Patent Grant
12004320
This application is a national stage of International Application No. PCT/CN2020/096575, filed on Jun. 17, 2020, which claims priority to Chinese Patent Application No. 201910526651.7, filed on Jun. 18, 2019. Both of the aforementioned applications are hereby incorporated by reference in their entireties.
This application relates to the field of heat dissipation technologies used for electronic devices, and in particular, to a thermal component and an electronic device.
With the progress of science and technology, current electronic devices are developing in directions of a multifunction, a high speed, and a small size. Integration of some chips such as system on chips (system on chips, SOCs) in the electronic device is increasingly high, and a calculation amount in a data processing process is increasingly large. As a result, working heat generated by a processor on a unit area is greatly increased, and the processor becomes a high heat emitting element. The working heat from the high heat emitting element affects performance and life of the processor and other components in the electronic device.
Embodiments of this application provide a thermal component and an electronic device, to dissipate heat for a high heat emitting element in the electronic device.
To achieve the foregoing objective, the following technical solutions are used in the embodiments of this application.
According to a first aspect of the embodiments of this application, a thermal system is provided. The thermal system includes a system component. The system component includes a first-level thermal component and a working medium driver. The thermal system further includes a working medium, a second-level thermal component, and a working medium transmission component. The first-level thermal component includes a primary thermal plate to be in contact with a heat emitting element, and a primary flow-through structure that is disposed in the primary thermal plate and through which the working medium flows. The second-level thermal component includes a secondary thermal plate, and a secondary flow-through structure that is disposed in the secondary thermal plate and through which the working medium flows. The working medium transmission component is rotatably connected to the secondary thermal plate and the system component. A transmission channel in the working medium transmission component is used to communicate at least the primary flow-through structure and the secondary flow-through structure. The working medium driver is configured to drive the working medium to flow through the primary flow-through structure, the secondary flow-through structure, and the transmission channel in the working medium transmission component.
In this way, the working medium driver can drive the working medium to be transmitted from the working medium driver to the primary flow-through structure in the primary thermal plate. The primary thermal plate is in contact with the heat emitting element. Therefore, when flowing through the primary thermal plate, the working medium can absorb heat of the heat emitting element, so that the heat emitting element can be cooled down, thereby dissipating heat for the heat emitting element. Then, driven by the working medium driver, the working medium that absorbs the heat of the heat emitting element flows into the secondary flow-through structure in the secondary thermal plate through the transmission channel in the working medium transmission component. The secondary thermal plate is connected to a housing of the electronic device. Therefore, a part of heat in the working medium can be absorbed by using the housing, so that temperature of the working medium can be reduced, thereby dissipating heat for the heat emitting element.
Optionally, the working medium transmission component includes at least one first working medium transmission portion. The first working medium transmission portion is rotatably connected to the primary thermal plate and the secondary thermal plate. A transmission channel in the first working medium transmission portion communicates with the primary flow-through structure and the secondary flow-through structure. In this way, on a basis that the primary thermal plate can be rotatably connected to the secondary thermal plate by using the first working medium transmission portion, the primary flow-through structure on the primary thermal plate can communicate with the secondary flow-through structure on the secondary thermal plate, so that the working medium in the primary flow-through structure can flow to the secondary flow-through structure through the transmission channel in the first working medium transmission portion. In addition, the working medium in the secondary flow-through structure can also flow to the primary flow-through structure through the transmission channel in the first working medium transmission portion.
Optionally, the first working medium transmission portion includes a primary connection pipe and a secondary connection pipe. The primary connection pipe is connected to the primary thermal plate, and an inner hole of the primary connection pipe communicates with the primary flow-through structure. The secondary connection pipe is rotatably connected to the primary connection pipe. The secondary connection pipe is connected to the secondary thermal plate, and an inner hole of the secondary connection pipe communicates with the secondary flow-through structure. In this way, with the primary connection pipe and the secondary connection pipe, the primary flow-through structure on the primary thermal plate can communicate with the secondary flow-through structure on the secondary thermal plate, and the primary thermal plate can be rotatably connected to the secondary thermal plate.
Optionally, the first working medium transmission portion further includes a hose. The hose passes through the inner holes of the primary connection pipe and the secondary connection pipe. One end of the hose communicates with the primary flow-through structure, and the other end communicates with the secondary flow-through structure. An inner hole of the hose serves as the transmission channel in the first working medium transmission portion. Therefore, the working medium can flow through the inner hole of the hose, so that the working medium can be transmitted in the first working medium transmission portion.
Optionally, the first working medium transmission portion further includes a lyophobic coating covering an outer surface of the hose. The lyophobic coating can be used to reduce a probability that polymer leakage occurs in the working medium in the hose when the working medium passes through the hose.
Optionally, the first working medium transmission portion further includes a rotary connection pipe and at least one sealing component. One end of the primary connection pipe is butted with one end of the secondary connection pipe, and the two ends are both nested in the rotary connection pipe. The sealing component is located between a hole wall of an inner hole of the rotary connection pipe and an outer wall of the primary connection pipe, or the sealing component is located between a hole wall of an inner hole of the rotary connection pipe and an outer wall of the secondary connection pipe. In this way, a probability that liquid leakage occurs in the first working medium transmission portion can be reduced by disposing the sealing component.
Optionally, the first working medium transmission portion further includes at least one sealing component. A part of the primary connection pipe extends into the inner hole of the secondary connection pipe. The sealing component is located between an outer wall of the primary connection pipe and a hole wall of the inner hole of the secondary connection pipe. Alternatively, a part of the secondary connection pipe extends into the inner hole of the primary connection pipe. The sealing component is located between an outer wall of the secondary connection pipe and a hole wall of the inner hole of the primary connection pipe. In this way, a part of the primary connection pipe extends into the inner hole of the secondary connection pipe, or a part of the secondary connection pipe extends into the inner hole of the primary connection pipe, so that the primary connection pipe can be rotatably connected to the secondary connection pipe. In addition, a probability that liquid leakage occurs in the first working medium transmission portion can be reduced by disposing the sealing component.
