Patent Grant
11416045
The field of the invention is data processing, or, more specifically, methods and system for thermal interface material structures for directing heat in a three-dimensional space.
The development of the EDVAC computer system of 1948 is often cited as the beginning of the computer era. Since that time, computer systems have evolved into extremely complicated devices. Today's computers are much more sophisticated than early systems such as the EDVAC. Computer systems typically include a combination of hardware and software components, application programs, operating systems, processors, buses, memory, input/output devices, and so on. As advances in semiconductor processing and computer architecture push the performance of the computer higher and higher, more sophisticated computer software has evolved to take advantage of the higher performance of the hardware, resulting in computer systems today that are much more powerful than just a few years ago.
These advances in computer systems have led to the need for more efficient heat management within such complex systems. In order to get the best performance from certain components, particularly central and graphics processing units, heat must quickly and efficiently be removed from these components and nearby areas. Often however, such components are situated near other components that produce relatively less heat that also require quick and efficiently heat removal. Complicating matters further, different components may have different load requirements to maintain workable temperatures.
Thermal interface material structures for directing heat in a three-dimensional space may include: a thermal interface material (TIM) sheet including: a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.
Advantages provided by such embodiments for thermal interface material structures for directing heat in a three-dimensional space include providing a thermal interconnect between a heat exchanger and/or a heat spreader plate and components at different elevations relative to a circuit board. Advantages further include providing a thermal interconnect between components with different load requirements. The three-dimensional shape of the TIM sheet allows for accurate TIM placement and retention during manufacturing. The larger surface area provides continuous heat transfer and heat spreading. The three-dimensional TIM sheet is highly compressible, highly conductive at lower loads, and provides a range of gap filling capability for small gaps. Finally, the TIM sheet is easily assembled, easily reworked, and easily replaced. These advantages are achieved by using a single TIM sheet folded to provide a thermal interconnect between at least two planes within a system.
In an optional embodiment, the TIM sheet may further include a second side portion along a second side plane; a second upper portion along the upper plane; a third fold between the lower portion and the second side portion positioning the second side portion substantially perpendicular to the lower portion; and a fourth fold between the second side portion and the second upper portion positioning the second upper portion substantially perpendicular to the second side portion and substantially parallel to the lower portion. This provides the advantage of an additional portion of the TIM sheet that extends the thermal interconnect to another section of the upper plane.
In an optional embodiment, thermal interface material structures for directing heat in a three-dimensional space may further include a gap filler pad in thermal contact with the first upper portion. This provides the advantage of ensuring reliable thermal contact with elements above and below the upper portion of the TIM sheet, such as a heat spreader plate and heat exchanger.
In an optional embodiment, the upper portion of the TIM sheet may include additional alternating folds creating adjacent layers of the TIM sheet, or an upper portion that is coiled. This provides the advantage of additional gap filling for different types of gaps while maintaining a thermal interconnect with the TIM sheet.
Thermal interface material structures for directing heat in a three-dimensional space may include a system that includes: a circuit board comprising a first component having a first load requirement and a second component having a second load requirement; a heat exchanger; and a heat spreader plate in thermal contact with the first component, wherein the heat spreader plate comprises a cavity exposing the second component; and a thermal interface material (TIM) sheet comprising: a lower portion positioned between and in thermal contact with the second first component and the heat exchanger; a first upper portion positioned between and positioned between and in thermal contact with the heat spreader plate and the heat exchanger and the second component; and a first side portion connecting the lower portion to the first upper portion.
Advantages provided by such embodiments for thermal interface material structures for directing heat in a three-dimensional space include providing a thermal interconnect between a heat exchanger and components at different elevations relative to a circuit board. Advantages further include providing a thermal interconnect between components with different load requirements. These advantages are achieved by using a single TIM sheet folded to provide a thermal interconnect between a circuit board component, a heat spreader plate, and heat exchanger at different planes within a system.
