Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Production method for aluminum-diamond composite
- Patent number 12,303,973
- Issue date May 20, 2025
- DENKA COMPANY LIMITED
- Hiroaki Ota
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Double-sided cooling type power module
- Patent number 12,308,300
- Issue date May 20, 2025
- Hyundai Motor Company
- Jun Hee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and bonded body
- Patent number 12,308,301
- Issue date May 20, 2025
- Kabushiki Kaisha Toshiba
- Yumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 12,308,349
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Takamasa Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for power semiconductor devices
- Patent number 12,300,678
- Issue date May 13, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid metal foam thermal interface material
- Patent number 12,300,567
- Issue date May 13, 2025
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies with power electronic devices and three-dime...
- Patent number 12,300,653
- Issue date May 13, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates and related methods
- Patent number 12,300,558
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 12,300,512
- Issue date May 13, 2025
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency heat dissipation using discrete thermal interface m...
- Patent number 12,300,568
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,300,569
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Masanori Tsukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grindable heat sink for multiple die packaging
- Patent number 12,300,570
- Issue date May 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 12,293,955
- Issue date May 6, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged power electronic device, in particular bridge circuit comp...
- Patent number 12,295,128
- Issue date May 6, 2025
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit comprising a RF switches having reduced parasiti...
- Patent number 12,293,981
- Issue date May 6, 2025
- STMicroelectronics (Crolles 2) SAS
- Stephane Monfray
- G11 - INFORMATION STORAGE
Information Patent Grant
Power module and method for manufacturing same
- Patent number 12,288,940
- Issue date Apr 29, 2025
- AMOSENSE CO., LTD.
- Jonguk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation sheet and heat dissipation sheet-attached device
- Patent number 12,288,732
- Issue date Apr 29, 2025
- FUJIFILM Corporation
- Satoshi Kuniyasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-phase immersion-cooling heat-dissipation composite structure ha...
- Patent number 12,289,865
- Issue date Apr 29, 2025
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Chun-Te Wu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multi-fractal heatsink system and method
- Patent number 12,288,731
- Issue date Apr 29, 2025
- FRACTAL HEATSINK TECHNOLOGIES LLC
- Alexander Poltorak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
- Patent number 12,283,535
- Issue date Apr 22, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with warpage release layer structure in package a...
- Patent number 12,283,553
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alumina-based thermally conductive oxide and method for producing same
- Patent number 12,281,254
- Issue date Apr 22, 2025
- Dainichiseika Color & Chemicals Mfg. Co., Ltd.
- Akira Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Wire bonded air heat sink
- Patent number 12,278,159
- Issue date Apr 15, 2025
- RAYTHEON TECHNOLOGIES CORPORATION
- James S. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,278,160
- Issue date Apr 15, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat radiator and electronic component module
- Patent number 12,278,157
- Issue date Apr 15, 2025
- Molex, LLC
- Tetsunori Tsumuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Agglomerated boron nitride powder, heat dissipation sheet, and semi...
- Patent number 12,275,888
- Issue date Apr 15, 2025
- Mitsubishi Chemical Corporation
- Masanori Yamazaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Multi-layer semiconductor material structure and preparation method...
- Patent number 12,278,104
- Issue date Apr 15, 2025
- Institute of Microelectronics of the Chines Academy of Sciences
- Fengwen Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip cooling platform based on micro-nano structure
- Patent number 12,278,164
- Issue date Apr 15, 2025
- Guangdong Ocean University
- Haowei Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ACTIVE METAL BRAZING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250162280
- Publication date May 22, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIH-WEI MAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHODS FOR ON-CHIP HEAT ROUTING ARCHITECTURES
- Publication number 20250167064
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Radwanul Hasan SIDDIQUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A RADIATIVE NANOMATERIAL PACKAGE ARCHITECTURE
- Publication number 20250167069
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Radwanul Hasan SIDDIQUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167063
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Takeshi TOKOROZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
- Publication number 20250167065
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR
- Publication number 20250167071
- Publication date May 22, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167163
- Publication date May 22, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCT...
- Publication number 20250167072
- Publication date May 22, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20250167099
- Publication date May 22, 2025
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE HEAT-DISSIPATION PACKAGE STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20250157873
- Publication date May 15, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Ting-An Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157913
- Publication date May 15, 2025
- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR HEAT DISSIPATION
- Publication number 20250157876
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS
- Publication number 20250157969
- Publication date May 15, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE
- Publication number 20250157877
- Publication date May 15, 2025
- Niterra Co., Ltd.
- Takuya HANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250157880
- Publication date May 15, 2025
- Hitachi Astemo, Ltd.
- Fusanori NISHIKIMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250157937
- Publication date May 15, 2025
- Hitachi Astemo, Ltd.
- Takahiro ARAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED PHOTOVOLTAIC (PV) PANEL AND METHOD OF MANUFACTURING
- Publication number 20250151418
- Publication date May 8, 2025
- PURE IMPACT FZCO
- Huseyin Cenk YABAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD O...
- Publication number 20250149345
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES HAVING ENCAPSULATION STRESS AND STRAIN MITIGATING CON...
- Publication number 20250149395
- Publication date May 8, 2025
- Utkarsh Mehrotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149401
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MODULE
- Publication number 20250151238
- Publication date May 8, 2025
- LITE-ON TECHNOLOGY CORPORATION
- Chien-Hsiung Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20250149512
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250149515
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Kiju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140635
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit with Enhanced Thermal Dissipation Structure
- Publication number 20250140639
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION BY NANO PIPES
- Publication number 20250140644
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS
- Publication number 20250140641
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...
- Publication number 20250140698
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK
- Publication number 20250140769
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yunyi Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREA...
- Publication number 20250140632
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS

Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Production method for aluminum-diamond composite

Double-sided cooling type power module

Structure and bonded body

Semiconductor apparatus

Package for power semiconductor devices

Solid metal foam thermal interface material

Electronics assemblies with power electronic devices and three-dime...

Substrates and related methods

Metal/ceramic bonding substrate and method for producing same

High efficiency heat dissipation using discrete thermal interface m...

Semiconductor device

Grindable heat sink for multiple die packaging

High power module package structures

Packaged power electronic device, in particular bridge circuit comp...

Electronic circuit comprising a RF switches having reduced parasiti...

Power module and method for manufacturing same

Heat dissipation sheet and heat dissipation sheet-attached device

Two-phase immersion-cooling heat-dissipation composite structure ha...

Multi-fractal heatsink system and method

Systems and methods for cooling system and power module for inverte...

IC die and heat spreaders with solderable thermal interface structu...

Semiconductor die with warpage release layer structure in package a...

Alumina-based thermally conductive oxide and method for producing same

Systems and methods for parameter drift correction for inverter for...

Wire bonded air heat sink

Methods and heat distribution devices for thermal management of chi...

Heat radiator and electronic component module

Agglomerated boron nitride powder, heat dissipation sheet, and semi...

Multi-layer semiconductor material structure and preparation method...

Chip cooling platform based on micro-nano structure

Patents Applicationslast 30 patents

ACTIVE METAL BRAZING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SYSTEM AND METHODS FOR ON-CHIP HEAT ROUTING ARCHITECTURES

SYSTEM AND METHODS FOR A RADIATIVE NANOMATERIAL PACKAGE ARCHITECTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCT...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

DUAL-SIDE HEAT-DISSIPATION PACKAGE STRUCTURE AND PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE FOR HEAT DISSIPATION

ELECTRONIC ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS

SEMICONDUCTOR SUBSTRATE

POWER CONVERSION DEVICE

POWER CONVERSION DEVICE

DOUBLE-SIDED PHOTOVOLTAIC (PV) PANEL AND METHOD OF MANUFACTURING

SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD O...

POWER MODULES HAVING ENCAPSULATION STRESS AND STRAIN MITIGATING CON...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

HEAT DISSIPATION MODULE

SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR PACKAGES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Integrated Circuit with Enhanced Thermal Dissipation Structure

HEAT DISSIPATION BY NANO PIPES

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS

INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...

INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREA...