Claims
- 1. A thin film magnetic head comprising:a first magnetic core; a second magnetic core formed on said first magnetic core; a coil disposed between said first magnetic core and second magnetic core; and a non-magnetic insulator body for separating said first magnetic core, second magnetic core and coil with respect to each other; wherein at least one of said first magnetic core and said second magnetic core includes an electroplated thin film with an average crystal grain size smaller than 500 Å; and wherein said electroplated thin film is made of Ni—Fe alloy of which Ni is 38 to 60 wt % and Fe is 40 to 62 wt %.
- 2. A thin film magnetic head according to claim 1, wherein said Ni—Fe alloy contains Co as an additional element and an amount of said Co is less than 15 wt % in the total weight.
- 3. A thin film magnetic head according to claim 2, wherein said Ni—Fe alloy contains another additional element which is at least one element selected from the group of Mo, Cr and Pd, and a total amount of said Mo, Cr and Pd is less than 3 wt % in the total weight.
- 4. A thin film magnetic head according to claim 1, further comprising:a substrate; a lower shield formed on the substrate; a pair of electrodes formed on said lower shield; a magnetoresistive element disposed between said pair of electrodes; and an upper shield formed on said magnetoresistive element; wherein the thin film magnetic head is formed on said upper shield.
- 5. An assembled construction of a magnetic head comprising:a magnetic head including reading and writing elements; a magnetic head slider in which said magnetic head is disposed; a gimbal system for supporting said magnetic head slider including a flexible body having one end attached to said magnetic head slider and a rigid beam connected to said flexible body; said writing element comprises: a first magnetic core; a second magnetic core; wherein at least one of said first magnetic core and said second magnetic core is made of an electroplated thin film with an average crystal grain size smaller than 500 Å; and wherein said electroplated thin film is made of Ni—Fe alloy of which Ni is 38 to 60 wt % and Fe is 40 to 62 wt %.
Priority Claims (1)
Number |
Date |
Country |
Kind |
7-16666 |
Feb 1995 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATION
This is a continuation of U.S. application Ser. No. 09/626,743, filed Jul. 26, 2000, now U.S. Pat. No. 6,262,867, which is a continuation of U.S. application Ser. No. 08/594,275, filed Jan. 30, 1996, now U.S. Pat. No. 6,118,628, issued Sep. 12, 2000, the subject matter of which is incorporated by reference herein.
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Continuations (2)
|
Number |
Date |
Country |
Parent |
09/626743 |
Jul 2000 |
US |
Child |
09/899215 |
|
US |
Parent |
08/594275 |
Jan 1996 |
US |
Child |
09/626743 |
|
US |