In an optional embodiment, the system includes a heat spreader plate positioned between and in thermal contact with the second component and the first upper portion, wherein the heat spreader plate comprises a cavity exposing the first component, and wherein the first side portion connects the lower portion to the first upper portion through the cavity in the heat spreader plate. This provides the advantage of providing a heat spreading agent between the second component and the TIM sheet.
In an optional embodiment, the TIM sheet further comprises a gap filler pad between and in thermal contact with the first upper portion and the heat exchanger. This provides the advantage of ensuring reliable thermal contact with the heat spreader plate and heat exchanger above and below the upper portion of the TIM.
In an optional embodiment, the TIM sheet may further include a second upper portion positioned between and in thermal contact with the heat spreader plate and the heat exchanger; and a second side portion connecting the lower portion to the second upper portion through the cavity in the heat spreader plate. This provides the advantage of an additional portion of the TIM that extends the thermal interconnect to another section of the upper plane between the heat spreader plate and the heat exchanger.
In an optional embodiment, thermal interface material structures for directing heat in a three-dimensional space may further include an upper portion with additional alternating folds creating adjacent layers of the TIM sheet, or an upper portion that is coiled. This provides the advantage of additional gap filling for different types of gaps while maintaining a thermal interconnect with the TIM sheet.
Methods for forming thermal interface material structures for directing heat in a three-dimensional space may include: placing a TIM sheet between an upper forming tool and a lower forming tool; pressing the upper forming tool to the lower forming tool creating a first fold and a second fold in the TIM sheet, where the first fold is between a lower portion of the TIM sheet and a first side portion of the TIM sheet, where the first fold positions the first side portion of the TIM sheet substantially perpendicular to the lower portion of the TIM sheet, where the second fold is between the first side portion of the TIM sheet and a first upper portion of the TIM sheet, and where the second fold positions the first upper portion of the TIM sheet substantially perpendicular to the first side portion of the TIM sheet and substantially parallel to the lower portion of the TIM sheet.
Advantages provided by such embodiments for forming thermal interface material structures for directing heat in a three-dimensional space include forming a three-dimensional TIM sheet that provides a thermal interconnect between a heat exchanger and/or a heat spreader plate and components at different elevations relative to a circuit board. Advantages further include forming a TIM sheet that provides a thermal interconnect between components with different load requirements. These advantages are achieved by folding a single TIM sheet to provide a thermal interconnect between at least two planes within a system.
In an optional embodiment, methods for forming thermal interface material structures for directing heat in a three-dimensional space may further include pressing the upper forming tool to the lower forming tool to compresses the upper portion of the TIM sheet without compressing the lower portion of the TIM sheet. This provides the advantage of forming the three-dimensional TIM sheet without unnecessarily compressing and avoiding degradation of the lower portion which may be used to make thermal contact with a component with higher heat generation and a lower-load requirement.
In an optional embodiment, pressing the upper forming tool to the lower forming tool further creates a third fold and a fourth fold in the TIM sheet, where the third fold is between the lower portion of the TIM sheet and a second side portion of the TIM sheet, where the third fold positions the second side portion of the TIM sheet substantially perpendicular to the lower portion of the TIM sheet, where the fourth fold is between the second side portion of the TIM sheet and a second upper portion of the TIM sheet, and where the fourth fold positions the second upper portion of the TIM sheet substantially perpendicular to the second side portion of the TIM sheet and substantially parallel to the lower portion of the TIM sheet. This provides the advantage of an additional portion of the TIM sheet that extends the thermal interconnect to another section of the upper plane.
In an optional embodiment, pressing the upper forming tool to the lower forming tool creates additional folds creating adjacent layers of the TIM sheet adjacent and substantially parallel to the first upper portion, or rolling the first upper portion into a coil. This provides the advantage of additional gap filling for different types of gaps while maintaining a thermal interconnect with the TIM sheet.
The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular descriptions of exemplary embodiments of the invention as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts of exemplary embodiments of the invention.
