Research Disclosure No. 251, Mar. 1985, Kenneth Mason Publications Ltd., England. |
IBM Technical Disclosure Bulletin, vol. 21, No. 8, Jan. 79, pp. 3211-3212--"Thermal Conduction Piston for Semiconductor Packages" by L. Landstein. |
IBM Technical Dislosure Bulletin, vol. 21, No. 11, Apr. 79, p. 4493--"Liquid Piston Tip" by P. Ginnings and J. Lynch. |
IBM Technical Disclosure Bulletin, vol. 23, No. 4, p. 1400, 9/80, "Self-Aligning Heat Transfer Pad for Pad-Mounted Chips" by R. Durand et al. |
IBM Technical Disclosure Bulletin, vol. 20, No. 8, pp. 3131/3132, 1/78, "Articulated Thermal Conductor for Semiconductor Chip Packages" by L. V. Gregor et al. |
IBM Technical Disclosure Bulletin, vol. 23, No. 12, p. 5489, 5/81, "Gimbal-Suspended Cooling Piston", by W. Otte et al. |