Claims
- 1. A thermosetting composition of matter comprising (A) a prepolymer of (a) at least one bis-imide having the general formula (II): ##STR14## wherein Y is hydrogen or methyl; L is a divalent hydrocarbon radical or a radical having the formula (III): ##STR15## in which T is a valence bond or T represents one of the following: ##STR16## X is hydrogen, methyl, ethyl or isopropyl, with (b) at least one monomaleimide having the following general formula (I): ##STR17## wherein R is hydrogen or methyl; and (B) at least one imidazole compound.
- 2. The thermosetting composition as defined by claim 1, said prepolymer further comprising (c) at least one organosilicic compound having at least one hydroxyl group bonded to a silicon atom in the molecular structure thereof.
- 3. The thermosetting composition as defined by claim 1, wherein L is cyclohexylene, phenylene, 4-methyl-1,3-phenylene, 2-methyl-1,3-phenylene, 5-methyl-1,3-phenylene or 2,5-dimethyl-3-methyl-1,4-phenylene.
- 4. The thermosetting composition as defined by claim 1, said at least one bis-imide (II) comprising
- N,N'-meta-phenylene-bis-maleimide;
- N,N'-para-phenylene-bis-maleimide;
- N,N'-4,4'-diphenylmethane-bis-maleimide;
- N,N'-4,4'-diphenylether-bis-maleimide;
- N,N'-4,4'-diphenylsulfone-bis-maleimide;
- N,N'-1,4-cyclohexylene-bis-maleimide;
- N,N'-4,4'-(1,1-diphenylcyclohexylidene)bismaleimide;
- N,N'-4,4'-(2,2-diphenylpropane)bis-maleimide;
- N,N'-4,4'-triphenylmethane-bis-maleimide;
- N,N'-1,3-(4-methylphenylene)bis-maleimide; or
- N,N'-1,3-(2-methylphenylene)bis-maleimide.
- 5. The thermosetting composition as defined by claim 4, said at least one monomaleimide (b) comprising
- N-(2-allyloxyphenyl)maleimide;
- N-(3-allyloxyphenyl)maleimide;
- N-(4-allyloxyphenyl)maleimide;
- N-(2-methallyloxyphenyl)maleimide;
- N-(3-methallyloxyphenyl)maleimide;
- N-(4-methallyloxyphenyl)maleimide;
- or admixture thereof.
- 6. The thermosetting composition as defined by claim 2, said at least one organosilicic compound (c) having the general formula (IV): ##STR18## in which R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5, which are identical or different, are each hydroxyl or --OR.sub.6 in which R.sub.6 is a straight or branched chain alkyl radical containing 1 to 6 carbon atoms or a phenyl radical; hydrogen; a straight or branched chain alkyl radical containing 1 to 6 carbon atoms or a substituted such radical bearing one or more chlorine, fluorine or --CN substituents; a straight or branched chain alkenyl radical containing 2 to 6 carbon atoms; a phenyl radical, or a substituted phenyl radical bearing at least one of alkyl and alkoxy substituents containing 1 to 4 carbon atoms, or one or more chlorine atoms; and y is an integer or a fractional number ranging from 0 to 1000.
- 7. The thermosetting composition as defined by claim 1, said at least one imidazole compound (B) having the general formula (V): ##STR19## In which R.sub.7, R.sub.8, R.sub.9 and R.sub.10, which are identical or different, are each a hydrogen atom, an alkyl or alkoxy radical containing 1 to 20 carbon atoms, a vinyl radical, a phenyl radical, or a nitro group, or R.sub.9 together forms, with R.sub.10 and the carbon atoms to which R.sub.9 and R.sub.10 are linked, a single hydrocarbon ring, or R.sub.7 is a carbonyl group linked to a second imidazole ring.
- 8. The thermosetting composition as defined by claim 1, said at least one bis-imide (II) comprising N,N'-4,4'-diphenylmethane-bis-maleimide, N,N'-1,3-(4-methylphenylene)-bis-maleimide, N,N'-1,3-(2-methylphenylene)-bismaleimide, or admixture thereof.
- 9. The thermosetting composition as defined by claim 2, said at least one organosilicic compound (c) comprising diphenylsilanediol.
- 10. The thermosetting composition as defined by claim 1, comprising from 50 to 95% by weight of said at least one bis-imide (II) and from 5 to 50% by weight of said at least one monomaleimide (b).
- 11. The thermosetting composition as defined by claim 2, comprising from 40 to 90% by weight of said at least one bis-imide (II), from 5 to 40% by weight of said at least one monomaleimide (b), and from 5 to 40% by weight of said at least one hydroxylated organosilicic compound (c).
- 12. The thermosetting composition as defined by claim 1, comprising from 0.02 to 1% by weight of said at least one imidazole compound (B).
- 13. The thermosetting composition as defined by claim 1, further comprising up to 5% by weight of an N,N',N"-tris(hydroxyalkyl)hexahydrotriazine, relative to said prepolymer (A).
- 14. A process for the preparation of the thermosetting composition as defined by claim 1, comprising (i) intimately admixing the maleimido compounds, (ii) melting said admixture at a temperature not exceeding the melting point of the most difficult to liquefy of said maleimides, (iii) adding a solvent solution of said at least one imidazole compound thereto, under vigorous stirring, (iv) degassing the resulting mixture, (v) homogenizing same, and (vi) casting the resin immediately thereafter.
- 15. A cured composition produced from the thermosetting composition as defined by claim 1.
- 16. A shaped article comprising the cured composition as defined by claim 15.
Priority Claims (2)
Number |
Date |
Country |
Kind |
85 10190 |
Jul 1985 |
FRX |
|
86 05744 |
Apr 1986 |
FRX |
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Parent Case Info
This application is a divisional of application Ser. No. 880,838, filed July 1, 1986, now U.S. Pat. No. 4,788,295.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
4788295 |
Rakoutz |
Nov 1988 |
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Divisions (1)
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Number |
Date |
Country |
Parent |
880838 |
Jul 1986 |
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