Optionally, the working medium transmission component further includes a second working medium transmission portion. The second working medium transmission portion is rotatably connected to the secondary thermal plate and the working medium driver. A liquid outlet of the working medium driver communicates with the primary flow-through structure, and a transmission channel in the second working medium transmission portion communicates with the secondary flow-through structure and a liquid inlet of the working medium driver. In this way, driven by the working medium driver, the working medium can flow from the liquid outlet of the working medium driver to the primary flow-through structure to dissipate heat for the heat emitting element, and then the working medium is transmitted from the first working medium transmission portion to the secondary flow-through structure to perform heat dissipation on the primary thermal plate. Then, the working medium is transmitted to the second working medium transmission portion by using the secondary flow-through structure, and then flows back to the liquid inlet of the working medium driver after passing through the second working medium transmission portion, so that the working medium can perform next cyclic heat dissipation on the heat emitting element.
Optionally, the working medium transmission component further includes two first working medium transmission portions that are disposed side by side: a right first working medium transmission portion and a left first working medium transmission portion. The primary flow-through structure includes a first primary channel and a second primary channel. A liquid outlet of the working medium driver communicates with the first primary channel, and a liquid inlet of the working medium driver communicates with the second primary channel. A transmission channel in the right first working medium transmission portion communicates with the first primary channel and the secondary flow-through structure. A transmission channel in the left first working medium transmission portion communicates with the secondary flow-through structure and the second primary channel. In this way, the working medium driver can drive the working medium to be transmitted from the liquid outlet of the working medium driver to the first primary channel in the primary thermal plate. The primary thermal plate is in contact with the heat emitting element on a main board. Therefore, when flowing through the primary thermal plate, the working medium can absorb heat of the heat emitting element, so that the heat emitting element can be cooled down, thereby dissipating heat for the heat emitting element. Then, driven by the working medium driver, the working medium that absorbs the heat of the heat emitting element flows into the secondary flow-through structure in the secondary thermal plate through the transmission channel in the right first working medium transmission portion. The secondary thermal plate is connected to a first housing. Therefore, a part of heat in the working medium can be absorbed by using the first housing, so that temperature of the working medium can be reduced. Then, driven by the working medium driver, the working medium that is cooled down may flow from the secondary flow-through structure in the secondary thermal plate to the transmission channel in the left first working medium transmission portion, flow to the second primary channel in the primary thermal plate after passing through the left first working medium transmission portion, and then enter the liquid inlet of the working medium driver through the second primary channel. Therefore, after being driven by the working medium driver, the working medium enters the first primary channel in the primary thermal plate again from the liquid outlet of the working medium driver, to perform a next heat dissipation process.
Optionally, the working medium transmission component includes a first connection pipe and a second connection pipe. The second connection pipe is nested in an inner hole of the first connection pipe. The first connection pipe is rotatably connected to the primary thermal plate and the secondary thermal plate. The inner hole of the first connection pipe communicates with a liquid inlet of the working medium driver and the secondary flow-through structure, and a liquid outlet of the working medium driver communicates with the primary flow-through structure. An inner hole of the second connection pipe communicates with the primary flow-through structure and the secondary flow-through structure. In this way, the second connection pipe is nested in the first connection pipe, so that the working medium that flows from the liquid outlet of the working medium driver to the primary flow-through structure can flow to the secondary flow-through structure through the second connection pipe, and then flow back from the secondary flow-through structure to the liquid inlet of the working medium driver through the first connection pipe.
Optionally, at least a part that is in each of the first connection pipe and the second connection pipe and that is located between the primary thermal plate and the secondary thermal plate is made of a flexible material. Therefore, when the first connection pipe is connected to the primary thermal plate and the secondary thermal plate, the primary thermal plate and the secondary thermal plate can rotate by using the first connection pipe.
The primary flow-through structure includes a first primary channel and a second primary channel. A liquid outlet of the working medium driver communicates with the first primary channel, and a liquid inlet of the working medium driver communicates with the second primary channel. The working medium transmission component includes a third connection pipe and a fourth connection pipe. The fourth connection pipe is nested in an inner hole of the third connection pipe. The third connection pipe is rotatably connected to the primary thermal plate and the secondary thermal plate, and the inner hole of the third connection pipe communicates with the second primary channel and the secondary flow-through structure. An inner hole of the fourth connection pipe communicates with the first primary channel and the secondary flow-through structure. In this way, the fourth connection pipe is nested in the third connection pipe, so that the working medium that flows from the liquid outlet of the working medium driver to the first primary channel can flow to the secondary flow-through structure through the third connection pipe, then flow from the secondary flow-through structure to the second primary channel through the fourth connection pipe, and then flow back to the liquid inlet of the working medium driver through the second primary channel. In addition, when the liquid outlet of the working medium driver communicates with the second primary channel, and the liquid inlet communicates with the first primary channel, a flow-through process of the working medium is the same as that described above, and details are not described herein again.
Optionally, at least a part that is in each of the third connection pipe and the fourth connection pipe and that is located between the primary thermal plate and the secondary thermal plate is made of a flexible material. A manner of disposing the third connection pipe and the fourth connection pipe is the same as that of the first connection pipe and the second connection pipe, and details are not described herein again.
Optionally, the working medium driver includes a first upper cover, a first lower bottom, a partition plate, a stator, and a rotor. The first lower bottom is connected to the first upper cover to form an accommodation cavity. The partition plate is located in the accommodation cavity and connected to the first lower bottom. A sealing sub-cavity is formed between the partition plate and the first lower bottom, and a liquid sub-cavity is formed between the partition plate and the first upper cover. A liquid outlet and a liquid inlet of the working medium driver are provided on the liquid sub-cavity. The stator is located in the sealing sub-cavity. The rotor is located in the liquid sub-cavity. The rotor is configured to rotate under an action of a magnetic field generated by the stator, to drive the working medium in the liquid sub-cavity to flow. In this way, the stator can be separated from the working medium in the liquid sub-cavity by using the partition plate. When an electrical signal is provided for the stator, a magnetic field is generated around the stator. The rotor generates induced electromotive force in the magnetic field, thereby generating a current in a closed-loop rotor line. The current can enable another magnetic field to be generated around the rotor. When poles of the two magnetic fields are the same, repulsion occurs, so that the rotor rotates. When the rotor rotates, the working medium in the liquid sub-cavity can be driven to flow in the liquid sub-cavity, so that the working medium flows out of the liquid outlet from the liquid inlet of the working medium driver, to implement circulation of the working medium in a closed loop including the working medium driver, the primary flow-through structure, and the secondary flow-through structure.
