The present application is based on, and claims priority from, Taiwan Application Serial Number 95106252, filed Feb. 24, 2006, the disclosure of which is hereby incorporated by reference herein in its entirety.
1. Field of Invention
The present invention relates to an active device array substrate and a display device. More particularly, the present invention relates to a thin film transistor array substrate and an E-ink display device.
2. Description of Related Art
E-ink display device was initially developed in 1970's. It is featured by a charged small ball with white color on one side and black color on the other side. The charged small ball rotates up and down to show different colors when the electrical field applied to small ball is changed. The second generation E-ink display device, developed in 1990's, is featured by a bi-stable charged particles which substitutes the conventional charged ball. The charged white particles may carry positive charge, negative charge or both. Nowadays, the major technical is using particles carrying positive/negative charge or using particles carrying single type charge/solution to display white/black colors.
In general, commercial E-ink display device comprises a front plane laminate (FPL) and a thin film transistor array substrate. Front plane laminate usually comprises a transparent cover, a transparent electrode layer and an E-ink material layer. The E-ink material layer comprises E-ink and supporting liquid. When the electrical field between each pixel electrode of the thin film transistor array substrate and the transparent cover of the front plane laminate is changed, E-ink will flow up or down to change optical property of each pixel.
After the thin film transistor array substrate and the FPL have been manufactured. It is always necessary to test the optical and electric property of wiring lines and pixels of the thin film transistor array substrate to ensure a good yield rate of E-ink display device. Before the driving circuit has been formed, a conventional shorting bar is used to test pixels. A gate shorting bar contacts to all scan lines and turn on all thin film transistors connected to all scan lines. A source shorting bar contacts to all data lines and a testing signal is input from the source shorting bar to data lines to input image data to every pixel so an image can be displayed and observed. The kind of test allows all thin film transistors and pixel electrodes to receive same signal. The existence of broken circuit leads thin film transistors and pixel electrodes to be unable to receive signal so an abnormal electric or optical behavior can be expected.
However, the above conventional test method is to input the same testing signal to all pixels so only the abnormal phenomenon of a specific displayed image can be observed, other pixel defects such as bright pint and dark point are not able to be observed. For example, two pixel electrodes of two neighboring pixels connected by residual indium tin oxide (ITO) is a type of defect which can not be detected by shorting bar because the testing signal for every pixel is the same no matter unanticipated residual ITO exists or not
Furthermore, other problems when using a shorting bar to test a device might be expected. A shorting bar is generally longer than the length of the area pressed by and contacted to the shorting bar to ensure all signal lines are able to receive signal. However, because of growing development of small-sized portable products, electric circuit is always restricted in a very small area. It is necessary to shorten the length of shorting bar so it can be fitted to small-sized portable products without possible short circuit problem caused by long shorting bar. But some signal lines might not be able to receive signal when using such short shorting bar to test devices. Furthermore, the effects of pressing and contacting signal lines are varied by material, shape of shorting bar and pressure applied to signal lines. Signal with different intensity might be transmitted to different) signal line due to the non-uniform pressure applied by shorting bar to signal lines. The accuracy of a test result is thus decreased if such problem exists.
An aspect of the present invention is to provide a thin film transistor array substrate with testing circuit to improve both test accuracy and yield rate.
In accordance with the foregoing and another aspect of the present invention, an E-ink display device utilizing the thin film transistor substrate and testing circuit mentioned above is provided to improve test accuracy and yield rate.
In accordance with the foregoing and other aspects of the present invention, a thin film transistor array substrate is provided in an E-ink display device. The thin film transistor array substrate of the invention comprises a substrate, a plurality of scan lines and a plurality of data lines, a plurality of thin film transistors, a plurality of pixel electrodes, a plurality of testing signal lines, a plurality of testing switch devices and a testing control line. Scan lines and data lines are formed on the substrate. The substrate is divided into a plurality of pixel areas by the scan line and the data lines. Thin film transistors are formed on the pixel areas and activated by scan lines. Besides, pixel electrodes are formed in the pixel areas and connected to corresponding thin film transistors. Testing signal lines are serially connected scan lines and/or data lines and each of testing signal line is connected to, at least, one testing signal input port. Testing switch device is formed between the testing signal line and the scan line or between the signal line and the data line. The testing control line is connected to testing switch device to turn on or turn off the testing switch device. The testing control line is connected to, at least, one control signal input port.
In accordance with the foregoing and yet another aspect of the present invention, an E-ink display device is provided in this invention. The E-ink display device comprises a thin film transistor array substrate mentioned above, an E-ink material layer, a transparent cover and a transparent electrode. The E-ink material layer is formed on the pixel electrodes of the E-ink transistor array substrate and the transparent cover is formed on the E-ink material layer. Furthermore, the transparent electrode layer is formed between the transparent cover and the E-ink material layer.
In one of the preferred embodiments of the invention, the testing control line mentioned above may be connected to a negative voltage power signal input port to turn off the testing switch device.
In one of the preferred embodiments of the invention, the testing switch device is, for example, a transistor.
In one of the preferred embodiments of the invention, the scan lines and/or data lines are divided into a plurality of wiring groups. The testing signal lines are serially connected to the wiring groups. Any two scan lines or data lines in one wiring group are not formed next to each other.
