| Number | Name | Date | Kind |
|---|---|---|---|
| 3775154 | Grego et al. | Nov 1973 | |
| 3844796 | Jasinski | Oct 1974 | |
| 3929674 | Patterson | Dec 1975 | |
| 4011087 | Short | Mar 1977 | |
| 4371459 | Nazarenko | Feb 1983 | |
| 4446059 | Eustice | May 1984 | |
| 4552691 | Shoji et al. | Nov 1985 | |
| 4623389 | Donley et al. | Nov 1986 | |
| 4636254 | Husson, Jr. et al. | Jan 1987 | |
| 4859214 | Grungy | Aug 1989 | |
| 5302557 | Carroll et al. | Apr 1994 | |
| 5346651 | Oprosky et al. | Sep 1994 | |
| 5378408 | Carroll et al. | Jan 1995 |
| Entry |
|---|
| International Journal for Hybrid Microelectronics, vol. 10, No. 4, 1987 Silver Spring MD US, pp. 20-24, H.Z. Wu et al., "Densification and Adhesion of Silver Thick Film Conductors", p. 20 (no month available). |
| Database WPI, Section Ch, Week 8212, Derwent Publications Ltd. London, GB; Class G02, An 82-23020E & JP-A-57 027 506 (Central Glass KK), 13 Feb. 1982, Abstract. |