Optionally, the working medium driver further includes a temperature sensor and a flow rate controller. The temperature sensor is located in the liquid sub-cavity, and is configured to detect temperature of the working medium in the liquid sub-cavity. The flow rate controller is electrically connected to the temperature sensor and the stator. The flow rate controller is configured to control, based on a detection result of the temperature sensor, a voltage applied to the stator. The temperature detected by the temperature sensor is directly proportional to the voltage applied to the stator. In this way, when the temperature of the working medium in the liquid sub-cavity is high, the voltage applied to the stator can be increased by using the flow rate controller, thereby increasing a rotational speed of the rotor, increasing a flow rate of the working medium, and improving efficiency of cooling down the heat emitting element. On the contrary, when the temperature of the working medium in the liquid sub-cavity is low, the flow rate of the working medium can be reduced.
Optionally, the working medium driver further includes a leakage detector. The leakage detector is electrically connected to the stator and the rotor, and the leakage detector is configured to: detect a voltage applied to the stator and a rotational speed of the rotor, and determine a volume of the working medium in the liquid sub-cavity based on the rotational speed of the rotor. In this way, an actual rotational speed of the rotor is detected by using the leakage detector, and the actual rotational speed is compared with a preset rotational speed. When the actual rotational speed is greater than the preset rotational speed, it may indicate that load of the rotor is reduced and therefore liquid leakage occurs in the liquid sub-cavity.
Optionally, the working medium driver further includes a plurality of blades that are disposed at intervals and that are connected to the rotor. The plurality of blades are disposed around an outer surface of the rotor. In this way, when the rotor rotates, the blades may be driven to rotate together, so that the blades can push the working medium in the liquid sub-cavity to flow in the rotation process.
Optionally, an included angle between the liquid inlet and the liquid outlet of the working medium driver is 0°, 90° or 180°. In this way, the working medium can enter an edge of the blade in the working medium driver from the liquid inlet, and then the working medium is driven by the blade to be thrown out of the liquid outlet from the edge of the blade in an acceleration manner, thereby completing driving of the working medium.
Optionally, the primary flow-through structure and the secondary flow-through structure each include at least one heat pipe. A capillary structure for dissipating heat is disposed in the heat pipe, thereby helping improve heat dissipation effects of the primary thermal plate and the secondary thermal plate.
Optionally, the first-level thermal component and the second-level thermal component are vapor chambers. A capillary structure for dissipating heat is disposed in the vapor chamber, thereby helping improve heat dissipation effects of the first-level thermal component and the second-level thermal component. Alternatively, in some other embodiments of this application, the first-level thermal component and the second-level thermal component may be cold plates (pipe sink). No capillary structure needs to be disposed in the cold plate, so that manufacturing processes of the first-level thermal component and the second-level thermal component are simpler.
Optionally, the thermal system further includes an auxiliary thermal component. The auxiliary thermal component is located between the heat emitting element and the primary thermal plate, and is in contact with the heat emitting element and the primary thermal plate. The auxiliary thermal component is a thermal fin or a thermoelectric cooling film. The thermal fin is made of a metal material and has a good heat conduction effect. In addition, when the auxiliary thermal component is the thermoelectric cooling film, if the thermoelectric cooling film is energized, a surface of a side with low temperature may be in contact with the heat emitting element, thereby facilitating heat dissipation of the heat emitting element.
Optionally, the first-level thermal component further includes a primary fan, and the primary fan is connected to the primary thermal plate. The second-level thermal component further includes a secondary fan, and the secondary fan is connected to the secondary thermal plate. In a rotation process, the primary fan can dissipate heat for the primary thermal plate that absorbs heat of the heat emitting element, to improve a heat dissipation effect of the primary thermal plate on the working medium. In a rotation process, the secondary fan can dissipate heat for the secondary thermal plate, to improve a heat dissipation effect of the secondary thermal plate on the working medium.
Optionally, the secondary flow-through structure includes at least one secondary channel extending through a plate structure of the secondary thermal plate. One end of each secondary channel communicates with a liquid inlet of the secondary thermal plate, and the other end communicates with a liquid outlet of the secondary thermal plate. Two adjacent secondary channels are separated by using the plate structure. In this way, the secondary channel can be used to steer the working medium flowing into the secondary flow-through structure, so that the working medium flows along a shape of the secondary channel.
Optionally, the secondary thermal plate includes a second upper cover, a second lower bottom, and a plurality of support bars that are disposed at intervals. The second lower bottom is connected to the second upper cover to form a cavity. The plurality of support bars that are disposed at intervals are located in the cavity, and are connected to the second upper cover and the second lower bottom. A secondary channel is formed between two adjacent support bars, and a plurality of secondary channels form the secondary flow-through structure. In this way, the secondary channels formed by using the plurality of support bars that are disposed at intervals can be used to steer the working medium flowing into the secondary flow-through structure, so that the working medium flows along a shape of the secondary channel.
Optionally, the secondary channel is spiral and does not intersect at any location. Because a side wall of the secondary channel is curved, resistance of the side wall of the secondary channel to the working medium can be effectively reduced in a process in which the working medium flows in the secondary channel. Therefore, the working medium can flow more smoothly in the secondary channel, and power consumption of the working medium driver is reduced.
Optionally, the secondary thermal plate further includes a plurality of support pillars located in the cavity. The support pillars are connected to the second upper cover and the second lower bottom. Therefore, a probability that cracking occurs between the support bars and both the second upper cover and the second lower bottom due to thermal expansion of the secondary thermal plate can be reduced.
According to a second aspect of the embodiments of this application, an electronic device is provided. The electronic device includes a first housing and a second housing that are rotatably connected, a display module mounted on the first housing, and a main board mounted on the second housing, where a heat emitting element is disposed on the main board. In addition, the electronic device further includes any one of the thermal systems described above. A first-level thermal component in the thermal system is disposed on the second housing, and a primary thermal plate of the first-level thermal component is in contact with the heat emitting element. A second-level thermal component in the thermal system is disposed on the first housing, and a secondary thermal plate of the second-level thermal component is connected to a back surface of the display module and the first housing. The electronic device has a same technical effect as the thermal system provided in the foregoing embodiment, and details are not described herein again.
Optionally, a working medium driver in the thermal system is located on the second housing, and is placed side by side with the second-level thermal component. Therefore, space occupied by the thermal system in the electronic device can be reduced.
