Patent Application
20230253663
This disclosure relates generally to a thermal barrier system and, more particularly, to a thermal barrier system of a busbar assembly within a traction battery.
A battery pack of an electrified vehicle can include groups of battery cells arranged in one or more battery arrays. Busbars can be used to distribute electrical power to and from the battery cells, and to and from the battery pack.
In some aspects, the techniques described herein relate to a busbar assembly, including: a busbar core configured to electrically couple a first component to a second component, the busbar core having a first connection portion that directly connects the busbar core to the first component, and a second connection portion that directly connects the busbar core to the second a component; and a thermal barrier system that covers the busbar core including the first connection portion, the second connection portion, or both.
In some aspects, the techniques described herein relate to a busbar assembly, wherein the first component is a first battery array of a traction battery pack.
In some aspects, the techniques described herein relate to a busbar assembly, wherein the second component is a second battery array of the traction battery pack.
In some aspects, the techniques described herein relate to a busbar assembly, wherein the first connection portion directly contacts a terminal of the first battery array.
In some aspects, the techniques described herein relate to a busbar assembly, further including a mechanical fastener directly securing the first connection portion to the terminal.
In some aspects, the techniques described herein relate to a busbar assembly, further including an overmolded cap of the mechanical fastener.
In some aspects, the techniques described herein relate to a busbar assembly, further including a hinged lid of the thermal barrier system, the hinged lid configured to pivotably connect to another portion of the thermal barrier system such that the hinged lid is pivotable to a position covering the first connection portion and the mechanical fastener.
In some aspects, the techniques described herein relate to a busbar assembly, further including a snap-fit lid and a snap-fit base of the thermal barrier system, the snap-fit lid and snap-fit base configured to snap together to cover the first connection portion and the mechanical fastener.
In some aspects, the techniques described herein relate to a busbar assembly, wherein the thermal barrier system is a polymer or polymer-based material.
In some aspects, the techniques described herein relate to a busbar assembly, wherein the busbar core is a metal or metal alloy.
In some aspects, the techniques described herein relate to a busbar assembly, wherein the thermal barrier system is at least partially an overmolded thermal barrier system that is overmolded to a portion of the busbar core.
In some aspects, the techniques described herein relate to a busbar assembly, wherein the thermal barrier system is at least partially a snap-fit thermal barrier system that snap-fits about at least a portion of the busbar core.
In some aspects, the techniques described herein relate to a busbar assembly, wherein the thermal barrier system includes a tape that is adhesively secured to the busbar core.
In some aspects, the techniques described herein relate to a busbar assembly, wherein the thermal barrier system includes a coating that is adhesively secured to the busbar core.
In some aspects, the techniques described herein relate to a busbar assembly, wherein the thermal barrier system covers both the first connection portion and the second connection portion.
In some aspects, the techniques described herein relate to a method of reducing thermal energy transfer within a battery pack, including; connecting a connection portion of a busbar core directly to a first component; using the busbar core to electrically couple the first component to a second component; and covering areas of the busbar core with a thermal barrier system, the areas including the connection portion.
In some aspects, the techniques described herein relate to a method, wherein the thermal barrier system is overmolded to the busbar core.
In some aspects, the techniques described herein relate to a method, wherein the thermal barrier system is snap-fit to the busbar core.
In some aspects, the techniques described herein relate to a method, further including connecting the connection portion of the busbar core directly to the first component using a mechanical fastener.
In some aspects, the techniques described herein relate to a method, further including connecting the connection portion of the busbar core directly to a terminal of the first component.
The embodiments, examples and alternatives of the preceding paragraphs, the claims, or the following description and drawings, including any of their various aspects or respective individual features, may be taken independently or in any combination. Features described in connection with one embodiment are applicable to all embodiments, unless such features are incompatible.
The various features and advantages of the disclosed examples will become apparent to those skilled in the art from the detailed description. The figures that accompany the detailed description can be briefly described as follows:
A typical traction battery pack includes an enclosure having an interior. Battery arrays and other components are held within the interior. Busbars can be used to electrically couple the battery arrays and other components. Busbars can be used to electrically couple the traction battery pack with components outside the interior.
