Thermal management of batteries using synthetic jets

Abstract
A thermally managed power source (201) is provided herein which comprises a first battery module (203), and a first synthetic jet ejector (215) disposed on a surface of said first battery module and being adapted to direct a plurality of synthetic jets along a surface (211) of said first battery module.
Description
FIELD OF THE DISCLOSURE

The present disclosure relates generally to thermal management systems, and more specifically to thermal management systems adapted for use in cooling battery modules disposed in laptop computers and other portable or handheld electronic devices.


BACKGROUND OF THE DISCLOSURE

The thermal management of laptop computers and other portable or handheld electronic devices has become increasingly challenging as these devices have become more powerful, while at the same time decreasing in size and weight. In particular, acceptable thermal management solutions for these devices are subject to stringent size and weight constraints, and yet must dissipate a sufficient amount of thermal energy to maintain the components and external surfaces of the device within suitable operating and ergonomic temperature ranges, respectively.


Battery modules have emerged as a particularly challenging component of electronic devices from a thermal management perspective. As portable and hand-held devices have become more powerful, battery modules are required to provide increasing power loads, and have also become more compact. Consequently, battery modules have evolved into increasingly intense hot spots within such devices.


Unfortunately, the placement of battery modules in laptops and handheld devices frequently makes them inaccessible to conventional thermal management schemes that rely on global forced air flow through the device. In particular, the battery module is often sealed off from other components of the device to protect those components in the event of battery leakage. Moreover, since the operation of batteries is typically exothermic, it is necessary to shield the components of a device from the heat generated by the battery module. On the other hand, conventional thermal management systems that rely on convection currents generally provide an insufficient level of heat dissipation to be suitable for this application.


The use of fan-based systems is a common global thermal management solution for desk top computers and other large electronic devices. However, the use of fans is precluded in many portable or handheld electronic devices due to the size and weight constraints noted above, and is also unfavorable from an acoustical perspective. Moreover, even in larger portable electronic devices such as laptops where these constraints are less stringent and where small fan units can be utilized to provide global cooling, these units generally provide insufficient heat dissipation for battery modules and other intense hotspots within the device.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is an illustration of a prior art thermal management system based on the use of synthetic jet ejectors;



FIG. 2 is a front view of a battery module equipped with a thermal management system of the type described herein;



FIG. 3 is a side view of the device of FIG. 2;



FIG. 4 is an illustration of a case having two channels defined therein;



FIG. 5 is an illustration of a case having four channels defined therein;



FIG. 6 is an illustration of a case having eight channels defined therein;



FIG. 7 is an illustration of a case having sixteen channels defined therein;



FIG. 8 is a graph of case temperature as a function of channel width;



FIG. 9 is a graph of flow rate (CFM) as a function of heat transfer coefficient;



FIG. 10 is a graph of pressure drop as a function of channel width;



FIG. 11 is a graph of case weight as a function of channel width;



FIG. 12 is a graph of case temperature as a function of conductivity;



FIG. 13 is a graph of case weight as a function of material;



FIG. 14 is an illustration of a battery module equipped with a thermal management system of the type described herein;



FIG. 15 is an illustration of an assembly of battery modules of the type depicted in FIG. 14;



FIG. 16 is an illustration of a battery module equipped with a thermal management system of the type described herein;



FIG. 17 is an illustration of a battery module equipped with a thermal management system of the type described herein; and



FIG. 18 is an illustration of a battery charger equipped with a thermal management system of the type depicted herein.





SUMMARY OF THE DISCLOSURE

In one aspect, a thermally managed power source is provided herein. The power source comprises a first battery module, and a first synthetic jet ejector adapted to direct a plurality of synthetic jets along a surface of said first battery module.


In another aspect, a battery charger is provided which comprises (a) a base having a synthetic jet ejector disposed therein; (b) a platform supported on said base; and (c) a charging station incorporated into said platform, said charging station having a first major surface which is adapted to receive and charge at least one battery; wherein said charging station is powered by electrical circuitry disposed in said base, and wherein said synthetic jet ejector is adapted to direct a plurality of synthetic jets along a surface of said base.


These and other aspects of the present disclosure are described in greater detail below.


