Claims
- 1. A thermoplastic molding material containing
- A) 4-94% by weight of a partly aromatic, semicrystal-line copolyamide having a triamine content of less than 0.5% by weight and composed of
- (A.sub.1) 20-90% by weight of units derived from terephthalic acid and hexamethylenediamine,
- (A.sub.2) 0-50% by weight of units derived from .epsilon.-caprolactam,
- (A.sub.3) 0-80% by weight of units derived from adipic acid and hexamethylenediamine and
- (A.sub.4) 0-40% by weight of further polyamide-forming monomers, the amount of components (A.sub.2) or (A.sub.3) or (A.sub.4) or of mixtures thereof being not less than 10% by weight,
- B) 4-94% by weight of a polyolefin homo- or copolymer or a mixture thereof,
- C) 2-20% by weight of a compatibility agent.
- D) 0-20% by weight of a toughening polymer, if desired
- E) 0-60% by weight of other additives and processing assistants.
- 2. A thermoplastic molding material as defined in claim 1, wherein component B) consists of polypropylene or polyethylene or of an ethylene/propylene copolymer or of a mixture thereof.
- 3. A thermoplastic molding material as defined in claim 1, wherein component C) is composed of a homo- or copolymer of at least one .alpha.-olefin which contains from 0.1 to 20% by weight, based on 100% by weight of component C), of functional monomers.
- 4. A thermoplastic molding material as defined in claim 1, wherein the partly aromatic copolyamide A) contains
- A.sub.1) 50-80% by weight of units derived from terephthalic acid and hexamethylenediamine and
- A.sub.2) 20-50% by weight of units derived from .epsilon.-caprolactam.
- 5. A thermoplastic molding material as defined in claim 1, wherein the partly aromatic copolyamide A) contains
- A.sub.1) 25-70% by weight of units derived from terephthalic acid and hexamethylenediamine and
- A.sub.3) 30-75% by weight of units derived from adipic acid and hexamethylenediamine.
- 6. A thermoplastic molding material as defined in claim 1, wherein the partly aromatic copolyamide A) contains
- A.sub.1) from 50 to 70% by weight of units derived from terephthalic acid and hexamethylenediamine and
- A.sub.3) from 10 to 20% by weight of units derived from adipic acid and hexamethylenediamine and
- A.sub.4) from 20 to 30% by weight of units derived from isophthalic acid and hexamethylenediamine.
- 7. A thermoplastic molding material as defined in claim 1, wherein component A) has a melting point of from 270.degree. to 325.degree. C.
- 8. A molding obtainable from a thermoplastic molding material as defined in claim 1.
- 9. The thermoplastic molding composition of claim 3, wherein component C) comprises 0.2 to 10% by weight of functional monomers.
Priority Claims (1)
Number |
Date |
Country |
Kind |
41 20 007.1 |
Jun 1991 |
DEX |
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Parent Case Info
This application is a continuation of application Ser. No. 07/900,472, filed on Jun. 18, 1992, abandoned.
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Continuations (1)
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Number |
Date |
Country |
Parent |
900472 |
Jun 1992 |
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