermined pattern; so that a heating of the beam causes a beam buckling and the beam mid-point to translate in a predetermined direction generally normal to and outward from the second side.
  • 42. The thermal actuator of claim 41, the predetermined pattern characterized in that, along the beam length from the first support to the beam mid-point, beam segment average widths corresponding to successive beam segments do not decrease and at least sometimes increase, and along the beam length from the beam mid-point to the second support, beam segment average widths corresponding to successive beam segments do not increase and at least sometimes decrease.
  • 43. The thermal actuator of claim 42, the heating of the beam provided by an included heater layer disposed on the surface, the heater layer coupled to a heater layer input and a heater layer output.
  • 44. The thermal actuator of claim 42, the heating of the beam provided by a beam heater current supplied by an included beam input and beam output.
  • 45. The thermal actuator of claim 42, wherein the beam is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.
  • 46. The thermal actuator of claim 42, wherein the beam is fabricated in a device layer of a silicon-on-insulator wafer.
  • 47. The thermal actuator of claim 42, wherein the beam comprises exactly five (5) beam segments.
  • 48. The thermal actuator of claim 42, wherein the beam comprises a plurality (n) of beam segments, where n does not equal 5.
  • 49. The thermal actuator of claim 42, wherein the beam comprises exactly three (3) beam segments having substantially parallel sides.
  • 50. The thermal actuator of claim 42, wherein the beam comprises exactly two (2) beam segments that are substantially equal with respect to their corresponding beam segment lengths and beam segment widths.
  • 51. A thermal actuator comprising: a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a plurality of beams extending in parallel between the first support and the second support, thus forming a beam array; each beam of the beam array having a first side, a second side, a beam length and a beam mid-point, each beam being substantially straight along its first side; each beam of the beam array comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment average width orthogonal to the beam length, each beam thus forming a corresponding plurality of beam segment average widths; wherein the plurality of beam segment average widths corresponding to each beam vary along the beam length based on a predetermined pattern; an included coupling beam extending orthogonally across the beam array to couple each beam of the beam array substantially at the corresponding beam mid-point; so that a heating of the beam array causes a beam array buckling and the coupling beam to translate in a predetermined direction generally normal to and outward from the second sides of the array beams.
  • 52. The thermal actuator of claim 51, the predetermined pattern characterized in that, along the beam length from the first support to the beam mid-point, beam segment average widths corresponding to successive beam segments do not decrease and at least sometimes increase, and along the beam length from the beam mid-point to the second support, beam segment widths corresponding to successive beam segments do not increase and at least sometimes decrease.
  • 53. The thermal actuator of claim 52, the heating of the beam array provided by an included heater layer disposed on the surface, the heater layer coupled to a heater layer input and a heater layer output.
  • 54. The thermal actuator of claim 52, wherein each beam of the beam array is heated by a beam heater current by an included beam input and beam output, thus forming the heating of the beam array.
  • 55. The thermal actuator of claim 52, wherein each beam of the beam array is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.
  • 56. The thermal actuator of claim 52, wherein each beam of the beam array is fabricated in a device layer of a silicon-on-insulator wafer.
  • 57. The thermal actuator of claim 52, wherein each beam of the beam array comprises exactly five (5) beam segments.
  • 58. The thermal actuator of claim 52, wherein each beam of the beam array comprises a plurality (n) of beam segments, where n does not equal 5.
  • 59. The thermal actuator of claim 52, wherein the beam array comprises exactly three (3) beams.
  • 60. The thermal actuator of claim 52, wherein the beam array comprises a plurality (n) of beams, where n does not equal 3.
  • 61. An optical waveguide switch comprising a thermal actuator, the thermal actuator comprising: a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a beam extending between the first support and the second support, the beam having a first side, a second side, a beam length and a beam mid-point, the beam being substantially straight along the first side; the beam comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment width orthogonal to the beam length, the beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to the beam vary along the beam length based on a predetermined pattern; so that a heating of the beam causes a beam buckling and the beam mid-point to translate in a predetermined direction generally normal to and outward from the second side.
  • 62. The optical waveguide switch of claim 61, the predetermined pattern characterized in that, along the beam length from the first support to the beam mid-point, beam segment widths corresponding to successive beam segments do not decrease and at least sometimes increase, and along the beam length from the beam mid-point to the second support, beam segment widths corresponding to successive beam segments do not increase and at least sometimes decrease.