DETAILED DESCRIPTION

More recently, thermal management systems have been developed which are based on synthetic jet ejectors. These systems are more energy efficient than comparable fan-based systems, and have the ability to provide localized spot cooling. Systems of this type, an example of which is depicted in FIG. 1, are described in greater detail in U.S. Pat. No. 6,588,497 (Glezer et al.).


The system depicted in FIG. 1 utilizes an air-cooled heat transfer module 101 which is based on a ducted heat ejector (DHE) concept. The module utilizes a thermally conductive, high aspect ratio duct 103 that is thermally coupled to one or more IC packages 105. Heat is removed from the IC packages 105 by thermal conduction into the duct shell 107, where it is subsequently transferred to the air moving through the duct. The air flow within the duct 103 is induced through internal forced convection by a pair of low form factor synthetic jet ejectors 109 which are integrated into the duct shell 107. In addition to inducing air flow, the turbulent jet produced by the synthetic jet ejector 109 enables highly efficient convective heat transfer and heat transport at low volume flow rates through small scale motions near the heated surfaces, while also inducing vigorous mixing of the core flow within the duct.


While systems of the type depicted in FIG. 1 have many unique advantages, there is nonetheless a need in the art for thermal management systems that are adapted to address the particular needs of battery modules. These and other needs are met by the devices and methodologies disclosed herein.


It has now been found that the aforementioned needs can be met through the provision of one or more synthetic jet ejectors in combination with a battery module. The synthetic jet ejectors may be utilized in combination with various channeling techniques that ensure adequate heat dissipation, a low form factor, and acceptable mass, while maintaining the external surfaces of a device incorporating the battery module within an ergonomically acceptable range. The use of synthetic ejectors in combination with various channeling techniques may be used to further ensure that the components of the battery module are maintained at a proper operating temperature. The means by which these objectives may be accomplished are described in greater detail below.



FIGS. 2-3 illustrate a first particular, non-limiting embodiment of a thermal management system in accordance with the teachings herein which is suitable for use in dissipating heat from a battery module. The system 201 depicted therein comprises a battery module 203 which contains one or more batteries 205. A heat exchanger 207 is provided which is adjacent to the batteries 205 and/or battery module 203 and which contains one or more conduits 209 for the flow of a fluid therethrough. The heat exchanger 207 may form part of the battery module 203, or may be a component of a device which incorporates the battery module 203. Thus, for example, the heat exchanger 207 may be a portion of (or may be embedded into) the casing of a laptop computer or handheld electronic device which is adjacent to the battery module 203.


Preferably, the heat exchanger 207 comprises an interior component 211 which is thermally conductive and which is in thermal contact with the battery module 203 and/or the batteries 205, and an exterior component 213 which is thermally non-conductive. The interior component 211 may comprise, for example, aluminum, copper, graphite, or other materials (including various metal alloys and metal filled polymeric compositions) having suitable thermal conductivity, while the exterior surface may comprise, for example, various thermally insulating plastics and other thermally non-conductive materials as are known to the art.


As seen in FIG. 3, the heat exchanger 207 is preferably constructed with a plurality of segregated conduits 209 or channels that are in fluidic communication with a synthetic jet ejector 215. The synthetic jet ejector 215 is preferably adapted to direct at least one synthetic jet into each channel 209. The use of focused synthetic jets in this application is found to have several advantages.


First of all, the flow rates of fluid achievable through the channels 209 with conventional global circulation systems is typically much lower than the rates achievable through the use of synthetic jets, due to the pressure drop created by the channel walls. This problem worsens as the cross-sectional channel dimensions become increasingly smaller. Indeed, at the dimensions typically imposed on thermal management systems by size constraints in portable or handheld electronic devices, the pressure drop is severe enough that these systems typically cannot provide adequate heat dissipation. The use of focused jets to direct a stream of fluid into the channels overcomes this problem by reducing this pressure drop, and hence facilitates increased entrainment of the flow of fluid into the channels.


The use of focused jets in the thermal management systems described herein also significantly improves the efficiency of the heat transfer process. Under conditions in which the fluid is in a non-boiling state, the flow augmentation provided by the use of synthetic jet ejectors increases the rate of local heat transfer in the channel structure, thus resulting in higher heat removal. Under conditions in which the fluid is in a boiling state (as may be the case, for example, if low boiling liquid coolants are utilized in the channels 209), these jets induce the rapid ejection of vapor bubbles formed during the boiling process. This rapid ejection dissipates the insulating vapor layer that would otherwise form along the surfaces of the channels, and hence delays the onset of critical heat flux. In some applications, the synthetic jets may also be utilized to create beneficial nucleation sites to enhance the boiling process.


