The present application is a continuation-in-part application of U.S. pateny Application Ser. No. 10/124,939. filed Apr. 17, 2002, which is hereby incorporated by reference in its entirety.
Number | Name | Date | Kind |
---|---|---|---|
4275912 | Bayer | Jun 1981 | A |
4413856 | McMahan et al. | Nov 1983 | A |
4634735 | Thiersault et al. | Jan 1987 | A |
4679837 | Bayer et al. | Jul 1987 | A |
4998761 | Bayer et al. | Mar 1991 | A |
5091435 | Suzuki et al. | Feb 1992 | A |
5206294 | Dawson | Apr 1993 | A |
5219197 | Rich et al. | Jun 1993 | A |
5290078 | Bayer et al. | Mar 1994 | A |
5385375 | Morgan et al. | Jan 1995 | A |
5721314 | Hausmann | Feb 1998 | A |
5721315 | Evans et al. | Feb 1998 | A |
5783629 | Srinivasan et al. | Jul 1998 | A |
5783630 | Evans et al. | Jul 1998 | A |
5883188 | Hwang et al. | Mar 1999 | A |
5942576 | Evans et al. | Aug 1999 | A |
5959032 | Evans et al. | Sep 1999 | A |
5965667 | Evans et al. | Oct 1999 | A |
5985999 | Dominguez et al. | Nov 1999 | A |
6107404 | Ryntz | Aug 2000 | A |
6120714 | Allan et al. | Sep 2000 | A |
6153680 | Shah et al. | Nov 2000 | A |
6204328 | Sanpei et al. | Mar 2001 | B1 |
6218032 | Berta | Apr 2001 | B1 |
6245856 | Kaufman et al. | Jun 2001 | B1 |
6261489 | Matsuki et al. | Jul 2001 | B1 |
6515074 | Kakarala et al. | Feb 2003 | B2 |
Entry |
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http://www.kittermanplastics.com/vacuum.htm (Process: Vacuum Forming, pp. 1-2). |
http://www.matrixplastics.com/thermo.htm (Thermoforming (Vacuum or Pressure), p. 1. |
http://www.vistar-online.com/forming.html (Vistar Technologies, Inc., The Thermoforming Process—Vacuum/Pressure Forming, pp. 1-3). |
http://www.formedplastics.com/pressure.html (Formed Plastics, Inc., Pressure/Vacuum Forming, pp. 1-2). |
http://members.aol.com/GCCnssnway/vacuform.htm (Vacuum Forming, pp. 1-7). |
Number | Date | Country | |
---|---|---|---|
Parent | 10/124939 | Apr 2002 | US |
Child | 10/173965 | US |