According to a third aspect of the embodiments of this application, a thermal system is provided. The thermal system includes a first thermal component, a first working medium, a working medium driver, a second thermal component, and a second working medium. The first thermal component includes a primary thermal plate to be in contact with a heat emitting element, and a primary flow-through structure disposed in the primary thermal plate. A liquid outlet and a liquid inlet of the working medium driver communicate with the primary flow-through structure, and the working medium driver is configured to drive the first working medium to circulate in a closed loop including the working medium driver and the primary flow-through structure. The second thermal component includes a secondary thermal pipe, a fan and a secondary thermal plate. One end of the secondary thermal pipe is in contact with the heat emitting element, and the other end is located between an air outlet of the fan and the secondary thermal plate, and is connected to the fan and the secondary thermal plate. The second working medium is located in the secondary thermal pipe.
In this case, the working medium driver can drive the first working medium to flow from the liquid outlet of the working medium driver to the primary flow-through structure in the primary thermal plate. Because the primary thermal plate is in contact with the heat emitting element, heat of the heat emitting element is absorbed by using the first working medium. The first working medium that absorbs the heat flows back to the liquid inlet of the working medium driver, so that the first working medium performs cyclic heat dissipation on the heat emitting element. In addition, because one end of the secondary thermal pipe is in contact with the heat emitting element, the heat of the heat emitting element may enable the second working medium in the secondary thermal pipe to vaporize and flow to the other end that is of the secondary thermal pipe and that has relatively low temperature. Because the other end of the secondary thermal pipe is located between the air outlet of the fan and the secondary thermal plate, and is connected to the fan and the secondary thermal plate, heat of the second working medium in the secondary thermal pipe may be taken away by using the air outlet of the fan and the secondary thermal plate. In this way, after temperature of the second working medium is reduced, the second working medium condenses into a liquid state, and flows, in a direction shown by an arrow, back to the end that is of the secondary thermal pipe and that is in contact with the heat emitting element. Therefore, the second working medium can perform cyclic heat dissipation on the heat emitting element.
Optionally, the working medium driver includes a first upper cover, a first lower bottom, a partition plate, a stator, and a rotor. The first lower bottom is connected to the first upper cover to form an accommodation cavity. The partition plate is located in the accommodation cavity and connected to the first lower bottom. A sealing sub-cavity is formed between the partition plate and the first lower bottom, a liquid sub-cavity is formed between the partition plate and the first upper cover, and the liquid outlet and the liquid inlet of the working medium driver are provided on the liquid sub-cavity. The stator is located in the sealing sub-cavity. The rotor is located in the liquid sub-cavity. The rotor is configured to rotate under an action of a magnetic field generated by the stator, to drive the working medium in the liquid sub-cavity to flow. A technical effect of the working medium driver is the same as that described above, and details are not described herein again.
Optionally, the working medium driver further includes a plurality of blades that are disposed at intervals and that are connected to the rotor. The plurality of blades are disposed around an outer surface of the rotor. A technical effect of the blade is the same as that described above, and details are not described herein again.
Optionally, the first thermal component is a vapor chamber or a cold plate. The secondary thermal plate is a thermal fin. Technical effects of the vapor chamber, the thermal fin, and the cold plate are the same as those described above, and details are not described herein again.
Optionally, the secondary thermal pipe is a heat pipe. A technical effect of the heat pipe is the same as that described above, and details are not described herein again.
Optionally, the thermal system further includes an auxiliary thermal component. The auxiliary thermal component is located between the heat emitting element and the primary thermal plate, and is in contact with the heat emitting element and the primary thermal plate. The auxiliary thermal component is a thermal fin or a thermoelectric cooling film. A technical effect of the auxiliary thermal component is the same as that described above, and details are not described herein again.
According to a fourth aspect of the embodiments of this application, an electronic device is provided. The electronic device includes a rear housing, a display module mounted on the rear housing, and a main board located between the display module and the rear housing. A heat emitting element is disposed on the main board. The electronic device further includes any one of the thermal systems described above. The thermal system is located between the display module and the housing. Both a primary thermal plate of a first thermal component and a secondary thermal pipe of a second thermal component in the thermal system are in contact with the heat emitting element. The electronic device has a same technical effect as the thermal system provided in the foregoing embodiments, and details are not described herein again.
01: electronic device; 10: heat emitting element; 11: first housing; 110: display module; 12: second housing; 120: main board; 100: system component; 101: liquid crystal display; 102: backlight unit; 02: thermal system; 20: first-level thermal component; 201: primary thermal plate; 202: primary flow-through structure; 30: second-level thermal component; 301: secondary thermal plate; 302: secondary flow-through structure; 40: working medium transmission component; 401: transmission channel; 50: working medium driver; 41: first working medium transmission portion; 42: second working medium transmission portion; 41a: right first working medium transmission portion; 41b: left second working medium transmission portion; 212: first primary channel; 222: second primary channel; 411: primary connection pipe; 412: secondary connection pipe; 413: rotary connection pipe; 414: sealing component; 400: hose; 402: lyophobic coating; 415: groove; 4110: first mounting part; 4120: second mounting part; 421: first connection pipe; 422: second connection pipe; 423: third connection pipe; 424: fourth connection pipe; 420: metal portion; 430: resin portion; 60: auxiliary thermal component; 3021: secondary channel; 3011: second upper cover; 3012: second lower bottom; 3013: cavity; 3014: support bar; 3015: support pillar; 3026: protrusion; 501: first upper cover; 502: first lower bottom; 503: accommodation cavity; 510: sealing sub-cavity; 511: liquid sub-cavity; 504: partition plate; 505: stator; 506: rotor; 520: temperature sensor; 521: flow rate controller; 522; leakage detector; 530: blade; 203: primary fan; 303: secondary fan; 111: middle frame; 112: rear housing; 70: first thermal component; 71: second thermal component; vii: secondary thermal pipe; 712: fan.
The following describes the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. It is clearly that, the described embodiments are merely a part rather than all of the embodiments of this application.
The following terms “first” and “second” are merely intended for a purpose of description, and shall not be understood as an indication or implication of relative importance or implicit indication of the number of indicated technical features. Therefore, a feature limited by “first” or “second” may explicitly or implicitly include one or more features. In the description of this application, unless otherwise stated, “a plurality of” means two or more than two.
In addition, in this application, direction terms such as “up”, “down”, “left”, and “right” are defined relative to directions of schematically placed components in the accompanying drawings. It should be understood that these direction terms are relative concepts, and the direction terms are used for relative description and clarification and may vary accordingly depending on the directions in which the components are placed in the accompanying drawings.
In this application, unless otherwise expressly specified and limited, the term “connection” should be understood broadly. For example, the “connection” may be a fixed connection, a detachable connection, or an integral connection, may be a direct connection, or may be an indirect connection based on an intermediate medium.