The TIM sheet (100) is a single, continuous sheet of thermal conducting material. The TIM sheet may be a single material type, such as a graphite TIM sheet. Alternatively, the TIM sheet may be a composite material, such as a particle or fiber filled silicone and/or acrylate TIM sheet. Additionally, the TIM sheet may be a cured or partially cured elastomer matrix, such as silicone, filled with any number of thermally conductive materials. Such thermally conductive materials may include ceramic particles such as, but not limited to, aluminum nitride, boron, nitride, zinc oxide, or aluminum oxide. Such thermally conductive materials may also include metal particles or metal plated particles such as, but not limited to, aluminum, copper, silver, gold, or tungsten, and particle fillers comprising an array of carbon morphologies including, for example, graphite flakes, carbon fibers, carbon nanotubes, or crystalline diamond particles. Non-silicone elastomer matrices with an array of fillers cited above may also be used for TIM pads. Folded TIM sheets may be created from polymeric phase change material matrices filled with the above sets of particle materials. Folded TIM sheets may also be made from metals such as, but not limited to, indium or aluminum clad indium. Further, the TIM sheet may be compressible in that as pressure is applied to the TIM sheet, the thickness of the TIM sheet may be reduced.
As shown in
An embodiment that includes the lower portion (102), a single side portion (e.g., side portion (106A)), and a single upper portion (e.g., upper portion A (104A)) has the advantage of providing a thermal interconnect between components on different planes addressing different working heights of hardware using a single TIM sheet, while being less complicated to form due to only requiring two folds of the TIM material. An embodiment that includes the lower portion (102) two upper portions (upper portion A (104A), upper portion B (104B)), and two side portions (side portion A (106A), side portion B (106B)) has the advantage of providing a larger thermal interconnect between components on multiple different planes addressing different working heights of hardware using a single TIM sheet.
Although the TIM sheet (100) of
The circuit board (204) is a collection of electronic components typically connected to layers of conductive and non-conductive substrate. Some of the components on the circuit board (204) require or benefit from being in thermal contact with a heat dissipation mechanism.
The heat spreader plate (202) is a plate of thermally conductive material that transfers heat away from components on the circuit board (204) thermally connected to the heat spreader plate (202) and toward the heat exchanger (200). The heat exchanger (200) is a mechanism, such as a cold plate, that transfers heat from the heat spreader plate (202) and the processing unit (206) to a fluid medium and dissipated. The heat exchanger (200) may be a liquid or air cooled. The heat exchanger may be used in combination with a heat spreader plate (202), as shown in
Different components on the circuit board (204), such as the processing unit (206), may have different heat removal and load requirements. Particularly, the processing unit (206) may generate more heat than other components (not shown) on the circuit board and have a lesser load requirement than other components on the circuit board (204). The cavity in the heat spreader plate (202) provides the heat exchanger (200) more direct access to the processing unit (206) in order to remove heat more effectively from the processing unit (206). The cavity in the heat spreader plate (202) provides also allows the load on the processing unit (206) to be different than the load placed on the other components in thermal contact with the heat spreader.
To accommodate the above configuration of the circuit board (204), heat spreader plate (202) and the heat exchanger (200), the TIM sheet (100) provides a thermal interconnect between the processing unit (206), heat spreader plate (202), and the heat exchanger (200). The bottom of the lower portion of the TIM sheet (100) makes thermal contact with the processing unit (206). The top of the lower portion of the TIM sheet (100) makes thermal contact with the heat exchanger (200). The bottom of the upper portions of the TIM sheet (100) makes thermal contact with the heat spreader plate (202). Finally, the top of the upper portions of the TIM sheet (100) makes thermal contact with the heat exchanger (200) (optionally with the gap fillers shown in
The load requirements for a component, such as the processing unit (206) refers to limits (maximums or minimums) to the amount of pressure applied to a component for optimal functionality or to avoid negative impacts to the functionality. Because two components on the circuit board (204) may have different load requirements, a single element may be unable to provide that load. As shown in
The TIM structure (400) of
In a similar embodiment, one or more upper portions (upper portion A (104A), upper portion B (104B)) of the TIM sheet may be coiled. The upper portions (upper portion A (104A), upper portion B (104B)) may be rolled on an axis into a spiral cylinder. An embodiment that includes a coiled upper portion has the advantage of filling cylindrical gaps that may exist between the heat spreader plate, upper portions of the TIM sheet, and heat exchanger.