One skilled in the art will also appreciate that the channels 209 in the devices of FIGS. 2-3 may take a variety of forms. For example, although the channels 209 are depicted as being essentially rectangular in cross-section in the embodiment shown therein, in other embodiments, they may be elliptical, circular, square, hexagonal, polygonal, or irregular in cross-section. Also, in some embodiments, the channels may be formed as an open-celled material. In various embodiments, the channels may also be convoluted to increase the residence time of fluid in the channels.


The number of channels in the heat exchanger 207 may also vary. The optimal choice for a particular application may depend, for example, on such factors as the space available, the amount of heat to be dissipated, and other such factors. Some possible examples are depicted in FIGS. 4-7. Thus, in the device 301 depicted in FIG. 4, the heat exchanger is segregated into 2 channels 303, each having a width of about 45 mm. In the device 321 depicted in FIG. 5, the heat exchanger is segregated into 4 channels 323, each having a width of about 22 mm. In the device 341 depicted in FIG. 6, the heat exchanger is segregated into 8 channels 343, each having a width of about 11 mm. In the device 361 depicted in FIG. 7, the heat exchanger is segregated into 16 channels 363, each having a width of about 5 mm. In each of the particular embodiments depicted in FIGS. 4-7, the channels have a height of about 3 mm, though one skilled in the art will appreciate that this dimension may vary from one embodiment to another and may be application specific.


The effect of channel width (and therefore the number of channels) on heat dissipation is illustrated in FIG. 8. The graph shown therein is based on the results of mathematical modeling studies performed on cases for laptop computers, with the cases having the structures depicted in FIGS. 4-7. The model assumed a fixed heat transfer coefficient of 25 W/m2K, and that the total power to be dissipated was 18 W, which corresponds to a typical device operation of about 90 W.


As seen therein, case temperature drops significantly with an increase in the number of channels, and a corresponding decrease in channel width. Thus, with two channels (each having a width of about 45 mm), the exterior case temperature reached about 80° C. Increasing the number of channels to 4 (and correspondingly decreasing the channel width to about 22 mm) lowered the exterior case temperature to about 74° C. Further increasing the number of channels to 8 (and correspondingly decreasing the channel width to about 11 mm) lowered the exterior case temperature to about 70° C. Finally, increasing the number of channels to 16 (and correspondingly decreasing the channel width to about 5 mm) lowered the exterior case temperature to about 66° C. It is to be noted here that these results are achievable, in part, by the unique ability of synthetic jets to compensate for the increase in flow resistance that would otherwise attend a reduction in channel dimensions.



FIG. 9 is a graph of flow rate (in cubic feet per minute (CFM)) as a function of heat transfer coefficient for a heat exchanger of the type depicted in FIGS. 2-3. As seen therein, in order to attain a desired thermal objective, the flow rate of fluid through the heat exchanger will typically have to increase as the heat transfer coefficient increases. It is thus desirable in many applications to use materials such as metals and graphite which have high thermal conductivities for the interior segment 211 (see FIG. 2) of the heat exchanger.



FIG. 10 is a graph of pressure drop as a function of channel width for a heat exchanger of the type depicted in FIGS. 2-3. As seen therein, pressure decreases significantly with channel width. Thus, for a device of the type depicted in FIG. 4 which has two channels (each having a width of about 45 mm), the channel pressure is about 10 N/m2. For a device of the type depicted in FIG. 5 which has four channels (each having a width of about 22 mm), the channel pressure is about 60 N/m2. For a device of the type depicted in FIG. 6 which has eight channels (each having a width of about 11 mm), the channel pressure is about 70 N/m2. For a device of the type depicted in FIG. 7 which has sixteen channels (each having a width of about 5 mm), the channel pressure is about 60 N/m2. Hence, the need for flow augmentation of the type provided by synthetic jets becomes more critical as the number of channels increases and channel width decreases. One skilled in the art will appreciate that the optimum channel dimensions for a particular application may thus be chosen with consideration of the amount of heat to be dissipated, the flow augmentation available with the synthetic jet ejector, the heat transfer coefficient of the material of the heat exchanger, and other such factors.