An embodiment of this application provides an electronic device. The electronic device includes, for example, a mobile phone, a tablet computer, a notebook computer, an in-vehicle computer, and an intelligent wearable product. A specific form of the electronic device is not particularly limited in this embodiment of this application.
In some embodiments of this application, an example in which an electronic device 01 is a notebook computer shown in
In this case, as shown in
In some embodiments of this application, the display module no is a liquid crystal display module. In this case, as shown in
The BLU 102 may provide a light source for the liquid crystal display 101, so that each sub pixel (sub pixel) in the liquid crystal display 101 can emit light to display an image.
Alternatively, in some other embodiments of this application, the display module 110 may be an organic light emitting diode (organic light emitting diode, OLED) display. Because each sub pixel of the OLED display is provided with an electroluminescence layer, the OLED display can implement self-luminescence after receiving a working voltage. In this case, there is no need to provide the BLU in the display module no that has the OLED display.
In addition, as shown in
On this basis, to dissipate heat for the heat emitting element 10, the electronic device 01 further includes a thermal system 02 shown in
The system component 100 includes a first-level thermal component 20 and a working medium driver 50 that are shown in
The second-level thermal component 30 includes a secondary thermal plate 301, and a secondary flow-through structure 302 that is disposed in the secondary thermal plate 301 and through which the working medium flows. As shown in
In addition, as shown in
There is a transmission channel 401 in the working medium transmission component 40. The transmission channel 401 of the working medium transmission component 40 is used to communicate at least the primary flow-through structure 202 and the secondary flow-through structure 302.
In addition, the working medium driver 50 has a liquid outlet and a liquid inlet. The thermal system 02 further includes the working medium located in the primary flow-through structure 202, the secondary flow-through structure 302, and the working medium driver 50. The working medium driver 50 is configured to drive the working medium to flow through the primary flow-through structure 202, the secondary flow-through structure 302, and the transmission channel 401 in the working medium transmission component 40.
In some embodiments of this application, as shown in
In addition, the second working medium transmission portion 42 is rotatably connected to the secondary thermal plate 301 and the working medium driver 50. A transmission channel in the second working medium transmission portion 42 communicates with the secondary flow-through structure 302 in the secondary thermal plate 301 and the liquid inlet B of the working medium driver 50. The liquid outlet A of the working medium driver 50 communicates with the primary flow-through structure 202 in the primary thermal plate 201.
On this basis, to reduce space occupied by the thermal system 02 in the second housing 12, as shown in
In this case, the working medium driver 50 can drive the working medium to be transmitted from the liquid outlet A of the working medium driver 50 to the primary flow-through structure 202 in the primary thermal plate 201 in an arrow direction shown in
Then, driven by the working medium driver 50, the working medium that absorbs the heat of the heat emitting element 10 flows into the secondary flow-through structure 302 in the secondary thermal plate 301 after passing through the first working medium transmission portion 41. The secondary thermal plate 301 is connected to the first housing 11. Therefore, a part of heat in the working medium can be absorbed by using the first housing 11, so that temperature of the working medium can be reduced.
Then, driven by the working medium driver 50, the working medium that is cooled down may be transmitted to the liquid inlet B (as shown in
In this way, when the working medium driver 50 drives the working medium to circulate in a closed loop including the working medium driver 50, the primary flow-through structure 202, and the secondary flow-through structure 302, the working medium can continuously absorb heat of the heat emitting element 10 to transfer the heat to the first housing 11 for heat dissipation, thereby dissipating heat for the heat emitting element 10.
Alternatively, in some other embodiments of this application, the working medium transmission component 40 in the thermal system 02 of the electronic device 01 includes two first working medium transmission portions that are configured to rotatably connect the primary thermal plate 201 to the secondary thermal plate 301. The two first working medium transmission portions are respectively a right first working medium transmission portion 41a and a left first working medium transmission portion 41b that are shown in
In addition, as shown in
A transmission channel in the right first working medium transmission portion 41a communicates with the first primary channel 212 and the secondary flow-through structure 302. A transmission channel in the left first working medium transmission portion 41b communicates with the secondary flow-through structure 302 and the second primary channel 222.
In this case, the working medium driver 50 can drive the working medium to be transmitted from the liquid outlet A of the working medium driver 50 to the first primary channel 212 in the primary thermal plate 201 in an arrow direction shown in
Then, driven by the working medium driver 50, the working medium that absorbs the heat of the heat emitting element 10 flows into the secondary flow-through structure 302 in the secondary thermal plate 301 through the transmission channel 401a in the right first working medium transmission portion 41a. The secondary thermal plate 301 is connected to the first housing 11. Therefore, a part of heat in the working medium can be absorbed by using the first housing 11, so that temperature of the working medium can be reduced.
Then, driven by the working medium driver 50, the working medium that is cooled down may flow from the secondary flow-through structure 302 in the secondary thermal plate 301 to the second primary channel 222 in the primary thermal plate 201 after passing through the left first working medium transmission portion 41b, and then enter the liquid inlet B of the working medium driver 50 through the second primary channel 222. Therefore, a next heat dissipation process is performed again after the working medium is driven by the working medium driver 50.
It should be noted that flow of the working medium is described by using an example in which the liquid outlet A of the working medium driver 50 communicates with the first primary channel 212 in the primary thermal plate 201 and the liquid inlet B communicates with the second primary channel 222. In some other embodiments of this application, alternatively, the liquid inlet B of the working medium driver 50 may communicate with the first primary channel 212 in the primary thermal plate 201, and the liquid outlet A may communicate with the second primary channel 222. A flow process of the working medium is similar to that described above, and details are not described herein.
In this way, when the working medium driver 50 drives the working medium to circulate in a closed loop that is shown in
The following uses an example to describe a structure of the working medium transmission component 40 based on a connection manner of the liquid inlet B and the liquid outlet A of the working medium driver 50 in the thermal system 02.