In one of the preferred embodiments of the invention, the testing signal lines comprise a scan testing signal line and a data testing signal line. The scan testing signal line is serially connected to all scan lines and the data testing signal line is serially connected to all data lines.
In one of the preferred embodiments of the invention, the testing signal lines comprise a scan testing signal line and a plurality of data testing signal lines. The scan testing signal line is serially connected to all scan lines and the data testing signal lines are serially connected to all data lines. Any two data lines connected to one data testing signal line are not formed next to each other. For example, the testing signal lines comprise a scan testing signal line, a first data testing signal line and a second data testing signal line. The scan testing signal line is serially connected to all scan lines. The first data testing signal line is serially connected to No. 2N−1 data line and the second data testing signal line is serially connected to No. 2N data line, N is integer. In addition, the testing signal lines further comprise a scan testing signal line, a first data testing signal line, a second data testing signal line and a third testing signal line. The scan testing signal line is serially connected to all scan lines. The first data testing signal line is connected to No. 3N−2 data line, the second data testing signal line is connected to No. 3N−1 data line, the third data testing signal line is connected to No. 3N data line, N is integer.
In one of the preferred embodiments of the invention, the testing signal lines comprise a scan testing signal line and a plurality of data testing signal lines. The scan testing signal line is serially connected to all scan lines and the data testing signal lines are serially connected to all data lines. Any two data lines connected to one data testing signal line are not formed next to each other. For example, the testing signal lines comprise a scan testing signal line, a first data testing signal line and a second data testing signal line. The scan testing signal line is serially connected to all scan lines. The first data testing signal line is serially connected to No. 2N−1 data line and the second data testing signal line is serially connected to No. 2N data line, N is integer.
In one of the preferred embodiments of the invention, the material of the pixel electrode is, for example, transparent conducting material or metallic material.
Accordingly, a plurality of testing signal lines are used to test the optical and electric properties of the wiring lines and pixels on the thin film transistor array substrate. The test accuracy is higher than what conventional method is able to obtain. The scan lines and/or data lines can be divided into a plurality of wiring groups and serially connected to different testing signal lines. Different testing signals are input from different testing signal lines to the pixels in order to detect any possible pixel defect between two neighboring pixels. Therefore, the test accuracy as well as the production yield of the E-ink display device and the thin film transistor array substrate can be improved by the design of the aforementioned testing circuit. Production cost can thus be reduced.
It is to be understood that both the foregoing general description and the following detailed description are by examples, and are intended to provide further explanation of the invention as claimed.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,
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The wiring and pixel structure of the thin film transistor array substrate in this invention will be disclosed and several preferred embodiments will also be discussed.
Please refer to
A plurality of gate drivers 142 and source drivers 144 are formed on the peripheral circuit device 104. The gate drivers 142 connected to scan lines 152 transmit driving signal from scan lines 152 to the gates of the thin film transistors 114 and turn on the thin film transistor 114 when displaying images. Source drivers 144 connected to data lines 154 are able to transmit image data to the pixel electrodes 112 when the thin film transistors 114 are turned on.
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What has to be noticed is both testing signal line and testing control line can be connected to, at least, one signal input port from where testing signal and control signal can be input.
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Therefore, when testing the E-ink display device 100. Testing signal can be transmitted from the testing signal lines 164a, 164b and 164c to two neighboring pixel lines to detect possible pixel defect between the two pixel lines.
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If white image is the normally white of a display device, then V1 allows, for example, the pixel corresponded to the pixel electrode 212a to display a bright point and the V2 allows, for example, the pixel corresponded to the pixel electrode 212b to display a dark point. However, the pixel electrode 212a and the pixel electrode 212b are connected together, so pixels corresponded to both pixel electrode 212a and pixel electrode 212b will display a bright point. Therefore, defect can thus be located.
The preferred embodiment mentioned above is to connect three different testing signal lines to pixels with different colors. However, it will be apparent to those skilled in the art that modifications can be made to the number of testing signal lines and the method of dividing data lines and scan lines into wiring groups. If any two scan lines or data lines in every wiring group are not formed next to each other, then the projective of this invention can be obtained. E-ink display device with different types of wiring groups will be illustrated. Only the method of dividing scan lines or data lines into groups and the way how to connect testing signal line will be discussed in follow preferred embodiments. The details of other devices on E-ink display device will be skipped and can be referred to previous preferred embodiments.
In addition,
It is apparent that both scan lines and data lines can be selected together and divided into groups by ways mentioned in previous preferred embodiments to obtain better test accuracy. However, it is easy for those skilled in the arts to modify the wiring method based on this present invention. Other related modification will not be discussed again.
Accordingly, this invention is to increase the accuracy of pixel test result. A plurality of testing signal lines are divided into groups and serially connected to scan lines or data lines to improve test accuracy. Besides, scan lines and/or data lines can be divided into groups and serially connected to different testing signal lines in order to input different testing signals from different testing signal lines to two neighboring pixels. Therefore, possible defect between two neighboring pixel can be detected. The test accuracy as well as the production yield of the E-ink display device and the thin film transistor array substrate can be improved. Production cost can thus be reduced
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
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