  • 63. The optical waveguide switch of claim 62, the heating of the beam provided by an included heater layer disposed on the surface, the heater layer coupled to a heater layer input and a heater layer output.
  • 64. The optical waveguide switch of claim 62, the heating of the beam provided by a beam heater current supplied by an included beam input and beam output.
  • 65. The optical waveguide switch of claim 62, wherein the beam is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.
  • 66. The optical waveguide switch of claim 62, wherein the beam is fabricated in a device layer of a silicon-on-insulator wafer.
  • 67. The optical waveguide switch of claim 62, wherein the beam comprises a plurality (n) of beam segments, where n does not equal 3.
  • 68. The optical waveguide switch of claim 62, wherein the beam comprises exactly three (3) beam segments.
  • 69. The optical waveguide switch of claim 62, wherein the beam comprises exclusively beam segments having substantially parallel sides.
  • 70. The optical waveguide switch of claim 62, wherein the beam comprises exactly two (2) beam segments that are substantially equal with respect to their corresponding beam segment lengths and beam segment widths.
  • 71. An optical waveguide switch comprising a thermal actuator, the thermal actuator comprising: a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a plurality of beams extending in parallel between the first support and the second support, thus forming a beam array; each beam of the beam array having a first side, a second side, a beam length and a beam mid-point, each beam being substantially straight along its first side; each beam of the beam array comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment width orthogonal to the beam length, each beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to each beam vary along the beam length based on a predetermined pattern; an included coupling beam extending orthogonally across the beam array to couple each beam of the beam array substantially at the corresponding beam mid-point; so that a heating of the beam array causes a beam array buckling and the coupling beam to translate in a predetermined direction generally normal to and outward from the second sides of the array beams.
  • 72. The optical waveguide switch of claim 71, the predetermined pattern characterized in that, along the beam length from the first support to the beam mid-point, beam segment widths corresponding to successive beam segments do not decrease and at least sometimes increase, and along the beam length from the beam mid-point to the second support, beam segment widths corresponding to successive beam segments do not increase and at least sometimes decrease.
  • 73. The optical waveguide switch of claim 72, the heating of the beam array provided by an included heater layer disposed on the surface, the heater layer coupled to a heater layer input and a heater layer output.
  • 74. The optical waveguide switch of claim 72, wherein each beam of the beam array is heated by a beam heater current supplied by an included beam input and beam output, thus forming the heating of the beam array.
  • 75. The optical waveguide switch of claim 72, wherein each beam of the beam array is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.
  • 76. The optical waveguide switch of claim 72, wherein each beam of the beam array is fabricated in a device layer of a silicon-on-insulator wafer.
  • 77. The optical waveguide switch of claim 72, wherein each beam of the beam array comprises a plurality (n) of beam segments, where n does not equal 3.
  • 78. The optical waveguide switch of claim 72, wherein each beam of the beam array comprises exactly three (3) beam segments.
  • 79. The optical waveguide switch of claim 72, wherein the beam array comprises a plurality (n) of beams, where n does not equal 3.
  • 80. The optical waveguide switch of claim 72, wherein the beam array comprises exactly three (3) beams.
  • 81. An optical waveguide switch comprising a thermal actuator, the thermal actuator comprising: a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a beam extending between the first support and the second support, the beam having a first side, a second side, a beam length and a beam mid-point, the beam being substantially straight along the second side; the beam comprised of a plurality of beam segments, each beam segment of the plurality of beam segments being having a beam segment width orthogonal to the beam length, the beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to the beam vary along the beam length based on a predetermined pattern; so that a heating of the beam causes a beam buckling and the beam mid-point to translate in a predetermined direction generally normal to and outward from the second side.
  • 82. The optical waveguide switch of claim 81, the predetermined pattern characterized in that, along the beam length from the first support to the beam mid-point, beam segment widths corresponding to successive beam segments do not increase and at least sometimes decrease, and along the beam length from the beam mid-point to the second support, beam segment widths corresponding to successive beam segments do not decrease and at least sometimes increase.
  • 83. The optical waveguide switch of claim 82, the heating of the beam provided by an included heater layer disposed on the surface, the heater layer coupled to a heater layer input and a heater layer output.
  • 84. The optical waveguide switch of claim 82, the heating of the beam provided by a beam heater current supplied by an included beam input and beam output.
  • 85. The optical waveguide switch of claim 82, wherein the beam is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.
  • 86. The optical waveguide switch of claim 82, wherein the beam is fabricated in a device layer of a silicon-on-insulator wafer.
  • 87. The optical waveguide switch of claim 82, wherein the beam comprises a plurality (n) of beam segments, where n does not equal 3.
  • 88. The optical waveguide switch of claim 82, wherein the beam comprises exactly three (3) beam segments.
  • 89. The optical waveguide switch of claim 82, wherein the beam comprises exclusively beam segments having substantially parallel sides.
  • 90. The thermal actuator of claim 82, wherein the beam comprises exactly two (2) beam segments that are substantially equal with respect to their corresponding beam segment lengths and beam segment widths.
  • 91. An optical waveguide switch comprising a thermal actuator, the thermal actuator comprising: a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a plurality of beams extending in parallel between the first support and the second support, thus forming a beam array; each beam of the beam array having a first side, a second side, a beam length and a beam mid-point, each beam being substantially straight along its second side; each beam of the beam array comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment width orthogonal to the beam length, each beam thus forming a corresponding plurality of beam segment widths; wherein the plurality of beam segment widths corresponding to each beam vary along the beam length based on a predetermined pattern; an included coupling beam extending orthogonally across the beam array to couple each beam of the beam array substantially at the corresponding beam mid-point; so that a heating of the beam array causes a beam array buckling and the coupling beam to translate in a predetermined direction generally normal to and outward from the second sides of the array beams.
  • 92. The optical waveguide switch of claim 91, the predetermined pattern characterized in that, along the beam length from the first support to the beam mid-point, beam segment widths corresponding to successive beam segments do not increase and at least sometimes decrease, and along the beam length from the beam mid-point to the second support, beam segment widths corresponding to successive beam segments do not decrease and at least sometimes increase.
  • 93. The optical waveguide switch of claim 92, the heating of the beam array provided by an included heater layer disposed on the surface, the heater layer coupled to a heater layer input and a heater layer output.
  • 94. The optical waveguide switch of claim 92, wherein each beam of the beam array is heated by a beam heater current supplied by an included beam input and beam output, thus forming the heating of the beam array.
  • 95. The optical waveguide switch of claim 92, wherein each beam of the beam array is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.
  • 96. The optical waveguide switch of claim 92, wherein each beam of the beam array is fabricated in a device layer of a silicon-on-insulator wafer.
  • 97. The optical waveguide switch of claim 92, wherein each beam of the beam array 813 comprises a plurality (n) of beam segments, where n does not equal 3.
  • 98. The optical waveguide switch of claim 92, wherein each beam of the beam array comprises exactly three (3) beam segments.
  • 99. The optical waveguide switch of claim 92, wherein the beam array comprises a plurality (n) of beams, where n does not equal 3.
  • 100. The optical waveguide switch of claim 92, wherein the beam array comprises exactly three (3) beams.
  • 101. An optical waveguide switch comprising a thermal actuator, the thermal actuator comprising: a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a beam extending between the first support and the second support, the beam having a first side, a second side, a beam length and a beam mid-point, the beam being substantially straight along the first side; the beam comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment average width orthogonal to the beam length, the beam thus forming a corresponding plurality of beam segment average widths; wherein the plurality of beam segment average widths corresponding to the beam vary along the beam length based on a predetermined pattern; so that a heating of the beam causes a beam buckling and the beam mid-point to translate in a predetermined direction generally normal to and outward from the second side.
  • 102. The optical waveguide switch of claim 101, the predetermined pattern characterized in that, along the beam length from the first support to the beam mid-point, beam segment average widths corresponding to successive beam segments do not decrease and at least sometimes increase, and along the beam length from the beam mid-point to the second support, beam segment average widths corresponding to successive beam segments do not increase and at least sometimes decrease.
  • 103. The optical waveguide switch of claim 102, the heating of the beam provided by an included heater layer disposed on the surface, the heater layer coupled to a heater layer input and a heater layer output.