In this example, an example in which the thermal system 02 is the structure shown in
It can be learned from the foregoing description that the first working medium transmission portion 41 in the thermal system 02 may communicate the primary flow-through structure 202 on the primary thermal plate 201 and the secondary flow-through structure 302 on the secondary thermal plate 301, and the first working medium transmission portion 41 may further enable the primary thermal plate 201 to be rotatably connected to the secondary thermal plate 301. To enable the first working medium transmission portion 41 to implement the functions, the first working medium transmission portion 41 includes a primary connection pipe 411, a secondary connection pipe 412, and a rotary connection pipe 413 shown in
As shown in
In some embodiments of this application, the inner hole of the primary connection pipe 411 and the inner hole of the secondary connection pipe 412 may be used as the transmission channel in the first working medium transmission portion 41. Therefore, the working medium can flow from the inner hole of the primary connection pipe 411 to the inner hole of the secondary connection pipe 412 in an arrow direction shown in
Alternatively, in some other embodiments of this application, the first working medium transmission portion 41 further includes a hose 400 shown in
In this case, an inner hole of the hose 400 serves as the transmission channel in the first working medium transmission portion 41. Therefore, the working medium can flow through the inner hole of the hose 400 in an arrow direction shown in
On this basis, the first working medium transmission portion 41 further includes a lyophobic coating 402 covering an outer surface of the hose 400 shown in
In addition, to enable the primary connection pipe 411 and the secondary connection pipe 412 to relatively rotate, as shown in
It should be noted that, in this embodiment of this application, a material of the rotary connection pipe 413 may be a hard metal material, or may be a flexible resin material. This is not limited in this application.
On this basis, to reduce a probability that liquid leakage occurs in the working medium transmission component 40 in a process in which the working medium is transmitted in the first working medium transmission portion 41, as shown in
One sealing component 414a is located between a hole wall of an inner hole of the rotary connection pipe 413 and an outer wall of the primary connection pipe 411. The other sealing component 414b is located between the hole wall of the inner hole of the rotary connection pipe 413 and an outer wall of the secondary connection pipe 412.
The sealing component may be a sealing ring. In this case, to fasten the sealing ring, as shown in
In addition, to mount the first working medium transmission portion 41 in the electronic device 01, as shown in
It should be noted that the structure of the first working medium transmission portion 41 is used as an example for description above. A structure of the second working medium transmission portion 42 that is configured to rotatably connect the secondary thermal plate 301 to the working medium driver 50 is similar to that described above, and details are not described herein again.
This example is the same as Example 1, and in this example, an example in which the thermal system 02 is the structure shown in
For example, as shown in
Similarly, in some embodiments of this application, an inner hole of the primary connection pipe 411 may serve as the transmission channel in the first working medium transmission portion 41. Therefore, the working medium can flow in an arrow direction shown in
Alternatively, in some other embodiments of this application, the first working medium transmission portion 41 further includes a hose 400 shown in
Alternatively, for another example, as shown in
It should be noted that the structure of the first working medium transmission portion 41 is used as an example for description above. A structure of the second working medium transmission portion 42 that is configured to rotatably connect the secondary thermal plate 301 to the working medium driver 50 is similar to that described above, and details are not described herein again.
In this example, as shown in
As shown in
To enable the primary thermal plate 201 and the secondary thermal plate 301 to relatively rotate by using the first connection pipe 421, at least a part that is in each of the first connection pipe 421 and the second connection pipe 422 and that is located between the primary thermal plate 201 and the secondary thermal plate 301 is made of a flexible material such as a resin material. On this basis, in a process of manufacturing the first connection pipe 421, a metal portion 420 and a resin portion 430 that are shown in
On this basis, the working medium that is output from the liquid outlet A of the working medium driver flows into the primary flow-through structure 202 in an arrow direction shown in
It can be learned from the foregoing description that, in the working medium transmission component 40 shown in
In this example, as shown in
In some embodiments of this application, the liquid outlet A of the working medium driver 50 communicates with the first primary channel 212, and the liquid inlet B communicates with the second primary channel 222. In addition, an inner hole of the third connection pipe 423 communicates with the second primary channel 222 in the primary thermal plate 201 and the secondary flow-through structure 302 in the secondary thermal plate 301. An inner hole of the fourth connection pipe 424 communicates with the first primary channel 212 and the secondary flow-through structure 302.
To enable the primary thermal plate 201 and the secondary thermal plate 301 to relatively rotate by using the third connection pipe 423, a disposing manner is the same as that of disposing the first connection pipe 421 and the second connection pipe 422 in Example 3: At least a part that is in each of the third connection pipe 423 and the fourth connection pipe 424 and that is located between the primary thermal plate 201 and the secondary thermal plate 301 is made of a flexible material such as a resin material.
In this way, the working medium flows, in an arrow direction shown in
Alternatively, in some other embodiments of this application, the liquid inlet B of the working medium driver 50 may communicate with the first primary channel 212, and the liquid outlet A may communicate with the second primary channel 222. In this case, a flow-through manner of the working medium in the thermal system 02 may be the same as that described above, and details are not described herein again.
For any one of the examples described above, the following describes the primary flow-through structure 202 and a structure of the primary thermal plate 201 in the first-level thermal component 20. In some embodiments of this application, the first-level thermal component 20 may be a vapor chamber. In this case, the primary flow-through structure 202 in the first-level thermal component 20 may be a capillary structure in the vapor chamber. Alternatively, the first-level thermal component 20 may be a cold plate. No capillary structure needs to be disposed in the cold plate, so that a structure of the first-level thermal component 20 is simpler.
Alternatively, in some other embodiments of this application, the primary thermal plate 201 may be a metal block, and the primary flow-through structure 202 may be a pipe disposed in the metal block and extending through the metal block. For example, the pipe may be a heat pipe having a capillary structure.
It can be learned from the foregoing description that the primary thermal plate 201 is configured to be in contact with the heat emitting element 10 (as shown in
The auxiliary thermal component 60 is located between the heat emitting element 10 and the primary thermal plate 201, and the auxiliary thermal component 60 is in contact with the heat emitting element 10 and the primary thermal plate 201. When the auxiliary thermal component 60 is the thermoelectric cooling film, if the thermoelectric cooling film is energized, a surface of a side with low temperature may be in contact with the heat emitting element 10, thereby facilitating heat dissipation of the heat emitting element 10.
The following describes a structure of the second-level thermal component 30 including the secondary flow-through structure 302 and the secondary thermal plate 301. As described above, in some embodiments of this application, the second-level thermal component 30 may be a vapor chamber. In this case, the secondary flow-through structure 302 may be a capillary structure in the vapor chamber. Alternatively, in some other embodiments of this application, the secondary thermal plate 301 may be a metal block, and the secondary flow-through structure 302 may be a heat pipe disposed in the metal block and extending through the metal block. Alternatively, the second-level thermal component 30 may be a cold plate.