This disclosure details a thermal barrier for a busbar. The busbar is associated with a battery array of the traction battery pack. The thermal barrier can be an electrically non-conductive protective layer. The thermal barrier can help to slow consumption of the busbar during a thermal event. This can reduce a likelihood of the thermal event extending to another battery array of the battery pack.
With reference to
The battery pack 14 is, in the exemplary embodiment, secured to an underbody 26 of the electrified vehicle 10. The battery pack 14 could be located elsewhere on the electrified vehicle 10 in other examples. The battery pack 14 can be secured to the underbody 26 using straps and mechanical fasteners, for example.
The electrified vehicle 10 is an all-electric vehicle. In other examples, the electrified vehicle 10 is a hybrid electric vehicle, which selectively drives wheels using torque provided by an internal combustion engine instead, or in addition to, an electric machine. Generally, the electrified vehicle 10 could be any type of vehicle having a traction battery pack.
Referring now to
With reference now to
The example busbar 38 is busbar assembly having a busbar core 54 that is substantially covered by a thermal barrier system 58. The busbar core 54 includes connection portions 56, which, in this example, are the portions of the busbar 38 that are directly connected to the terminals 46.
As known, a thermal event can be a rapid increase in temperature within a battery array. The thermal event can be due to overcharging, overdischarging, or short circuits, for example.
During a cell thermal propagation event, the thermal barrier system 58 can help to slow the rate at which thermal energy is transferred from the battery environment through the busbar 38 and the rate at which the busbar 38 is consumed. Retaining the non-conductive material can help to isolate electrical energy to a busbar connection point, such as the connection point of
The busbar core 54, is a metal or metal alloy. In the exemplary embodiment, the busbar core 54 is copper. Electrical power is transferred through the busbar core 54 part of the busbar 38.
In the exemplary embodiment, the thermal barrier system 58 is a polymer-based material that is overmolded onto the busbar 38. The polymer-based material can be a material configured to withstand exposure to temperatures from 700 to 800 degrees Celsius continuously for five minutes. The material can additionally be configured to withstand a temperature of up to 1000 degrees Celsius for less than 40 seconds.
The material can be non-halogenated and can have a relatively high dielectric strength and a high Comparative Tracking Index of approximately 600 Volts or more.
In specific examples, the polymeric material of the thermal barrier system 58 consists of long/short glass fibers that provide an integrated inorganic additive. The additive can be an intumescent material that is included with the polymeric resin. In some examples, the high-temperature polymer materials can create a char layer when exposed to a temperature above 140 degrees Celsius, which can establish a thermal barrier and increase thermal resistance in order to help prevent an electrical short through the busbar 38 from one battery array 34 to another, and through other metals in the electrical path.
Referring to the thermal barrier as overmolded implicates structure. A person having skill in this art would be able to structurally distinguish a thermal barrier that is overmolded to a busbar core from a thermal barrier that is not overmolded to a busbar core.
Notably, the thermal barrier system 58 covers the connection portions 56 of the busbar 38, which can help to slow movement of thermal energy more than if these areas were left uncovered. Although both connection portions 56 are covered by the example thermal barrier system 58, other examples could cover only one of the connection portions 56.
The fastener 50 can be a polymer material, or can, as shown in this example, have an overmolded cap 62 over a metal or metal alloy head 66 of the fastener 50. Making the fastener 50 polymer or to have an overmolded cap 62 can slow thermal energy transfer through the fastener.
As shown in
Referring now to
For exemplary purposes, two types of connection covers are used to cover the connection portions 156 of busbar core 154. The first cover type 156A is shown in
The second cover type 156B is shown in
In an example, the second cover type 156B is a fiber-filled silicone material. The formulation can further include aerogel, glass bubble, and melamine. In an example, the formulation of high-temp silicone can be as follows in Table A.
In other examples, the thermal barrier is not overmolded as shown in connection with the exemplary embodiment of
Features of the disclosed examples, include using a thermal barrier on a busbar to mitigate thermal energy transfer between battery arrays and other components.
The preceding description is exemplary rather than limiting in nature. Variations and modifications to the disclosed examples may become apparent to those skilled in the art that do not necessarily depart from the essence of this disclosure. Thus, the scope of protection given to this disclosure can only be determined by studying the following claims.
