Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die package with multi-lid structures and method for...
- Patent number 12,170,238
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded copper substrates fabricated using silver sintering
- Patent number 12,170,239
- Issue date Dec 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado Tolentino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Display device
- Patent number 12,165,949
- Issue date Dec 10, 2024
- Samsung Display Co., Ltd.
- Munsik Ham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 12,165,950
- Issue date Dec 10, 2024
- Vitesco Technologies GmbH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder thermal interface material (STIM) with dopant
- Patent number 12,166,004
- Issue date Dec 10, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,165,946
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor devices and method for forming the same
- Patent number 12,165,947
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interconnect structure for thermal management of electrical...
- Patent number 12,165,945
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded substrate, and method for manufacturing bonded substrate
- Patent number 12,165,948
- Issue date Dec 10, 2024
- NGK Insulators, Ltd.
- Takashi Ebigase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lidded microelectronic device packages and related systems, apparat...
- Patent number 12,159,811
- Issue date Dec 3, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of forming
- Patent number 12,154,838
- Issue date Nov 26, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive silicone gel composition
- Patent number 12,152,147
- Issue date Nov 26, 2024
- Fuji Polymer Industries Co., Ltd.
- Takumi Kataishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spaced apart containers
- Patent number 12,154,836
- Issue date Nov 26, 2024
- Kabushiki Kaisha Toshiba
- Hisashi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side cooling semiconductor packages and related methods
- Patent number 12,154,844
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising antenna and communication m...
- Patent number 12,154,870
- Issue date Nov 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Meng-Wei Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-coated heat spreader for integrated circuit device assemblies
- Patent number 12,154,839
- Issue date Nov 26, 2024
- Advanced Micro Devices, Inc.
- Xiaoyang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package having the same
- Patent number 12,154,840
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Seonho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 12,148,735
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical multichip package with multiple system-on-chip dies
- Patent number 12,148,744
- Issue date Nov 19, 2024
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material structure for low thermal resistance silicon-based gallium...
- Patent number 12,142,643
- Issue date Nov 12, 2024
- Xidian University
- Jincheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising metal layer configured for electromagnetic inter...
- Patent number 12,142,577
- Issue date Nov 12, 2024
- QUALCOMM Technologies, Inc.
- Marc Huesgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance two-phase cooling apparatus for portable applications
- Patent number 12,140,385
- Issue date Nov 12, 2024
- PiMEMS, Inc.
- Payam Bozorgi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 12,136,581
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip package, method of forming a semiconductor...
- Patent number 12,136,583
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 12,136,579
- Issue date Nov 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with high heat dissipation property using hexa...
- Patent number 12,131,978
- Issue date Oct 29, 2024
- Electronics and Telecommunications Research Institute
- Il Gyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus
- Patent number 12,132,014
- Issue date Oct 29, 2024
- Hitachi, Ltd.
- Junpei Kusukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421031
- Publication date Dec 19, 2024
- InnoLux Corporation
- Te-Hsun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421052
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL, THREE-DIMENSIONAL MEMORY, AND METHOD OF OPERATING THRE...
- Publication number 20240421032
- Publication date Dec 19, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Gang ZHANG
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HEAT SHIELD
- Publication number 20240421217
- Publication date Dec 19, 2024
- Analog Devices, Inc.
- James G. Fiorenza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE ASSEMBLY OF MULTIPLE SEMICONDUCTOR DEVICES WITH INSULATING S...
- Publication number 20240421139
- Publication date Dec 19, 2024
- Transphorm Technology, Inc.
- Davide Bisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20240421029
- Publication date Dec 19, 2024
- Wolfspeed, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL MITIGATION
- Publication number 20240421030
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER FOR HEAT GENERATING ELECTRONIC COMPONENT
- Publication number 20240422944
- Publication date Dec 19, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yuuki SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240421106
- Publication date Dec 19, 2024
- Hyundai Motor Company
- Jin Myeong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FAB...
- Publication number 20240413046
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Frank Sauerland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR USING S...
- Publication number 20240413050
- Publication date Dec 12, 2024
- Kabushiki Kaisha Toshiba
- Toshihide UENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER MATERIAL
- Publication number 20240409800
- Publication date Dec 12, 2024
- ARCELORMITTAL
- Cristina BLANCO ROLDAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS
- Publication number 20240414837
- Publication date Dec 12, 2024
- Bitmain Technologies Inc.
- Shitao TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...
- Publication number 20240413025
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, APPARATUSES, AND METHODS FOR NANOWIRES FOR SEMICONDCUTOR P...
- Publication number 20240413043
- Publication date Dec 12, 2024
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING THERMAL MANAGEMENT STRUCTURE
- Publication number 20240413047
- Publication date Dec 12, 2024
- CHUN-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Publication number 20240413031
- Publication date Dec 12, 2024
- Intel Corporation
- Chandru Periasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND HEAT DISSIPATION PLATE
- Publication number 20240413045
- Publication date Dec 12, 2024
- DENSO CORPORATION
- MASAYUKI KAMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413049
- Publication date Dec 12, 2024
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413044
- Publication date Dec 12, 2024
- DENSO CORPORATION
- Koji URAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER
- Publication number 20240413051
- Publication date Dec 12, 2024
- Denka Company Limited
- Daisuke GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING THERMAL MANAGEMENT STRUCTURE
- Publication number 20240413048
- Publication date Dec 12, 2024
- CHUN-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER
- Publication number 20240404913
- Publication date Dec 5, 2024
- Denka Company Limited
- Daisuke GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK-SILVER LAYER INTERFACE
- Publication number 20240404914
- Publication date Dec 5, 2024
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20240399895
- Publication date Dec 5, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240404912
- Publication date Dec 5, 2024
- Fuji Electric Co., Ltd.
- Taichi ITOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER, METHOD OF MANUFACTURING THE HEAT DISSIPATI...
- Publication number 20240395653
- Publication date Nov 28, 2024
- DENSO CORPORATION
- MASAKI AOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE EQUIPPED WITH A UNIQUE CODE FOR A HEAT DISSIPATIO...
- Publication number 20240395659
- Publication date Nov 28, 2024
- LX Semicon Co., Ltd.
- Min Yup JANG
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE
- Publication number 20240395661
- Publication date Nov 28, 2024
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240395678
- Publication date Nov 28, 2024
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS

Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die package with multi-lid structures and method for...

Direct bonded copper substrates fabricated using silver sintering

Display device

Power semiconductor component and method for producing a power semi...

Solder thermal interface material (STIM) with dopant

Semiconductor package and manufacturing method thereof

Systems and methods for phase switch timing controller for inverter...

Semiconductor devices and method for forming the same

Thermal interconnect structure for thermal management of electrical...

Bonded substrate, and method for manufacturing bonded substrate

Lidded microelectronic device packages and related systems, apparat...

Semiconductor arrangement and method of forming

Thermally conductive silicone gel composition

Semiconductor device with spaced apart containers

Dual-side cooling semiconductor packages and related methods

Semiconductor device package comprising antenna and communication m...

Graphene-coated heat spreader for integrated circuit device assemblies

Semiconductor device and semiconductor package having the same

Memory device and manufacturing method thereof

Optical multichip package with multiple system-on-chip dies

Material structure for low thermal resistance silicon-based gallium...

Package comprising metal layer configured for electromagnetic inter...

Package including multiple semiconductor devices

High performance two-phase cooling apparatus for portable applications

Semiconductor package structure and fabrication method thereof

Method of forming a chip package, method of forming a semiconductor...

Package structure and method for manufacturing the same

Semiconductor device with high heat dissipation property using hexa...

Power semiconductor apparatus

Heat sink, semiconductor package and semiconductor module

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

MEMORY CELL, THREE-DIMENSIONAL MEMORY, AND METHOD OF OPERATING THRE...

SEMICONDUCTOR DEVICE INCLUDING HEAT SHIELD

MODULE ASSEMBLY OF MULTIPLE SEMICONDUCTOR DEVICES WITH INSULATING S...

Semiconductor Package

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL MITIGATION

COVER FOR HEAT GENERATING ELECTRONIC COMPONENT

POWER MODULE

SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FAB...

CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR USING S...

HEAT SPREADER MATERIAL

COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS

METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...

SYSTEMS, APPARATUSES, AND METHODS FOR NANOWIRES FOR SEMICONDCUTOR P...

SEMICONDUCTOR PACKAGE STRUCTURE HAVING THERMAL MANAGEMENT STRUCTURE

ON DIE FLEXURE CONTROL DEVICE AND METHOD

SEMICONDUCTOR MODULE AND HEAT DISSIPATION PLATE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

HEAT DISSIPATION MEMBER

SEMICONDUCTOR PACKAGE STRUCTURE HAVING THERMAL MANAGEMENT STRUCTURE

HEAT DISSIPATION MEMBER

THICK-SILVER LAYER INTERFACE

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

HEAT DISSIPATION MEMBER, METHOD OF MANUFACTURING THE HEAT DISSIPATI...

CERAMIC SUBSTRATE EQUIPPED WITH A UNIQUE CODE FOR A HEAT DISSIPATIO...

IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...