For another example, in some other embodiments of this application, as shown in FIG. boa, the secondary flow-through structure 302 may be a cavity formed in a plate structure of the secondary thermal plate 301. One end of the cavity communicates with a liquid inlet of the secondary thermal plate 301 (a direction in which the working medium enters a secondary channel along an arrow), and the other end communicates with a liquid outlet of the secondary thermal plate 301 (a direction in which the working medium flows out of the secondary channel along the arrow).
For another example, in some other embodiments of this application, the secondary flow-through structure 302 includes at least one secondary channel 3021 extending through a plate structure of the secondary thermal plate 301. For example, as shown in
One end of each secondary channel 3021 communicates with a liquid inlet of the secondary thermal plate 301 (a direction in which the working medium enters the secondary channel along an arrow), and the other end communicates with a liquid outlet of the secondary thermal plate 301 (a direction in which the working medium flows out of the secondary channel along the arrow). Two adjacent secondary channels 3021 are separated by using the plate structure. In this way, the secondary channel 3021 can be used to steer the working medium flowing into the secondary flow-through structure 302, so that the working medium flows along a shape of the secondary channel 3021.
It should be noted that, an example in which the secondary thermal plate 301 is fan-shaped is used for description in
On this basis, one secondary channel 3021 in the secondary flow-through structure 302 is used as an example. In some embodiments of this application, as shown in FIG. na, a shape of the secondary channel 3021 may be in a shape of a square wave. After passing through the first-level thermal component from the liquid outlet A of the working medium driver 50 and dissipating heat for the heat emitting element 10, the working medium flows to the secondary channel 3021 in the square-wave-shaped in the second-level thermal component, and then flows back to the liquid inlet B of the working medium driver 50.
Alternatively, in some other embodiments of this application, as shown in FIG. bib, the secondary channel 3021 may be spiral and does not intersect at any location. After passing through the first-level thermal component from the liquid outlet A of the working medium driver 50 and dissipating heat for the heat emitting element 10, the working medium flows to the spiral secondary channel 3021 in the second-level thermal component, and then flows back to the liquid inlet B of the working medium driver 50.
Compared with the solution in FIG. na, in the solution in
For another example, in some other embodiments of this application, the secondary thermal plate 301 of the second-level thermal component 30 includes a second upper cover 3011 and a second lower bottom 3012 that are shown in
In addition, the secondary thermal plate 301 further includes a plurality of support bars 3014 that are located in the cavity 3013 and that are disposed at intervals. The support bar 3014 is connected to the second upper cover 3011 and the second lower bottom 3012. A secondary channel 3021 shown in
It should be noted that, a shape of each secondary channel 3021 is the same as that described above, and may be in the shape shown in
In addition, to prevent cracking from occurring between the support bars 3014 and both the second upper cover 3011 and the second lower bottom 3012 due to thermal expansion of the secondary thermal plate 301 when the working medium that carries heat passes through the secondary flow-through structure 302, as shown in
In addition, to precisely mount the secondary thermal plate 301 of the second-level thermal component 30 on the second housing 12, a plurality of protrusions 3016 that are shown in
The following describes a structure of the working medium driver 50. It can be learned from the foregoing description that the working medium driver 50 may drive the working medium to circulate in the closed loop including the working medium driver 50, the primary flow-through structure 202, and the secondary flow-through structure 302. On this basis, in this embodiment of this application, the working medium driver 50 may be a micro pump body, a micro magnetic liquid thruster, or a micro propeller thruster. When the working medium driver 50 is the micro magnetic liquid thruster, the working medium needs to be conductive.
For any one of the working medium drivers 50, as shown in
As shown in
In this way, the stator 505 can be separated from the working medium in the liquid sub-cavity 511 by using the partition plate 504. When an electrical signal such as a pulse width modulation (pulse width modulation, PWM) signal is provided for the stator 505, a magnetic field is generated around the stator 505. The rotor 506 generates induced electromotive force in the magnetic field, thereby generating a current in a closed-loop rotor line. The current can enable another magnetic field to be generated around the rotor 506. When poles of the two magnetic fields are the same, repulsion occurs, so that the rotor 506 rotates. When the rotor 506 rotates, the working medium in the liquid sub-cavity 511 can be driven to flow in the liquid sub-cavity 511, so that the working medium flows out of the liquid outlet from the liquid inlet of the working medium driver 50, to implement circulation of the working medium in the closed loop including the working medium driver 50, the primary flow-through structure 202, and the secondary flow-through structure 302.
In addition, when the PWM signal is changed, polarities of the magnetic field generated by the stator 505 and the magnetic field generated by the rotor 506 can be changed, so that a rotation direction of the rotor 506 is changed, and the rotor 506 can rotate forward or backward as required. Therefore, a flow direction of the working medium is changed, and positions of the liquid inlet and the liquid outlet of the working medium accelerator 50 are exchanged.
In some embodiments of this application, the working medium driver 50 may further include a temperature sensor 520, a flow rate controller 521 and a leakage detector 522 that are shown in
The temperature sensor 520 may be located in the liquid sub-cavity 511. The temperature sensor 520 may be configured to detect temperature of the working medium in the liquid sub-cavity 511. In addition, the flow rate controller 521 is electrically connected to the temperature sensor 520 and the stator 505. The flow rate controller 521 may be configured to control, based on a detection result of the temperature sensor 520, a voltage applied to the stator 505, to be specific, control the PWM signal. The temperature detected by the temperature sensor 520 may be directly proportional to the voltage applied to the stator 505. In this way, when the temperature of the working medium in the liquid sub-cavity 511 is high, the voltage applied to the stator 505 can be increased by using the flow rate controller 521, thereby increasing a rotational speed of the rotor 506, increasing a flow rate of the working medium, and improving efficiency of cooling down the heat emitting element 10. On the contrary, when the temperature of the working medium in the liquid sub-cavity 511 is low, the flow rate of the working medium can be reduced.
In addition, as shown in
On this basis, to drive the working medium to flow, as shown in
In addition, it can be learned from the foregoing description that, to enable the working medium to be driven by the working medium driver 50 to circulate in the closed loop including the working medium driver 50, the primary flow-through structure 202, and the secondary flow-through structure 302, the working medium driver 50 has the liquid inlet B and the liquid outlet A that are shown in
For example, in some embodiments of this application, as shown in
In some embodiments of this application, parameters of the working medium driver 50 may be shown in Table 1.