FIG. 11 illustrates the effect of channel width on the weight of a device for a particular embodiment of the heat exchanger of the type depicted in FIGS. 2-3. Thus, for an exemplary heat exchanger having the configuration depicted in FIG. 4 (which has two channels, each having a width of about 45 mm), the weight of the device is about 20 g. For an exemplary heat exchanger of the type depicted in FIG. 5 (which has four channels, each having a width of about 22 mm), the weight of the device is about 22 g. For an exemplary heat exchanger of the type depicted in FIG. 6 (which has eight channels, each having a width of about 11 mm), the weight of the device is about 24 g. For an exemplary heat exchanger of the type depicted in FIG. 7 (which has sixteen channels, each having a width of about 5 mm), the weight of the device is about 30 g. It is thus seen that, with respect to the device depicted in FIGS. 2-3, there is a weight penalty associated with increasing the number of channels, due in part to the increased number of channel partitions. In designing a heat exchanger for a particular application, this weight penalty must be considered in light of the other benefits and drawbacks attendant to an increase in the number of channels.



FIG. 12 illustrates the effect of thermal conductivity of the case material on the case temperature. As seen therein, the use of case materials such as aluminum, copper or graphite in the interior component 211 (see FIG. 2) of the case allows the exterior case temperature to be maintained at about 70° C. (assuming a 4-channel heat exchanger of the type depicted in FIG. 5), which is well within ergonomically acceptable ranges for many applications. By contrast, the use of thermally insulating materials such as non-thermally conductive plastics increases the exterior case temperature about two-fold to 140° C.



FIG. 13 illustrates the effect of materials choice on the weight of the case. As seen therein, plastics (i.e., ABS) provide the most light-weight construction at about 8 grams. The use of graphite increases the weight of the casing to about 17 g, while the use of aluminum increases the weight to about 20 g. For comparison, a copper construction would yield a casing that weighs about 70 g. It should be noted that the foregoing assumes that the entire casing is made of the noted material. However, one skilled in the art will appreciate that the advantages of thermal conductivity (and the previously noted reduction in exterior casing temperatures) and lighter weight casings can be achieved by making the casing with a two-component or multi-component construction of the type depicted in FIGS. 2-3. In such a construction, only the interior component 211 is required to be thermally conductive, thus significantly reducing the weight penalty associated with the use of heavier, thermally conductive materials.



FIG. 14 illustrates a second, non-limiting embodiment of a thermal management system of the type disclosed herein which is suitable for use in dissipating heat from a battery module. The system 401 comprises a battery module 403 which contains one or more batteries. Rather than utilizing a channeling scheme as is the case with the device of FIGS. 2-3, in this embodiment, a synthetic jet ejector 405 is mounted on one end of the battery module 403 and is adapted to direct a plurality of synthetic jets along one or more surfaces of the battery module 403, as indicated by the first set of arrows 407. A series of apertures 409 or nozzles are provided on a surface of the synthetic jet ejector 405 adjacent to each major surface of the battery module 403 for this purpose. As indicated by the second set of arrows 411 in FIG. 14, the synthetic jets created by the synthetic jet ejector 405 cause entrainment of the ambient fluid, thus improving the efficiency of heat transfer from the surfaces of the battery module 403 to the ambient environment.


As shown in FIG. 15, battery modules 403 of the type depicted in FIG. 14 may be assembled in parallel. One advantage of this type of arrangement is that the resulting entrainment of the ambient fluid, indicated in FIG. 15 by arrows 413, results in a turbulent flow of the fluid medium through the space between adjacent battery modules 403, thus resulting in a more efficient transfer of heat between the surfaces of the battery modules 403 and the ambient environment.



FIG. 16 illustrates another possible, non-limiting embodiment of a thermally managed battery module made in accordance with the teachings herein. The device 501 depicted therein comprises a casing 503 which contains a battery module 505 and associated circuitry 507. The battery module 505 has a synthetic jet actuator 509 mounted on a surface thereof. The casing 503 may contain one or more vents to permit fluid flow between the interior and exterior of the casing 503.



FIG. 17 illustrates yet another possible, non-limiting embodiment of a thermally managed battery module made in accordance with the teachings herein. The device 531 depicted therein, which is similar in many respects to the device depicted in FIG. 16, comprises a casing 533 which contains a battery module 535 and associated circuitry 537. In contrast to the device depicted in FIG. 16, however, the device depicted in FIG. 17 utilizes a channeling scheme 539 similar to that depicted in FIGS. 2-3, in conjunction with a surface mounted synthetic jet actuator 541, to create a flow of fluid over the surfaces of the battery module 535, thereby maintaining the battery modules within a desired temperature range.


While much of the discussion above has focused on the thermal management of battery modules, one skilled in the art will appreciate that the teachings disclosed herein are not limited to battery modules, but are applicable to the thermal management of a wide variety of devices. Thus, for example, FIG. 18 illustrates one particular, non-limiting embodiment of the application of a synthetic jet ejector of the type disclosed herein to a battery charger 601. The battery charger 601 comprises a platform 603 which has an upper surface 605 that has a series of ports therein (not shown), each of which is adapted to accept a battery 607 or battery pack for charging. The base 609 of the battery charger 601 contains a power supply which is in electrical communication with the ports defined in the upper surface 605 of the platform 603.


The base 609 is equipped with a planar surface for supporting the battery charger on a substrate. The platform 603 is preferably supported at an angle to the planar surface. Preferably, this angle is within the range of about 15° to about 75°, and more preferably, this angle is within the range of about 30° to about 60°.


In the particular embodiment of the battery charger depicted in FIG. 18, significant heating occurs during the normal charge and discharge cycles attendant to the operation of the device such that, if no thermal management measures are taken, the temperature of the (typically aluminum) front surface 611 of the base 603 is about 68° C., which is well above the critical limit of 55° C. dictated by end-user ergonomics. Moreover, the device is found to lose capacity when the temperature of this component exceeds 65° C.


The base 609 of the device includes a base plate 613. The base plate contains a synthetic jet ejector that is adapted to eject a plurality of synthetic jets (indicated by the larger arrows) along the front surface 611 of the chassis 603. The formation of the synthetic jets causes entrainment of the ambient fluid (indicated by the smaller arrows). Operation of the synthetic jet ejector is found to reduce the temperature of the front surface 611 of the base 603 such that it is in an ergonomically acceptable range.


The above description of the present invention is illustrative, and is not intended to be limiting. It will thus be appreciated that various additions, substitutions and modifications may be made to the above described embodiments without departing from the scope of the present invention. Accordingly, the scope of the present invention should be construed in reference to the appended claims.

Claims
  • 1. A battery charger, comprising: a base having a synthetic jet ejector disposed therein;a platform supported on said base; anda charging station incorporated into said platform, said charging station having a first major surface which is adapted to receive and charge at least one battery;
  • 2. The battery charger of claim 1, wherein said first major surface is spaced apart from said base.
  • 3. The battery charger of claim 1, wherein said angle is within the range of about 15° to about 75°.
  • 4. The battery charger of claim 1, wherein said angle is within the range of about 30° to about 60°.
  • 5. The battery charger of claim 1, wherein said charging station has a first major surface which is adapted to receive and charge a plurality of batteries.
  • 6. The battery charger of claim 5, wherein said first major surface is open to the ambient environment.
  • 7. The battery charger of claim 1, wherein said base is supported on a plate, and wherein said plate has a plurality of apertures therein.
  • 8. The battery charger of claim 7, wherein said plurality of apertures are in fluidic communication with a synthetic jet actuator.
  • 9. The battery charger of claim 7, wherein said synthetic jet ejector is adapted to direct a plurality of synthetic jets along a surface of said base which is perpendicular to said base plate.
  • 10. The battery charger of claim 7, wherein said plurality of apertures are spaced apart from the surface of said base.
  • 11. The battery charger of claim 10, wherein said plate has a first portion which is covered by said base and a second portion which is not covered by said base, and wherein said plurality of apertures are disposed in said second portion of said plate.
  • 12. The battery charger of claim 1, in combination with a battery, wherein said battery is disposed on said first major surface.
  • 13. The battery charger of claim 1, in combination with a plurality of batteries, wherein said plurality of batteries are disposed on said first major surface.
  • 14. The battery charger of claim 13, wherein said batteries are arranged in parallel on said first major surface.
  • 15. The battery charger of claim 1, wherein said platform has a second major surface, and wherein said first and second major surfaces of said platform are opposing surfaces.
CROSS REFERENCE TO RELATED APPLICATION

The present application claims priority from U.S. Provisional Application Ser. No. 60/753,074 entitled “THERMAL MANAGEMENT OF BATTERIES USING SYNTHETIC JETS”, which was filed on Dec. 21, 2005, and which is incorporated herein by reference in its entirety.