As shown in
A modified forming tool may be used to create adjacent layers of the TIM sheet adjacent and substantially parallel to the upper portions of the TIM sheet (as depicted in
Prior to pressing the upper forming tool to the lower forming tool, the TIM sheet may be scored along the anticipated folding lines. Specifically, the TIM sheet may be scored between the lower portion of the TIM sheet and the first side portion of the TIM sheet and scored between the first side portion of the TIM sheet and the first upper portion of the TIM sheet. Scoring the TIM sheet prior to folding has the advantage of precisely guiding the location of the fold within the TIM sheet, increasing the precision with which the TIM sheets are formed.
For further explanation,
Pressing the upper forming tool to the lower forming tool may compress the upper portion of the TIM sheet without compressing the lower portion of the TIM sheet. This has the advantage of maintaining the compressible integrity of the lower portion of the TIM sheet during the forming of the three-dimension TIM sheet.
It will be understood from the foregoing description that modifications and changes may be made in various embodiments of the present invention without departing from its true spirit. The descriptions in this specification are for purposes of illustration only and are not to be construed in a limiting sense. The scope of the present invention is limited only by the language of the following claims.
| Number | Name | Date | Kind |
|---|---|---|---|
| 5323292 | Brzezinski | Jun 1994 | A |
| 5625229 | Kojima | Apr 1997 | A |
| 6484980 | Medlin, Sr | Nov 2002 | B2 |
| 6982877 | Vinson et al. | Jan 2006 | B2 |
| 7726385 | Mok | Jun 2010 | B2 |
| 8310045 | Son | Nov 2012 | B2 |
| 9257364 | Ahuja et al. | Feb 2016 | B2 |
| 9342118 | Barina et al. | May 2016 | B2 |
| 9743558 | Bosak et al. | Aug 2017 | B2 |
| 10168749 | Aoki et al. | Jan 2019 | B2 |
| 10681801 | Kotlar | Jun 2020 | B2 |
| 20020015288 | Dibene, II | Feb 2002 | A1 |
| 20110075377 | Paquette et al. | Mar 2011 | A1 |
| 20110075388 | Zadesky | Mar 2011 | A1 |
| 20110096505 | Inoue | Apr 2011 | A1 |
| 20130214406 | Schultz | Aug 2013 | A1 |
| 20130306273 | Iyengar | Nov 2013 | A1 |
| 20140177166 | Nardi et al. | Jun 2014 | A1 |
| 20140217575 | Hung | Aug 2014 | A1 |
| 20160100511 | Kurz | Apr 2016 | A1 |
| 20170148767 | Hung et al. | May 2017 | A1 |
| 20170186628 | Antoniswamy | Jun 2017 | A1 |
| 20170221793 | Smalley et al. | Aug 2017 | A1 |
| 20180203496 | Campbell | Jul 2018 | A1 |
| 20200135701 | Li | Apr 2020 | A1 |
| 20200234616 | Ha | Jul 2020 | A1 |
| 20200276658 | Fujii | Sep 2020 | A1 |
| 20200292429 | Fujii | Sep 2020 | A1 |
| Number | Date | Country |
|---|---|---|
| 102280418 | Dec 2011 | CN |
| 204584067 | Aug 2015 | CN |
| 108105732 | Jun 2018 | CN |
| 208288806 | Dec 2018 | CN |
| 109937617 | Jun 2019 | CN |
| 2017112332 | Jun 2017 | WO |
| Entry |
|---|
| International Search Report and Written Opinion, PCT/IB2021/052311, dated Jun. 24, 2021, 9 pages. |
| Number | Date | Country | |
|---|---|---|---|
| 20210318734 A1 | Oct 2021 | US |
