BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view of prior art electronic components cooled by a cold plate;
FIG. 2 is a perspective view of prior art electronic components cooled by a cold plate and aluminum cover;
FIG. 3 is a perspective view of electronic components cooled by a carbon fiber laminate and stitched fibers according to one embodiment of the present invention;
FIG. 4 is a perspective view of the electronic components of FIG. 3 removed from its housing to show methods of attaching the carbon fiber laminate according to the present invention;
FIG. 5A is a close up view of the carbon fiber laminate and the stitched fibers according to the present invention;
FIG. 5B is a close up view of the carbon fiber laminate and the stitched fibers according to another embodiment of the present invention and
FIG. 6 is a perspective view of electronic components cooled using a thermal pad having a carbon fiber laminate and stitched fibers according to another embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
The following detailed description is of the best currently contemplated modes of carrying out the invention. The description is not to be taken in a limiting sense, but is made merely for the purpose of illustrating the general principles of the invention, since the scope of the invention is best defined by the appended claims.
Briefly, the present invention provides a carbon fiber laminate having stitched therein a plurality of stitched carbon fibers. The carbon fiber laminate and stitched fibers may comprise a thermal spreader for electronic components. The stitched fibers may have various loop heights, resulting in a thermal spreader that may provide additional heat dissipating surface area, thereby increasing the thermal efficiency of the thermal spreader. The thermal spreader of the present invention may be useful in applications where there is a need for the dissipation of heat from high power electronic components. Such industries may include the aerospace industry, avionics and automotive industries.
Conventional thermal spreaders may use an aluminum sheet and/or a carbon fiber sheet as heat transfer devices. These conventional thermal spreaders, however, often are inefficient or require additional space or a complex manufacture method. The thermal spreader of the present invention may provide excellent thermal efficiency by providing stitched fibers on an exterior surface of a carbon laminate thermal spreader. The resulting increased surface area due to the carbon fibers may increase convectional cooling of the thermal spreader, thereby resulting in greater efficiency.
Carbon fiber may have a nominal thermal conduction of 1100 W/m K° and a carbon fiber with polymer (a carbon fiber laminate) may have a nominal in-plane thermal conduction of 300 W/m K°. This compares favorably with conventional aluminum thermal spreaders, as aluminum has a thermal conduction of about 150 W/m K°. Therefore, the thermal conduction of carbon fiber laminate layers will remove heat faster than a comparable thermal spreader made of aluminum.
Referring to FIG. 3, there is shown a perspective view of electronic components 30 conductively cooled by a carbon fiber composite 34 according to one embodiment of the present invention. The electronic components 30 may be attached to a cold plate 32. An attachment section 40 may be used to attach the carbon fiber composite 34 to the cold plate 32.
Referring now to FIG. 4, there is shown a perspective view of the electronic components 30 of FIG. 3, with the cold place 32 removed, in order to provide a better view of the attachment section 40. The carbon fiber composite 34 may be attached to cold plate 32 by an attachment strip 42. Alternatively, or in addition to the attachment strip 42, a plurality of holes 44 may be provided through the carbon fiber composite 34 to allow for mechanically attaching the carbon fiber composite 34 to the cold plate 32. In this embodiment, the holes 44 may be plated with a thermally-conductive material, for example, copper, to increase thermal conductivity through the holes 44. While the above refers to examples for attaching the carbon fiber composite 34 to the cold plate 32, any known method may be used to make this attachment.
Referring to FIGS. 5A and 5B, there is shown a close up views of the carbon fiber composite 34 of FIG. 3, showing two patterns for stitching the carbon fiber composite 34. Carbon fiber composite 34 may comprise a plurality of carbon fiber laminate layers 38. The carbon fiber laminate layers 38 may comprise carbon fibers in a polymer matrix. The polymer may be chosen from any of the polymers known in the art. As examples, epoxies and polyimides may be useful polymers to make the carbon fiber laminate layers 38 of the present invention. The carbon fiber laminate layers 38 may be made by any conventional means. As examples, the carbon fiber laminate layers 38 may be made from any one of the processes disclosed in U.S. Pat. Nos. 4,356,227, 4,543,145 and 4,892,780, each herein incorporated by reference. The carbon fiber laminate layers 38 may have a generally planar geometry and may be shaped to the contour of the electronic components. As an example, from about 2 to about 6 carbon fiber laminate layers 38 may be stacked together to form the carbon fiber composite 34. The thickness of the carbon fiber composite 34 may vary depending on the particular application and typically may be from about 15 to about 40 mils.
The stitched fibers 36 may comprise carbon fibers woven into at least one carbon fiber laminate layer 38 and having loops extending above/below the carbon fiber laminate layer 38. The stitched fibers 36 may have loop heights varying from about two times to about 5 times the thickness of the carbon fiber composite 34. Typically, the loop height of the stitched fibers 36 may be from about 3 times to about 4 times the thickness of the carbon fiber composite 34. For typical applications, the loop height may range from about 50 to about 100 mils. The stitched fibers 36 may provide an increased surface area for convection cooling of the carbon fiber composite 34. The stitched fibers 36 may be attached to the carbon fiber laminate layers 38 by any conventional means. For example, the stitched fibers 36 may be attached to the carbon fiber laminate layers 38 by a variation of methods disclosed in U.S. Pat. No. 6,051,089, herein incorporated by reference. The stitched fibers 36 may be any conventional carbon fiber, including vapor grown carbon fibers and pitch based carbon fibers. While FIGS. 5A and 5B shows different ways to stitch fibers to the carbon fiber laminate, the invention is not limited to such methods, and any conventional stitching methods and patterns may be used in the present invention.
Referring now to FIG. 6, there is shown a perspective view of electronic components 30 cooled using a thermal pad 34′ having a carbon fiber laminate and stitched fibers (not shown) according to another embodiment of the present invention. In this embodiment of the present invention, the carbon fiber composite 34 may be used as a thermal pad 34′. The thermal pad 34′ may be glued to the surface of the electronic components 30 by any conventional means. The thermal pad 34′, having the stitched fibers as previously described, may result in improved cooling of the electronic components 30 due to the increased convectional cooling of the thermal pad 34′.
It should be understood, of course, that the foregoing relates to preferred embodiments of the invention and that modifications may be made without departing from the spirit and scope of the invention as set forth in the following claims.
Patent Application
20080026179