US Referenced Citations (153)
Number Name Date Kind
3464672 Massa Sep 1969 A
4031171 Asao et al. Jun 1977 A
4170244 Bernaerts Oct 1979 A
4238425 Matsuoka Dec 1980 A
4257224 Wygnanski et al. Mar 1981 A
4350838 Harrold Sep 1982 A
4406323 Edelman Sep 1983 A
4498851 Kolm et al. Feb 1985 A
4501319 Edelman et al. Feb 1985 A
4533082 Maehara et al. Aug 1985 A
4590399 Roxlo et al. May 1986 A
4590970 Mott May 1986 A
4595338 Kolm et al. Jun 1986 A
4664345 Lurz May 1987 A
4667877 Yao et al. May 1987 A
4693201 Williams et al. Sep 1987 A
4697116 Nakamura et al. Sep 1987 A
4697769 Blackwelder et al. Oct 1987 A
4708600 AbuJudom, II et al. Nov 1987 A
4727930 Bruckner et al. Mar 1988 A
4763225 Frenkel et al. Aug 1988 A
4780062 Yamada et al. Oct 1988 A
4802642 Mangiarotty Feb 1989 A
4923000 Nelson May 1990 A
4930701 Porter et al. Jun 1990 A
4930705 Broerman Jun 1990 A
4932610 Maestrello Jun 1990 A
4938279 Betker Jul 1990 A
4938742 Smits Jul 1990 A
4939405 Okuyama et al. Jul 1990 A
4941398 Morris et al. Jul 1990 A
RE33448 Bauer Nov 1990 E
4969802 Merrigan et al. Nov 1990 A
4976311 Kurzweg Dec 1990 A
4989810 Meier et al. Feb 1991 A
5008582 Tanuma et al. Apr 1991 A
5034688 Moulene et al. Jul 1991 A
5040560 Glezer et al. Aug 1991 A
5083194 Bartilson Jan 1992 A
5107398 Bailey Apr 1992 A
5137079 Anderson Aug 1992 A
5142260 House Aug 1992 A
5154347 Vijay Oct 1992 A
5156306 Perera Oct 1992 A
5165243 Bennett Nov 1992 A
5183104 Novotney Feb 1993 A
5190099 Mon Mar 1993 A
5199640 Ursic Apr 1993 A
5199856 Epstein et al. Apr 1993 A
5209438 Wygnanski May 1993 A
5226597 Ursic Jul 1993 A
5242110 Riley Sep 1993 A
5251817 Ursic Oct 1993 A
5303555 Chrysler et al. Apr 1994 A
5316075 Quon et al. May 1994 A
5335143 Maling, Jr. et al. Aug 1994 A
5346745 Bandyopadhyay Sep 1994 A
5361989 Merchat et al. Nov 1994 A
5395592 Bolleman et al. Mar 1995 A
5402312 Kinjo et al. Mar 1995 A
5411208 Burgener May 1995 A
5419780 Suski May 1995 A
5429302 Abbott Jul 1995 A
5437421 Nosenchuck et al. Aug 1995 A
5493615 Burke et al. Feb 1996 A
5516043 Manna et al. May 1996 A
5558156 Tsutsui Sep 1996 A
5595205 Sirovich et al. Jan 1997 A
5681152 Aha Oct 1997 A
5758823 Glezer et al. Jun 1998 A
5791601 Dancila et al. Aug 1998 A
5797414 Sirovich et al. Aug 1998 A
5798465 Ziada et al. Aug 1998 A
5857619 Huang et al. Jan 1999 A
5861703 Losinski Jan 1999 A
5873408 Bellet et al. Feb 1999 A
5876187 Afromowitz Mar 1999 A
5881954 Holm Mar 1999 A
5894990 Glezer et al. Apr 1999 A
5901037 Hamilton et al. May 1999 A
5921757 Tsutsui et al. Jul 1999 A
5957413 Glezer et al. Sep 1999 A
5983944 Niv Nov 1999 A
5988522 Glezer et al. Nov 1999 A
5996903 Asai et al. Dec 1999 A
5997671 Takeuchi et al. Dec 1999 A
6016969 Tilton et al. Jan 2000 A
6032464 Swift et al. Mar 2000 A
6056204 Glezer et al. May 2000 A
6059020 Jairazbhoy et al. May 2000 A
6109222 Glezer et al. Aug 2000 A
6123145 Glezer et al. Sep 2000 A
6137891 Porrazzo et al. Oct 2000 A
6186748 Umeda et al. Feb 2001 B1
6247525 Smith et al. Jun 2001 B1
6280148 Zengerle et al. Aug 2001 B1
6315215 Gipson et al. Nov 2001 B1
6333852 Lin Dec 2001 B1
6405794 Kim et al. Jun 2002 B1
6412732 Amitay et al. Jul 2002 B1
6440212 Hayes Aug 2002 B1
6451175 Lal Sep 2002 B1
6457654 Glezer et al. Oct 2002 B1
6458618 Allen et al. Oct 2002 B1
6475658 Pedicini et al. Nov 2002 B1
6481984 Shinohara et al. Nov 2002 B1
6554607 Glezer et al. Apr 2003 B1
6588497 Glezer et al. Jul 2003 B1
6628522 Trautman et al. Sep 2003 B2
6629425 Vaiyapuri Oct 2003 B2
6631077 Zuo Oct 2003 B2
6644598 Glezer et al. Nov 2003 B2
6650542 Chrysler et al. Nov 2003 B1
6668911 Bingler Dec 2003 B2
6669115 Sun et al. Dec 2003 B2
6710577 Shum Mar 2004 B1
6722581 Saddoughi Apr 2004 B2
6725670 Smith et al. Apr 2004 B2
6759159 Gray et al. Jul 2004 B1
6801430 Pokharna Oct 2004 B1
6809928 Gwin et al. Oct 2004 B2
6817204 Bash et al. Nov 2004 B2
6824915 Pedicini Nov 2004 B1
6843310 Chen Jan 2005 B1
6848631 Monson et al. Feb 2005 B2
6937472 Pokhama Aug 2005 B2
6949309 Moores et al. Sep 2005 B2
6967464 Heigl et al. Nov 2005 B2
6988706 Seeley Jan 2006 B2
7023697 Pokharna et al. Apr 2006 B2
7039213 Hyre et al. May 2006 B2
7055329 Martens et al. Jun 2006 B2
7092254 Monsef et al. Aug 2006 B1
7211347 Sugiura et al. May 2007 B2
20020098097 Singh Jul 2002 A1
20030043531 Trautman et al. Mar 2003 A1
20030075615 Saddoughi Apr 2003 A1
20030110788 Koeneman et al. Jun 2003 A1
20030133587 Hyre et al. Jul 2003 A1
20030177899 Monson et al. Sep 2003 A1
20040125561 Gwin et al. Jul 2004 A1
20040231341 Smith Nov 2004 A1
20050013116 Pokharna et al. Jan 2005 A1
20050031137 Browning et al. Feb 2005 A1
20050074662 Cho et al. Apr 2005 A1
20050105757 Tummire et al. May 2005 A1
20050111185 Bhattacharya et al. May 2005 A1
20050163338 Ohashi Jul 2005 A1
20050284612 Machiroutu Dec 2005 A1
20060016581 Wang et al. Jan 2006 A1
20060022092 Miller et al. Feb 2006 A1
20060145027 Warsop et al. Jul 2006 A1
20060164805 Meinders et al. Jul 2006 A1
Foreign Referenced Citations (9)
Number Date Country
0 385 090 Jan 1990 EP
10-047254 Feb 1998 JP
2001-355574 Dec 2001 JP
2005-264811 Sep 2005 JP
1274165 Jan 1984 SU
WO 9926457 Nov 1998 WO
WO 0272421 Mar 2002 WO
WO 2005008348 Jul 2004 WO
WO 2005090789 Feb 2005 WO
Related Publications (1)
Number Date Country
20070141453 A1 Jun 2007 US
Provisional Applications (1)
Number Date Country
60753074 Dec 2005 US