  • 104. The optical waveguide switch of claim 102, the heating of the beam provided by a beam heater current supplied by an included beam input and beam output.
  • 105. The optical waveguide switch of claim 102, wherein the beam is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.
  • 106. The optical waveguide switch of claim 102, wherein the beam is fabricated in a device layer of a silicon-on-insulator wafer.
  • 107. The optical waveguide switch of claim 102, wherein the beam comprises a plurality (n) of beam segments, where n does not equal 5.
  • 108. The optical waveguide switch of claim 102, wherein the beam comprises exactly five (5) beam segments.
  • 109. The optical waveguide switch of claim 102, wherein the beam comprises exactly three (3) beam segments having substantially parallel sides.
  • 110. The optical waveguide switch of claim 102, wherein the beam comprises exactly two (2) beam segments that are substantially equal with respect to their corresponding beam segment lengths and beam segment widths.
  • 111. An optical waveguide switch comprising a thermal actuator, the thermal actuator comprising: a substrate having a surface; a first support and a second support disposed on the surface and extending orthogonally therefrom; a plurality of beams extending in parallel between the first support and the second support, thus forming a beam array; each beam of the beam array having a first side, a second side, a beam length and a beam mid-point, each beam being substantially straight along its first side; each beam of the beam array comprised of a plurality of beam segments, each beam segment of the plurality of beam segments having a beam segment average width orthogonal to the beam length, each beam thus forming a corresponding plurality of beam segment average widths; wherein the plurality of beam segment average widths corresponding to each beam vary along the beam length based on a predetermined pattern; an included coupling beam extending orthogonally across the beam array to couple each beam of the beam array substantially at the corresponding beam mid-point; so that a heating of the beam array causes a beam array buckling and the coupling beam to translate in a predetermined direction generally normal to and outward from the second sides of the array beams.
  • 112. The optical waveguide switch of claim 111, the predetermined pattern characterized in that, along the beam length from the first support to the beam mid-point, beam segment average widths corresponding to successive beam segments do not decrease and at least sometimes increase, and along the beam length from the beam mid-point to the second support, beam segment widths corresponding to successive beam segments do not increase and at least sometimes decrease.
  • 113. The optical waveguide switch of claim 112, the heating of the beam array provided by an included heater layer disposed on the surface, the heater layer coupled to a heater layer input and a heater layer output.
  • 114. The optical waveguide switch of claim 112, wherein each beam of the beam array is heated by a beam heater current supplied by an included beam input and beam output, thus forming the heating of the beam array.
  • 115. The optical waveguide switch of claim 112, wherein each beam of the beam array is fabricated of a low-conductivity material of either monocrystalline silicon or polycrystalline silicon.
  • 116. The optical waveguide switch of claim 112, wherein each beam of the beam array is fabricated in a device layer of a silicon-on-insulator wafer.
  • 117. The optical waveguide switch of claim 112, wherein each beam of the beam array comprises a plurality (n) of beam segments, where n does not equal 5.
  • 118. The optical waveguide switch of claim 112, wherein each beam of the beam array comprises exactly five (5) beam segments.
  • 119. The optical waveguide switch of claim 112, wherein the beam array comprises a plurality (n) of beams, where n does not equal 3.
  • 120. The optical waveguide switch of claim 112, wherein the beam array comprises exactly three (3) beams.
CROSS-REFERENCE TO RELATED APPLICATION

This is a continuation-in-part of its commonly-assigned “parent” prior application Ser. No. 10/634,941, filed 5 Aug. 2003, now pending, attorney docket D/A3207, by Joel A. Kubby et al., the same inventors as in the present application, entitled “A thermal actuator and an optical waveguide switch including the same”, the disclosure of which prior application is hereby incorporated by reference verbatim, with the same effect as though such disclosure were fully and completely set forth herein. This application is related to the commonly-assigned application number ______, filed on the same date as the present application, now pending, attorney docket D/A3207IQ, by Joel A. Kubby et al., the same inventors as in the present application, entitled “A thermal actuator with offset beam segment neutral axes and an optical waveguide switch including the same”.

Continuation in Parts (1)
Number Date Country
Parent 10634941 Aug 2003 US
Child 10772564 Feb 2004 US