It should be noted that, in Table 1, the XOY plane is a surface parallel to a bearing surface that is of the second housing 12 and that is used to bear the working medium driver 50. The thickness of the working medium driver 50 is a dimension that is of the working medium driver 50 and that is in an upward direction perpendicular to the XOY surface. Because the thickness of the working medium driver 50 may be less than or equal to 5 mm, space occupied by the working medium driver 50 in the electronic device 01 can be effectively reduced, thereby facilitating ultra-thin design of the electronic device 01. Therefore, a thickness of the electronic device 01 may be about 13 mm.
In addition, it can be learned from Table 1 that the noise of the working medium driver 50 is less than or equal to 25 dB. Therefore, when the entire thermal system 02 is designed without a fan, noise during normal working is less than 25 dB.
On this basis, a test is performed on the electronic device 01 in a dual burn-in scenario, to be specific, a stress (stress) test and a graphic card test (furmark) are performed on the electronic device 01. A test result is shown in Table 2.
It can be learned from Table 2 that, compared with the solution in which only a fan is used to dissipate heat for the heat emitting element 10, after the thermal system 02 provided in this embodiment of this application is used in the electronic device 01 to dissipate heat for the heat emitting element 10, the power consumption of the heat emitting element 10 may be increased from 5 W to 12 W, the power consumption of the electronic device 01 may be increased from 16 W to 25 W, and the temperature of the CPU is 62° C. that is less than 80° C.
In addition, after the thermal system 02 provided in this embodiment of this application dissipates heat for the heat emitting element 10, the temperature of the keyboard surface of the electronic device 01, the temperature of the back surface of the first housing 11, and the entire temperature of the electronic device 01 may be equivalent to those in the solution in which only a fan is used to dissipate heat for the heat emitting element 10. Therefore, when the thermal system 02 provided in this embodiment of this application is used in the electronic device 01, the overall power consumption of the heat emitting element 10 and the electronic device 01 can be improved while a heat dissipation effect is ensured, thereby facilitating development of the electronic device 01 in a multifunction and high-speed direction.
On this basis, to further improve the heat dissipation effect of the thermal system 02 on the heat emitting element 10, the first-level thermal component 20 further includes a primary fan 203 shown in
Similarly, the second-level thermal component further includes a secondary fan 303 shown in
In some embodiments of this application, the primary fan 203 and the secondary fan 303 include but are not limited to a centrifugal fan, an axial fan, an air suction turbine, and the like.
An example in which the electronic device 01 is a notebook computer shown in
In this case, as shown in
A drive circuit in the display module no may be electrically connected to a main board such as a printed circuit board (printed circuit board, PCB) on the middle frame 111 after passing through the middle frame 111 by using a flexible printed circuit (flexible printed circuit, FPC). Therefore, the display module no may be controlled by using a chip on the PCB, to be specific, a heat emitting element 10 such as an SOC to display an image.
In this case, to dissipate heat for the heat emitting element 10 in the electronic device 01, the electronic device 01 further includes a thermal system 02 shown in
The first thermal component 70 includes a primary thermal plate 201 and a primary flow-through structure 202 disposed in the primary thermal plate 201. A manner of disposing the primary thermal plate 201 and the primary flow-through structure 202 is the same as that described above, and details are not described herein again. In this case, the thermal system 02 may be disposed between the middle frame 111 and the rear housing 112. In addition, after the middle frame 111 is connected to the rear housing 112, the thermal system 02 shown in
In addition, a liquid outlet A and a liquid inlet B of the working medium driver 50 communicate with the primary flow-through structure 202 in the primary thermal plate 201. The thermal system 02 further includes a first working medium (not shown in the figure) located in the working medium driver 50 and the primary flow-through structure 202. The working medium driver 50 is configured to drive the first working medium to circulate in a closed loop including the working medium driver 50 and the primary flow-through structure 202. A structure of the working medium driver 50 is the same as that described above, and details are not described herein again.
In this way, as shown in
In addition, because the primary thermal plate 201 is further in contact with the rear housing 112, in a process in which the first working medium flows in the primary flow-through structure 202, heat may be dissipated to the rear housing 112 by using the primary thermal plate 201, and the rear housing 112 releases the heat into the environment.
On this basis, as described above, the thermal system 02 further includes an auxiliary thermal component located between the heat emitting element 10 and the primary thermal plate 201. The auxiliary thermal component and the heat emitting element 10 are in contact with the primary thermal plate 201. In some embodiments of this application, the auxiliary thermal component may be a thermal fin or a thermoelectric cooling film. A beneficial effect of the auxiliary thermal component is the same as that described above, and details are not described herein again.
As shown in
In some embodiments of this application, the secondary thermal plate 301 may be a thermal fin, a vapor chamber, or a thermoelectric cooling film. The secondary thermal pipe 711 may be a heat pipe. On this basis, the thermal system 02 further includes a second working medium (not shown in the figure) located in the secondary thermal pipe 711.
In this way, because one end of the secondary thermal pipe 711 is in contact with the heat emitting element 10, heat of the heat emitting element 10 may enable the second working medium in the secondary thermal pipe 711 to vaporize and flow, in an arrow direction shown in
In addition, the fan 712 includes but is not limited to a centrifugal fan, an axial fan, an air suction turbine, and the like.
It can be learned from the foregoing description that, when the electronic device 01 is a mobile phone or a tablet computer, the thermal system 02 provided in the embodiments of this application includes two independent thermal paths. In a first thermal path, the first working medium circulates in the working medium driver 50 and the primary flow-through structure 202 in the primary thermal plate 201, to dissipate heat for the heat emitting element 10 that is in contact with the primary thermal plate 201. In a second thermal path, the second working medium circulates in the secondary thermal pipe 711, to dissipate heat for the heat emitting element 10 that is in contact with the primary thermal plate 201.
In addition, it can be learned from the foregoing description that, a thickness of the working medium driver 50 may be less than or equal to 5 mm, thereby effectively reducing space occupied by the working medium driver 50 in the electronic device 01. Therefore, a thickness of the mobile phone or the tablet computer having the thermal system 02 may be within 7 mm.
The foregoing descriptions are merely specific implementations of this application, but are not intended to limit the protection scope of this application. Any variation or replacement within the technical scope disclosed in this application shall fall within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201910526651.7 | Jun 2019 | CN | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2020/096575 | 6/17/2020 | WO |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO2020/253723 | 12/24/2020 | WO | A |
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